JP4505284B2 - Manufacturing method of multilayer wiring board - Google Patents

Description

  The present invention relates to a method for producing a multilayer printed wiring board, and in particular, a reduction in circuit peel strength due to uneven surface roughness of a resin layer, which is made for the purpose of improving circuit adhesion, is suppressed, and is excellent in reliability. The present invention relates to a method for manufacturing a built-up multilayer printed wiring board.

A printed wiring board in which a circuit is formed on the surface of an insulating substrate is widely used for electronic components and semiconductor elements. With recent demands for downsizing and higher functionality of electronic devices, there is a demand for higher density and thinner circuits of the printed wiring board.
As a method for producing a multilayer printed wiring board, conventionally, copper foil is laminated on a surface of an inner layer circuit board through a prepreg formed by impregnating a base material such as glass cloth with an epoxy resin or the like, and heated by a hot plate press A technique of so-called sequential lamination method in which molding is performed integrally is known. However, with this sequential lamination method, it is difficult to obtain a desired thin wiring board because prepreg intervention is essential, and it is difficult to meet the recent demand for higher density and thinner multilayer printed wiring boards. It is.
On the other hand, in recent years, the manufacturing technology of multilayer printed wiring boards by a so-called build-up method, which does not require hot-press molding by a hot plate press and directly forms a conductor circuit on an insulating resin layer, has attracted attention. . According to this method of manufacturing a multilayer printed wiring board by the build-up method, the conductor circuit layers and the insulating resin layers are alternately formed and stacked to be multilayered, so that an inclusion for interlayer adhesion is unnecessary. Therefore, it is possible to cope with the high density and thinning of the wiring board.

However, the multilayer printed wiring board manufactured by this build-up method generally has sufficient adhesion to the insulating resin layer of the conductor circuit than the multilayer printed wiring board manufactured by heat-press molding using a prepreg. However, the peel strength tends to be low, especially during mass production, as compared with the sequential lamination method, the peel strength due to uneven surface properties due to the rough surface of the insulating resin layer is greatly reduced. It was. This decrease in peel strength has a problem of greatly affecting the connection reliability and interlayer insulation of the circuit.
In order to improve this, a technique of irradiating short wavelength ultraviolet rays before or after the surface roughening treatment is performed on the insulating resin layer has been proposed (for example, see Patent Document 1). As a result, the wettability of the surface roughening treatment liquid or the adsorptivity of the electroless plating catalyst after the surface roughening is improved, and although an improvement in peel strength is seen, practically uniform and highly reliable fine circuits are formed. In reality, sufficient adhesion strength is not obtained. In addition, this method requires complicated steps such as resist coating, resist exposure, etching, and resist stripping, and also has a problem of etching waste liquid, and countermeasures are desired from an environmental point of view.
JP 2001-85840 A

  The object of the present invention, which has been made in consideration of the drawbacks of the above prior art, is to form uniform and fine wiring on a smooth insulating substrate with improved adhesion between the conductor circuit layer and the insulating resin layer. Another object of the present invention is to provide a method for manufacturing a multilayer wiring board.

As a result of intensive studies, the inventor conducted electroless plating treatment using a graft polymer pattern directly bonded to the surface of an insulating layer mainly composed of epoxy resin as a plating receiving region when forming a multilayer wiring. As a result, the present invention was completed.
That is, in the method for producing a multilayer wiring board of the present invention, (a) an insulating resin layer-forming material containing an epoxy resin is applied on a first conductive pattern arbitrarily formed on an insulating substrate; forming an insulating resin layer composed mainly of epoxy resin to cure the insulating resin layer forming material, a polymer compound having a polar functional group and a double bond to the surface of the (b) the insulating resin layer Coating, irradiating with ultraviolet light in a pattern, generating a graft polymer in which the polymer compound is bonded starting from the active site generated in the ultraviolet light irradiation region on the insulating resin layer, A step of forming a graft polymer pattern composed of a non-existing region, a step of forming a via hole opening in the insulating resin layer before or after the steps (c) and (b), and (d) no step in the insulating resin layer. With electrolytic plating A second conductive pattern and a via hole corresponding to the graft polymer pattern are formed, and the second conductive pattern and the first conductive pattern are electrically connected by the via hole to form a conductive path. And a process.

That is, as two aspects in the method of the present invention, (First aspect) (a) Formation of an insulating resin layer containing an epoxy resin on a first conductive pattern arbitrarily formed on an insulating substrate (C) forming a via-hole opening in the insulating resin layer; and (b) forming a via-hole opening in the insulating resin layer. ) A polymer compound having a polar functional group and a double bond is applied to the surface of the insulating resin layer, and the active point generated in the ultraviolet light irradiation region on the insulating resin layer is irradiated by irradiating the pattern with ultraviolet light. Forming a graft polymer to which the polymer compound is bonded , and forming a graft polymer pattern composed of an existing region and a non-existing region of the graft polymer, and (d) applying electroless plating to the insulating resin layer And A second conductive pattern and a via hole corresponding to the raft polymer pattern are formed, and the second conductive pattern and the first conductive pattern are electrically connected by the via hole to form a conductive path. A mode in which the steps are carried out in this order, and (second mode) (a) An insulating resin layer forming material containing an epoxy resin is applied on the first conductive pattern arbitrarily formed on the insulating substrate. after the step of forming an insulating resin layer by curing the insulating resin layer-forming material composed mainly of an epoxy resin, a polymer compound having a polar functional group and a double bond to the surface of the (b) the insulating resin layer the coating was irradiated with ultraviolet light in a pattern, to produce a graft polymer obtained by binding a polymer compound starting active sites generated in the ultraviolet light irradiation region on the insulating resin layer, there territory of the graft polymer And (c) forming a via hole opening in the insulating resin layer formed with the graft polymer pattern, and (d) electrolessly forming the insulating resin layer. Plating is performed to form a second conductive pattern and a via hole corresponding to the graft polymer pattern, and the second conductive pattern and the first conductive pattern are electrically connected by the via hole. There exists an aspect which performs the process of forming a conductive path in this order.

In the step (b), the graft polymer pattern formed on the insulating resin layer is composed of a graft polymer existing region / non-existing region, and selectively exists in the graft polymer existing region having a polar functional group. A plating film is formed and a conductive pattern is formed.
In the method for producing a multilayer wiring board of the present invention, the insulating resin layer mainly composed of epoxy resin has an average roughness (Rz) measured by JIS B0601 (1994), 10-point average height method of 3 μm or less. It is preferable that it has smoothness and has not been subjected to pretreatment for generating active sites and improving adhesion such as glow treatment and roughening treatment. According to the method of the present invention, High-definition wiring (circuit) having excellent adhesion can be formed even on the insulating resin layer.

