JP5803399B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring board. More specifically, the present invention relates to a method of manufacturing a wiring board that can easily exhibit a high adhesive force to a wiring conductor even when the uneven shape on the surface of the insulating resin layer is small.

  As electronic devices are further reduced in size, weight, and functionality, LSIs and chip components have been highly integrated, and their forms are rapidly changing to more pins and smaller sizes. For this reason, in order to improve the mounting density of electronic components, development of a wiring board that can cope with miniaturization is underway. As such a wiring board, there is a build-up type wiring board that uses an insulating resin that does not contain glass cloth instead of a prepreg, and performs interlayer connection with via holes only at necessary portions to form a wiring layer. It is becoming mainstream as a method suitable for miniaturization and miniaturization.

In this build-up type wiring board, first, an insulating resin layer is formed on a substrate having a circuit. And after hardening an insulating resin layer, in order to ensure the adhesive force with a wiring conductor, the insulating resin layer surface is immersed in an oxidizing process liquid, and a roughening process is performed. Next, electroless plating is performed by pre-plating treatment. Furthermore, after forming a resist pattern on the electroless plating layer and thickening by electroplating, the resist pattern is peeled off and the electroless plating layer is removed to obtain a wiring board.
However, with the miniaturization of wiring, the unevenness on the surface of the insulating resin layer formed by roughening the surface of the insulating resin layer causes a decrease in the yield of wiring formation. The reason for this is that the electroless metal plating layer bites into the irregularities on the surface of the insulating resin layer and remains without being removed during etching, causing a short circuit of the wiring or forming a resist pattern due to the irregularities on the surface of the insulating resin layer. This is because accuracy decreases.

  Therefore, reducing the unevenness on the surface of the insulating resin layer is important for realizing fine wiring. However, since the unevenness decreases, the adhesive force between the insulating resin layer and the electroless metal plating layer decreases. There was a need to solve the problem. Further, as the oxidizing roughening liquid used for forming irregularities on the surface of the insulating resin layer, a strong alkaline liquid containing sodium permanganate and sodium hydroxide is generally used. Sodium permanganate dissolves the resin under strong alkali. However, since 7-valent manganese is consumed in the oxidation treatment, it is necessary to regenerate manganese with an electrolytic regeneration device. Ordinary insulating resins are designed with increased resistance to the roughening solution in order to ensure insulation reliability and heat resistance. Therefore, management of manganese is important for stable roughening treatment. However, since the dissolved resin floats in the processing solution, the electrolytic regeneration of manganese is not in time, and it is necessary to frequently perform bathing of the solution. Since these are added with additional processes such as washing with water and waste liquid treatment, they have resulted in a decrease in productivity.

As described above, an insulating resin layer used for a build-up type wiring board is required to ensure an adhesive force even if the unevenness is small.
In addition, when forming irregularities on the surface of the insulating resin layer using a sodium permanganate-based roughening solution, it is important to be able to form irregularities on the surface of the sodium permanganate-based roughening solution without strict control. If the adhesive force on the surface of the insulating resin layer can be secured without using a roughening solution, it is more preferable.

In response to these requirements, Patent Document 1 irradiates an insulating resin layer using a polyphenylene ether resin with ultraviolet rays, does not use a sodium permanganate-based roughening solution, and has a high adhesive force with small unevenness. A technique for expressing it is disclosed.
Patent Document 2 discloses a technique for treating an insulating resin layer with an ultraviolet ray under an ozone solution.
Furthermore, Patent Documents 3 and 4 disclose techniques using an active ester group-containing compound for a resin composition.

JP 2004-214597 A JP 2005-5319 A JP 2003-82063 A JP 2006-278994 A

However, according to the techniques of Patent Literatures 1 to 4, via holes (holes for connecting between patterns), component insertion holes (holes to which component leads are inserted and connected), etc., while reducing the unevenness of the surface of the insulating resin, etc. It is difficult to remove smear in the hole.
That is, when a hole is provided in the insulating resin layer on the substrate, smear occurs in the hole. Conventionally, a desmear treatment in the hole has also been performed during the roughening treatment of the surface of the insulating resin layer using the roughening solution.
However, when ultraviolet irradiation is performed in place of the uneven treatment with the sodium permanganate-based roughening solution as in Patent Documents 1 and 2, the desmear treatment in the holes with the roughening solution is also omitted. As a result, the smear in the hole cannot be removed sufficiently.
In Patent Document 3, there is no description regarding desmear treatment in the hole, and there is no description regarding expression of adhesive force on the surface of the insulating resin layer.
In Patent Document 4, since the desmear treatment in the hole is performed using the roughening liquid as in the conventional case, the surface of the insulating resin layer is also roughened during the desmear treatment as in the conventional case.

  The present invention has been made under such circumstances, and the adhesive strength between the insulating resin layer and the wiring conductor is high and the smear in the hole is sufficiently removed despite the small unevenness of the surface of the insulating resin layer. An object of the present invention is to provide a method of manufacturing a wiring board capable of obtaining a wiring board.

As a result of intensive studies to achieve the above object, the present inventors have obtained the following knowledge.
That is, it has been found that the surface of the insulating resin layer can be prevented from becoming uneven by protecting the surface of the insulating resin layer with a support during the desmear treatment in the hole and then removing the support.
In addition, there is a problem in that the adhesive force between the surface of the insulating resin layer and the wiring may be insufficient unless irregularities are formed on the surface of the insulating resin layer during the desmear process (roughening process). It has been found that this problem can be solved by irradiating the surface of the insulating resin layer with ultraviolet rays to improve the adhesion to the wiring and then forming the wiring on the surface of the insulating resin layer.
The present invention has been completed based on such findings.

That is, the present invention provides the following [1] to [11].
[1] A method of manufacturing a wiring board having an insulating resin layer and wiring formed on the surface of the insulating resin layer, the laminate forming step of forming a laminate having the insulating resin layer and a support; A hole forming step for providing a hole in the laminate, a desmear treatment step for removing smear in the hole with a desmear treatment liquid, a support removal step for removing the support from the laminate, and an insulating resin layer Among the insulating resin layers, the support is removed after a wiring formation step of forming the wiring on the surface from which the support is removed, and after the laminate formation step and before the wiring formation step. A method of manufacturing a wiring board, comprising: an ultraviolet irradiation step of irradiating an applied surface with ultraviolet rays to improve adhesion to the wiring.
[2] The method for manufacturing a wiring board according to [1], wherein the support is a synthetic resin film.
[3] The method for manufacturing a wiring board according to [1], wherein the support is a metal foil.
[4] The method for manufacturing a wiring board according to [3], wherein the metal foil is a copper foil.
[5] The method for manufacturing a wiring board according to any one of [1] to [4], wherein the insulating resin layer is made of a thermosetting resin.
[6] The method for manufacturing a wiring board according to [5], wherein the insulating resin layer is obtained from an insulating resin composition containing an epoxy resin, a curing agent, and an epoxy resin curing accelerator.
[7] The method for manufacturing a wiring board according to [6], wherein the epoxy resin is an epoxy resin containing a hexanediol structure having two or more epoxy groups in one molecule.
[8] The method for manufacturing a wiring board according to [6] or [7], wherein the curing agent is an active ester group-containing compound.
[9] The method for producing a wiring board according to [8], wherein an active ester equivalent of the active ester group-containing compound is 0.75 to 1.25 equivalents relative to 1 epoxy equivalent of the epoxy resin.
[10] The method for producing a wiring board according to any one of [6] to [9], wherein the curing agent is an active ester group-containing compound having one or more ester groups in one molecule.
[11] In any one of [1] to [10], in the ultraviolet irradiation step, the insulating resin layer is irradiated with ultraviolet rays having a wavelength of 300 to 450 nm at an irradiation amount of 1000 to 5000 mJ / cm ² under atmospheric pressure. The manufacturing method of the wiring board as described in any one of.

