JP5806062B2 - Non-contact data transmitter / receiver - Google Patents

Description

 The present invention is a non-contact type that can receive information from the outside and transmit information to the outside in a non-contact state using an electromagnetic wave as a medium, such as an information recording medium for RFID (Radio Frequency IDentification). In particular, it relates to a non-contact type data receiving / transmitting body that can be directly attached to a metal, can receive information from the outside in a non-contact state, and can transmit information to the outside. is there.

 Non-contact type data receiving / transmitting bodies such as IC tags and IC labels are used, for example, for the purpose of article management. In order for the IC tag and IC label to operate, the electromagnetic wave transmitted from the information writing / reading device is sufficiently taken into the antenna of the IC tag or IC label, and an electromotive force higher than the operating electromotive force of the IC chip is induced. However, when an IC tag or IC label is affixed to the surface of a metal article, there is a problem that the IC chip becomes inoperable due to a fluctuation in radio waves or a decrease in magnetic flux that is below the operating electromotive force of the IC chip. was there.

 In view of this, there has conventionally been disclosed an antenna in which an antenna can be arranged separately from the surface of a metal article by bending a part of the IC tag or IC label (see, for example, Patent Document 1).

JP 2009-49763 A

 However, when the IC tag or IC label is bent, the antenna directivity changes, and the IC tag or IC label is placed on the surface of the metal article while keeping the antenna away from the surface of the metal article. There was a problem that it was difficult to stick.

 The present invention has been made in view of the above circumstances, and provides a non-contact type data transmitter / receiver that can be attached to a metal article in a state where the antenna is stably separated from the metal article. With the goal.

A non-contact type data receiving / transmitting body of the present invention is a non-contact type data including an inlet having a first base material, and an IC chip and an antenna provided on the first base material and electrically connected to each other. A transmitter / receiver , wherein an adhesive layer is provided at least at a position facing the IC chip, the adhesive layer is covered with a release material, and a first adhesive layer covering the IC chip is provided; A weak adhesive layer that can be peeled off and is difficult to reattach after peeling is provided around the adhesive layer, a second adhesive layer is laminated on the weak adhesive layer, and the first adhesive layer and the second adhesive layer A second base material is laminated on the inlet via a layer, the adhesive layer is provided on a surface of the second base material opposite to the surface facing the inlet, and the adhesive layer is It is characterized by being covered with a release material .

A non-contact type data receiving / transmitting body of the present invention is a non-contact type data including an inlet having a first base material, and an IC chip and an antenna provided on the first base material and electrically connected to each other. A transmitter / receiver, wherein an adhesive layer is provided at least at a position facing the IC chip, the adhesive layer is covered with a release material, and a first adhesive layer covering the IC chip is provided; Around the adhesive layer, a weak adhesive layer that can be peeled off and difficult to be reattached after peeling is provided in a state of being sandwiched between the second adhesive layer and the third adhesive layer, the first adhesive layer and the A second base material is laminated on the inlet via a third adhesive layer, and the sticking layer is provided on a surface of the second base material opposite to the face facing the inlet, and the sticking is performed. The layer is covered with the release material .

A non-contact type data receiving / transmitting body of the present invention is a non-contact type data including an inlet having a first base material, and an IC chip and an antenna provided on the first base material and electrically connected to each other. The transmitter / receiver is provided with an adhesive layer at least at a position facing the IC chip, the adhesive layer is covered with a release material, and the IC chip and the antenna are provided on the first substrate. On the opposite side of the formed surface, a gap is formed from both ends of the first base material in a direction perpendicular to the thickness direction of the first base material, and the IC chip and the antenna of the first base material are provided. The adhesive layer is provided on a surface opposite to the provided surface, and the adhesive layer is covered with the release material .

 According to the non-contact type data receiving / transmitting body of the present invention, if the release material is peeled off and attached to one surface of the metal article via the adhesive layer, the non-contact type data is at least as much as the thickness of the adhesive layer. A gap is generated between the transmission / reception body and the metal article, and as a result, the antenna can be arranged separately from the metal article.