According to the present invention, there is provided a method for producing a multilayer wiring board capable of forming uniform and fine wiring with improved adhesion between a conductor circuit layer and an insulating resin layer on a smooth insulating resin layer surface. Can do.
Furthermore, according to the method of the present invention, a high-definition and uniform wiring can be formed because a high-definition graft polymer pattern excellent in plating acceptability can be formed on a smooth insulating resin layer without any pretreatment. Can be manufactured by a simple method.

The method for producing a multilayer printed wiring board according to the present invention is characterized in that a graft polymer is formed on the surface of an insulating resin layer mainly composed of an epoxy resin, and electroless plating is performed based on the graft polymer. Since the graft polymer is firmly bonded to the surface of the insulating resin by covalent bond, the plating film (metal film) formed based on it is firmly bonded to the insulating resin, and the conventional surface unevenness has been achieved. High adhesion is developed without any treatment. In addition, the multilayer wiring board obtained according to the present invention exhibits favorable performance for high-frequency power transmission because it is not subjected to surface unevenness treatment and is flat and exhibits close adhesion. In particular, according to the method of the present invention, a fine wiring showing high adhesion to an epoxy resin useful as a multilayer printed wiring board can be formed.
Hereinafter, the structure and process of the method for manufacturing a multilayer wiring board according to the present invention will be described in detail.
The multilayer wiring board of the present invention has a conductive path for electrically connecting the conductive pattern present on the insulating substrate and the second conductive pattern formed on the insulating material layer present thereon. However, in that case, the second conductive pattern is characterized by being formed corresponding to the graft polymer pattern.

Insulating resin layer used in this method are those formed by curing the insulating resin layer-forming material containing an epoxy resin, following, appropriately referred to as an epoxy resin insulating resin layer. First, the insulating resin layer made of epoxy resin will be described.
Epoxy resins made insulation resin layer]
In the present invention, the insulating resin layer mainly composed of an epoxy resin is composed of (A) an epoxy compound having two or more epoxy groups in one molecule and (B) a functional group that reacts with two or more epoxy groups in one molecule. It is comprised with the reaction material with the compound which has this. The functional group in (B) is selected from functional groups such as a carboxyl group, a hydroxyl group, an amino group, and a thiol group.

  (A) The epoxy compound having two or more epoxy groups in one molecule is an epoxy compound having two or more epoxy groups, preferably 2 to 50, more preferably 2 to 20 in one molecule (epoxy resin). Is included). The epoxy group should just be a structure which has an oxirane ring structure, for example, can show a glycidyl group, an oxyethylene group, an epoxycyclohexyl group, etc. Such polyvalent epoxy compounds are widely disclosed in, for example, published by Masaki Shinbo “Epoxy Resin Handbook” published by Nikkan Kogyo Shimbun (1987), and these can be used.

  Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol S type epoxy resin, diphenyl ether type epoxy resin, hydroquinone type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin , Fluorene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, trifunctional type epoxy resin, tetraphenylolethane type epoxy resin, dicyclopentadiene phenol type epoxy resin, water Bisphenol A type epoxy resin, bisphenol A nucleated polyol type epoxy resin, polypropylene glycol type epoxy resin, glycidyl ester type epoxy Shi resin, glycidyl amine type epoxy resins, glyoxal type epoxy resins, alicyclic epoxy resins, and the like heterocyclic epoxy resin.

One particularly preferred configuration of the epoxy resin layer applied to the present invention is an insulating resin layer made of the same material as the epoxy resin substrate used in the field of printed electrical wiring. As a composition (insulating resin layer forming material) constituting such a resin substrate, specifically, for example, (A) two or more epoxy groups are contained in one molecule described in JP-A No. 2001-181375. An epoxy resin having (B) a phenolic curing agent, (C) a phenoxy resin having a bisphenol S skeleton and a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator. An epoxy resin composition, (A) a phenoxyphosphazene compound or a condensed phosphate ester compound, (B) a phosphorus-containing polyepoxide compound, (C) a curing agent for a nitrogen-containing epoxy resin, and (D) Halogen-free flame-retardant epoxy resin composition characterized by containing an inorganic filler as an essential component.
In addition, the epoxy substrate provided with photosensitivity described in JP-A-8-212832 and JP-A-10-1596, JP-A-2002-171074, JP-A-2002-179887, JP-A-2001-49125. In addition, the material of the flame-retardant epoxy substrate described in each publication such as JP-A-2000-198907 can also be applied to the formation of the insulating resin layer of the present invention.

In the present invention, the epoxy resins made insulation resin layer, the total component constituting the insulating resin layer refers to a mode in which the epoxy resin is contained more than 30 wt%. When forming the insulating resin layer, in order to strengthen the properties of the epoxy resin such as mechanical strength, heat resistance, weather resistance, flame retardancy, water resistance, and electrical properties, it contains 30% by mass or more of epoxy resin, and A composite (composite material) containing other resin components and a filler for adjusting conductivity can also be used. Examples of the material used for the composite include a conductive adjusting material such as silica particles, and resin components such as a phenol resin, a polyimide resin, a bismaleimide triazine resin, a fluorine resin, and a polyphenylene oxide resin.
When such other components are added, they are added in the range of 1 to 200% by mass, preferably in the range of 10 to 80% by mass with respect to the epoxy resin. If the additive component is less than 1% by mass with respect to the epoxy resin, the effect of the addition cannot be sufficiently obtained, and if other components are added in excess of 200% by mass, the properties such as the strength of the epoxy resin may be reduced. Furthermore, the formation reaction of the graft polymer is difficult to proceed, which is not preferable.

The insulating resin layer made of an epoxy resin in the present invention is obtained by applying and curing an insulating resin layer forming material containing these epoxy resins. There is no restriction | limiting in particular in the thickness of a layer, Although it selects suitably according to the objective, Generally, it is the range of 10-200 micrometers.
The epoxy resin insulating resin layer used in the present invention is generally subjected to electron beam irradiation, plasma irradiation, glow treatment, etc., which are often performed for the purpose of improving adhesion to a circuit, etc. It is characterized by the fact that the surface graft can be formed simply by bringing the double bond compound into contact and irradiating with ultraviolet rays without performing surface activation treatment by applying high energy, but considering the characteristics of the obtained surface graft material In this case, the surface of the insulating resin layer made of epoxy resin is preferably smooth, and from this viewpoint, the surface of the resin layer in the present invention is preferably used without any surface treatment or pretreatment. Specifically, as described above, JIS B0601 (1994) having an average roughness (Rz) measured by a 10-point average height method of 3 μm or less is preferable.

