JP5807205B2 - 実装基板 - Google Patents
実装基板 Download PDFInfo
- Publication number
- JP5807205B2 JP5807205B2 JP2012127333A JP2012127333A JP5807205B2 JP 5807205 B2 JP5807205 B2 JP 5807205B2 JP 2012127333 A JP2012127333 A JP 2012127333A JP 2012127333 A JP2012127333 A JP 2012127333A JP 5807205 B2 JP5807205 B2 JP 5807205B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- light emitting
- transfer plate
- emitting module
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
まず、電子部品を実装可能な実装基板2について図1〜図5に基づいて説明し、その後、この実装基板2を備えた発光モジュールについて図6〜図9に基づいて説明する。
以下、本実施形態の発光モジュール1について図18に基づいて説明する。
2 実装基板
21b 貫通孔
3 固体発光素子(電子部品、LEDチップ)
21 伝熱板
21d 第2スリット
21ga 第1側片
21gb 第2側片
21ha 第1バー
21hb 第2バー
22 配線パターン
22c 連結片
22d 第1スリット
22u 単位パターン
23 絶縁層
26 ワイヤ
31 第1電極
32 第2電極
37 色変換部
Claims (2)
- 電子部品を実装可能な実装基板であって、第1金属板により形成され前記電子部品を一面側に搭載可能な伝熱板と、第2金属板により形成されてなり前記伝熱板の他面側に配置され前記電子部品を電気的に接続可能な配線パターンと、前記伝熱板と前記配線パターンとの間に介在する絶縁層と、を備え、前記配線パターンは、前記電子部品を電気的に接続可能な複数の単位パターンと、前記単位パターンの並設方向に直交する規定方向の一端側において前記単位パターンどうしを連結し且つ電気的に接続する連結片と、前記規定方向の他端側が開放され前記連結片に至る第1スリットと、を有し、前記伝熱板は、前記第1スリットに重なる第2スリットを有することを特徴とする実装基板。
- 電子部品を実装可能な実装基板であって、第1金属板により形成され前記電子部品を一面側に搭載可能な伝熱板と、第2金属板により形成されてなり前記伝熱板の他面側に配置され前記電子部品を電気的に接続可能な配線パターンと、前記伝熱板と前記配線パターンとの間に介在する絶縁層と、を備え、前記配線パターンは、前記電子部品を電気的に接続可能な複数の単位パターンと、前記単位パターンの並設方向に直交する規定方向の一端側において前記単位パターンどうしを連結し且つ電気的に接続する連結片と、前記規定方向の他端側が開放され前記連結片に至る第1スリットと、を有し、前記伝熱板は、前記第1スリットに重なる第2スリットを有し、前記単位パターンは、平面形状がそれぞれ櫛形状に形成された第1パターンと第2パターンとを有することを特徴とする実装基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012127333A JP5807205B2 (ja) | 2012-06-04 | 2012-06-04 | 実装基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012127333A JP5807205B2 (ja) | 2012-06-04 | 2012-06-04 | 実装基板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011138520A Division JP5011445B1 (ja) | 2011-06-22 | 2011-06-22 | 実装基板および発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013008965A JP2013008965A (ja) | 2013-01-10 |
JP5807205B2 true JP5807205B2 (ja) | 2015-11-10 |
Family
ID=47676018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012127333A Expired - Fee Related JP5807205B2 (ja) | 2012-06-04 | 2012-06-04 | 実装基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5807205B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113314656B (zh) * | 2021-05-24 | 2022-02-18 | 深圳市华拓照明有限公司 | 一种高透光高散热型led灯带的封装结构的封装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007158210A (ja) * | 2005-12-08 | 2007-06-21 | Matsushita Electric Ind Co Ltd | 発光モジュールとその製造方法 |
JP5279225B2 (ja) * | 2007-09-25 | 2013-09-04 | 三洋電機株式会社 | 発光モジュールおよびその製造方法 |
-
2012
- 2012-06-04 JP JP2012127333A patent/JP5807205B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2013008965A (ja) | 2013-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5011445B1 (ja) | 実装基板および発光モジュール | |
KR101495580B1 (ko) | 리드 프레임, 배선판, 발광 유닛, 조명 장치 | |
JP5665160B2 (ja) | 発光装置および照明器具 | |
JP2013038018A (ja) | 照明器具 | |
JP5673190B2 (ja) | 発光装置 | |
JP5517616B2 (ja) | 薄膜半導体構成素子および構成素子結合体 | |
JP2011035264A (ja) | 発光素子用パッケージ及び発光素子の製造方法 | |
JP4976982B2 (ja) | Ledユニット | |
JP5935078B2 (ja) | Ledモジュールおよびその製造方法、照明器具、直管形ledランプ | |
JP2011249737A (ja) | リードフレーム、配線板およびそれを用いたledユニット | |
US11611014B2 (en) | Light-emitting module | |
JP2013008966A (ja) | 実装基板 | |
JP5935074B2 (ja) | 実装基板および発光モジュール | |
KR101852436B1 (ko) | 반도체 발광 소자를 이용한 차량용 램프 | |
JP5807205B2 (ja) | 実装基板 | |
JP2014007204A (ja) | Ledモジュール | |
JP4976895B2 (ja) | 発光装置 | |
JP5011442B1 (ja) | 発光ユニットおよび照明装置 | |
JP5011441B1 (ja) | 発光ユニットおよび照明装置 | |
JP5938623B2 (ja) | 実装基板およびその製造方法、ledモジュール | |
JP2012209366A (ja) | 両面発光ユニットおよび照明装置 | |
JP7174264B2 (ja) | 面発光光源及びその製造方法 | |
JP2012209563A (ja) | 発光ユニット | |
JP5954657B2 (ja) | 実装基板およびその製造方法、ledモジュール | |
JP2012209562A (ja) | 照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140612 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20141008 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150306 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150317 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150410 |
|
LAPS | Cancellation because of no payment of annual fees |