It is the schematic which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is a schematic sectional drawing which shows the usage method of 1st embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows the usage method of 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 3rd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows the usage method of 3rd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 4th embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows the usage method of 4th embodiment of the non-contact-type data transmission / reception body of this invention.

An embodiment of the non-contact type data receiving / transmitting body of the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment FIG. 1 is a schematic view showing a first embodiment of a non-contact type data receiving / transmitting body of the present invention, where (a) is a plan view and (b) is an A- of (a). It is sectional drawing which follows A line.
The non-contact type data transmitting / receiving body 10 of the present embodiment includes a first base material 11 having a substantially rectangular shape in plan view, and ICs provided on one surface 11a of the first base material 11 and electrically connected to each other. An inlet 14 having a chip 12 and an antenna 13, an adhesive layer 15 provided at a position facing the IC chip 12, and a release material 16 that covers the adhesive layer 15 are schematically configured.

The fact that the adhesive layer 15 is provided at a position facing the IC chip 12 means that the adhesive layer 15 is provided so as to cover the IC chip 12 and the vicinity thereof.
Further, the release material 16 covers the adhesive layer 15 means that the release material 16 is a surface opposite to the surface in contact with the IC chip 12 and the antenna 13 in the adhesive layer 15 (hereinafter referred to as “one surface”. It says that it is provided so as to cover 15a.

 The antenna 13 is a dipole antenna composed of a pair of planar radiating elements 17, 18 made of various conductors, facing each other and having a feeding point (portion connected to the IC chip 12) on each facing side. is there.

 The length in the longitudinal direction of the antenna 13 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 17 and 18 is a length corresponding to a quarter wavelength.

 The thickness of the adhesive layer 15 is not particularly limited, but at least the unevenness caused by the IC chip 12 and the antenna 13 does not appear on the one surface 15 a of the adhesive layer 15, and the thickness is not determined by the adhesive layer 15. The contact-type data receiving / transmitting body 10 is appropriately adjusted to such an extent that a sufficient adhesive force can be obtained for attaching the contact-type data receiving / transmitting body 10 to the surface of the metal article. The thickness of the sticking layer 15 is in the range of 10 μm to 2000 μm, for example.

 As the first base material 11, a base material made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE) Base material made of polyolefin resin such as polypropylene (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Polyamide resin such as nylon 6, nylon 6,6 A substrate made of a vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacrylic Base material made of acrylic resin such as butyl phosphate; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfuric acid A substrate made of paper such as paper is used.

 The IC chip 12 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 13, and a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC card. Anything can be used as long as it is applicable to RFID media.

 The antenna 13 is formed on one surface 11a of the first base material 11 by using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or a conductive foil. Etched or metal plated.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer type conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 13 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric path of the coating film forming the antenna 13 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 13 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 13 include copper plating, silver plating, gold plating, and platinum plating.

 The sticking layer 15 is provided for sticking the non-contact type data transmitting / receiving body 10 to the surface of the metal article, and is made of an adhesive that can adhere to the surface of the metal article. Such a pressure-sensitive adhesive is selected from either a strong pressure-sensitive adhesive that is not intended for re-peeling or a re-peelable pressure-sensitive adhesive.

The release material 16 is affixed to one surface 15 a (adhesion surface) of the adhesion layer 15 in order to protect the adhesion layer 15.
As the release material 16, for example, a material in which a release agent is applied to the surface that contacts the adhesive layer 15 of paper selected from fine paper, glassine paper, coated paper, art paper, imitation paper and the like is used.

Next, referring to FIG. 2, an example in which the contactless data receiving / transmitting body 10 is attached to a metal article and the metal article is managed using the contactless data receiving / transmitting body 10 will be described as an example. The operation of the non-contact type data receiving / transmitting body 10 will be described.
FIG. 2 is a schematic cross-sectional view showing how to use the non-contact type data receiving / transmitting body 10. In FIG. 2, the code | symbol 30 has shown the metal articles | goods.