Similarly to the insulating resin layer, the substrate used in the present invention, particularly preferably a substrate mainly composed of an epoxy resin, preferably has excellent surface smoothness, and is converted into an Rz value (10-point average height: JIS standard). B0601) is more preferably 3 μm or less, and further preferably 1 μm or less. If the surface smoothness of the substrate and the insulating resin layer is within the above range, that is, in a state where there is substantially no unevenness, the surface roughness of the substrate is affected even if the wiring is extremely fine. And can be formed with high accuracy. That is, it is possible to manufacture a wiring board in which circuits are formed with high density and high accuracy.
Examples of the epoxy resin used for the substrate mainly composed of the epoxy resin used here include the same epoxy resins that constitute the insulating resin layer described above, and composite materials can be used as well. The epoxy resin substrate may further include a reinforcing material such as paper, glass fiber, silica particles, or a filler added to the composite material or composite resin of the composite material described above.

[Surface graft formation method]
In the present invention, a compound having a double bond (hereinafter appropriately referred to as a double bond compound) is brought into contact with the surface of the insulating resin layer made of epoxy resin, energy is applied by ultraviolet irradiation, and the resin is applied to the ultraviolet irradiation region. It is characterized by producing a graft polymer that is directly bonded to the surface of the layer. At this time, the graft polymer is not generated in the ultraviolet non-irradiated region, thereby forming a graft polymer pattern composed of a graft polymer generated region and a non-generated region. Next, the compound having a double bond used here will be described.

[Double bond compound]
The double bond compound used, it is possible to have use of the high molecular compound that having a polymerizable group. As these compounds, known compounds can be arbitrarily used. Among these, compounds particularly useful in the present invention are compounds having a polymerizable group and a polar functional group. With this polar functional group, the formed graft polymer can be imparted with characteristics such as hydrophilicity or interaction with an electroless plating catalyst (precursor). Examples of polar functional groups include hydrophilic groups such as carboxyl groups, hydroxyl groups, amino groups, sulfonic acid groups, phosphonic acid groups, and amide groups.

Specific examples of the monomer having a double bond used for forming the polymer compound that can be used in the present invention include (meth) acrylic acid or an alkali metal salt and amine salt thereof, itaconic acid or an alkali metal salt thereof. And amine salts, styrenesulfonic acid or its alkali metal salts and amine salts, 2-sulfoethyl (meth) acrylate or its alkali metal salts and amine salts, 2-acrylamido-2-methylpropanesulfonic acid or its alkali metal salts and amine salts Acid phosphooxypolyoxyethylene glycol mono (meth) acrylate or alkali metal salts and amine salts thereof, polyoxyethylene glycol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, (meth) acrylamide, N- Nomechiroru (meth) acrylamide, N- dimethylol (meth) acrylamide, allylamine or its hydrohalogenic acid salt, N - vinyl pyrrolidone, vinyl imidazole, vinyl pyridine, vinyl thiophene, styrene, ethyl (meth) acrylate, n- Examples thereof include (meth) acrylic acid esters having an alkyl group having 1 to 24 carbon atoms such as butyl (meth) acrylic acid esters.

The polymer compound having a double bond that can be used in the present invention is a polymer in which an ethylene addition polymerizable unsaturated group (polymerizable group) such as a vinyl group, an allyl group, or a (meth) acryl group is introduced as a polymerizable group. The polymer has a polymerizable group at least at the terminal or side chain, and more preferably has a polymerizable group at the side chain.
In addition to the polymerizable group, the polymer compound having a double bond is a polar functional group such as a carboxyl group as described above, that is, a hydrophilic group, or a functional material to be introduced on the surface , specifically, Preferably has a functional group capable of interacting with an electroless plating catalyst or a precursor thereof (hereinafter sometimes referred to as an interactive group) .
The useful weight average molecular weight of the polymer compound having a polymerizable group is in the range of 500 to 500,000, and a particularly preferred range is in the range of 1000 to 50,000.

By using a macromer or polymer having a plurality of polymerizable groups in the side chain as well as the terminal as the double bond compound, the graft formation density is improved and a uniform and high-density graft is produced. For this reason, even when an electroless plating catalyst or a precursor thereof is attached to such a surface graft material, the adhesion density is improved and an excellent plating receptive region can be obtained. When using a macromer or a polymer as a double bond compound, since a polymerizable group exists at a high density, if a polymerization initiator coexists or a graft is generated using a known method using a high energy electron beam. Since the formation of the homopolymer described above is remarkable and the removability of the formed homopolymer is further reduced, the effect of the present invention is remarkable when such a double bond compound is used. Recognize.
From the viewpoint of the production method, when a double bond compound is brought into contact with the surface of the insulating resin layer by a coating method using a polymer, a polymer coating film having a uniform thickness is easily formed. The coating liquid protection cover required for the coating becomes unnecessary, and the double bond compound can be uniformly contacted at an arbitrary thickness, so that the uniformity of the formed graft polymer is improved and the production suitability is excellent. It also has advantages. For these reasons, in the production of a large area or a large amount, it is particularly useful in terms of production suitability to use a polymer having a double bond (polymer compound).

As a method for synthesizing such a polymer compound having a polymerizable group and an interactive group , i ) a method of copolymerizing a monomer having an interactive group and a monomer having a polymerizable group, ii) an interaction A method of copolymerizing a monomer having a reactive group and a monomer having a double bond precursor and then introducing a double bond by treatment with a base or the like; iii) having a polymer having an interactive group and a polymerizable group There is a method of reacting with a monomer and introducing a double bond (introducing a polymerizable group).
A preferred synthesis method is, from the viewpoint of synthesis suitability, ii) a method in which a monomer having an interactive group and a monomer having a double bond precursor are copolymerized, and then a double bond is introduced by treatment with a base, iii) A method of introducing a polymerizable group by reacting a polymer having an interactive group with a monomer having a polymerizable group.

