JP5804605B2 - PCB case unit - Google Patents

Description

  The present invention relates to a board case unit that houses a control board used for controlling a gaming machine.

A gaming machine such as a pachinko gaming machine is provided with a control board that controls the operation of an electronic component mounted on the gaming machine. For example, a control board called a main control board or a main control board is equipped with a ROM in which game machine control software is written, and has a role as a central control device for overall control of the game machine operation. doing. For this reason, the control board of the gaming machine is likely to be a target of action such as replacement with a counterfeit ROM or addition of an illegal circuit.

In order to prevent such dishonest act and provide a fair game, the control board is a board case comprising a case body formed of a transparent resin material and a case lid that can be opened and closed in front of the case body. Is housed inside. Further, when the case lid is attached to the case body in a closed state, the engagement portion formed on the case body side and the engagement portion formed on the case lid side are engaged and connected to the board case. In this way, the substrate case is locked in a closed state, and the connecting case that connects between the case lid (or case body) and its engaging portion is not opened with a tool such as a nipper. A prevention structure is provided (see, for example, Patent Document 1).

JP 2004-65280 A

However, fraudulent acts on control boards are becoming more sophisticated, and there is a need for measures to prevent such fraudulent acts more reliably.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a board case unit that can more reliably prevent an illegal act on a control board.

In order to achieve such an object, the substrate case unit according to the present invention includes a first case member (for example, the bottom case 120 in the embodiment) and a second case member (for example, in the embodiment) that are mounted to be openable and closable. In a state in which the top case 130 is provided and the first case member and the second case member are combined, a control board (for example, in the embodiment) is formed inside the case surrounded by the first case member and the second case member. A circuit board unit (for example, the main control circuit board case unit 100 in the embodiment) that houses the main control circuit board 41), and the control circuit board is attached to one of the first case member and the second case member. Board and electronic components disposed at a predetermined mounting position on the circuit board (for example, ROM 41 in the embodiment) And a first cover member (for example, the first protective cover 180 in the embodiment) that is provided on the electronic component placement surface side of the circuit board and surrounds the electronic component, and the circuit board. A second cover member (for example, the second protective cover 190 in the embodiment) provided at a position aligned with the mounting position on the side opposite to the surface, and holding the electronic component at the mounting position of the circuit board. A socket member (for example, an IC socket 170 in the embodiment) that is attached and electrically connects the electronic component and the circuit board, and the circuit board has a through-hole penetrating front and back at the mounting position. Formed, the first cover member and the second cover member are connected through the through hole through the socket member, the socket member, A socket main body on which a child component is mounted; and a coupling portion provided outside the socket main body. The first cover member is welded or bonded to an end of the coupling portion on the arrangement surface side. In addition to being connected, the second cover member is connected to the end of the coupling portion on the opposite surface side by welding or adhesion.

  According to the present invention, it is possible to more reliably prevent fraudulent acts on the control board.

It is a perspective view of the pachinko game machine provided with the main control board case unit concerning this embodiment. It is a rear view of the pachinko gaming machine. It is a disassembled perspective view of the said main control board case unit. It is a perspective view of a bottom case and a top case in the main control board case unit. It is a perspective view which shows the ROM protective cover structure with which the said main control board case unit was equipped. It is a disassembled perspective view which shows the said ROM protective cover structure. It is a top view which shows the said ROM protective cover structure. It is sectional drawing shown along the arrow VIII-VIII in FIG. It is a perspective view of the IC socket in the ROM protective cover structure. It is a top view of the said IC socket. It is sectional drawing shown along arrow XI-XI in FIG. It is a top view of the 1st protective cover in the said ROM protective cover structure. It is sectional drawing shown along the arrow XIII-XIII in FIG. It is a top view of the 2nd protective cover in the said ROM protective cover structure. It is sectional drawing shown along the arrow XV-XV in FIG. It is a disassembled perspective view which shows the modification of the said protective cover structure. It is sectional drawing which shows the modification of the said protective cover structure.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. As a representative example of a gaming machine provided with a substrate case unit according to the present invention, a perspective view and a rear view of a pachinko gaming machine PM are shown in FIGS. 1 and 2, and first, referring to this figure, the pachinko gaming machine PM The overall configuration will be described.

[Overall configuration of pachinko machines]
First, the basic structure of the front side of the pachinko gaming machine PM will be described with reference to FIG. As shown in FIG. 1, the pachinko gaming machine PM is configured with a rectangular frame size adapted to the front of the opening of the outer frame 1 which forms a vertically fixed holding frame configured in an outer rectangular frame size, and can be opened and closed. The front frame 2 that forms a frame is attached to the front left side edge portion of the front left and right hinge mechanism 3 so that it can be opened and closed sideways and detachable, and is called a double lock provided on the front right side edge portion. Device 4
Is always held in a closed state engaged and connected to the outer frame 1.

On the front frame 2, a rectangular glass frame 5 fitted to the upper front area of the front frame 2 is assembled so as to be opened and closed laterally and detachable using the upper and lower hinge mechanisms 3, and using the locking device 4 It is always kept in a closed state covering the front surface of the front frame 2. In the front frame 2, the game board 10 is detachably set and held, and the game area PA in front of the game board 10 is faced through the multi-layer glass 5a of the glass frame 5 that is always held closed. ing.

Upper and lower ball trays (upper ball tray 6a and lower ball tray 6b) for storing game balls are provided below the glass frame 5, and a launch handle 7 for performing a game ball launch operation on the front right side of the lower ball tray 6b. Is provided. On the front side of the glass frame 5, an electric decoration device 8 such as a light emitting diode (LED) or a lamp,
A speaker 9 is provided for generating sound effects according to the game development state.

Although the detailed illustration is omitted in FIG. 1, the game board 10 is a board with a decorative board that is molded by attaching a cell on which a predetermined pattern is printed to a rectangular laminated plywood that has been subjected to router processing or the like. A substantially circular game area PA is formed surrounded by upper and lower rail decorations. The game area PA is provided with game components such as a large number of game nails, windmills, central decorations, an effect display device that displays a predetermined image according to the progress of the game, and various winning holes. At the lower end of the game board, an out port is formed through the game board 10 in the front-rear direction for discharging the game ball that has fallen to the back side without falling into the winning port.

Next, the basic structure of the back side of the pachinko gaming machine PM will be described with reference to FIG. On the back side of the front frame 2, there is a back set board 30, which has a window that communicates with the front and rear in the center and is based on a base frame that is formed in a rectangular frame shape somewhat smaller than the front frame 2. Via the hinge mechanism 3, it is connected to the back of the front frame 2 so that it can be opened, closed, and detached. A back set cover 30C having a rectangular box shape with an open front is detachably attached to the back set board 30 and is always attached to the front frame 2.
(The main control board case unit 100 and the effect control board case unit 200 which will be described later are arranged on the back set cover 3).
Covered by 0C).

Each part of the back set board 30 includes a ball storage tank 31 for storing a large number of game balls, a tank rail 32 extending from the ball storage tank 31 with a gentle downward slope to the right, and a tank rail 32.
A ball supply passage member 33 that extends to the right end of the ball and extends downward, a prize ball payout unit 34 that pays out a game ball guided by the ball supply passage member 33, and a game ball paid out from the prize ball payout unit 34. A prize ball passage member 35 and the like for leading to 6 are provided.

On the back side of the game board 10 is a main control board 4 for comprehensively controlling the operation of the pachinko machine PM.
1 (main control board case unit 100), an effect control board 42 (effect control board case unit 200) for controlling the overall effects such as image display, effect lighting, and sound effects according to game development are attached. . On the other hand, on the back side of the back set board 30, a payout control board 43 (payout control board case unit 300) that performs control related to the launch and payout of game balls.
And a power supply board 4 that receives power from the game facility side and supplies power to various control boards and electrical / electronic components.
4 (power supply board case unit 400) and the like are attached. These control boards and electrical / electronic components of each part of the pachinko gaming machine PM are connected by a harness (connector cable) so that the pachinko gaming machine PM can be operated.

The pachinko gaming machine PM is used for a game in which the outer frame 1 is fixedly installed on the gaming island (installation frame base) of the gaming facility, the front frame 2, the glass frame 5 and the like are closed and locked, and is placed on the upper ball tray 6a. The game is started by storing the game ball and rotating the launch handle 7. When the firing handle 7 is turned, the game balls stored in the upper ball tray 6a are sent to the launching mechanism one by one by the ball feeding mechanism disposed on the back side of the glass frame 5, and the launching mechanism 7 After being launched into the game area PA, a pachinko game is developed thereafter.