The release material 16 is peeled off, and the non-contact type data transmitter / receiver 10 is attached to the one surface 30 a of the metal article 30 through the adhesive layer 15.
Then, a gap is generated between the non-contact type data receiving / transmitting body 10 and the metal article 30 by at least the thickness of the adhesive layer 15, and as a result, the antenna 13 is arranged away from the metal article 30. The In particular, when the one surface 30 a of the metal article 30 is a curved surface or a spherical surface, the antenna 13 is separated from the metal article 30 by attaching the non-contact type data receiving / transmitting body 10 to the one surface 30 a of the metal article 30. Can be arranged.
Therefore, in this state, when the antenna of the information writing / reading device is opposed to the non-contact type data receiving / transmitting body 10, a current flows through the antenna 13 by electromagnetic induction from the information writing / reading device.
Then, when the current flowing through the antenna 13 is supplied to the IC chip 12, information is written from the information writing / reading device to the IC chip 13 via the antenna 13, or information written to the IC chip 12. Is read by the information writing / reading device via the antenna 13.

 The distance at which the non-contact type data receiving / transmitting body 10 is separated from the one surface 30a of the metal article 30 is not particularly limited, and the non-contact type data receiving / transmitting body 10 is in contact with the one surface 30a of the metal article 30. Otherwise, information is written from the information writing / reading device to the IC chip 12 via the antenna 13, or the information written to the IC chip 12 is read by the information writing / reading device via the antenna 13. can do.

 Moreover, although the case where the adhesion layer 15 was provided directly with respect to the inlet 14 was illustrated in this embodiment, this invention is not limited to this. In the present invention, the inlet may be sandwiched between the pair of base materials via the adhesive layer, and an adhesive layer may be provided at a position corresponding to the IC chip of the inlet on one of the base materials. Moreover, you may cover the surface in which the IC chip and antenna of the 1st base material which comprise an inlet were provided with another base material through the adhesive agent.

(2) Second Embodiment FIG. 3 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
In FIG. 3, the same components as those of the non-contact type data receiving / transmitting body 10 shown in FIG.
The non-contact type data receiving / transmitting body 40 of the present embodiment is provided on the first base 11 having a substantially rectangular shape in plan view, and on one surface 11a of the first base 11 and are electrically connected to each other. The inlet 14 having the chip 12 and the antenna 13, the first adhesive layer 41 provided so as to cover the IC chip 12, and the vicinity of the first adhesive layer 41 are peelable, and can be peeled off. A weak adhesive layer 42 that is difficult to stick, a second adhesive layer 43 laminated on the weak adhesive layer 42, and a second substrate laminated on the inlet 14 via the first adhesive layer 41 and the second adhesive layer 43. 44 and the adhesive layer 45 provided on the surface (hereinafter referred to as “one surface”) 44a opposite to the surface facing the inlet 14 of the second base material 44, and the adhesive layer 45 are covered. Is roughly composed of a release material 46.

 That the release material 46 covers the adhesive layer 45 means that the release material 46 is the surface opposite to the surface in contact with the second substrate 44 in the adhesive layer 45 (hereinafter referred to as “one surface”). .) Saying that it is provided so as to cover 45a.

The weak adhesive layer 42 includes a first weak adhesive layer 42A and a second weak adhesive layer 42B that are stacked (attached) in the thickness direction of the non-contact type data transmitting / receiving body 40.
The first weak adhesive layer 42 </ b> A and the second weak adhesive layer 42 </ b> B are formed of a material that can be peeled off even after pasting and difficult to be stuck again after peeling. As such a material, a material having a peeling force of 110 gf / 25 mm to 170 gf / 25 mm is used. As such a material, for example, (1) an adhesive composition comprising a non-peelable pressure-sensitive adhesive base and a non-affinity fine particulate filler for the non-peelable pressure-sensitive adhesive base, (2) Pressure sensitivity obtained by adding a coupling agent that does not have reactivity with the inorganic filler, a resin that is not compatible with the adhesive agent, and the like to a formulation that includes the adhesive main agent, the tackifier, and the inorganic filler. And (3) a heat-sealable thermoplastic resin film.