  In the present invention, examples of the monomer having an interactive group that can be used in the graft polymer synthesis method ii) include (meth) acrylic acid or alkali metal salts and amine salts thereof, itaconic acid or alkali metal salts and amines thereof. Salts, more specifically, 2-hydroxyethyl (meth) acrylate, (meth) acrylamide, N-monomethylol (meth) acrylamide, N-dimethylol (meth) acrylamide, allylamine or a hydrohalide thereof, 3- Vinyl propionic acid or its alkali metal salt and amine salt, vinyl sulfonic acid or its alkali metal salt and amine salt, 2-sulfoethyl (meth) acrylate, polyoxyethylene glycol mono (meth) acrylate, 2-acrylamido-2-methylpro Sulfonic acid, acid phosphooxypolyoxyethylene glycol mono (meth) acrylate, N-vinyl pyrrolidone (the following structure), sodium styrene sulfonate, vinyl benzoic acid, etc., generally carboxyl group, sulfonic acid group, Monomers having a functional group such as a phosphate group, an amino group or a salt thereof, a hydroxyl group, an amide group, a phosphine group, an imidazole group, a pyridine group, or a salt thereof, and an ether group can be used.

Examples of the monomer having a polymerizable group that is copolymerized with the monomer having an interactive group include allyl (meth) acrylate and 2-allyloxyethyl methacrylate.
Examples of the monomer having a double bond precursor include 2- (3-chloro-1-oxopropoxy) ethyl methacrylate, and compounds (i-1 to i-60) described in JP-A No. 2003-335814. Among these, the following compound (i-1) is particularly preferable.

  Furthermore, polymerization used to introduce unsaturated groups by utilizing a reaction with a functional group such as a carboxyl group, an amino group or a salt thereof, a hydroxyl group, and an epoxy group in a polymer having an interactive group Examples of the monomer having a functional group include (meth) acrylic acid, glycidyl (meth) acrylate, allyl glycidyl ether, and 2-isocyanatoethyl (meth) acrylate.

  ii) Regarding a method of introducing a double bond by treatment with a base after copolymerizing a monomer having an interactive group and a monomer having a double bond precursor, for example, JP-A-2003-335814 The technique described in the publication can be used.

(Surface graft polymerization)
In the method for forming a multilayer wiring board of the present invention, the graft polymer (surface graft polymer) produced on the surface of the insulating resin layer made of epoxy resin is produced using a means generally called surface graft polymerization.
Graft polymerization is a method of synthesizing a graft (grafting) polymer by giving an active species on the polymer compound chain and further polymerizing another monomer that initiates polymerization. When a molecular compound forms a solid surface, it is called surface graft polymerization.

  In the present invention, the double bond compound is brought into contact with the surface of the insulating layer composed of the epoxy resin described above and irradiated with ultraviolet rays to generate active sites on the substrate. The polymerizable group and the substrate react to cause a surface graft polymerization reaction.

  As a method of bringing the compound having a double bond into contact with the surface of the insulating resin layer made of epoxy resin, the base material having the first conductive pattern is immersed in a liquid composition containing the double bond compound. However, in consideration of handling properties, production efficiency, and influence on the formed circuit, the double bond compound is applied as it is to the surface of the insulating resin layer, or it is used as a main component. It is preferable to carry out by forming a layer containing a double bond compound on the surface by applying the composition contained as

  This contact is preferably performed in the absence of a compound having a polymerization initiating ability from the viewpoint of suppressing undesired formation of a homopolymer. That is, when the contact is performed with the double bond compound alone, naturally other compounds will not coexist, but when the double bond compound is dissolved in a solvent or dispersed in a dispersion medium and contacted, The double bond compound-containing composition needs to be free of other compounds that can participate in a polymerization reaction such as a polymerization initiator. Therefore, in any of the dipping method and the coating method, the double bond compound-containing composition to be used is preferably a composition comprising only a double bond compound and a solvent or a dispersion medium as main components. Even if it contains a compound, it is preferably limited to a surfactant or the like for the purpose of improving the properties of the liquid composition such as coating properties and surface properties, if desired. Even when the coating method is used, it is preferable to perform exposure after removing the solvent by drying after coating.

The solvent used for the double bond compound-containing composition is not particularly limited as long as it can dissolve or disperse etc. polymer compound having a polymerizable group and an interactive group which is the main component, Aqueous solvents such as water and water-soluble solvents are preferred, and surfactants may be further added to these mixtures and solvents.
Examples of the solvent that can be used include alcohol solvents such as methanol, ethanol, propanol, ethylene glycol, glycerin and propylene glycol monomethyl ether, acids such as acetic acid, ketone solvents such as acetone and cyclohexanone, amides such as formamide and dimethylacetamide. System solvents, and the like.

  The surfactant that can be added to the solvent as needed may be any that dissolves in the solvent. Examples of such surfactants include an anionic surfactant such as sodium n-dodecylbenzenesulfonate. Agents, cationic surfactants such as n-dodecyltrimethylammonium chloride, polyoxyethylene nonylphenol ether (commercially available products such as Emulgen 910, manufactured by Kao Corporation), polyoxyethylene sorbitan monolaurate (commercially available) Examples of the product include a trade name “Tween 20” and the like, and nonionic surfactants such as polyoxyethylene lauryl ether.

When the graft polymer is produced by bringing the composition into contact with the surface of the insulating resin layer in a liquid state, it can be optionally performed, but as the coating amount when the composition is applied to the substrate surface by a coating method, from the viewpoint of obtaining sufficient coating film is preferably 0.1 to 10 g / m ² in terms of solid content, in particular 0.5 to 5 g / m ² is preferred.

Hereinafter, the manufacturing method of the multilayer printed wiring board concerning this invention is demonstrated concretely.
First, a laminate having an arbitrary conductive pattern (first conductive pattern) on an insulating substrate is prepared. The insulating substrate used here is an epoxy resin substrate, and is made of the same material as the above-described insulating resin layer made of epoxy resin.
The method for forming the first conductive pattern is arbitrary, and the copper-clad laminate may be etched to form a copper pattern, or by electroless plating through a resist to form a copper pattern. Even if it is formed, it may be formed using a graft polymer pattern in the same manner as the second conductive pattern described later.

(A) step of the present invention, in such an insulating substrate, a step of further forming the epoxy resins made insulation resin layer on the first conductive pattern on which is formed optionally.
If the insulating resin layer is an epoxy resin, a thermosetting resin, a photosensitive resin, a thermoplastic resin, a photo-curing thermosetting resin appropriately combining these resins, and a sea-island structure or an IPN structure (interpenetrating network). You may form using any of composite resin etc. which have (structure) etc. Specifically, it is not particularly limited as long as it has heat resistance, insulation and plating solution resistance. For example, epoxy resin, epoxy acrylate, modified epoxy resin, epoxy-PES resin composite, etc. Any of the above-mentioned epoxy resins can be selected and used. This insulating resin layer is, for example, applied to an uncured epoxy resin material for forming an insulating resin layer on a substrate by a known printing method such as a screen printing method, a spray method, or a curtain coating method, and then cured. Alternatively, the insulating resin film can be laminated and then cured.
In addition, before forming the insulating resin layer, the insulating resin can be embedded in the recesses between the first circuit layers, and the substrate surface can be smoothed in advance. Thereby, the thickness of the insulating resin layer becomes uniform, and the reliability in the subsequent steps is obtained.