[Configuration of main control board case unit]
Next, the configuration of the main control board case unit 100 according to the present embodiment will be described with reference to FIGS.
This will be described with additional reference. 3 is an exploded perspective view of the main control board case unit 100, and FIG. 4 is a perspective view of the bottom case and the top case in the main control board case unit 100. In the following description, for convenience of explanation, the vertical and horizontal directions are
The direction in the state of attachment to the pachinko gaming machine PM is defined with reference to the state of FIG. 3, and the directions of the arrows shown in FIG.

The main control board case unit 100 includes the above-described main control board 41 that plays a central role in the pachinko gaming machine PM, and a substantially rectangular container-like board case 11 that houses the main control board 41 therein.
0 is the main component.

The main control board 41 includes a CPU 411 serving as a control center, a ROM 412 that stores a program that prescribes arithmetic processing of the CPU 411, data handled by the CPU 411 (for example, various data generated during a game, and computer programs read from the ROM 412) RAM 413 as a work area for temporarily storing the
The main control relating to the game is performed by the operation of each drive circuit and the like according to the control program stored in FIG.

As shown in FIG. 3, the main control board 41 uses a rectangular printed wiring board as a board, and CP
IC packages such as U411, ROM412, and RAM413, and electronic / electrical components such as resistors, capacitors, and connectors are mounted. In the present embodiment, the main control board 41 has a ROM protective cover structure (details will be described later) for preventing unauthorized replacement of the ROM 412.
Is provided. The main control board 41 includes a board case 110 (a top case 1 described later).
30) and fixed to the inner surface side of the screw 30).

The board case 110 includes a bottom case 120 that is detachably attached to the back surface of the game board 10 and a top case 130 that is detachably attached to the bottom case 120. The top case 130 is attached to the bottom case 120. The right and left ends of the case, which are aligned in the closed state in the closed state, are provided with an unauthorized opening prevention structure and a sealing structure (both will be described in detail later). The bottom case 120 and the top case 130 are combined and integrated in a closed state in which the openings are opposed to each other. Both the bottom case 120 and the top case 130 are formed by a molding means such as injection molding using a transparent resin material (for example, polycarbonate), and the inside of the substrate case 110 is visible from the outside.

The bottom case 120 includes a bottom case main body 121 formed in a rectangular box shape having an opening on the rear surface side, and a bottom side lock portion 12 integrally formed at the right end of the bottom case main body 121.
2 and a bottom-side sealing portion 123 formed integrally with the left end portion of the bottom case main body 121. On the upper and lower side walls 121a of the bottom case main body 121, a plurality of bottom side slide engaging portions 121c that protrude rearward from the bottom portion 121b are formed side by side in the left-right direction.

The top case 130 includes a top case main body 131 formed in a rectangular box shape having an opening on the front surface side, a top side lock portion 132 integrally connected to a right end portion of the top case main body 131 via a connecting portion 132b, The top case main body 131 has a top-side sealing portion 133 formed integrally with the left end portion thereof, and is configured to be slidable with respect to the bottom case 120 in the left-right direction. The upper and lower side walls 131 a of the top case body 131 are provided on the side walls 13.
A top groove 131b having a concave groove shape that opens to the front side along the longitudinal direction (left and right direction) in which 1a extends and can receive the bottom side slide engaging portion 121c of the bottom case 120 is formed. In the portion 131b, a top-side slide engagement portion 131c that can be engaged with the bottom-side slide engagement portion 121c of the bottom case 120 is formed. The top case 130 is formed with a connector insertion / extraction opening 131d penetrating front and back corresponding to the mounting position of the connector (not shown) of the main control board 41, and the main control board 41 is attached to the top case 130. The connector of the main control board 41 is exposed to the outside through the connector insertion / extraction port 131d, and can be electrically connected to the effect control board 42, the payout control board 43, etc. via a harness (connector cable).