 The non-releasable pressure-sensitive adhesive base contained in the above-mentioned adhesive composition, when applied to a substrate or the like, does not adhere when the substrates are simply in contact with each other, but has a property of adhering by pressure Is mentioned. As the non-peelable pressure-sensitive adhesive base, it can be arbitrarily selected from the bases commonly used as conventional pressure-sensitive adhesives, and in particular, natural rubber with styrene and methyl methacrylate. Natural rubber latex obtained by graft copolymerizing is preferable in terms of blocking resistance, heat resistance, wear resistance and the like.

 Examples of the fine particulate filler contained in the above adhesive composition include those that are not dissolved or swollen by each component constituting the non-peelable pressure-sensitive adhesive base. Examples of such fine filler include zinc oxide, titanium oxide, calcium carbonate, kaolin, activated clay, spherical alumina, wheat starch, silica, glass powder, and shirasu balloon. In the present invention, it is necessary to use a combination of two or more selected from these fine particulate fillers, and in particular, a combination of silica and other fillers is preferred. In addition, it is preferable to select two or more kinds of fine particulate fillers having different particle diameters. Thus, by using a combination of two or more kinds having different particle diameters, the surface of the adhesive layer is formed in an uneven shape. In addition, the peeling performance can be improved. Moreover, the coating film of adhesive composition can be strengthened by adding a silica to said non-peeling pressure-sensitive adhesive base. Furthermore, since silica is porous, the non-releasable pressure-sensitive adhesive base easily adheres to the surface of the silica, and it is easy to adjust the adhesive force and peel force. Even when printing is performed by the method, since the silica absorbs the silicone oil, the adhesive composition is not stuck by the silicone oil. These fine particulate fillers preferably have an average particle size in the range of 10 to 30 μm, and more preferably have an average particle size in the range of 1 to 20 μm.

 Examples of the pressure-sensitive adhesive contained in the pressure-sensitive pressure-sensitive adhesive include resins having a low glass transition point (Tg) and a strong stickiness (tackiness). Examples of such an adhesive main agent include natural rubber (NR), esterified natural rubber, styrene-butadiene rubber (SBR), chloroprene rubber, polyvinyl acetate, polymethyl methacrylate (PMMA), and the like.

 Examples of the tackifier included in the pressure-sensitive adhesive include rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, modified rosin, rosin ester, hydrogenated rosin ester, disproportionated rosin ester, and polymerized rosin ester. Etc.

 As an inorganic filler contained in the pressure-sensitive adhesive, microsilica, synthetic zeolite, activated alumina gel, calcium carbonate, zinc oxide, titanium oxide, talc, clay, which have no affinity with the above-mentioned adhesive main agent. , Fine particles such as kaolin, activated clay, and shirasu balloon.

 In addition to the inorganic filler, the pressure-sensitive adhesive may be used in combination with resin beads such as acrylic, finely divided substances such as purified starch, corn starch, and cellulose powder.

 Examples of the coupling agent contained in the pressure-sensitive pressure-sensitive adhesive include those having a binding property with the inorganic filler and having an affinity with the pressure-sensitive adhesive main agent. Examples of such a coupling agent include vinyl chlorosilane, vinyl triethoxy silane, vinyl tris (β-methoxyethoxy) silane, γ-glycidoxypropyl trimethoxy silane, γ-methacryloxypropyl trimethoxy silane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, Silanes such as γ-aminopropyltriethoxysilane, vinyltris (t-butylperoxy) silane, or a mixture thereof, or a partial hydrolyzate or partial cohydrolyzate thereof; tetraisopropyl titanate, tetrabutyl titanate, Tet Titanium orthoesters such as 2-ethylhexyl titanate, titanium chelates such as titanium acetylacetonate and triethanolamine titanate, titanium acylates such as polyhydroxy titanium stearate and polyisopropoxy titanium stearate, and organic titanium compounds such as above Alone or a mixture thereof, aluminum alcoholate such as aluminum isopropylate, mono-sec-butoxyaluminum diisopropylate, aluminum chelate compound such as ethyl acetoacetate aluminum diisopropylate, organoaluminum compound as above alone or a mixture thereof Other organometallic compounds; and mixtures of the above silanes and organometallic compounds.