[Adhesive layer]
In addition, after forming a 1st circuit (1st electroconductive pattern) on an insulated substrate and manufacturing a wiring board (multilayer wiring board) on it by the build-up, an insulating resin layer ( = Insulating substrate) In order to improve the adhesion between the first circuit and the first circuit, an adhesive layer may be provided on the back surface of the second insulating resin layer.
For the adhesive layer, for example, a conventional adhesive resin is used, and a known technique can be applied as long as it has an appropriate resin flow property and can realize strong adhesiveness. Further, the adhesive layer may be a conductive adhesive layer including appropriate conductive particles such as metal fine particles.

  The type of the adhesive layer is not particularly limited, but it can be roughly classified according to the type of adhesive resin to be contained. (A) A heat-fusible adhesive using a thermoplastic resin, (B) a thermosetting resin (thermosetting type) Two types of curable adhesives utilizing the curing reaction of resin) are typical.

Next, (b) a step of applying a compound having a double bond to the surface of the insulating resin layer and irradiating the pattern with ultraviolet light to form a graft polymer pattern on the insulating material layer. Prior to or after this step, a step (c) of forming a via hole opening in the insulating resin layer, which will be described in detail below, is performed.
The method for forming the graft polymer pattern in step (b) is as described in detail above. That is, when a compound having a double bond is brought into contact with the surface of the insulating resin layer made of epoxy resin and pattern exposure with ultraviolet rays is performed, a graft polymer pattern directly bonded to the surface of the insulating resin layer is formed only in the exposed region.

[UV irradiation]
As an energy application method for generating an active site on the surface of the insulating resin layer made of epoxy resin and generating a graft, irradiation with ultraviolet rays can be used. For example, light irradiation with a UV lamp, black light, or the like is possible.
Examples of the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp. Further, g-line, i-line, and Deep-UV light are also used.
The time required for energy application varies depending on the amount of the target graft polymer produced and the light source, but is usually between 10 seconds and 5 hours.
A preferable exposure light source for forming a high-resolution pattern is a mercury lamp (low pressure, medium pressure, high pressure, ultrahigh pressure) having exposure wavelengths of 254 nm and 365 nm and capable of parallel light exposure. In general, the exposure is performed by a method called a contact aligner. Other exposure methods include light beam scanning exposure using an optical system, exposure using a mask, and the like, and an exposure method corresponding to the resolution of a desired pattern may be employed. A patterned mask film May be adhered to the surface of the insulating resin layer and exposed through a mask film, or scanning exposure may be performed. Since ultraviolet rays have a relatively short wavelength, by using a parallel light source, a pattern having a pattern width of 100 μm or less, preferably 3 to 25 μm is formed, thereby forming a high-definition pattern corresponding to the mask film pattern. Is possible.

After the exposure, washing with a solvent, for example, washing with water is performed to remove the unreacted double bond compound, thereby forming a graft polymer pattern. In the method of the present invention, there is no formation of an undesired homopolymer, impurities are easily removed by simple washing, and a high-definition graft polymer pattern according to the exposure conditions is formed.
Graft film formed is preferably the thickness is in the range of 0.1 to 2.0 g / m ^2, more preferably 0.3 to 1.0 g / m ^2, and most preferably, 0.5 The range is 1.0 g / m ² .
Patterned graft polymer over type forming region in accordance with such UV irradiation area, by having a polar group, or interactive group with the electroless plating catalyst (precursor), when performing an electroless plating The region has excellent plating receptivity.

The step of forming a via hole opening in the insulating material layer, which is performed before or after the step (b), electrically connects a second conductive pattern, which will be described later, and the first conductive pattern. Forming an opening for forming a conductive path.
Examples of the processing method for forming the opening include a method using a known drill machine, dry plasma apparatus, carbon dioxide laser, UV laser, excimer laser, etc. Among them, UV-YAG laser and excimer laser are used. The method is more preferable because a via having a small diameter and a good shape can be formed. In addition, when forming the opening for via | veering by decomposition | disassembly by laser heating like the method using a carbon dioxide laser etc., it is more preferable to perform a desmear process further. By the desmear process, the conductive layer in the via can be formed more favorably in the subsequent process.

Next, (d) electroless plating is performed on the insulating resin layer to form a second conductive pattern and a via hole corresponding to the graft polymer pattern, and the second conductive pattern and the first hole are formed by the via hole. A step of forming a conductive path by electrically connecting the conductive pattern is performed.
In the steps (b) to (c), the graft polymer is formed in a pattern on the surface of the insulating resin layer, and the graft polymer formation region becomes the plating receptive region. For this reason, electroless plating is selectively performed on the graft polymer formation region, and secondly, a conductive pattern is formed. Also, by applying electroless plating, the via hole opening is also plated at the same time, thereby forming a via and electrically connecting the first conductive pattern and the second conductive pattern. A conductive path is formed.
The plating process performed in this step is not particularly limited to the type of metal such as copper plating or nickel plating, and generally known electroless plating can be applied.

Specifically, the electroless plating treatment is performed by applying an electroless plating catalyst or a precursor thereof to the existing region (graft pattern) of the graft polymer chain, and then performing electroless plating to form a metal pattern. The method of forming a film | membrane is mentioned.
<Electroless plating catalyst>
The electroless plating catalyst used in this step is mainly a zero-valent metal, and examples thereof include Pd, Ag, Cu, Ni, Al, Fe, and Co. In the present invention, Pd and Ag are particularly preferable because of their good handleability and high catalytic ability. As a method for fixing the zero-valent metal on the graft pattern (interactive region), for example, a functional group (interactive group) that interacts with the electroless plating catalyst (precursor) on the graft pattern, A technique is used in which a metal colloid whose charge is adjusted so as to interact is applied to the interactive region. In general, a metal colloid can be prepared by reducing metal ions in a solution containing a charged surfactant or a charged protective agent. The charge of the metal colloid can be adjusted by the surfactant or the protective agent used here, and the metal colloid having the charge adjusted as described above is interacted with the interactive group of the graft pattern. The metal colloid (electroless plating catalyst) can be selectively adsorbed onto the graft pattern.