  According to the present invention, it is possible to obtain a wiring board having high adhesion between the insulating resin layer and the wiring conductor and sufficiently removing smears in the via hole, although the unevenness on the surface of the insulating resin layer is small. is there.

It is sectional drawing explaining an example of the manufacturing method of the wiring board of this invention. It is sectional drawing explaining the other example of the manufacturing method of the wiring board of this invention.

A method for manufacturing a wiring board according to the present invention is a method for manufacturing a wiring board having an insulating resin layer and a wiring formed on a surface of the insulating resin layer, the laminate including the insulating resin layer and a support. Laminate forming step to form, hole forming step for providing holes in the laminate, desmear treatment step for removing smear in the holes with a desmear treatment liquid, and support removal step for removing the support from the laminate And a wiring forming step of forming the wiring on the surface of the insulating resin layer from which the support is removed, and after the insulating resin layer forming step with the support and before the wiring forming step, And a step of irradiating the surface of the insulating resin layer from which the support has been removed with an ultraviolet ray to improve the adhesion to the wiring.
Below, each process is demonstrated.

[Laminated body forming step]
In this step, an insulating resin layer with a support made of a laminate having an insulating resin layer and a support is formed.

<Support>
The material of the support is not particularly limited as long as it is difficult to dissolve in the desmear treatment liquid used in the desmear treatment step described later, and synthetic resin, metal, or the like is used. As the synthetic resin, a heat-resistant polyester film such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) is preferable. As the metal, copper is preferable.
The thickness of the support is not particularly limited as long as it is a thickness that dissolves in the course of the desmear treatment step and prevents a part of the surface of the insulating resin layer from being exposed, but is preferably about 10 to 200 μm. 20-100 micrometers is more preferable. When the support is copper, a low profile foil is preferable and a profile free foil is more preferable than a general copper foil from the viewpoint of reducing the unevenness of the surface of the insulating resin layer.
The surface roughness Ra of the support is preferably 0.12 μm or less, and more preferably 0.1 μm or less. Thereby, the unevenness | corrugation of the surface of the insulating resin layer which contacts the surface of this support body can be suppressed, and thinning of the wiring on the surface of the insulating resin layer can be achieved.

<Insulating resin layer>
≪Insulating resin composition≫
The insulating resin composition used as the material of the insulating resin layer is not particularly limited as long as the adhesive strength with the wiring is improved by ultraviolet irradiation, and a thermosetting resin is preferably used.
Preferably, the insulating resin composition used as the material of the insulating resin layer is one containing (A) an epoxy resin, (B) an active ester group-containing compound, and (C) an epoxy resin curing accelerator. Furthermore, an inorganic filler and various additive components can be contained as required within the range where the object of the present invention is not impaired.

((A) Epoxy resin)
The epoxy resin as the component (A) is preferably an epoxy resin having two or more epoxy resins in one molecule and containing a hexanediol structure. For example, cresol novolac type epoxy resin, phenol novolac type epoxy resin, naphthol novolac type epoxy resin, biphenyl novolac type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol T type epoxy resin, Bisphenol Z type epoxy resin, tetrabromobisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, tetramethylbiphenyl type epoxy resin, triphenyl type epoxy resin, tetraphenyl type epoxy resin, naphthol aralkyl type epoxy resin, Naphthalenediol aralkyl epoxy resin, naphthol aralkyl epoxy resin, fluorene epoxy resin, dicyclopentadiene Epoxy resins having a skeleton, epoxy resins having an ethylenically unsaturated compound in the skeleton, epoxy resins having alkanediol in the skeleton, for example, epoxy resins having ethanediol in the skeleton, epoxy resins having propanediol in the skeleton, butanediol Epoxy resin having skeleton, epoxy resin having pentanediol as skeleton, epoxy resin having hexanediol as skeleton, epoxy resin having heptane diol as skeleton, epoxy resin having octanediol as skeleton, alicyclic epoxy resin, etc. Is mentioned. In addition, when the insulating resin is treated with a sodium permanganate-based roughening solution to remove smear in holes such as via holes, the smear can be easily removed, and a finer roughened uneven shape is formed on the surface of the insulating resin. From the viewpoint of uniform formation, a resin containing a hydrocarbon in the epoxy resin skeleton is preferable. Cresol novolac epoxy resin, phenol novolac epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, ethylenically unsaturated What contains many epoxy resins which have a compound in frame | skeleton in an insulating resin compound is good. Furthermore, one or more of the above epoxy resins may be mixed as appropriate from the viewpoint of insulation reliability and heat resistance.

((B) active ester group-containing compound)
The active ester group-containing compound can be used without particular limitation as long as it contains one or more ester groups in one molecule and does not contain a hydroxyl group and can cure an epoxy resin. For example, the ester compound etc. which are obtained from an aliphatic or aromatic carboxylic acid and an aliphatic or aromatic hydroxyl compound are mentioned. Among these, it is known that an ester compound composed of an aliphatic carboxylic acid, an aliphatic hydroxy compound, or the like can increase solubility in an organic solvent and compatibility with an epoxy resin by including an aliphatic chain. An ester compound composed of an aromatic carboxylic acid, an aromatic hydroxyl compound, or the like can have improved heat resistance by having an aromatic ring. Examples of the compound containing an active ester group used in the present invention preferably include 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid. An aromatic carboxylic acid component selected from those substituted with a group, a monohydric phenol in which one of the hydrogen atoms of the aromatic ring is substituted with a hydroxyl group, and a polyhydric group in which 2 to 4 of the hydrogen atoms of the aromatic ring are substituted with a hydroxyl group. An aromatic ester obtained by a condensation reaction of an aromatic carboxylic acid and a phenolic hydroxyl group using a mixture with a monohydric phenol as a raw material can be mentioned, and is also available as a commercial product. Examples thereof include EXB-9460, EXB-9460S, EXB-9480, EXB-9420, and BPN80 manufactured by Mitsui Chemicals, manufactured by DIC Corporation.

  The content of the active ester group-containing compound used as a curing agent for the epoxy resin is preferably 0.75 to 1.25 equivalents relative to 1 equivalent of the epoxy resin epoxy. Heat resistance will become favorable in it being this range.

((C) Epoxy resin curing accelerator)
As the curing accelerator, a general curing accelerator used for curing an epoxy resin can be used. For example, imidazole compounds, organic phosphite compounds, amine compounds, amines, salts with 1.8-diazabicyclo (5,4,0) -undecene-7, and the like can be used. These may be used alone or in combination of two or more.

  Specific examples of the curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-un Imidyl compounds such as decylimidazole and 1-cyanoethyl-2-phenylimidazolium trimellitate, organic phosphinic compounds such as triphenylphosphine and tributylphosphine, and organic phosphite compounds such as trimethylphosphite and triethylphosphite Phosphonium salt compounds such as triphenylphosphonium bromide and tetraphenylphosphonium tetraphenylborate, trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzine Amine compounds such as dimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5.4.0) undecene-7 (hereinafter abbreviated as DBU); DBU and terephthalic acid, Examples thereof include salts with 2,6-naphthalenedicarboxylic acid and the like, quaternary ammonium salt compounds such as tetraethylammonium chloride, tetrapropylammonium chloride, tetrabutylammonium bromide, tetrahexylammonium bromide, and benzyltrimethylanonium chloride. . These may be used individually by 1 type, and may be used in combination of 2 or more types. Moreover, 0.02-1.5 mass% is optimal with respect to the compounding quantity of an epoxy resin as content of the hardening accelerator in insulating resin. When it is 0.02% by mass or more, the epoxy resin is sufficiently cured and the solder heat resistance is maintained, and when it is 1.5% by weight or less, the storage stability of the insulating resin and the handleability of the B-stage insulating resin are maintained. This is because it improves. A more preferable content is 0.8 to 1.3% by mass.

(Inorganic filler)
The insulating resin composition of the present invention may contain an inorganic filler for the purpose of increasing the coefficient of thermal expansion and the strength of the coating film. The inorganic filler can be selected from silica, fused silica, talc, alumina, aluminum hydroxide, barium sulfate, calcium hydroxide, aerosil, and calcium carbonate, and these can be used alone or in combination. good. In addition, it is good to use a silica from the point of a dielectric characteristic or a low thermal expansion, and the compounding quantity needs to be 5-35 vol% in solid content of the whole insulating resin except a solvent. More preferably, it is preferably 10 to 30 vol%, and if it is 10 vol% or more, the thermal expansion coefficient and the dielectric loss are small, and if it is 25 vol% or less, the necessary flow for forming the insulating resin in the inner layer circuit becomes sufficient. Filling places are less likely to occur.

(Coupling agent (surface treatment agent))
In the insulating resin composition of the present invention, a coupling agent used for surface treatment of the inorganic filler may be blended for the purpose of enhancing the dispersibility of the inorganic filler. Examples of the coupling agent include silane-based, titanate-based, and aluminum-based coupling agents. Among these, a silane coupling agent is preferable. For example, N-phenyl-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ- (2-aminoethyl) aminopropyltriethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyl Triethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, and N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltriethoxysilane γ-aminopropyl Aminosilane compounds such as trimethoxysilane, epoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and others Γ-glycidoxy Propyltrimethoxysilane, γ-glycidoxypropylvinylethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, Examples thereof include γ-methacryloxypropyltrimethoxysilane.

(Various additive ingredients)
As various additive components, for example, a leveling agent, an acid value inhibitor, a flame retardant, a thixotropic agent, a thickener and the like can be contained.

(solvent)
The insulating resin composition is used after diluting in a solvent, such as methyl ethyl ketone, xylene, toluene, acetone, ethylene glycol monoethyl ether, cyclohexanone, ethyl ethoxypropionate, N, N-dimethylformamide, N, N- Dimethylacetamide or the like can be used. These solvents may be used alone or in a mixed system. The ratio of the solvent to the resin may be the ratio used in the past, and the amount used is adjusted according to the equipment for forming the insulating resin coating film.
In addition, you may use the material of patent documents 1-4 as an insulating resin composition. For example, the polyphenylene ether resin disclosed in Patent Document 1 may be used. An epoxy resin, a phenol resin, a polyimide resin, a polyamideimide resin, a bismaleimide resin, an unsaturated polyester resin, a silicon resin and the like exemplified in Patent Document 2 may be used. The epoxy resin composition disclosed in Patent Document 3 may include an epoxy resin having two or more epoxy groups in one molecule, di (α-naphthyl) isophthalate, and a curing accelerator. A compound having a cyclic olefin resin and an active ester group disclosed in Patent Document 4 may be used.
≪Insulation resin layer thickness≫
There is no restriction | limiting in particular in the thickness (thickness after drying) of an insulating resin layer, The range of 3-60 micrometers is preferable according to a use. Increasing the thickness of the insulating resin layer is advantageous in terms of insulation, but on the other hand, from the viewpoint of economy, it is usually preferably about 60 μm or less, and preferably 3 μm or more for ensuring insulation.

[Hole formation process]
In this step, holes (via holes, through holes, and component insertion holes) are provided in the laminate (support and insulating resin layer) after the laminate formation step.
This hole is preferably formed by a drill, laser, plasma, or a combination thereof. As the laser, a carbon dioxide laser, a YAG laser, or the like is generally used.

[Desmear process]
Next, the smear generated in the hole by the hole forming step is removed with a desmear treatment liquid.
At this time, since the surface of the insulating resin layer is protected by the support, the surface of the insulating resin layer is prevented from being roughened (unevenness is generated) by the desmear treatment liquid. Thereby, wiring can be formed later on the surface of the insulating resin layer with small unevenness, and miniaturization of the wiring can be achieved.

  As the desmear treatment liquid, a chromium / sulfuric acid roughening liquid, an alkaline permanganic acid roughening liquid, a sodium fluoride / chromium / sulfuric acid roughening liquid, a borofluoric acid roughening liquid, or the like can be used. Moreover, when processing with this desmear process liquid, you may process with a desmear process liquid, after immersing in a solvent or alkaline liquid, and these mixture liquids (generally swelling liquid or pre-dip liquid). As the solvent, alcohol solvents such as diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, isopropyl alcohol and the like can be used. Further, the alkaline solution is not particularly limited as long as it is a solution that exhibits alkalinity when dissolved in water, and a sodium hydroxide solution, a potassium hydroxide solution, or the like can be used. Furthermore, you may mix a solvent or an alkali liquid, for example, the thing of the composition of sodium hydroxide 3g / L and diethylene glycol monobutyl ether 300mL / L can be used. Next, it is immersed in a hydrochloric acid aqueous solution of stannous chloride, neutralized, washed with water, and dried for removing water.