 Resins that are included in the pressure-sensitive pressure-sensitive adhesive and have no compatibility with the pressure-sensitive adhesive agent include water-dispersible polymer polyester, polyvinyl alcohol, acid-modified polyvinyl alcohol, silicon-containing water-soluble polymer, thermoplastic elastomer, Moreover, low molecular polyethylenes, such as low density polyethylene, ionomer, a vinyl acetate olefin copolymer, a cellulose derivative, etc. are mentioned. Among these resins, those having a glass transition temperature (Tg) of 30 ° C. to 80 ° C., a weight average molecular weight of 10,000 to 25,000, and a viscosity of 20 to 20,000 cps (30 ° C.) are preferable.

 Examples of the thermoplastic resin film include polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methacrylic acid ester copolymer, ethylene-acrylic acid copolymer, ethylene- Examples thereof include films made of acrylic acid ester copolymers and cross-linked products of these metals, and among these, transparent ones are desirable.

 Once the first weak adhesive layer 42A and the second weak adhesive layer 42B made of such a material are peeled off, they cannot be attached again.

 The first adhesive layer 41 and the second adhesive layer 43 are made of a non-peelable pressure-sensitive adhesive that is difficult to peel or cannot be peeled after being stuck. As such a non-peelable pressure-sensitive adhesive, those conventionally used as conventional pressure-sensitive adhesives are used, and among them, an adhesive having a peeling force of 220 gf / 25 mm or more can be mentioned. Examples of such a non-peelable pressure sensitive adhesive include natural rubber latex obtained by graft copolymerization of styrene and methyl methacrylate with natural rubber. This natural rubber latex is an adhesive suitable for the inlet member of the present invention in terms of blocking resistance, heat resistance, abrasion resistance, and the like.

As the 2nd base material 44, the thing similar to the above-mentioned 1st base material 11 is used.
As the adhesive layer 45, the thing similar to the above-mentioned adhesive layer 15 is used.
As the peeling material 46, the thing similar to the above-mentioned peeling material 16 is used.

Next, with reference to FIG. 4, regarding the operation of the non-contact type data receiving / transmitting body 40, the non-contact type data receiving / transmitting body 40 is attached to a metal article, and the non-contact type data receiving / transmitting body 40 is used to A case where product management is performed will be described as an example.
FIG. 4 is a schematic cross-sectional view showing a method of using the non-contact type data receiving / transmitting body 40.

 First, the release material 46 is peeled off, and the non-contact type data receiving / transmitting body 40 is attached to the one surface 30 a of the metal article 30 through the adhesive layer 45.

Next, the first weak adhesive layer 42A and the second weak adhesive layer 42B are separated, and the first weak adhesive layer 42A and the second weak adhesive layer 42B are separated. Then, the antenna 13 is disposed away from the metal article 30. In particular, when the one surface 30 a of the metal article 30 is a curved surface or a spherical surface, the antenna 13 is separated from the metal article 30 by attaching the non-contact type data receiving / transmitting body 40 to the one surface 30 a of the metal article 30. Can be arranged.
Therefore, in this state, when the antenna of the information writing / reading device is opposed to the non-contact type data receiving / transmitting body 40, a current flows through the antenna 13 by electromagnetic induction from the information writing / reading device.
Then, when the current flowing through the antenna 13 is supplied to the IC chip 12, information is written from the information writing / reading device to the IC chip 13 via the antenna 13, or information written to the IC chip 12. Is read by the information writing / reading device via the antenna 13.

 The distance at which the non-contact type data receiving / transmitting body 40 is separated from the one surface 30 a of the metal article 30 is not particularly limited, and the non-contact type data receiving / transmitting body 40 is in contact with the one surface 30 a of the metal article 30. Otherwise, information is written from the information writing / reading device to the IC chip 12 via the antenna 13, or the information written to the IC chip 12 is read by the information writing / reading device via the antenna 13. can do.

 In the present embodiment, the case where the first adhesive layer 41 and the weak adhesive layer 42 are provided directly on the inlet 14 is illustrated, but the present invention is not limited to this. In the present invention, the inlet is sandwiched between the pair of base materials via the adhesive layer, and the first adhesive layer is provided at a position corresponding to the IC chip of the inlet on one of the base materials. A weak adhesive layer may be provided near the periphery of the adhesive layer.

(3) Third Embodiment FIG. 5 is a schematic cross-sectional view showing a third embodiment of the contactless data receiving / transmitting body of the present invention.
In FIG. 5, the same components as those of the non-contact type data receiving / transmitting body 10 shown in FIG.
The non-contact type data transmitting / receiving body 50 of the present embodiment is provided on the first base 11 having a substantially rectangular shape in plan view, and one surface 11a of the first base 11 and are electrically connected to each other. The first adhesive layer is sandwiched between the inlet 14 having the chip 12 and the antenna 13, the first adhesive layer 51 provided so as to cover the IC chip 12, the second adhesive layer 52, and the third adhesive layer 53. 51, which is provided near the periphery of 51, can be peeled off, and is difficult to reattach after peeling, and the first adhesive layer 51 and the third adhesive layer 53 are stacked on the inlet 14 via the first adhesive layer 51 and the third adhesive layer 53. Adhesive layer 56 provided on two substrates 55 and a surface (hereinafter referred to as “one surface”) 55a opposite to the surface facing the inlet 14 of second substrate 55, and an adhesive layer 56 is generally composed of a release material 57.

 That the release material 57 covers the adhesive layer 56 means that the release material 57 is the surface opposite to the surface in contact with the second base material 55 in the adhesive layer 56 (hereinafter referred to as “one surface”). .) It is provided so as to cover 56a.

 The weak adhesive layer 54 includes a first weak adhesive layer 54A and a second weak adhesive layer 54B that are stacked (attached) in the thickness direction of the non-contact type data transmitting / receiving body 50.

As the 1st contact bonding layer 51, the 2nd contact bonding layer 52, and the 3rd contact bonding layer 53, the thing similar to the above-mentioned 1st contact bonding layer 41 and the 2nd contact bonding layer 43 is used.
As the weak adhesive layer 54, the same thing as the above-mentioned weak adhesive layer 42 is used.
As the 2nd base material 55, the thing similar to the above-mentioned 1st base material 11 is used.
As the adhesive layer 56, the thing similar to the above-mentioned adhesive layer 15 is used.
As the peeling material 57, the thing similar to the above-mentioned peeling material 16 is used.

Next, referring to FIG. 6, regarding the operation of the non-contact type data receiving / transmitting body 50, the non-contact type data receiving / transmitting body 50 is attached to a metal article, and the non-contact type data receiving / transmitting body 50 is used to A case where product management is performed will be described as an example.
FIG. 6 is a schematic cross-sectional view showing a method of using the non-contact type data receiving / transmitting body 50.

 First, the release material 57 is peeled off, and the non-contact type data transmitter / receiver 50 is attached to the one surface 30 a of the metal article 30 through the adhesive layer 56.

Next, the first weak adhesive layer 54A and the second weak adhesive layer 54B are separated, and the first weak adhesive layer 54A and the second weak adhesive layer 54B are separated. Then, the antenna 13 is disposed away from the metal article 30. In particular, when the one surface 30 a of the metal article 30 is a curved surface or a spherical surface, the antenna 13 is separated from the metal article 30 by attaching the non-contact type data receiving / transmitting body 50 to the one surface 30 a of the metal article 30. Can be arranged.
Therefore, in this state, when the antenna of the information writing / reading device is opposed to the non-contact type data transmitting / receiving body 50, a current flows through the antenna 13 by electromagnetic induction from the information writing / reading device.
Then, when the current flowing through the antenna 13 is supplied to the IC chip 12, information is written from the information writing / reading device to the IC chip 13 via the antenna 13, or information written to the IC chip 12. Is read by the information writing / reading device via the antenna 13.