<Electroless plating catalyst precursor>
The electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction. Mainly, metal ions of zero-valent metal used in the electroless plating catalyst are used. The metal ion that is an electroless plating catalyst precursor becomes a zero-valent metal that is an electroless plating catalyst by a reduction reaction. The metal ion that is the electroless plating catalyst is applied to the base material, and before being immersed in the electroless plating bath, it may be changed to a zero-valent metal by a separate reduction reaction and used as an electroless plating catalyst. The precursor may be immersed in an electroless plating bath and changed to a metal (electroless plating catalyst) by a reducing agent in the electroless plating bath.

In fact, the metal ions that are electroless plating precursors are imparted to the graft pattern in the state of a metal salt and allowed to interact. The metal salt used is not particularly limited as long as it is dissolved in an appropriate solvent and dissociated into a metal ion and a base (anion), and M (NO ₃ ) _n , MCl _n , M _{2 / n} (SO ₄ ), M _{3 / n} (PO ₄ ) (M represents an n-valent metal atom), and the like. As a metal ion, the thing which said metal salt dissociated can be used suitably. Specific examples include, for example, Ag ions, Cu ions, Al ions, Ni ions, Co ions, Fe ions, and Pd ions, and Ag ions and Pd ions are preferable in terms of catalytic ability.

  As a method for applying a metal colloid as an electroless plating catalyst or a metal salt as an electroless plating precursor onto a graft pattern, the metal colloid is dispersed in an appropriate dispersion medium, or the metal salt is added with an appropriate solvent. A solution containing dissolved and dissociated metal ions is prepared, and the solution is applied to the surface of the substrate on which the graft pattern exists, or the substrate having the graft pattern is immersed in the solution. Contacting a solution containing a metal ion to adsorb a metal ion to the interacting group of the graft pattern forming region using an ion-ion interaction or a bipolar-ion interaction; or The interaction region can be impregnated with metal ions. From the viewpoint of sufficient adsorption or impregnation, the metal ion concentration or metal salt concentration of the solution to be contacted is preferably in the range of 1 to 50% by mass, and in the range of 10 to 30% by mass. Is more preferable. Further, the contact time is preferably about 1 minute to 24 hours, more preferably about 5 minutes to 1 hour.

  Next, by performing electroless plating on the substrate having the electroless plating catalyst (precursor) adsorbed in the graft polymer formation region, a high-density metal film according to the pattern on the graft pattern obtained in the previous step. And a second conductive pattern is obtained. As a result, the formed metal pattern has excellent conductivity and adhesion with the insulating resin layer.

<Electroless plating>
Electroless plating refers to an operation of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
The electroless plating in this step is performed by, for example, washing the substrate provided with the electroless plating catalyst in a pattern to remove excess electroless plating catalyst (metal) and then immersing it in an electroless plating bath. . As the electroless plating bath to be used, a generally known electroless plating bath can be used.
In addition, when the substrate to which the electroless plating catalyst is applied in a pattern is immersed in the electroless plating bath in a state where the electroless plating catalyst precursor is adsorbed or impregnated in the graft pattern, the substrate is washed with excess water. After removing the electroless plating catalyst precursor (metal salt, etc.), it is immersed in an electroless plating bath. In this case, reduction of the precursor and subsequent electroless plating are performed in the electroless plating bath. As the electroless plating bath used in this embodiment, a generally known electroless plating bath can be used as described above.

The composition of a general electroless plating bath is as follows: 1. metal ions for plating; 2. reducing agent; Additives (stabilizers) that improve the stability of metal ions are mainly included. In addition to these, the plating bath may contain known additives such as a plating bath stabilizer.
Copper, tin, lead, nickel, gold, palladium, and rhodium are known as the types of metals used in the electroless plating bath, and copper and gold are particularly preferable from the viewpoint of conductivity.
In addition, there are optimum reducing agents and additives according to the above metals. For example, a copper electroless plating bath contains Cu (SO ₄ ) ₂ as a copper salt, HCOH as a reducing agent, and a chelating agent such as EDTA or Rochelle salt as a copper ion stabilizer as an additive. The plating bath used for electroless plating of CoNiP includes cobalt sulfate and nickel sulfate as metal salts, sodium hypophosphite as a reducing agent, sodium malonate, sodium malate, and sodium succinate as complexing agents. It is included. In addition, the palladium electroless plating bath contains (Pd (NH ₃ ) ₄ ) Cl ₂ as metal ions, NH ₃ and H ₂ NNH ₂ as reducing agents, and EDTA as a stabilizer. These plating baths may contain components other than the above components.

The film thickness of the metal film thus formed can be controlled by the concentration of the metal salt or metal ion in the plating bath, the immersion time in the plating bath, the temperature of the plating bath, etc. Is preferably 0.5 μm or more, more preferably 3 μm or more.
Further, the immersion time in the plating bath is preferably about 1 minute to 3 hours, and more preferably about 1 minute to 1 hour.

[Electroplating]
After the electroless plating in the present invention, an electroplating process can be performed. That is, when a metal film is formed using an electroless plating process, electroplating can be further performed using the formed metal film as an electrode. As a result, a metal film having an arbitrary thickness can be easily formed on the metal film pattern having excellent adhesion to the substrate. By adding this step, a patterned metal film can be formed with a thickness according to the purpose, so that a conductive pattern having desired characteristics can be formed.
A conventionally known method can be used as the electroplating method in the present invention. In addition, as a metal used for the electroplating of this process, copper, chromium, lead, nickel, gold, silver, tin, zinc, etc. are mentioned. From the viewpoint of conductivity, copper, gold, and silver are preferable, and copper is preferable. More preferred.

  The film thickness of the metal film obtained by electroplating varies depending on the application, and can be controlled by adjusting the concentration of metal contained in the plating bath, the dipping time, or the current density. In addition, from the viewpoint of conductivity, the film thickness when used for general electric wiring or the like is preferably 0.3 μm or more, and more preferably 3 μm or more.

  According to the method of the present invention, the second conductive pattern formed on the insulating resin layer is chemically bonded through the graft polymer pattern having excellent adhesion to the substrate. For this reason, the adhesion strength between the insulating material layer and the second conductive pattern shows a practically sufficient value even when the insulating substrate and the insulating material layer provided thereon have high smoothness.