[Support removal step]
After the desmear treatment, the support is removed from the laminate.
This support can be removed by peeling or etching. When the support is a synthetic resin, it is preferably removed by peeling, and when the support is a metal, it is preferably removed by etching. When etching copper as a support, an sulfuric acid / hydrogen peroxide aqueous solution, a cupric chloride aqueous solution, a ferric chloride aqueous solution, an ammonium peroxodisulfate aqueous solution, an aqueous sodium peroxodisulfate solution, or the like can be used as an etchant. .

[Ultraviolet irradiation process]
By irradiating the surface of the insulating resin layer from which the support has been removed with ultraviolet rays, the adhesive strength to the wiring is improved on the surface of the insulating resin layer.
In the present invention, in order to improve the adhesive force on the surface of the insulating resin layer by ultraviolet irradiation in this way, even if the surface of the insulating resin layer is protected by a support during the desmear treatment so as not to cause the formation of irregularities, the subsequent wiring In the forming step, the wiring can be formed on the surface of the insulating resin layer with a strong adhesive force.
The ultraviolet irradiation method is not particularly limited, and ultraviolet irradiation may be performed in the atmosphere, or ultraviolet irradiation may be performed in an ozone solution as in Patent Document 2.
In this embodiment, the ultraviolet irradiation process is performed after the support removing process. However, the ultraviolet irradiation process is performed after any of the laminated body forming process and before the wiring forming process described later. It may be done at the timing.

[Wiring formation process]
The wiring is formed on the surface of the insulating resin layer from which the support is removed. As described above, since the wiring is formed on the surface of the insulating resin layer whose adhesion to the wiring has been improved by ultraviolet irradiation, the adhesion of the wiring to the insulating resin layer is increased.
For example, after applying a catalyst to the surface of the insulating resin layer, a predetermined resist pattern is formed on the surface of the insulating layer, and the conductive layer is formed by electroless plating, and then the resist pattern is removed. Further, an electrolytic plating treatment may be further performed on the electroless plating.

[One Example of Manufacturing Method of Wiring Board (First Example)]
Below, an example of the manufacturing method of a wiring board is demonstrated with reference to drawings. FIG. 1 is a cross-sectional view illustrating an example of a method for manufacturing a wiring board.
For convenience, the configuration of the wiring board manufactured by the manufacturing method of the wiring board will be described first, and then the manufacturing method of this wiring board will be described.

<Wiring board>
As shown in FIG. 1F, the wiring board 10 includes a substrate 2 having a first wiring circuit 1 on the back surface side and a second wiring circuit 3 on the front surface side, and an insulating resin on the second wiring circuit 3. Layer 4, third wiring circuit 5 on insulating resin layer 4, first via hole 6 extending from third wiring circuit 5 to second wiring circuit 3, and third wiring circuit 5 to second wiring circuit 5. The second via hole 7 extends to one wiring circuit 1.

<< Substrate having first and second wiring circuits >>
The substrate 2 having the first and second wiring circuits 1 and 3 (hereinafter sometimes referred to as an insulating substrate with circuit) is not particularly limited as long as it is an insulating substrate having circuits on both sides of the substrate 2. For example, a double-sided copper-clad laminate is mentioned. For this insulating substrate, a known laminated board used in a normal wiring board, for example, glass cloth-epoxy resin, paper-phenol resin, paper-epoxy resin, glass cloth / glass paper-epoxy resin, etc. should be used. There is no particular limitation. The circuit may be formed by any known method, using a copper-clad laminate in which a copper foil and the insulating substrate are bonded together, using a subtractive method for etching away unnecessary portions of the copper foil, A known method for manufacturing a wiring board such as an additive method for forming a circuit by electroless plating at a necessary location can be used.
Moreover, you may perform the circuit surface treatment for improving adhesiveness to this circuit 1 and 3 surface. This treatment method is also not particularly limited. For example, a copper oxide needle crystal is formed on the circuit surface with an alkaline aqueous solution of sodium hypochlorite, and the formed copper oxide needle crystal is converted into a dimethylamine borane aqueous solution. It is possible to employ a known method such as dipping in a reducing solution.

≪Insulating resin layer≫
In this example, as the insulating resin composition constituting the insulating resin layer, the one containing the above-described (A) epoxy resin, (B) active ester group-containing compound, and (C) epoxy resin curing accelerator is used.

<Manufacturing method of wiring board>
Next, a method for manufacturing the wiring board having such a structure will be described.
(1) Preparation of insulating resin composition There is no restriction | limiting in particular in the preparation method of a thermosetting insulating resin composition, A conventionally well-known preparation method can be used.
For example, the above-described solvent (A) epoxy resin, component (B) active ester group-containing compound, and component (C) epoxy resin curing accelerator are added to the solvent and used as necessary. After adding filler and various additive components, it can be prepared as a varnish by mixing and stirring using various mixers such as an ultrasonic dispersion method and a rotation and revolution dispersion method.
The solid content concentration excluding the solvent of the varnish is preferably 20 to 70% by mass from the viewpoint of coating property and the like.

(2) Formation of insulating resin layer with support (FIG. 1 (a))
The insulating resin varnish thus prepared is applied to a support 9 made of synthetic resin or copper foil and dried to obtain the insulating resin layer 4. Drying after applying the insulating resin varnish to the support 9 can be performed at 80 to 180 ° C. for about 1 to 10 minutes. When the drying temperature is higher than 80 ° C. or the time is 1 minute or longer, the drying proceeds sufficiently and the amount of residual solvent in the insulating resin layer 4 is reduced. As a result, the amount of resin flow is suppressed, and the residual solvent It is prevented that voids are generated in the insulating resin layer 4 due to volatilization. On the other hand, if the drying temperature is 180 ° C. or lower, or if the time is 10 minutes or shorter, it is prevented that the drying progresses excessively, and the amount of resin flow considered to be due to the progress of the reaction on the surface of the insulating resin layer 4 is reduced. .

There is no restriction | limiting in particular regarding the thickness (thickness after drying) of the insulating resin layer 4, The range of 3-60 micrometers is preferable according to a use. Increasing the thickness of the insulating resin layer 4 is advantageous in terms of insulation, but on the other hand, from the viewpoint of economy, it is usually preferably about 60 μm or less, and preferably 3 μm or more for ensuring insulation. .
Although there is no restriction | limiting in particular as the thickness of the said support body 9, About 10-200 micrometers is preferable and 20-100 micrometers is more preferable. As the support 9, a polyethylene terephthalate (PET) film or a copper foil is preferably used.

(3) Lamination of insulating resin layer with support and insulating substrate with circuit (FIG. 1 (b))
The insulating resin layer 4 with the support 9 and the insulating substrate 2 with the circuits 1 and 3 can be laminated by a laminating method or a pressing method.

In the case of the laminating method, the insulating resin layer 4 with the support 9 is superposed on the wiring circuit 3 of the insulating substrate 2 with the circuits 1 and 3 so that the insulating resin layer 4 faces, and for example, using a vacuum pressure laminator. Laminate.
When using a vacuum pressurization laminator, the temperature is preferably 50 to 170 ° C. and the pressure is 0.2 MPa or more. The preferred pressure value also varies depending on the thickness of the substrate, the residual copper ratio, etc., as with the heating temperature, but is preferably 1.0 MPa · s or less in order to suppress deformation of the substrate. Further, when the degree of vacuum is 15 hPa or less, the embedding property to the inner layer circuit board is improved. On the other hand, it is preferable that the degree of vacuum is high, but the capacity of the apparatus and the waiting time until reaching the predetermined value are increased. Considering the influence on productivity, it is preferable to carry out in the range of 5 to 10 hPa. When the thermocompression bonding time is 10 seconds or more, it is sufficient as the time required for the resin to flow into the inner layer circuit, and when it is 90 seconds or less, productivity is improved, and therefore it is preferably 20 to 60 seconds.

  On the other hand, in the case of the pressing method, in the same manner as described above, the insulating resin layer 4 with the support 9 is superposed on the circuit 3 of the insulating substrate 2 with the circuits 1 and 3 so that the insulating resin layer 4 faces, and the insulation used. Press under appropriate conditions according to the resin layer 4. For example, the circuit 1 is heated by heating at a temperature rising temperature of 3 ° C./min for 50 minutes, held at 190 ° C. and a pressure of 2.0 to 3.0 MPa for 60 to 90 minutes, and then cooled to room temperature in 30 minutes. The insulating resin 4 with the support 9 can be formed on the circuit 3 of the insulating substrate 4 with 3.

(4) Thermosetting of insulating resin layer (FIG. 1 (c))
The insulating resin layer 4 formed on the circuit 3 of the insulating substrate 2 with the circuits 1 and 3 as described above is first thermally cured. This thermosetting is preferably performed at a temperature and time taking into account subsequent plating treatment or annealing treatment of the wiring conductor. If the curing is advanced too much, the adhesion to the wiring conductor may be reduced during the subsequent plating process, and conversely, if the curing is insufficient, it may be eroded by the alkaline treatment liquid during the plating process and dissolved in the plating solution. It is. Considering these matters, for example, in the case of the epoxy resin-based insulating resin 4, it is preferable to cure by applying a heat treatment at 150 to 190 ° C. for about 30 to 90 minutes.

(5) Drilling and desmear processing (Fig. 1 (d))
Next, drilling is performed to form via holes 6 and through holes 7. The details of this drilling process are as described above.
Next, desmear in the via hole 6 and the through hole 7 is performed using a desmear treatment liquid. The details of the desmear treatment liquid are as described in the above hole forming step.

(6) Removal of support (FIG. 1 (e))
Next, the synthetic resin film or copper foil which is the support body 9 is removed. The synthetic resin film is preferably removed by peeling. On the other hand, the copper foil is preferably removed by etching.

(7) UV irradiation (Fig. 1 (e))
Next, the surface of the insulating resin layer 4 exposed by removing the support 9 is subjected to ultraviolet irradiation treatment under the following conditions. Thereby, although the uneven | corrugated shape of this insulating resin layer 4 surface is small, high adhesive force expresses with respect to a wiring conductor.
Although the mechanism is not necessarily clear, by irradiating the insulating resin layer 4 with ultraviolet rays, the surface of the insulating resin layer 4 is subjected to oxygen by decomposition of the active ester group in the active ester group-containing compound (B). It is presumed that a containing group is formed, and that this oxygen-containing group provides a high adhesion to the wiring conductor. The amount of oxygen atoms of the oxygen-containing group formed on the surface of the insulating resin 4 can be measured by X-ray photoelectron spectroscopy.

The ultraviolet irradiation conditions of the, for example, using an ultraviolet lamp emitting in the wavelength range of 300 to 450 nm, under atmospheric pressure, the amount of light is 1000~5000mJ / cm ² or so, made preferably in 2000~4000mJ / cm ² Thus, it is desirable to irradiate with ultraviolet rays. The light quantity (mJ / cm ² ) is represented by “illuminance mW / cm ² × irradiation time (seconds)”.
As described above, the insulating resin layer 4 is not subjected to the ultraviolet irradiation treatment after the thermosetting treatment, so that the insulating resin layer 4 does not form a concavo-convex shape using a conventionally used roughening solution such as sodium permanganate. However, high adhesive force can be expressed with respect to the wiring conductor.
In addition, about 50-90 degreeC is preferable and the temperature of the insulating resin layer 4 at the time of ultraviolet irradiation has more preferable 60-80 degreeC.

The method of irradiating the insulating resin 4 with ultraviolet rays under an atmospheric pressure atmosphere is not particularly limited since it differs depending on the ultraviolet device, but conveyor-type ultraviolet irradiation is preferable in consideration of productivity. As an ultraviolet lamp having a wavelength in the range of 300 to 450 nm, a mercury short arc lamp, a high pressure mercury lamp, a capillary type ultra high pressure lamp, a high pressure lamp, and a metal halide lamp can be used. Among these lamps, metal halide lamps having a wide ultraviolet wavelength over the entire region are preferable.
The purpose of using an ultraviolet lamp having an ultraviolet wavelength range of 300 to 450 nm relates to versatility and the ultraviolet wavelength range. That is, an ultraviolet lamp having a wavelength of 300 to 450 nm is generally used as a conveyor type ultraviolet irradiation apparatus, for example, a solder resist post-exposure apparatus.

Furthermore, the metal halide type conveyor irradiation apparatus has a wide ultraviolet wavelength region, and the effects of the present invention can be exhibited by substituting these apparatuses without requiring a special apparatus. UV dose, the adhesive strength between the plated conductors when no processing 1000 mJ / cm ² or more in the insulating resin layer 4 in an oxidizing roughening solution that becomes sufficient, the adhesive force is not changed even beyond 5000 mJ / cm ² Therefore, 1000 to 5000 mJ / cm ² is preferable. More preferably in the range of ^{2000mJ / cm 2 ~4000mJ / cm 2} .

(8) Plating treatment (FIG. 1 (f))
In the present embodiment, the surface of the insulating resin layer 4 that has been subjected to the ultraviolet treatment is subjected to a plating treatment, for example, as shown below.
First, the above-mentioned insulating resin layer 4 is further subjected to a plating catalyst application treatment for adhering palladium. The plating catalyst treatment is performed by immersing in a palladium chloride plating catalyst solution. Next, by immersing in an electroless plating solution, an electroless plating layer having a thickness of 0.3 to 1.5 μm is deposited thereon. If necessary, further electroplating is performed. As the electroless plating solution used for electroless plating, a known electroless plating solution can be used, and there is no particular limitation. Also, electroplating can be performed by a known method and is not particularly limited.
Thus, the wiring board 10 can be manufactured by forming the wiring circuit 5 on the insulating resin layer 4 by plating.
In this example, a double-sided wiring board is used, but a single-sided wiring board may be used. In addition, although one insulating resin layer and one wiring circuit are formed on the surface of the double-sided wiring board, a multilayer wiring board is manufactured by repeating these methods to form a plurality of insulating resin layers and wiring circuits. You can also

[Another Example of Manufacturing Method of Wiring Board (Second Example)]
FIG. 2 is a cross-sectional view illustrating another example of a method for manufacturing a wiring board.
<Description of the structure of the wiring board of FIG. 2>
As shown in FIG. 2C, the wiring board 20 includes a prepreg laminate 21, insulating resin layers 4 laminated on both upper and lower sides thereof, third wiring circuits 5 laminated on both upper and lower sides thereof, And a through hole 7 penetrating the layer.
<Method for Manufacturing Wiring Board in FIG. 2>
(1) Production of prepreg laminate A prepreg laminate 21 is formed by stacking semi-cured epoxy resin prepreg sheets reinforced with glass fibers or the like.

(1) Preparation of Insulating Resin Composition A thermosetting insulating resin composition is prepared in the same manner as in the first example (FIG. 1).
(2) Formation of insulating resin layer with support In the same manner as in the first example (FIG. 1), the insulating resin layer 4 with support 9 is formed.

(3) Lamination of insulating resin layer with support and insulating substrate with circuit (FIG. 2 (a))
The prepreg laminate 21 is superposed and laminated so that the insulating resin layer 4 side of the insulating resin layer 4 with the support 9 is in contact with the front and back surfaces of the prepreg laminate 21. This laminating method can be performed by a laminating method or a pressing method as in the first example (FIG. 1).

(4) Thermosetting of insulating resin layer (FIG. 2 (b))
The insulating resin layer 4 is thermally cured in the same manner as in the first example (FIG. 1).

(5) Drilling and desmear processing (Fig. 2 (b))
Next, drilling that penetrates in the thickness direction is performed to form the through hole 7, and then desmear treatment in the through hole 7 is performed. The details of the drilling and desmear processing are the same as those in the first example (FIG. 1).

(6) Removal of support The support 9 is removed in the same manner as in the first example (FIG. 1).
(7) Ultraviolet irradiation In the same manner as in the first example (FIG. 1), the ultraviolet irradiation treatment is performed on the insulating resin layers 4 on both sides.
(8) Plating treatment (FIG. 2 (c))
In the same manner as in the first example (FIG. 1), the insulating resin layers 4 on both sides are plated to manufacture the third wiring circuits 5 and 5.
In this way, the wiring board 20 can be manufactured.
In this example, one insulating resin layer 4 and one wiring circuit 5 are formed on both surfaces of the prepreg laminate, but a plurality of insulating resin layers 4 and wiring circuits 5 may be formed by repeating these methods. .

EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples.
In addition, the various characteristics in each example were calculated | required by the method shown below.

Characteristics of multilayer wiring board (i) Adhesive strength with circuit Part of outermost circuit layer (third circuit layer for multilayer wiring board, first circuit layer for single-layer wiring board) part of 10 mm width and 100 mm length Was formed, and one end was peeled off and grasped with a gripper, and the load when peeled off in the vertical direction at about 50 mm at room temperature was measured.
(Ii) Insulation resin layer roughness of the plated copper etching removal surface A test piece is prepared by etching the outer circuit layer to remove copper. This test piece is cut into about 2 mm square, and using a ultra deep shape measurement microscope “VK-8500 type” manufactured by Keyence Co., Ltd., a measurement length of 149 μm and a magnification of 2000 times at three different points in the test piece. The measurement was performed under the condition of a resolution of 0.05 μm, and a value obtained by subtracting the minimum portion from the maximum portion of the roughness in the measurement length of 149 μm was defined as the surface roughness of the insulating resin layer, and the average value of the three locations was calculated.
(Iii) Solder heat resistance The wiring board was cut into 25 mm square, and immediately after that, it was floated in a solder bath prepared at 288 ° C. ± 2 ° C., and the time until blistering was examined.

Example 1
(1) Fabrication of circuit board Glass cloth base epoxy resin double-sided copper-clad laminate [MCL-E-67 manufactured by Hitachi Chemical Co., Ltd. having a roughened foil with a copper foil thickness of 18 μm and a substrate thickness of 0.8 mmt on both sides. (Product Name)] was etched to produce a circuit board having a circuit layer (hereinafter referred to as a first circuit layer) on one side.

(2) Preparation of epoxy resin A-1 as component (A) In a flask equipped with a thermometer and a stirrer, 228 g (1.00 mol) of bisphenol A and 92 g (0.85 mol) of 1,6-hexanediol divinyl ether And heated to 120 ° C. for 1 hour, and further reacted at 120 ° C. for 6 hours to obtain 400 g of a transparent semi-solid modified polyhydric phenol.
Next, 400 g of the modified polyphenols, 925 g of epichlorohydrin, and 185 g of n-butanol were charged and dissolved in a flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer. Thereafter, the temperature was raised to 65 ° C. while purging with nitrogen gas, and then the pressure was reduced to an azeotropic pressure, and 122 g (1.5 mol) of a 49% aqueous sodium hydroxide solution was added dropwise over 5 hours. Stirring was then continued under these conditions for 0.5 hour. During this time, the distillate distilled azeotropically was separated with a Dean-Stark trap, the aqueous layer was removed, and the reaction was conducted while returning the organic layer to the reaction system. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure. To the resulting crude epoxy resin, 1000 g of methyl isobutyl ketone and 100 g of n-butanol were added and dissolved. Further, 20 g of a 10% sodium hydroxide aqueous solution was added to this solution and reacted at 80 ° C. for 2 hours. Then, washing with 300 g of water was repeated three times until the pH of the washing solution became neutral. Next, the system was dehydrated by azeotropic distillation, and after passing through microfiltration, the solvent was distilled off under reduced pressure to obtain 457 g of a transparent liquid epoxy resin. The epoxy equivalent was 403.

(3) Preparation of insulating resin composition Table 1 shows the composition of the insulating resin. 49 parts by mass of the epoxy resin prepared in (2) as component (A), UV-excited ester group-containing resin “EXB-9460S” as component (B) (DIC Corporation, trade name, ester equivalent: 223) 27 parts by mass, (C) component 1-cyanoethyl-2-phenylimidazolium trimellitate (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name “2PZ-CNS”) 0.15 parts by mass of methyl ethyl ketone ( Hereinafter, it is described as “MEK”.) Dissolved in 40 parts by mass to obtain an insulating resin composition (varnish).

(4) Formation of insulating resin layer with support The insulating resin composition obtained in the above (3) was applied on a polyethylene terephthalate (PET) film (thickness 38 μm) as a support, and then at 100 ° C. for 10 minutes. By drying, an insulating resin layer with a support having a thickness of 50 ± 3 μm was produced.

(5) Lamination / thermosetting treatment Furthermore, the insulating resin layer with the support and the circuit board obtained in (1) above are overlapped so that the insulating resin layer and the circuit layer are in contact with each other, and the batch type Lamination was performed using a vacuum pressure laminator MVLP-500 (trade name, manufactured by Meiki Co., Ltd.). Next, the insulating resin layer was subjected to thermosetting treatment at 170 ° C. for 60 minutes to obtain a substrate with an insulating resin layer.

(6) Formation of via hole A via hole for interlayer connection from the support to the circuit layer is formed on the substrate with the insulating resin layer by a CO ₂ laser processing machine LCO-1B21 manufactured by Hitachi Via Mechanics, with a beam diameter of 80 μm and a frequency. It was fabricated by processing under conditions of 500 Hz, pulse width 5 μsec, and number of shots 7.

(7) Desmear treatment In order to desmear the inside of the via hole, as a swelling liquid, an aqueous solution of diethylene glycol monobutyl ether: 200 mL / L, NaOH: 5 g / L is heated to 80 ° C., and this is immersed for 5 minutes. did. Next, an aqueous solution of KMnO ₄ : 60 g / L, NaOH: 40 g / L as a desmear treatment liquid was heated to 80 ° C. and immersed for 20 minutes. Subsequently, the mixture was neutralized by immersing in an aqueous solution of a neutralizing solution (SnCl ₂ : 30 g / L, H ₂ SO _{4 having} a concentration of 98% by mass: 300 mL / L) at room temperature for 5 minutes, washed with water for 5 minutes, and then 100 ° C. For 10 minutes.

(8) Support body removal process Next, the support body (PET film) was peeled off and removed from the insulating resin composition.

(9) Ultraviolet irradiation The said board | substrate with an insulating resin processed the conveyor type ultraviolet irradiation apparatus (wavelength 350-380 nm) of the lamp | ramp with a metal halide lamp, and irradiated ultraviolet rays 3000mJ / cm < ² >.

(10) Formation of Second Circuit Layer As a pretreatment for electroless plating, the surface of the insulating resin layer was immersed in a conditioner liquid CLC-601 (trade name, manufactured by Hitachi Chemical Co., Ltd.) at 60 ° C. for 5 minutes. Thereafter, it was washed with water and immersed in pre-dip liquid PD-201 (trade name, manufactured by Hitachi Chemical Co., Ltd.) at room temperature for 2 minutes. Next HS-202B (manufactured by Hitachi Chemical Co., Ltd., trade name) is an electroless plating catalyst containing PdCl _2, the soaked for 10 minutes at room temperature, washed with water, CUST-201 plating is an electroless copper plating It was immersed in a liquid (manufactured by Hitachi Chemical Co., Ltd., trade name) for 15 minutes at room temperature. Subsequently, copper sulfate electrolytic plating was further performed. Thereafter, annealing was performed at 170 ° C. for 30 minutes to form a conductor layer having a thickness of 20 μm on the surface of the insulating resin layer.
In order to remove unnecessary portions of the plated conductor layer by etching, the oxide film on the copper surface was removed by # 600 buffol polishing, an etching resist was formed and etched, and then the etching resist was removed. In this way, a second circuit layer connected to the first circuit layer through the via hole was formed.

(11) Production of Multilayer Wiring Board Further, in order to make a multilayer, the surface of the second circuit layer is 85% in an aqueous solution of sodium chlorite: 50 g / l, NaOH: 20 g / l, trisodium phosphate: 10 g / l. After immersing at 20 ° C. for 20 minutes, washing with water and then drying at 80 ° C. for 20 minutes, copper oxide irregularities were formed on the surface of the second circuit layer.
Subsequently, the multilayer wiring board of 3 layers was produced by repeating the process of (4)-(10).

Example 2
(1) Production of copper-clad laminate The insulating resin composition shown in Table 1 was applied onto a profile-free copper foil (HLN-18, manufactured by Nippon Electrolytic Co., Ltd., trade name, thickness 18 μm) as a support, and 100 An insulating resin layer with a copper foil of 10 ± 1 μm was produced by drying at 10 ° C. for 10 minutes.
Next, four prepregs (0.1 mm thick) used in MCL-E-67 (trade name) manufactured by Hitachi Chemical Co., Ltd. are stacked, and the two insulating resin layers with copper foil are laminated to the insulating resin layer. A copper-clad laminate was obtained by placing the plate up and down so that the side abuts the prepreg and laminating and deforming at a temperature of 185 ° C. and a pressure of 3.5 MPa for 1 hour.

(2) Formation of Through Hole Next, using a drill having a diameter of 0.105 mm (trade name: KMD J464, manufactured by Union Tool Co., Ltd.), the rotational speed is 300 krpm, the feed speed is 2.1 m / min, and the chip load is 7. 2000 holes were drilled under the condition of 0 μm / rev. In this way, through holes penetrating to the front and back surfaces of the copper-clad laminate were formed.

(3) Desmear treatment In order to chemically roughen the smear in the through hole, an aqueous solution of diethylene glycol monobutyl ether: 200 mL / L, NaOH: 5 g / L was heated to 80 ° C. as a swelling liquid. Immersion treatment was performed for a minute. Next, an aqueous solution of KMnO ₄ : 60 g / L, NaOH: 40 g / L as a desmear treatment liquid was heated to 80 ° C. and immersed for 20 minutes. Subsequently, the mixture was neutralized by immersing in an aqueous solution of a neutralizing solution (SnCl ₂ : 30 g / L, H ₂ SO _{4 having} a concentration of 98% by mass: 300 mL / L) at room temperature for 5 minutes, washed with water for 5 minutes, and then 100 ° C. For 10 minutes.

(4) Support body removal process Next, all the support bodies (copper foil of outermost layer) were etched away.

(5) Ultraviolet irradiation The said board | substrate with an insulating resin processed the conveyor type ultraviolet irradiation apparatus (wavelength 350-380 nm) of the lamp | ramp with a metal halide lamp, and irradiated 3000 mJ / cm < ² > of ultraviolet rays.

(6) Formation of Conductor Layer As a pretreatment for electroless plating, each surface of a total of two insulating resin layers formed on the upper surface side and the lower surface side of the substrate with the insulating resin layer was subjected to conditioner liquid CLC-601 (Hitachi For 5 minutes at 60 ° C. Thereafter, it was washed with water and immersed in pre-dip liquid PD-201 (trade name, manufactured by Hitachi Chemical Co., Ltd.) at room temperature for 2 minutes. Next HS-202B (manufactured by Hitachi Chemical Co., Ltd., trade name) is an electroless plating catalyst containing PdCl _2, the soaked for 10 minutes at room temperature, washed with water, CUST-201 plating is an electroless copper plating It was immersed in a liquid (manufactured by Hitachi Chemical Co., Ltd., trade name) for 15 minutes at room temperature. Subsequently, copper sulfate electrolytic plating was further performed. Thereafter, annealing was performed at 170 ° C. for 30 minutes to form a conductor layer having a thickness of 20 μm on each surface of the two insulating resin layers on the upper surface side and the mask surface side.

(7) Formation of circuit layer After removing the oxide film on the copper surface by # 600 buffol polishing to remove unnecessary portions of the two conductor layers, an etching resist is formed, etched, and then etched. The resist was removed. Thus, a circuit layer connected to the internal copper foil through the through hole was formed.
In this way, a wiring board was produced.

Examples 3-6
A multilayer wiring board was produced in the same manner as in Example 1 except that the composition of the insulating resin composition was changed as shown in Table 1 in Example 1.
Example 7
In Example 1, as shown in Table 1, the insulating resin composition to which spherical silica “SO-25R” (manufactured by Admatechs Co., Ltd.) having an inorganic filler average particle size of 0.5 μm was used was used, and the insulation was used. Except that the composition of the resin composition was changed as shown in Table 1, the same operation was performed to produce a multilayer wiring board.
Example 8
A multilayer wiring board was produced in the same manner as in Example 1 except that the ultraviolet irradiation lamp was changed to a high pressure mercury lamp conveyor type ultraviolet irradiation device (wavelength of 310 to 370 nm). In addition, as in Example 1, the irradiation with ultraviolet rays was performed so that the amount of light was 3000 mJ / cm ² .

Comparative Example 1
A multilayer wiring board was produced in the same manner as in Example 1 except that the order of (7) desmear treatment and (8) support removal processing was reversed.
Comparative Example 2
A wiring board was produced in the same manner as in Example 2 except that the order of (3) desmear treatment and (4) support removal processing was reversed.
Comparative Example 3
(5) A wiring board was produced in the same manner as in Example 2 except that ultraviolet irradiation was not performed.

A1: Epoxy resin based on hexanediol produced by the above method A2: Phenol novolac type epoxy resin “N-770” (manufactured by DIC Corporation)
B1: Active ester group-containing compound “EXB-9460S” (manufactured by DIC Corporation)
B2: Cresol novolac type phenol resin “KA-1165” (manufactured by DIC Corporation)
C1: Curing accelerator, imidazole derivative compound, 1-cyanoethyl-2-phenylimidazolium trimellitate “2PZ-CNS” (manufactured by Shikoku Kasei Kogyo Co., Ltd.)
D1: methyl ethyl ketone E1: inorganic filler, spherical silica “SO-25R” having an average particle size of 0.5 μm (manufactured by Admatechs Co., Ltd.)

  The multilayer wiring board produced as described above was tested for adhesive strength with the outer layer circuit, insulation resin roughness of the plated copper etching removal surface, and 288 ° C. solder heat resistance test. The results are shown in Table 2.

  As shown in Table 2, in Examples 1 to 8, since the surface of the insulating resin layer is protected by the support during the desmear treatment in the via hole, and then the support is removed, the unevenness of the surface of the insulating resin layer Can be prevented from becoming large. Moreover, in Examples 1-8, although roughening the insulating resin layer surface at the time of a desmear process is abbreviate | omitted in this way, ultraviolet rays are irradiated to the insulating resin layer surface, and the adhesive force with respect to wiring is expressed. Therefore, the adhesive strength between the surface of the insulating resin layer and the wiring circuit was excellent. Especially Examples 1-8 were excellent also in solder heat resistance.

On the other hand, in Comparative Examples 1 and 2, since the desmear treatment was performed with the support on the surface of the insulating resin layer removed, the surface roughness of the insulating resin layer was large.
In Comparative Example 3, since ultraviolet irradiation was not performed, the adhesive strength between the insulating resin layer and the wiring circuit was low, and the solder heat resistance was poor.

DESCRIPTION OF SYMBOLS 1 1st wiring circuit 2 Board | substrate 3 2nd wiring circuit 4 Insulating resin layer 5 3rd wiring circuit 6 Via hole 7 Through hole 9 Support body 10 Wiring board 20 Wiring board 21 Prepreg laminated body

Claims (11)

A method of manufacturing a wiring board having an insulating resin layer and wiring formed on the surface of the insulating resin layer,
A laminate forming step of forming a laminate having the insulating resin layer and the support;
A hole forming step of providing a hole in the laminate;
A desmear treatment step of removing smear in the hole with a desmear treatment liquid;
A support removing step of removing the support from the laminate after the desmear treatment step ;
A wiring forming step of forming the wiring on a surface of the insulating resin layer from which the support is removed;
An ultraviolet irradiation step for improving the adhesion to the wiring by irradiating the surface of the insulating resin layer from which the support has been removed, after the laminate forming step and before the wiring forming step; A method of manufacturing a wiring board including:   The method for manufacturing a wiring board according to claim 1, wherein the support is a synthetic resin film.   The method for manufacturing a wiring board according to claim 1, wherein the support is a metal foil.   The method for manufacturing a wiring board according to claim 3, wherein the metal foil is a copper foil.   The method for manufacturing a wiring board according to claim 1, wherein the insulating resin layer is made of a thermosetting resin. The method for manufacturing a wiring board according to claim 5, wherein the insulating resin layer is obtained from an insulating resin composition containing an epoxy resin, a curing agent, and an epoxy resin curing accelerator.   The method for producing a wiring board according to claim 6, wherein the epoxy resin is an epoxy resin containing a hexanediol structure having two or more epoxy groups in one molecule.   The method for manufacturing a wiring board according to claim 6 or 7, wherein the curing agent is an active ester group-containing compound.   The method for producing a wiring board according to claim 8, wherein an active ester equivalent of the active ester group-containing compound is 0.75 to 1.25 equivalent with respect to 1 equivalent of epoxy of the epoxy resin.   The method for manufacturing a wiring board according to any one of claims 6 to 9, wherein the curing agent is an active ester group-containing compound having one or more ester groups in one molecule. 11. The wiring board according to claim 1, wherein, in the ultraviolet irradiation step, the insulating resin layer is irradiated with ultraviolet rays having a wavelength of 300 to 450 nm at an irradiation amount of 1000 to 5000 mJ / cm ² under atmospheric pressure. Manufacturing method.

Images