To assemble the top case 130 to the bottom case 120, as shown in FIG. 4, the top case 130 is opposed to the bottom case 120 in the front-rear direction with the top case 130 slightly shifted to the left. The bottom side slide engagement portion 121c of the bottom case 120 is inserted into the portion 131b, and the top case 130 is slid rightward (hereinafter also referred to as “closing direction”), whereby the bottom side slide engagement portion 121c and the top The side slide engaging part 131c is engaged. Thereby, the bottom case 120 and the top case 130 are attached in a closed state in which the openings are opposed to each other. And
In the closed state in which the top case 130 is assembled to the bottom case 120 in this way, the bottom side lock portion 122 and the top side lock portion 132 that are aligned in the front-rear form an unauthorized opening prevention structure, and the position alignment is also performed in the front-rear direction. The bottom-side sealing portion 123 and the top-side sealing portion 133 are configured to form a sealing structure. Furthermore, the substrate case 110
The main control board 41 housed in a sealed state is provided with a ROM protective cover structure for preventing unauthorized replacement of the ROM 412. Hereinafter, the unauthorized opening prevention structure, the seal seal structure, and the ROM protective cover structure provided in the main control board case unit 100 will be described in order.

<Illegal opening prevention structure>
The unauthorized opening prevention structure is also referred to as a so-called caulking structure and is a conventionally known configuration, and various configurations are employed as appropriate. In this embodiment, as shown in FIG. The bottom side lock portion 122 provided at the right end portion of the bottom case main body 121, the top side lock portion 132 provided at the right end portion of the top case main body 131 via the connecting portion 132b, the bottom side lock portion 122 and the top And a lock member 140 for engaging and connecting the side lock portion 132.

The bottom side lock part 122 has a bottom side lock hole 122a that opens rearward. The top side lock part 132 has a top side lock hole 132a formed through the front and back at a position aligned with the bottom side lock hole 122a in the front-rear direction. The caulking member 140 includes a shaft portion 141 extending in the front-rear direction and an operation portion 142 formed in a disk shape having a larger diameter than the shaft portion 141.
And a cylindrical lock pin 143 provided in a pin receiving hole (not shown) recessed in the shaft portion 141 and supported so as to be able to advance and retract in a direction orthogonal to the central axis of the shaft portion 141. Yes. The lock pin 143 is urged and disposed so that the tip of the pin protrudes outward from the shaft portion 141 by the repulsive force of a spring (not shown) provided in the pin accommodation hole.

In the caulking structure having such a configuration, the lock member 1 is closed in a state in which the substrate case 110 is closed and the bottom side lock portion 122 and the top side lock portion 132 are overlapped facing each other in the front-rear direction.
40 shaft portions 141 are inserted so as to straddle the main body side lock hole 122a and the lid side lock hole 132a, and the caulking member 140 is engaged and connected to the bottom side lock portion 122 and the top side lock portion 132. When the top case 130 is closed with respect to the bottom case 120, it cannot be removed (cannot be opened). To release the substrate case 110 from this state, the connecting portion 132b connecting the top case main body 131 and the top side lock portion 132 is cut and engaged with the bottom caulking portion 122 via the lock member 140. Connected top side crimping part 1
32 may be separated from the top case body 131.

<Sealed seal structure>
The sealing and sealing structure is a conventionally known configuration, and various configurations are appropriately employed. In this embodiment, as shown in FIG. 3 and the like, the bottom seal body 121 has a left end portion. The bottom side sealing portion 123 formed integrally connected, the top side sealing portion 133 formed integrally connected to the left end portion of the top case main body 131, and the bottom side sealing portion 122 are attached to the substrate case. The seal seal 150 seals the seal 110 and the cutter member 151 breaks the seal seal 140 when the substrate case 110 is opened.

The seal seal 150 is formed, for example, on the surface of a paper sheet member, in which an IC chip and an antenna wire connected thereto are covered with a transparent resin film. Various kinds of information stored in the IC chip (for example, pachinko) Information relating to the gaming machine PM, identification information of the main control board 41, and the like) can be read by the reader device from the outside of the board case 110 via the antenna line. The seal seal 150 is attached to the bottom side seal portion 123 in a state of being folded in a U shape.

The cutter member 151 is mounted so as to cover the sealing seal 150 attached to the bottom side sealing portion 122. When the substrate case 110 is closed, the cutter member 151 is attached to the bottom side sealing portion 123 to surround and protect the sealing seal 150 from the outside, while the substrate case 110 is opened, that is, the top case 130 is protected. When the bottom case 120 is slid in the left direction (hereinafter also referred to as “opening direction”), the bottom case 120 is attached to the bottom side sealing part 123 by moving in the opening direction in cooperation with the top side sealing part 133. The attached seal seal 150 is broken so as not to be regenerated.

By the way, in recent years, there has been a situation in which the substrate case 110 is opened by a clever trick by Goto without leaving any traces on the unauthorized opening prevention structure and the sealing structure. If the board case 110 is illegally opened, the legitimate ROM 412 mounted on the main control board 41 is extracted in order to illegally acquire a large number of prize balls, and the program is replaced with an illegal ROM that has been tampered with. There is a problem. Therefore, in the present embodiment, a ROM protective cover structure, which will be described in detail below, is provided in order to prevent such illegal acts.

<ROM protective cover structure>
Now, the ROM protective cover structure, which is a characteristic configuration of this embodiment, will be described with reference to FIGS. Here, FIG. 5 is a perspective view showing a ROM protective cover structure, and FIG.
7 is an exploded perspective view showing the M protective cover structure, FIG. 7 is a plan view showing the ROM protective cover structure, FIG. 8 is a sectional view taken along arrows VIII-VIII in FIG. 7, FIG. 9 is a perspective view of the IC socket, and FIG.
Is a plan view of the IC socket, FIG. 11 is a sectional view taken along arrows XI-XI in FIG.
2 is a plan view of the first protective cover, FIG. 13 is a sectional view taken along arrows XIII-XIII in FIG. 12, FIG. 14 is a plan view of the second protective cover, and FIG. 15 is taken along arrows XV-XV in FIG. FIG. 5 to 15, only the main part is extracted from the main control board 41 for easy understanding of the description.

The ROM protection cover structure includes a ROM 412 as an IC package, an IC socket 170 placed and held on the main control board 41, and a first protection that is welded and bonded to the IC socket 170 to conceal the ROM 412. A cover 180 and a second protective cover 190 that is welded and bonded to the IC socket 170 to conceal the soldered portion of the ROM 412 with respect to the main control board 41 are configured. In this ROM protective cover structure, the first protective cover 180 is disposed on the top case 130 side, and the second protective cover 190 is disposed on the bottom case 120 side.

The ROM (IC package) 412 is configured by a plurality of terminal pins (not shown) connected in a row at predetermined intervals to an IC body 412a formed in a flat rectangular parallelepiped shape. In the present embodiment, the ROM 412 is detachably attached to the IC socket 170 and is electrically connected to the main control board 41. By using the IC socket 170 in this manner, a program or the like can be upgraded. If the data is to be revised at this time, the ROM 4
Since it is only necessary to replace 12 with a new upgraded ROM, the replacement work is facilitated as compared with the method of replacing the entire board.

The IC socket 170 is electrically connected to a socket body 171 formed using a thermoplastic insulating resin material (for example, PBT) and a terminal pin (not shown) of the ROM 412 held by the socket body 171. Connected to the main control board 4.
1 is soldered and mounted at a predetermined ROM mounting position. The socket main body 171 includes a pair of base portions 172 disposed substantially in parallel with a predetermined interval, and four connecting portions 173 that connect the base portions 172 to each other, and is formed in a rectangular frame shape as a whole. Each base 172 is provided with a terminal insertion hole 174 that can receive a terminal pin of the ROM 412, and a connection pin 175 is press-fitted and connected to the terminal insertion hole 174. The terminal insertion holes 174 and the connection pins 175 are provided in the same number and at the same intervals as the terminal pins at a position aligned with the terminal pins of the ROM 412. In such a configuration, the ROM 4
12 is mounted on the socket body 171, terminal pins (not shown) of the ROM 412 and IC
The connection pins 175 of the socket 170 are contact-connected.

A cylindrical shaft-like shape extending in parallel with the axial direction of the connection pin 175 is provided at each corner portion (end portion in the longitudinal direction of the base portion 172) located on one of the four corners of the socket body 171 having a substantially rectangular frame shape. A welded portion 176 is integrally formed. The welded portion 176 is formed to be insertable into a through hole 419 (see FIG. 4) penetrating the main control board 41. On each end face in the longitudinal direction of the welded portion 176, a hook-shaped convex portion 177 is integrally formed in a sectional view. The convex portion 177 is a portion that serves as a welding allowance when the IC socket 170 and the protective covers 180 and 190 are welded. By appropriately setting the size of the welding allowance (convex portion 177), the bonding strength with each of the cover members 180 and 190 is ensured, and the proof strength against unauthorized opening is increased. In the present embodiment, the convex portion 177 as the welding allowance projects in the axial direction by about 0.3 to 0.5 mm with respect to each end face of the welded portion 176.

The first protective cover 180 has a bottom wall 181 and four side walls 182 erected from the periphery of the bottom wall 181, and is entirely formed by a molding means such as injection molding using a thermoplastic synthetic resin material. Are formed in a rectangular box shape in which the side facing the surface of the main control board 41 is opened. The first protective cover 180 has a RAM accommodating space 183 surrounded by the bottom wall 181 and the four side walls 182, and the RAM 412 attached to the IC socket 170 is covered in the RAM accommodating space 183. It is like that. In addition, on the left and right side walls 182 of the first protective cover 180, a substantially tongue-shaped first weld receiving portion 184 is provided projecting outward in the left and right directions at a position aligned with the weld portion 176 of the IC socket 170. The first weld receiving portion 184 is formed with a concave portion 185 for receiving the convex portion 177. By joining the first welding receiver 184 and the welding part 176 of the IC socket 170 using a predetermined welding method in a state where the convex part 177 of the welding part 176 is received in the concave part 185 of the first welding receiver 184. The first protective cover 180 is connected to the IC socket 170 so as to conceal the RAM 421.

The second protective cover 190 has a bottom wall 191 and four side walls 192 erected from the periphery of the bottom wall 191, and is entirely formed by a molding means such as injection molding using a thermoplastic synthetic resin material. Are formed in a rectangular box shape in which the side facing the back surface of the main control board 41 is opened. The second protective cover 190 is formed with a connection pin accommodating space 193 surrounded by the bottom wall 191 and the four side walls 192, and a soldered portion of the connection pin 175 in the IC socket 170 in the connection pin accommodating space 193. Is to be covered. In addition, the left and right side walls 182 of the second protective cover 180 are aligned with the welded portion 176 of the IC socket 170.
A second welding receiving portion 194 having a substantially tongue-like shape is provided so as to project outward in the left and right directions. This second welding receiving portion 1
A concave portion 195 for receiving the convex portion 177 is formed in 94. Second weld receiver 194
The second protective cover 190 is joined by joining the second weld receiving part 194 and the welded part 176 of the IC socket 170 using a predetermined welding method in a state in which the convex part 177 of the welded part 176 is received in the concave part 195 of the second socket 195. In the form of concealing the soldered portion of the connection pin 175 to the main control board 41
Connected to C socket.

[Operation of main control board case unit]
Next, the operation when assembling the main control board case unit 100 according to the present embodiment will be described.

To assemble the main control board case unit 100, first, terminal pins (not shown) of the ROM 412 are inserted into the terminal insertion holes 174 of the IC socket 170, and the ROM 412 is mounted in the IC socket 170. As a result, the terminal pins (not shown) of the ROM 412 and the IC
The connection pin 175 of the socket 170 is contact-connected through the terminal insertion hole 174. Then, the IC socket 170 to which the ROM 412 is attached is connected to a predetermined ROM on the main control board 41.
Install in the mounting position. In the ROM mounting position of the main control board 41, a plurality of through holes (not shown) are penetrated on the front and back sides at positions aligned with the connection pins 175 of the IC socket 170, and each connection pin 175 is inserted into the through hole. At the same time, the connection pins 175 are soldered on the back side of the main control board 41. At the same time, the welding portion 176 of the IC socket 170 is inserted into the through hole 419 of the main control board 41, and one convex portion (welding allowance) 177 of the welding portion 176 is arranged on the surface side of the main control board 41. And the other convex portion of the welded portion 176 (
The welding margin 177 is arranged on the back side of the main control board 41.

After the ROM 412 is mounted on the main control board 41 via the IC socket 170 in this way, the first weld receiving portion 184 of the first protective cover 180 is aligned with the weld portion 176 of the IC socket 170, and the first protective cover 180 is attached to the IC. Put on the socket 170. And, for example, by using a known welding method such as ultrasonic welding, by melting the convex portion 177 as a welding margin,
The first weld receiving part 184 of the first protective cover 180 and the weld part 176 of the IC socket 170 are welded in a substantially flush state. Here, the ultrasonic welding is to weld the welding portion 176 and the welding receiving portion 184 in a polymerized state by applying pressure simultaneously with ultrasonic vibration to melt the welding margin and join them together. As a result, the first protective cover 180 is mounted on the IC socket 170 so as to enclose the ROM 412, and the ROM 412 is substantially sealed and concealed by the first protective cover 180.

Subsequently, the second weld receiving part of the second protective cover 190 is aligned with the welded part of the IC socket 170, and the second protective cover 190 is applied to the ROM mounting position on the back side of the main control board 41. Then, similarly to the above, the second weld receiving portion 194 of the second protective cover 190 and the IC are melted by using a known welding method such as ultrasonic welding to melt the convex portion 177 as a welding allowance.
The welding part 176 of the socket 170 is welded in a substantially flush state. As a result, the second protective cover 190 is disposed on the back side of the main control board 41, and the soldered portions of the connection pins 175 to the main control board 41 are substantially sealed and concealed by the second protective cover 190.

Subsequently, the main control board 41 on which the RAM 412 is mounted is fixed to the inner surface side of the top case 130 with screws. On the other hand, the bottom case 120 has a seal 1 on the bottom side sealing portion 123.
After attaching 50, the cutter member 151 is mounted so as to cover it.

Then, the top case 130 is slid onto the bottom case 120 and the substrate case 1
10 is closed. As a result, the main control board 41 is housed in the board case 110 in a closed state. In this closed state, the shaft portion 141 of the lock member 140 is inserted into the bottom side lock portion 122 and the top side lock portion 132, and the bottom side lock portion 122 and the top side lock portion 132 are engaged via the lock member 140. By connecting together, the bottom case 120
And the top case 130 are locked and fixed so that they cannot be opened. Therefore, the top case 130
The board case 110 is not opened unless the top side lock part 132 in a state in which the connection part 132b is broken and engaged with the bottom side lock part 122 is separated from the top case body 131.

On the other hand, when the substrate case 110 is opened improperly, the sealing seal 150 is broken by the cutter member 151, so that traces of opening the substrate case 110 remain clearly and the IC of the sealing seal 150 Various information stored in the chip becomes substantially unreadable.

Furthermore, even when the substrate case 110 is opened, the first side of the main control board 41 is the first side.
The ROM 412 is surrounded by the protective cover 180, while the soldering portion for the main control board 41 is concealed by the second protective cover 190 on the back side of the main control board 41. This makes it possible to prevent illegal acts such as unauthorized removal or replacement of the ROM 412.

As described above, according to the main control board case unit 100 according to the present embodiment, the first protective cover 1
80 and the second protective cover 190 surround the ROM 412 in such a manner that the IC socket 170 is sandwiched from the front and back of the main control board 41 at the same time and conceal the soldered portion with respect to the main control board 41, so that both the protective covers 180 and 190 are not destroyed. As long as the ROM 412 cannot be replaced. For this reason, it is possible to make it difficult to receive unauthorized actions such as replacement or modification of the electronic component (ROM 412) with respect to the main control board 41. In addition, when both the protective covers 180 and 190 are destroyed for the purpose of unauthorized access to the ROM 412, they remain clearly as traces of unauthorized acts, so that unauthorized acts such as unauthorized removal or replacement of the ROM 412 are promoted early. Can be found. Therefore, according to the present embodiment, there is an effect that it becomes possible to contribute to prevention and early detection of fraud.

In addition, this invention is not limited to the said embodiment, If it is a range which does not deviate from the summary of this invention, it can improve suitably.

In the above-described embodiment, the ROM 412 as an IC package is connected to the main control board 41 via the IC socket 170, but is not limited to this configuration. For example, as shown in FIGS. A configuration in which the IC socket 170 is not required and may be directly attached (direct soldering) to the main control board 41 may be employed. In the case of adopting this configuration, as shown in FIGS. 16 and 17, a substantially tongue-shaped weld receiving portion 184 'is formed on the first protective cover 180', and the main control board is formed on the second protective cover 190 '. A cylindrical shaft-shaped welded portion 194 ′ inserted into the through hole 419 of the 41 is formed, and the first protective cover 180 ′ is formed through the through hole 419 of the main control board 41.
By welding and welding the weld receiving portion 184 ′ and the weld portion 194 ′ of the second protective cover 190,
What is necessary is just to comprise so that ROM412 may be included by the 1st protective cover 180 and the 2nd protective cover 190. FIG. Therefore, even when the ROM 412 is directly attached to the main control board 41 as described above, the ROM 412 is surrounded by the first protective cover 180 on the front surface side of the main control board 41, while the second protection is provided on the back side of the main control board 41. Since the soldered portion of the ROM 412 with respect to the main control board 41 is concealed by the cover 190, it becomes very difficult to access the ROM 412, and illegal acts such as unauthorized removal or replacement of the ROM 412 are prevented in advance. Is possible.

In the above-described embodiment, among the electronic components (IC packages) mounted on the main control board, the ROM 412 is the target of the protective cover structure. However, the present invention is not limited to this configuration, and the CPU 411, the RAM 413, etc. Other electronic components may be the target of the protective cover structure.

In the above-described embodiment, the case where the IC socket 170 and the protective covers 180 and 190 are joined by ultrasonic welding has been described as an example. However, the present invention is not limited to this, and thermal welding, high-frequency welding, spin Other welding methods such as welding and laser welding may be used. Among these, ultrasonic welding and laser welding can be suitably used for welding the protective cover structure in the present embodiment because the mechanical strength and appearance are good as a method for joining resin molded products. Further, the welding method is not limited, and the IC socket 170 and the protective covers 180 and 190 may be bonded together using, for example, a phenol resin-based, epoxy-based, or ethylene-based adhesive.

In the above-described embodiment, the slide open / close type substrate case unit has been described as an example. However, the present invention is not limited to this configuration, and may be another substrate case unit such as a hinge open / close type.

In the above-described embodiment, the substrate case unit having both the unauthorized opening prevention structure and the sealing structure is applied. However, the present invention is not limited to this configuration, and the substrate case unit has only the unauthorized opening prevention structure. There may be.

In the above-described embodiment, the case where the board case unit according to the present invention is applied to the main control board case unit of the pachinko game machine is described as an example, but the present invention is not limited to this, and the production control board It may be applied to other board case units such as a case unit and a payout control board case unit, and further, the same effect can be obtained when applied to a gaming machine other than a pachinko gaming machine, for example, a board case unit of a slot machine. It is possible to obtain.

PM Pachinko machine 1 Outer frame 2 Front frame 5 Glass door 10 Game board 41 Main control board (control board)
100 Main control board case unit (board case unit)
110 Substrate case 120 Bottom case (first case member)
121 Bottom case body 130 Top case (second case member)
131 Top case body 170 IC socket (socket member)
171 Socket body 175 Connection pin 176 Welding part (joining part)
180 First protective cover (first cover member)
190 Second protective cover (second cover member)
412 ROM (electronic components)
419 Through hole

Claims (1)

A first case member and a second case member, which are mounted so as to be openable and closable with each other, are surrounded by the first case member and the second case member in a state where the first case member and the second case member are combined. A board case unit for accommodating the control board in a case formed by
The control board includes a circuit board attached to any one of the first case member and the second case member, and an electronic component disposed at a predetermined mounting position on the circuit board,
A first cover member that is provided on a side of the circuit board on which the electronic component is disposed and surrounds the electronic component;
A second cover member provided at a position aligned with the mounting position on the opposite side of the circuit board from the arrangement surface;
A socket member that holds the electronic component and is attached to the mounting position of the circuit board, and electrically connects the electronic component and the circuit board;
The circuit board is formed with a through-hole penetrating front and back at the mounting position, and the first cover member and the second cover member are connected through the through-hole through the socket member,
The socket member includes a socket main body on which the electronic component is mounted, and a coupling portion provided outside the socket main body.
The first cover member is connected to an end portion of the coupling portion on the arrangement surface side by welding or adhesion, and the second cover member is welded or adhered to an end portion of the coupling portion on the opposite surface side. The board case unit is connected by

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