In this step, the second conductive pattern and the first conductive pattern are electrically connected by embedding a conductive material in the hole (via) formed in the step (c) and imparting conductivity. A process for forming a conductive path to be connected is also performed at the same time. In order to make the inside of the via conductive, a method of embedding a conductive material in the via may be used. Specific examples of the conductive material include copper, nickel, chromium, titanium, aluminum, molybdenum, tungsten, zinc, tin, indium, gold, silver, and the like, or alloys thereof (such as nichrome). Metal materials; conductive polymer materials such as polypyrrole and polythiophene; nonmetallic inorganic conductive materials such as graphite and conductive ceramics; and the like.
Examples of the method for embedding the conductive material include an electroless plating method or a coating method. The reason for adopting these methods is that, according to the electroless plating method or the coating method, it is possible to form the conductivity relatively uniformly and easily in a minute space such as the inner surface of the via.
For example, when the via is made of the metal material, a chemical metal plating method (electroless plating method) is particularly preferably performed by applying a catalyst to the inside of the via. This metal plating is preferably performed simultaneously with the metal plating treatment of the graft surface.

  Further, when the via interior is made of a conductive polymer material, an electroless plating method or a coating method is adopted. In the electroless plating method, an appropriate oxidizing agent is applied to the inside of the via, and then the laminate is immersed in a solution containing pyrrole or a thiophene monomer, for example, a pyrrole solution. In the coating method, a solution obtained by dissolving a conductive polymer such as polypyrrole or poly-1,4 dioxythiophene in a solvent may be used, and this solution may be coated on the graft layer and the via.

  In addition, when the inside of the via is made of a nonmetallic inorganic conductive material such as graphite, an electroless plating method that does not use a catalyst is suitably employed. In the case of using graphite plating as an example, the laminate may be immersed in the graphite dispersion after the via surface is treated with the pretreatment liquid. A representative example of the graphite plating solution that can be used in this process is Direct Plating (registered trademark), which is a graphite plating solution manufactured by MEC. This graphite plating solution is a set of a pretreatment liquid (MEC S process SP-6560) and a graphite dispersion liquid (MEC S process SP-6601).

Thereafter, when manufacturing a multilayer wiring board having three or more layers, a second insulating resin layer is formed on the second conductive pattern, and the steps (a) to (d) of the present invention are similarly performed. By repeating, a multilayer wiring board having three or more layers of wiring can be formed.

  In the method for manufacturing a wiring board according to the present invention, more preferably, the second conductive pattern, and the third conductive pattern provided as desired, are formed on an insulating resin layer having a smooth surface. In this case, the second and third circuit layers in the multilayer wiring board of the present invention are smoother than the electroless plating metal layer formed on the surface of the roughened resin substrate which is the prior art. Good adhesion is formed on the surface. Therefore, according to the method for producing a high-definition conductive pattern according to the present invention, there is no disturbance of fine lines due to unevenness of the surface, excellent adhesion, and a good circuit shape as designed having uniform characteristics can be obtained. .

In addition, one characteristic point of the method for manufacturing a wiring board according to the present invention is that it is easy to ensure insulation characteristics during circuit formation. That is, in the conventional semi-additive method, since the electroless copper plating or electroless copper plating catalyst is attached to the entire surface of the insulating substrate, these metals are likely to remain, so that the insulating property between the wirings on the obtained wiring board is low. It tends to decline. However, in the manufacturing method according to the present invention, the electroless copper plating or the electroless copper plating catalyst is attached only to the pattern necessary for the wiring, not to the entire surface of the insulating substrate. The above problem that copper plating or catalyst remains does not occur. Therefore, in the method for manufacturing a wiring board according to the present invention, it is possible to form a high-density circuit (wiring) excellent in adhesion to the substrate and excellent in insulation.
In addition, a complicated process such as resist coating or etching is not required, and a high-definition pattern can be formed without performing an etching process. I can say that.

EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to these. In the following description, “part” means “part by mass” unless otherwise specified.
Example 1
First, a first circuit layer (first conductive pattern) was formed on a glass epoxy copper clad laminate by a subtractive method. Next, (a) a liquid insulating resin layer forming material shown below is applied onto the first circuit layer with a curtain coater, dried at 110 ° C. for 20 minutes, and then 30 ° C. under a temperature condition of 150 ° C. An epoxy resin insulating resin layer having a thickness of 60 μm was formed by curing in minutes. In addition, the component composition of the insulating resin layer forming material is as follows.

(Composition of insulating resin layer forming material)
・ Epoxy resin (Oka Chemical Shell Co., Ltd., Epicoat 1001): 100 parts ・ Epoxy resin (Oka Chemical Shell Co., Ltd., Epicoat 828): 50 parts ・ Rubber-modified epoxy resin (Toto Kasei Co., Ltd., YR-) 450): 50 parts ・ Imidazole-based epoxy curing agent
(Shikoku Kasei Kogyo Co., Ltd., Curesol 2MZ-A): 5 parts Phenol resin (Maywa Kasei Co., Ltd., HF-1): 20 parts Light calcium carbonate (average particle size 3 μm or less): 35 parts Fine powder Silica (average particle size 1.5 μm or less): 15 parts

Next, an opening for forming a via hole was formed in the insulating resin layer formed in (a) using (c) carbon dioxide laser. Processing conditions at this time are a pulse width of 15/12/5 μS and a shot number of 1/1/1 (Laser processing machine LCO-1B21 manufactured by Hitachi Via Mechanics Co., Ltd.).
(B) Next, a polymer compound having a double bond was applied to the surface of the insulating resin layer under the following conditions.
[Application of polymer compound having double bond]
A hydrophilic polymer (P-1, obtained by the following synthesis example) having an acrylic group and a carboxyl group as a double bond compound on the surface of the epoxy substrate resin B obtained as described above and having a polymerizable group in the side chain. ) Was applied with a rod bar # 6 and dried at 100 ° C. for 1 minute to provide a graft polymer precursor layer having a thickness of 2 μm.
Compound having a polymerizable group (application of graft precursor polymer)
<Coating liquid composition 1>
-Hydrophilic polymer (P-1) having a polymerizable group in the side chain 3.1 g
・ Water 24.6g
1-methoxy-2-propanol 12.3 g

(Synthesis of hydrophilic polymer (P-1) having a polymerizable group in the side chain)
18 g of polyacrylic acid (average molecular weight 25,000) is dissolved in 300 g of dimethylacetamide (DMAC), and 0.41 g of hydroquinone, 19.4 g of 2-methacryloyloxyethyl isocyanate, 0.25 g of dibutyltin dilaurate, , And reacted at 65 ° C. for 4 hours. The acid value of the obtained polymer was 7.02 meq / g. Thereafter, the carboxyl group was neutralized with a 1 mol / l (1N) aqueous sodium hydroxide solution, ethyl acetate was added to precipitate the polymer, washed well, and 18.4 g of a hydrophilic polymer having a polymerizable group in the side chain ( P-1) was obtained.