 The distance at which the non-contact type data receiving / transmitting body 50 is separated from the one surface 30a of the metal article 30 is not particularly limited, and the non-contact type data receiving / transmitting body 50 is in contact with the one surface 30a of the metal article 30. Otherwise, information is written from the information writing / reading device to the IC chip 12 via the antenna 13, or the information written to the IC chip 12 is read by the information writing / reading device via the antenna 13. can do.

 Moreover, although the case where the 1st contact bonding layer 51 and the 2nd contact bonding layer 52 were provided directly with respect to the inlet 14 was illustrated in this embodiment, this invention is not limited to this. In the present invention, the inlet is sandwiched between the pair of base materials via the adhesive layer, and the first adhesive layer is provided at a position corresponding to the IC chip of the inlet on one of the base materials. A second adhesive layer may be provided near the periphery of the adhesive layer.

(4) Fourth Embodiment FIG. 7 is a schematic cross-sectional view showing a fourth embodiment of the contactless data receiving / transmitting body of the present invention.
In FIG. 7, the same components as those of the non-contact type data receiving / transmitting body 10 shown in FIG.
The non-contact type data receiving / transmitting body 60 of the present embodiment includes a first base 61 having a substantially rectangular shape in plan view, and ICs provided on one surface 61a of the first base 61 and electrically connected to each other. The inlet 62 having the chip 12 and the antenna 13, the adhesive layer 63 provided on the other surface 61 b of the first base material 61, and the adhesive layer 63 that covers the adhesive layer 63 are roughly configured.

 That the release material 64 covers the adhesive layer 63 means that the release material 64 is a surface opposite to the surface in contact with the first base material 61 in the adhesive layer 63 (hereinafter referred to as “one surface”). .) It is provided so as to cover 63a.

The first base member 61 is provided on the opposite side of the surface (one surface) 61a on which the IC chip 12 and the antenna 13 are provided from both end surfaces 61c and 61d of the first base member 61. Clearances 61e and 61f are formed in the direction perpendicular to the thickness direction. Thereby, the 1st base material 61 has the 1st end part 61A and the 2nd end part 61B which were piled up at predetermined intervals in both ends.
The widths of the gaps 61e and 61f, that is, the interval between the first end 61A and the second end 61B is not particularly limited, and is such that the first end 61A and the second end 61B do not contact each other. If it is.
Further, the depths of the gaps 61e and 61f, that is, the distance from the end surface 61c of the gap 61e to the inner side surface of the gap 61e, and the distance from the end surface 61d of the gap 61f to the inner side surface of the gap 61f are not particularly limited. Absent.

As the 1st base material 61, the thing similar to the above-mentioned 1st base material 11 is used.
As the adhesive layer 63, the thing similar to the above-mentioned adhesive layer 15 is used.
As the peeling material 64, the thing similar to the above-mentioned peeling material 16 is used.

Next, referring to FIG. 8, regarding the operation of the non-contact type data receiving / transmitting body 60, the non-contact type data receiving / transmitting body 60 is affixed to a metal article, and the non-contact type data receiving / transmitting body 60 is used to A case where product management is performed will be described as an example.
FIG. 8 is a schematic cross-sectional view showing a method for using the non-contact type data receiving / transmitting body 60.

The release material 64 is peeled off, and the non-contact type data receiving / transmitting body 60 is attached to the one surface 30 a of the metal article 30 through the adhesive layer 63.
Then, a gap is generated between the first end portion 61A and the second end portion 61B by at least the width of the gaps 61e and 61f, and as a result, the antenna 13 is disposed away from the metal article 30. In particular, when the one surface 30 a of the metal article 30 is a curved surface or a spherical surface, the antenna 13 is separated from the metal article 30 by attaching the non-contact type data receiving / transmitting body 60 to the one surface 30 a of the metal article 30. Can be arranged.
Therefore, in this state, when the antenna of the information writing / reading device is opposed to the non-contact type data receiving / transmitting body 60, a current flows through the antenna 13 by electromagnetic induction from the information writing / reading device.
Then, when the current flowing through the antenna 13 is supplied to the IC chip 12, information is written from the information writing / reading device to the IC chip 13 via the antenna 13, or information written to the IC chip 12. Is read by the information writing / reading device via the antenna 13.

 The distance at which the non-contact type data receiving / transmitting body 60 is separated from the one surface 30 a of the metal article 30 is not particularly limited, and the non-contact type data receiving / transmitting body 60 is in contact with the one surface 30 a of the metal article 30. Otherwise, information is written from the information writing / reading device to the IC chip 12 via the antenna 13, or the information written to the IC chip 12 is read by the information writing / reading device via the antenna 13. can do.

 Moreover, although the case where the clearance gaps 61e and 61f were directly provided in the 1st base material 61 which comprises the inlet 62 was illustrated in this embodiment, this invention is not limited to this. In the present invention, the inlet is sandwiched between the pair of base materials through the adhesive layer, and a gap is formed in one of the base materials from the both end surfaces in the direction perpendicular to the thickness direction of the base material. May be. Moreover, you may cover the surface in which the IC chip and antenna of the 1st base material which comprise an inlet were provided with another base material through the adhesive agent.

10, 40, 50, 60 ... non-contact type data receiving / transmitting body, 11, 61 ... first substrate, 12 ... IC chip, 13 ... antenna, 14, 62 ... inlet, 15, 45, 56, 63 ... adhesive layer, 16, 46, 57, 64 ... release material, 41, 51 ... first adhesive layer, 42, 54 ... weak adhesive layer, 43, 52 ... second adhesive layer, 44, 55 ... second substrate, 53 ... third adhesive layer.

Claims (3)

A non-contact type data receiving / transmitting body including an inlet having a first base material, and an IC chip and an antenna provided on the first base material and electrically connected to each other,
An adhesive layer is provided at least at a position facing the IC chip, and the adhesive layer is covered with a release material ,
A first adhesive layer that covers the IC chip is provided, and a weak adhesive layer that can be peeled around the first adhesive layer and difficult to reapply after peeling is provided, and the second adhesive layer is provided on the weak adhesive layer. An adhesive layer is laminated, a second substrate is laminated on the inlet via the first adhesive layer and the second adhesive layer, and the surface of the second substrate opposite to the surface facing the inlet The contact layer is provided with the adhesive layer, and the adhesive layer is covered with the release material . A non-contact type data receiving / transmitting body including an inlet having a first base material, and an IC chip and an antenna provided on the first base material and electrically connected to each other,
An adhesive layer is provided at least at a position facing the IC chip, and the adhesive layer is covered with a release material,
A first adhesive layer that covers the IC chip is provided, and a weak adhesive layer that can be peeled around the first adhesive layer and difficult to reapply after peeling is provided by the second adhesive layer and the third adhesive layer. The second base material is laminated on the inlet via the first adhesive layer and the third adhesive layer, and is opposite to the surface facing the inlet of the second base material. the surface of the side, the bonded wear layer is provided, you wherein bonded wear layer is covered with the release material contactless data reception and transmission body. A non-contact type data receiving / transmitting body including an inlet having a first base material, and an IC chip and an antenna provided on the first base material and electrically connected to each other,
An adhesive layer is provided at least at a position facing the IC chip, and the adhesive layer is covered with a release material,
A gap is formed in the first base material on the opposite side of the surface on which the IC chip and the antenna are provided from both ends of the first base material in a direction perpendicular to the thickness direction of the first base material. The adhesive layer is provided on the surface of the first base material opposite to the surface on which the IC chip and the antenna are provided, and the adhesive layer is covered with the release material. contactless data reception and transmission body shall be the.

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