[Generation of graft polymer by exposure]
A mask corresponding to the circuit pattern was adhered to the surface of the insulating resin layer of the substrate thus obtained, energy was applied to the entire surface under the following conditions, and a graft polymer directly bonded to the epoxy substrate was formed in a pattern. Obtained material.
Energy application was performed by irradiating the entire surface for 5 minutes using a 1500 W high-pressure mercury lamp (UVX-02516S1LP01, manufactured by Ushio Electric Co., Ltd., light intensity at 254 nm: 38 mW / cm ² ) in an argon atmosphere. After light irradiation, the support was thoroughly washed with ion exchange water. Then, it was immersed in 5 wt% sodium bicarbonate water for 5 minutes and then washed with water.

  (D) Next, the substrate on which the graft polymer is formed in a pattern on the surface of the insulating resin is immersed in an electroless plating solution (manufactured by Atotech Co., Ltd.) at 35 ° C. for 10 minutes to perform electroless plating, and washed with water. Then, annealing was performed at 100 ° C. for 30 minutes. The film thickness of the electroless copper plating obtained here was 0.3 μm.

Subsequently, an electrolytic copper plating layer having a thickness of 18 μm was formed by electrolytic plating using an 80 g / l copper sulfate solution, and after-baking was performed at 150 ° C. for 60 minutes. Thus, the multilayer printed wiring board was manufactured by obtaining the 2nd circuit layer.
In this multilayer printed board, it was confirmed that a conductive circuit was also formed in the opening for the via hole by the plating process.

(Example 2)
A multilayer printed wiring board was produced in the same manner as in Example 1 except that the following materials were used as the insulating resin layer forming material.
As component (A), bisphenol A type epoxy resin (epoxy equivalent 185, Epicoat 828 manufactured by Yuka Shell Epoxy Co., Ltd.) 20 parts by mass (hereinafter, all compounding amounts are expressed in parts by mass), cresol novolac type epoxy resin (epoxy equivalent) 215, 45 parts by Daikoku Ink Chemical Co., Ltd. Epicron N-673), and 30 parts by weight of phenol novolac resin (phenolic hydroxyl group equivalent 105, Phenolite by Dainippon Ink Chemical Co., Ltd.) as component (B) After stirring and dissolving in 20 parts of diglycol acetate and 20 parts of solvent naphtha and cooling to room temperature, cyclohexanone varnish of phenoxy resin consisting of 828 and bisphenol S as component (C) (manufactured by Yuka Shell Epoxy Co., Ltd.) YL6747H30, nonvolatile content 30% by mass, weight average (Particulate amount 47000) 30 parts, and (D) component as 2-phenyl-4,5-bis (hydroxymethyl) imidazole pulverized product 0.8 parts, further finely pulverized silica 2 parts, silicon antifoaming agent 0.5 parts Addition to produce an epoxy resin varnish.

(Comparative Example 1)
In Example 1, it carried out like Example 1 except not having apply | coated the high molecular compound which has a double bond. Even when the electroless plating treatment was performed, a plating film (metal film) was not formed, and a circuit was not formed.

For the multilayer printed wiring boards of Examples 1 and 2 obtained in this way, the peel strength between the conductor (conductive pattern) and the insulating resin layer in accordance with JIS C 6481 (Max value, Min value, Ave value) was measured, and the results are shown below.
Example 1: Peel strength (kN / m) maximum value 1.9, minimum value 1.7, average value 1.8
Example 2: Peel strength (kN / m) maximum value 1.8, minimum value 1.7, average value 1.8

[Evaluation of conductivity]
Moreover, when the surface conductivity of the 2nd circuit layer was measured using the resistivity meter (Loresta, Mitsubishi Chemical make) with the obtained multilayer printed wiring board, all were 0.1 ohm / square.

  As is clear from the results shown above, in the multilayer printed wiring boards in Examples 1 and 2, the peel strength between the formed circuit and the insulating resin layer surface is a practically sufficient value, and the peel strength Max. It can be seen that there is almost no difference between the value and the Min value, and the conductor peel strength is stable over the entire circuit. Moreover, it turned out that it is excellent in the electroconductivity of a 2nd circuit layer. In addition, it was also confirmed that all the examples according to the present invention have high electrical connection reliability between conductors via via holes.

Claims (7)

(A) An insulating resin layer forming material containing an epoxy resin is applied to a first conductive pattern arbitrarily formed on an insulating substrate, and then the insulating resin layer forming material is cured to mainly use an epoxy resin. A step of forming an insulating resin layer as a component; and (b) applying a polymer compound having a polar functional group and a double bond to the surface of the insulating resin layer, and irradiating the pattern with ultraviolet light to insulate. A step of forming a graft polymer pattern composed of an existing region and a non-existing region of the graft polymer by generating a graft polymer to which the polymer compound is bonded starting from an active point generated in the ultraviolet light irradiation region on the resin layer; (C) a step of forming a via-hole opening in the insulating resin layer before or after the step (b), and (d) a second process according to the graft polymer pattern by applying electroless plating to the insulating resin layer. of Forming a conductive pattern and a via hole, and electrically connecting the second conductive pattern and the first conductive pattern by the via hole to form a conductive path. A method for manufacturing a multilayer wiring board.   2. The multilayer wiring according to claim 1, wherein in the step (b), a plating film is selectively formed in a region where the graft polymer formed on the insulating resin layer is present, thereby forming a conductive pattern. A manufacturing method of a board.   The insulating resin layer forming material containing the epoxy resin includes an epoxy compound having 2 or more and 50 or less epoxy groups in one molecule, and a compound having a functional group that reacts with two or more epoxy groups in one molecule; The method for producing a multilayer wiring board according to claim 1, comprising:   The method for producing a multilayer wiring board according to any one of claims 1 to 3, wherein the polymer compound has a weight average molecular weight in the range of 500 to 500,000.   The method for producing a multilayer wiring board according to claim 1, wherein the polymer compound has a polymerizable group in a side chain.   Any one of Claims 1-5 which the said high molecular compound is obtained by the method of copolymerizing the monomer which has a polar functional group, and the monomer which has a double bond precursor, and introduce | transducing a double bond by the process of a base. A method for producing a multilayer wiring board according to claim 1.   The polar functional group of the polymer compound includes a carboxyl group, a sulfonic acid group, a phosphoric acid group, an amino group or a salt thereof, an amide group, a phosphine group, an imidazole group, a pyridine group or a salt thereof, a hydroxyl group, and an ether group. The method for producing a multilayer wiring board according to any one of claims 1 to 6, wherein the functional group is selected from the group consisting of: