JP5797582B2 - Exposure drawing apparatus, program, and exposure drawing method - Google Patents

Description

  The present invention relates to an exposure drawing apparatus, a program, and an exposure drawing method, and in particular, an exposure drawing apparatus that draws a circuit pattern by exposing a light beam to an exposed substrate, a program executed by the exposure drawing apparatus, and The present invention relates to an exposure drawing method for drawing a circuit pattern by exposing a substrate to be exposed with a light beam.

  Conventionally, when manufacturing a semiconductor device, there has been a problem that dust floating in the manufacturing apparatus adheres to the wafer. Therefore, Patent Document 1 proposes a semiconductor device manufacturing apparatus that predicts the number of dust adhering to a wafer during manufacturing. This manufacturing apparatus includes a dust measuring device for measuring the number of dust floating in a vacuum processing chamber, the number of measured dust on the number of dust floating in the processing chamber, and a wafer processed in the processing chamber. A data processing device is provided that predicts the number of dust adhering to the wafer to be processed in the processing chamber by collating with the correlation with the number of adhering dust. With this configuration, the user can predict the number of dust adhering to the wafer during the manufacture of the semiconductor device, and if the predicted number of dust is equal to or greater than a reference value, the user can stop the process in the processing chamber and perform cleaning. it can.

  On the other hand, in an exposure drawing apparatus that draws a circuit pattern by exposing a light beam to an exposed substrate, similarly, when exposure is performed by a method using a conventional transfer mask, the transfer mask is used during manufacturing. If the adhered dust adheres to the substrate to be exposed, the substrate to be exposed becomes a defective product in lot units (job units). Therefore, it has been desired that the presence or absence of dust adhesion can be confirmed at the manufacturing site.

  On the other hand, exposure may be performed by a direct drawing type method that does not use a transfer mask. In this case, in principle, there is no transfer mask, so defective products in lot units due to dust adhering to the transfer mask. There is no occurrence. However, at the manufacturing site, the defect occurrence rate of the substrate to be exposed during the exposure process is grasped with respect to the dust cultivated in the era when the transfer mask was used, that is, with a high estimate of the occurrence rate of defective products, As the image pattern to be drawn becomes more precise, there is a sense of anxiety that the particle size of the dust that generates defective products has become smaller, and the user becomes more sensitive to dust that is invisible, which is more than necessary. There is a current situation of implementing measures against dust.

JP-A-8-5542

  As a countermeasure against dust in the exposure drawing apparatus, it is conceivable to apply the countermeasure against dust in the semiconductor device manufacturing apparatus disclosed in Patent Document 1 to the exposure drawing apparatus. However, in the dust countermeasure disclosed in Patent Document 1, since the process is stopped when the predicted number of dust exceeds a specified value, it is impossible to confirm the number of dust being manufactured for each wafer after manufacturing. There was a problem.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an exposure drawing apparatus, a program, and an exposure drawing method capable of confirming the dust level in the exposure apparatus at the time of exposure processing for each substrate to be exposed. And

  In order to achieve the above object, an exposure drawing apparatus according to claim 1, an exposure means for drawing a circuit pattern by exposing a substrate to be exposed, and a counting means for counting the number of fine particles in the exposure drawing apparatus. Determining means for determining whether or not the number of particles counted by the counting means during the exposure processing by the exposing means is equal to or greater than a threshold value determined based on a size related to the pattern of the circuit pattern; and And adding means for adding predetermined information to the substrate to be exposed when it is determined that the value is equal to or greater than the threshold value.

  In the exposure drawing apparatus according to the first aspect, the circuit pattern is drawn by exposing the substrate to be exposed by the exposure means, and the number of fine particles in the exposure drawing apparatus is counted by the counting means.

  Here, in the present invention, whether or not the number of particles counted by the counting unit during the exposure process by the exposing unit is greater than or equal to a threshold value determined based on a size related to the pattern of the circuit pattern by the determining unit. Is determined and the adding unit adds predetermined information to the substrate to be exposed when the determining unit determines that the value is equal to or greater than the threshold value. Note that “exposure processing” refers to a series of processing operations for bringing an exposed substrate into the exposure drawing apparatus, starting exposure on the exposed surface, and completing exposure on the exposed surface.

  As described above, according to the exposure drawing apparatus of the first aspect, the predetermined information is added to the exposed substrate in which the number of fine particles in the apparatus is equal to or larger than the threshold value during the exposure process. It is possible to confirm the dust level in the exposure apparatus during the exposure process on the exposure substrate.

  In the present invention, as in the invention described in claim 2, the size relating to the pattern is the minimum value of the pitch width between adjacent patterns in the circuit pattern, the minimum value of the pattern width, and the minimum value of the land diameter. You may make it be at least one of these. Thus, an appropriate threshold value can be determined according to the circuit pattern drawn on the substrate to be exposed.

  Further, in the present invention, as in the invention according to claim 3, the counting means counts the number of particles for each particle size range of the fine particles, the threshold is determined for each particle size range, The determination means determines whether or not the number of particles is equal to or greater than a predetermined threshold value for each particle size range, and the threshold value for which the number of particles in one or more particle size ranges is determined for each particle size range If it is above, it may be determined that the threshold value is exceeded. This makes it possible to determine whether the number of particles is greater than or equal to the threshold value for each type of fine particle, considering that the particle size of the fine particle is different for each type of fine particle.

  Further, according to the present invention, as in the invention described in claim 4, the acquisition unit that acquires the identification information of the substrate to be exposed, and the identification that the number of particles counted by the counting unit is acquired by the acquisition unit You may make it further provide the memory | storage means to match and memorize | store information. Thereby, the number of fine particles existing in the apparatus during the exposure process can be confirmed based on the identification information of the substrate to be exposed.

  Further, according to the present invention, as in the invention described in claim 5, the determination unit further determines to which of a plurality of predetermined categories the number of particles counted by the counting unit belongs. The determination unit may add information indicating the classification determined by the determination unit as the predetermined information to the substrate to be exposed. Thereby, the dust level in the exposure apparatus during the exposure process for each substrate to be exposed can be confirmed in more detail.

  In addition, as in the invention described in claim 6, the present invention may further include an aligning unit that aligns the substrate to be exposed to which the information indicating the section is added by the adding unit for each section. good. Thereby, it is possible to more easily check the dust level in the exposure apparatus during the exposure process for each substrate to be exposed.

  Further, according to the present invention, when it is determined by the determination means that the threshold value is equal to or greater than the threshold value, the exposure process is stopped when the exposure process performed at that time is completed. Then, after the stop, the determination unit may further include an exposure control unit that restarts the exposure process when it is determined that the threshold value is not greater than or equal to the threshold value. Thereby, it is possible to prevent a defective product of the substrate to be exposed from occurring due to failure of exposure.

  In addition, as in the invention described in claim 8, the present invention includes a receiving unit that receives an input of an allowable rate of occurrence of defects due to allowable dust, and the threshold value is a size related to the pattern and a defect received by the receiving unit. It may be determined based on the occurrence rate. Further, the present invention, as in the ninth aspect of the invention, further includes a receiving unit that receives an input of a ratio of the number of fine particles adhering to the exposed substrate with respect to the number of floating fine particles, and the threshold value May be determined based on the size relating to the pattern and the ratio received by the receiving means. Thus, an appropriate threshold value can be determined according to the manufacturing environment.

  On the other hand, in order to achieve the above object, the program according to claim 10 counts the number of fine particles in an exposure drawing apparatus having an exposure means for drawing a circuit pattern by exposing a substrate to be exposed. Determining means for determining whether or not the number of particles counted by the counting means during an exposure process by the exposing means is equal to or greater than a threshold value determined based on a size related to the pattern of the circuit pattern When the determination means determines that the value is equal to or greater than the threshold value, the determination means functions as a drawing means for drawing predetermined information on the substrate to be exposed.

  Therefore, according to the program according to the tenth aspect, the computer can be operated in the same manner as the invention according to the first aspect. Therefore, similarly to the first aspect, the exposure process for each substrate to be exposed is performed. The dust level in the exposure apparatus at the time can be confirmed.

  On the other hand, in order to achieve the above object, an exposure drawing method according to claim 11 counts the number of fine particles in an exposure drawing apparatus having an exposure means for drawing a circuit pattern by exposing a substrate to be exposed. And a determination step for determining whether or not the number of particles counted in the counting step is greater than or equal to a threshold value determined based on a size related to the circuit pattern during the exposure process by the exposure unit. And a drawing step of drawing predetermined information on the substrate to be exposed when it is determined by the determination step that the value is equal to or greater than a threshold value.

  Therefore, according to the exposure drawing method of the eleventh aspect, since it operates in the same manner as the first aspect of the invention, similarly to the first aspect of the invention, the exposure at the time of the exposure process for each substrate to be exposed is performed. The dust level in the device can be confirmed.

  According to the present invention, it is possible to check the dust level in the exposure apparatus during the exposure process for each substrate to be exposed.

It is a block diagram which shows the whole structure of the exposure drawing system which concerns on embodiment. It is a perspective view which shows the internal structure of the exposure drawing apparatus which concerns on embodiment. It is a figure which shows the inhalation position of the air by the dust measuring device in the exposure drawing apparatus which concerns on embodiment. It is a schematic top view which shows the structure of the dust measuring device of the exposure drawing apparatus which concerns on embodiment. It is a block diagram which shows the structure of the electric system of the exposure drawing apparatus which concerns on embodiment. It is a block diagram which shows the structure of the electric system of the control apparatus of the exposure drawing system which concerns on embodiment. It is a flowchart which shows the flow of a process of the exposure processing program which concerns on 1st Embodiment. It is the elements on larger scale which show an example of the image drawn on the to-be-exposed board | substrate in the exposure drawing apparatus which concerns on 1st Embodiment. It is a front view which shows an example of the to-be-exposed board | substrate with which the mark was formed by the exposure drawing apparatus which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process of the exposure processing program which concerns on 2nd Embodiment. It is a front view which shows an example of the to-be-exposed board | substrate with which the mark was formed by the exposure drawing apparatus which concerns on 2nd Embodiment. It is a schematic diagram which shows an example of the measurement result information produced in the exposure drawing apparatus which concerns on 2nd Embodiment. It is a flowchart which shows the flow of a process of the exposure process program which concerns on 3rd Embodiment. It is a front view which shows an example of the to-be-exposed board | substrate with which the mark was formed by the exposure drawing apparatus which concerns on 3rd Embodiment. It is a flowchart which shows the flow of a process of the alignment processing program which concerns on 4th Embodiment.

[First Embodiment]
Hereinafter, the exposure drawing system according to the first embodiment will be described in detail with reference to the accompanying drawings. In the first embodiment, the exposure drawing system 1 is an example of a system that performs exposure drawing on one or both sides of a substrate to be exposed, using a flat substrate such as a printed wiring board and a glass substrate for a flat panel display as a substrate to be exposed. explain.

  FIG. 1 is a configuration diagram showing the overall configuration of an exposure drawing system 1 according to the first embodiment. As shown in FIG. 1, the exposure drawing system 1 exposes a substrate to be exposed (exposed substrate C to be described later) and measures the number of fine particles in the apparatus, and the number of particles is equal to or greater than a threshold value. The exposure drawing device 2 for recording a mark (a mark M to be described later) on the substrate C to be exposed, and the control device 3 for controlling the exposure drawing and the formation of the mark M by the exposure drawing device 2 are provided.

  FIG. 2 is a perspective view showing an internal configuration of the exposure drawing apparatus 2 according to the first embodiment. In the following, the direction in which the stage 10 moves is defined as the Y direction, the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction, and the direction orthogonal to the Y direction in the vertical plane is defined as the Z direction. Further, the rotation direction that rotates clockwise about the Z axis is defined as the θ direction.

  As shown in FIG. 2, the exposure drawing apparatus 2 includes a flat stage 10 for fixing the substrate C to be exposed. When the exposed substrate C is placed on the upper surface, the stage 10 sucks air between the exposed substrate C and the stage 10 and causes the exposed substrate C to be vacuum-adsorbed on the upper surface. Further, the stage 10 is configured to be movable, and the exposure target substrate C fixed to the stage 10 moves to the exposure position as the stage 10 moves, and a light beam is irradiated by the exposure unit 16 described later. Thus, an image such as a circuit pattern is drawn.

  The stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11. One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported so as to be freely movable in the Y direction along the guide rail 14, and is moved by a stage drive unit (stage drive unit 41 described later) configured by a motor or the like. The stage 10 is supported on the upper surface of the movable base 12 and moves along the guide rail 14 in conjunction with the movement of the base 12.

  A gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14. The gate 15 exposes the surface of the substrate C to be exposed placed on the stage 10. An exposure unit 16 is attached. The exposure unit 16 includes a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10. An optical fiber 18 drawn from a light source unit 17 described later and a signal cable 20 drawn from an image processing unit 19 described later are connected to the exposure unit 16.

  Each exposure head 16 a has a digital micromirror device (DMD) as a reflective spatial light modulation element, and controls the DMD based on the image data input from the image processing unit 19 to emit light from the light source unit 17. Modulate the beam. The exposure drawing apparatus 2 performs exposure by irradiating the substrate C to be exposed with the modulated light beam. Note that a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.

  In the vicinity of the exposure head 16, an ultraviolet light source 21 that irradiates the exposed substrate C with an ultraviolet beam is provided. The irradiation time of the ultraviolet beam is set to an optimum time according to the photosensitive material applied to the substrate C to be exposed. The installation position of the ultraviolet light source 21 is not limited to the vicinity of the exposure head 16a, and may be a position where a part of the substrate to be exposed C can be irradiated with the ultraviolet beam. In the present embodiment, the ultraviolet light source 21 is fixed. However, the present invention is not limited to this. The ultraviolet light source 21 may be configured to be movable according to the irradiation target position of the ultraviolet beam by a motor or the like. Further, the ultraviolet light source 21 may be provided below the stage 10 so as to irradiate the back surface of the substrate C to be exposed (the surface in contact with the stage 10) with an ultraviolet beam. In this case, the stage 10 is provided with a through hole for allowing the ultraviolet beam to pass in the thickness direction.

  A gate 22 is provided on the upper surface of the base 11 so as to straddle the guide rail 14. The gate 22 includes one or a plurality (two in the present embodiment) of image capturing units 23 for photographing the alignment marks for exposure reference provided on the substrate C to be exposed placed on the stage 10. It is attached. The photographing unit 23 is a CCD camera or the like having a built-in strobe with a very short light emission time. Each photographing unit 23 is installed to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in a horizontal plane.

  The exposure drawing apparatus 2 includes an auto carrier hand (hereinafter referred to as an AC hand) 24 that transports the substrate C to be exposed, which has been carried into the first transport unit 5 from the outside, to the upper surface of the stage 10. The AC hand 24 is formed in a flat plate shape and is movably provided in the horizontal direction and the vertical direction. Further, on the lower surface of the AC hand 24, a suction mechanism having a suction portion 25 that sucks and holds the substrate C to be exposed by vacuum suction by sucking air, and a vertically movable member that presses the substrate C to be exposed downward are freely movable. A pressing mechanism having a pressing portion 26 is provided. The AC hand 24 lifts the unexposed substrate C placed on the first transport unit 5 upward by sucking and holding it by a suction mechanism, and the lifted exposed substrate C is predetermined on the upper surface of the stage 10. Place it at a different position.

  When the AC hand 24 places the exposed substrate C on the stage 10, the AC hand 24 releases the suction by the suction unit 25 while pressing the exposed substrate C against the stage 10 by a pressing mechanism, thereby bringing the exposed substrate C into the stage 10. The substrate to be exposed C is sucked and fixed to the stage 10. The AC hand 24 lifts the exposed substrate C, which has been exposed, placed on the upper surface of the stage 10 by suction and holds it by a suction mechanism, and holds the lifted exposed substrate C by suction. The substrate C to be exposed is moved to the second transport unit 6 by moving to the transport unit 6 and then releasing the suction by the suction mechanism. The exposed substrate C transported to the second transport unit 6 is discharged outside the exposure drawing apparatus 2.

  Here, the exposure drawing apparatus 2 includes a plurality (three in the present embodiment) of dust measuring apparatuses 4 that measure the number of fine particles in the apparatus. The dust measuring device 4 is a so-called particle counter that inhales ambient air and measures the number of fine particles contained in the inhaled air.

  FIG. 3 is a view showing an air suction position by the dust measuring device 4 in the exposure drawing device 2 according to the first embodiment. As shown in FIG. 3, in the exposure drawing apparatus 2, air flows in a direction from the position where exposure is performed to the position where the substrate to be exposed C is placed in the stage movement direction (Y direction). The internal air is discharged to the outside at the position where the substrate C to be exposed is placed.

  In the exposure drawing apparatus 2, in order to more accurately measure the number of fine particles in the apparatus, a predetermined position on the downstream side of the air flow (in this embodiment, a position between the first transport unit 5 and the stage 10, Tubes 4a for sucking air into the dust measuring device 4 are disposed at positions downstream of the stage 10 where the air flows and at positions between the stage 10 and the second transport unit 6, respectively. Further, the air inlet of the tube 4 a is installed at substantially the same height as the upper surface of the stage 10 (substantially the same position in the Z direction). With such a configuration, the number of fine particles near the upper surface of the stage 10 (that is, near the exposed substrate C) can be measured by the dust measuring device 4.

  FIG. 4 is a schematic top view showing the configuration of the dust measuring device 4 of the exposure drawing device 2 according to the first embodiment. As shown in FIG. 4, the dust measuring device 4 includes a suction window 30 for sucking external air (air inside the exposure drawing device 2) K through the tube 4a and the sucked air K. And a discharge window 31 for discharging to the outside (inside the exposure drawing apparatus 2). The air K flowing along the stage moving direction inside the exposure drawing apparatus 2 flows into the dust measurement apparatus 4 through the suction window 30 and then flows through the discharge window 31 to the dust measurement apparatus 4. It flows out to the outside.

  The dust measuring device 4 includes a laser generator 32 that generates the laser light L, an emission window 33 that emits the generated laser light L across the path of the air K, and the emitted laser light L. An incident window 34 that is incident after passing through the path of the air K is provided. When the laser light L passes through the path of the air K, if the air K contains fine particles, a part of the laser light L that collides with the fine particles P is scattered. The dust measuring device 4 is provided with a condensing lens 35 for condensing the scattered laser light L and a detecting device 36 for detecting the laser light L condensed by the condensing lens 35. The dust measuring device 4 counts the number of detected fine particles for each particle size by detecting the fine particles based on the detection value by the detection device 36 and measuring the particle size of each fine particle. The dust measuring device 4 transmits a signal indicating the number of detected fine particles to the control device 3.

  FIG. 5 is a block diagram showing the configuration of the electrical system of the exposure drawing apparatus 2 according to the first embodiment. As shown in FIG. 5, the exposure drawing apparatus 2 is provided with a system control unit 40 that is electrically connected to each part of the apparatus, and the system control unit 40 controls each part in an integrated manner. The system control unit 40 controls the AC hand 24 to perform an operation for loading the substrate C to be exposed into the stage 10 and an operation for discharging it from the stage 10. Further, the system control unit 40 controls the stage driving unit 41 to move the stage 10 and moves the imaging unit 23 via the movement control unit 43 described later to capture the alignment mark of the substrate C to be exposed. To adjust the exposure position and control the light source unit 17 and the image processing unit 19 to cause the exposure head 16a to perform the exposure process. As described above, the “exposure processing” refers to a series of processing operations for bringing the exposed substrate C into the exposure drawing apparatus 2 and starting exposure on the exposed surface to complete the exposure on the exposed surface. Say. The system control unit 40 starts the exposure process for the substrate C to be exposed at the timing when the signal for instructing the start of exposure is received from the control device 3, and at the timing when the signal for instructing the stop of exposure is received. The exposure process is stopped when the exposure process for the substrate C to be exposed is completed.

  Furthermore, the system control unit 40 acquires the number of fine particles for each particle size from the dust measuring device 4 at a predetermined timing. The timing may be the timing immediately before the start of exposure of the substrate C to be exposed, during the exposure, or immediately after the completion of the exposure, or may be the timing at every elapse of a predetermined time.

  The exposure drawing apparatus 2 includes an operation device 42. The operation device 42 includes a display unit that displays information under the control of the system control unit 40 and an input unit that inputs information through a user operation. The input unit is operated by the user when inputting, for example, the minimum pattern width of the substrate C to be exposed.

  Further, the exposure drawing apparatus 2 includes a movement control unit 43. Based on an instruction from the system control unit 40, the movement control unit 43 causes the alignment mark of the substrate to be exposed C to pass through one of the plurality of imaging units 23 or the center of each imaging region when the stage 10 is moved. The moving drive of the photographing unit 23 is controlled.

  FIG. 6 is a block diagram showing the configuration of the electrical system of the control device 3 of the exposure drawing system 1 according to the first embodiment. As shown in FIG. 6, the exposure drawing system 1 includes a control unit 50 that controls exposure processing in the exposure drawing system 1, an exposure processing program necessary for exposure processing by the control unit 50, and a ROM and HDD that store various data. A storage unit 51, a display unit 52 such as a display for displaying data based on the control of the control unit 50, an input unit 53 such as a keyboard for inputting data by a user operation, and an exposure drawing based on the control of the control unit 50 A communication interface 54 for transmitting / receiving data to / from the apparatus 2 is provided.

  Here, the exposure / drawing apparatus 2 according to the present embodiment measures the number of fine particles in the apparatus during the exposure processing of the substrate C to be exposed, and when the measured number of particles is equal to or greater than the threshold, A function of recording information on the number of particles with respect to the substrate C to be exposed.

  Since the conventional exposure drawing apparatus does not measure the number of fine particles in the apparatus as a measure against dust, the exposed substrate C without knowing that the dust is attached to the exposed substrate C at the manufacturing site. There was a potential anxiety of the user that they may have been exposed to and may eventually produce defective products.

  Therefore, in the exposure drawing apparatus 2 according to the present embodiment, the number of fine particles in the apparatus is always measured during the exposure process, and when the measured number of particles is equal to or greater than a threshold value, a predetermined value indicating that is provided. A mark (for example, mark M shown in FIG. 9) is drawn on the substrate C to be exposed. Accordingly, the user can confirm the dust level (for example, whether the measured number of particles is equal to or greater than the threshold value) at the time of the exposure process for each of the exposed substrates C that have been exposed. Can be resolved.

  Further, when the mark M is formed on the exposed substrate C to be inspected, the inspection person in charge has a high dust level during the exposure processing of the substrate C to be exposed (that is, the number of particles measured). Can increase the level of consciousness for the inspection, and as a result, the inspection failure can be suppressed. Furthermore, since it is possible for the user to grasp the correlation between the dust level and the defect occurrence rate of the substrate C to be exposed, it is possible to suppress dust countermeasures to the minimum necessary countermeasures. It leads to the efficiency of production process work.

  Next, the operation of the exposure drawing system 1 according to the first embodiment will be described.

  FIG. 7 is a flowchart showing the flow of processing of the exposure processing program according to the first embodiment. The program is stored in advance in a predetermined area of a ROM that is a recording medium provided in the storage unit 51 of the control device 3. Yes.

  The control unit 50 of the control device 3 performs the exposure at a predetermined timing (in this embodiment, a timing at which processing for continuously exposing a plurality of predetermined substrates C to be exposed is started). Execute the processing program.

  First, in step S101, the control unit 50 calculates a minimum pattern size from image information of an image (circuit pattern in this embodiment) exposed on the substrate C to be exposed. This is because the finer the circuit pattern exposed on the substrate C to be exposed, the finer the particle size (hereinafter also referred to as the allowable dust size) as a threshold for whether or not the substrate pattern C can be allowed to adhere to the substrate C. ) Is considered to be reduced in size.

  FIG. 8 is a partially enlarged view showing an example of an image drawn on the exposed substrate C in the exposure drawing apparatus 2 according to the first embodiment. As shown in FIG. 8, the pattern size according to the present embodiment includes a pattern width that is the width of each drawn pattern, a distance between adjacent patterns or a pitch width that is a distance between adjacent patterns and lands, and There are three types of land diameters for each pattern. The minimum pattern size according to the present embodiment is a minimum value among the minimum value of the pattern width, the minimum value of the pitch width, and the minimum value of the land diameter. Alternatively, the minimum value of the pitch width may be set as the minimum pattern size.

  Next, in step S103, the control unit 50 indicates, for each particle size, the number of particles serving as a threshold value as to whether or not it is acceptable for each particle size in the exposure drawing apparatus 2 to exist. Create a table. This table is used when setting a threshold value in step S109 described later.

  When creating the table, the control unit 50 first calculates the dust concentration, which is the number of fine particles contained in the unit volume. The dust concentration is defined by the following formula (1) according to JIS B 9920. In the expression (1), 0.1 in the second term on the right side is a constant (unit: μm).

Here, the number of classes indicates the cleanliness of the clean room, and is conventionally classified into 1 to 9 by the number of particles having a particle size of 0.5 μm or more in 1 cf (≈0.0283 m ³ ; solid feet), It is still often managed with this indicator. In ISO (International Organization for Standardization), the particle size in 1 m ³ is classified by the number of particles having a diameter of φ0.1 μm or more. In the present embodiment, description will be made on the basis of the unit of the conventional method.

  The table set in the initial state is created using the above formula. For example, when the threshold value of the number of fine particles having a particle size of φ0.5 μm or more is 100, the number of particles of other fine particles having a particle size of 100 or more is shown in Table 1 below. In Table 1 below, the threshold for the number of fine particles having a particle size range of 0.3 μm or more is 289, the threshold for the number of fine particles having a particle size range of 0.7 μm or more is 50, and the particle size range of 1 μm or more. The threshold value for the number of fine particles is 24, the threshold value for the number of fine particles in the particle size range of 2 μm or more is 6, and the threshold number of the particle number of the fine particles in the particle size range of 5 μm or more is one.

  Table 2 below shows an example in which the dust upper limit concentration is divided into a plurality of levels based on a particle diameter of φ0.5 μm or more. According to Table 2 below, the level A is when the number of fine particles having a particle diameter range of φ0.5 μm or more is 0 or more and 100 or less, and the case where the number of particles having a particle size range of φ0.5 μm or more is more than 100 and 200 or less. Level B, level division is performed so that level C is obtained when the number of fine particles having a particle size of φ0.5 μm or more is more than 200 and 300 or less.

  Here, according to Table 2, for example, when the allowable dust size is φ0.5 μm and the number of particles in the particle size range of φ0.5 μm or more measured during the exposure process is 150, the number of particles is 100. Since the number is more than 200 and not more than 200, the exposed substrate C is positioned at the B level.

  Further, the minimum pattern size acquired in step S101 is 30 μm, and the allowable dust size is set to 3 μm or more which is equal to or larger than a predetermined ratio (10% in the present embodiment, the allowable size ratio in the table) of the minimum pattern size. In this case, the condition of 2 μm, which is the closest value in Table 2 above, may be used, and as shown in Table 3 below, information on particles having a new particle size or more is added to the table according to the allowable dust size. Also good.

  In addition, since the predetermined ratio of the minimum pattern size varies depending on the type of manufactured product and the circumstances of the user, the user can freely set within a predetermined ratio width (for example, between 10 to 30%). It has become. The user inputs a predetermined ratio of the allowable dust size via the input unit 53 of the control device 3, and the control unit 50 sets the input value as the predetermined ratio of the allowable dust size.

  When using Table 1 to Table 3 above, the user can determine which level from the A level to the C level can be permitted by grasping the correlation with the defect occurrence rate based on the manufacturing data. Can be grasped through manufacturing experience. The user inputs, through the input unit 53 of the control device 3, an acceptable defect occurrence rate from the A level to the C level, and the control unit 50 accepts the input value. Set as possible level. The number of particles at the set level is used as a threshold value in step S109.

  By the way, the number of particles measured by the dust measuring device 4 is the number of particles having a particle size floating in the space inside the exposure drawing device 2 and having an allowable dust size or more, and actually adheres to the substrate C to be exposed. Therefore, it is more realistic to generate the table in consideration of the adhesion rate and the allowable defect occurrence rate. For example, when exposing both surfaces of the substrate C to be exposed with an adhesion rate of less than a predetermined value (1/1000 in the present embodiment) and a defect occurrence rate of less than a predetermined value (1% in the present embodiment), one surface is exposed. Assuming that the defect occurrence rate allowed at the time is less than half of 0.5%, the allowable number of fine particles having an allowable dust size is the allowable defect occurrence rate per side × 1 / (adhesion rate) = 0. 005 × 1000 = 5. Based on this result, a table as shown in Table 4 below may be generated.

  In Table 4 above, with the B level as a reference, the allowable number of the A level is half the allowable number of the B level and the allowable number of the C level is twice the allowable number of the B level. Here, when fine particles that can be measured by the dust measuring device 4 are limited to a particle size range of, for example, 0.5 μm or more, comparison data as shown in Table 3 above may be used. The adhesion rate varies depending on the base material of the substrate C to be exposed, the DFR (Dry Film Resist) material used by the user, and the type of dust floating in the installation environment of the exposure drawing apparatus 2, and is correlated with actual production data. It can be freely set to a value obtained by comparison. The user inputs the adhesion rate via the input unit 53 of the control device 3, and the control unit 50 sets the input value as the adhesion rate.

  As another classification method, the allowable dust size may be divided into a plurality of sizes according to the minimum pattern size. For example, when the minimum pattern size is 10 μm, and the predetermined percentage of the allowable dust size is divided into 10%, 20%, and 30%, both sides of the substrate C to be exposed with an adhesion rate of 1/1000 and a defect occurrence rate of less than 1%. When the exposure is performed, the table at each ratio corresponding to the above Table 4 is as shown in Table 5 below.

  When the dust measuring device 4 can measure fine particles having a plurality of types of particle sizes, the level may be classified using the above Table 5, but the dust measuring device 4 can measure fine particles having a particle size range of 0.5 μm or more. If a measurement environment in which measurement is performed is used, ranking is preferably performed using the table shown in Table 6 below based on Table 5. According to Table 6 below, when the predetermined percentage of the allowable dust size is 10%, rank A, when the predetermined ratio of the allowable dust size is 20%, rank B, and the predetermined ratio of the allowable dust size is 30%. Case becomes C rank.

  It should be noted that the above-described equation (1) for calculating the dust concentration and the actual distribution of fine particles, which have been described above, differ depending on the base material of the substrate C to be exposed, the state of the base material, the DFR and the maintenance state of the apparatus. It is good to change each numerical value freely according to the actual situation (production data and defect occurrence rate). For example, Table 7 below is a table set based on Table 2 assuming that there are few fine particles in the particle size range of 0.3 μm or more than usual and no fine particles in the particle size range of 2 μm or more exist. is there. A table obtained by such setting may be generated.

  By using the table created in this way, a standard for the number of fine particles that can be tolerated is set according to the pattern definition, so it is possible to set the standard according to the most severe conditions as in the past. It is avoided that the processing is stopped even though the number of particles has no problem with the medium-definition pattern.

  In step S105, the control unit 50 instructs the exposure drawing apparatus 2 to start exposure. The control unit 50 sends a signal for instructing the start of exposure to the system control unit 40 of the exposure drawing apparatus 2. The system control unit 40 that has received the signal starts to carry in the exposure target substrate C, starts exposure on the exposure target substrate C that is loaded into the exposure drawing apparatus 2 and placed on the stage 10, A circuit pattern is drawn on the substrate C to be exposed.

  In step S <b> 107, the control unit 50 acquires the number of fine particles measured by the dust measurement device 4 and displays the number of particles on the display unit 52. The user can recognize the number of fine particles in the exposure drawing apparatus 2 by visually recognizing the display unit 52.

  In step S109, the control unit 50 determines whether or not the number of particles acquired in step S107 is equal to or greater than a threshold value. The threshold value is determined by the table created in step S103. That is, the control unit 50 measures the number of fine particles having a predetermined particle size (for example, 0.5 μm) or more with the dust measuring device 4, and sets the value of the number of particles at a user-desired level in Tables 1 to 7 as a threshold value. Used as Further, when the number of fine particles having a plurality of particle sizes is measured for each particle size by the dust measuring device 4, any of the number of fine particles having each particle size is equal to or greater than a corresponding threshold value. In this case, it is determined that the number of particles is equal to or greater than a threshold value.

  If it is determined in step S109 that the number of particles is greater than or equal to the threshold value, in step S111, the control unit 50 irradiates the substrate C placed on the stage 10 with the ultraviolet beam generated by the ultraviolet light source 21. By forming a predetermined mark on the exposed surface of the exposed substrate C being exposed or on the surface facing the exposed surface, information indicating that the number of particles on the exposed substrate C is equal to or greater than a threshold value. Append.

  FIG. 9 is a front view showing an example of the substrate to be exposed C on which marks are formed by the exposure drawing apparatus 2 according to the first embodiment. As shown in FIG. 9, information indicating that the number of particles is equal to or greater than a threshold value is added to the end portion of the substrate C to be exposed by forming a circular mark M. The shape of the mark M is not limited to a circular shape, and may be a mark having an arbitrary shape such as a star shape or a cross shape, or may be a character, a number, or the like. The position and size of the mark M may be any position and size that does not overlap the image to be exposed, and can be arbitrarily set according to the size of the substrate to be exposed C and the image to be exposed.

  Further, the method of adding information to the substrate C to be exposed is not limited to the method of forming a mark by irradiating the substrate C to be exposed with an ultraviolet beam. For example, the method of drawing a mark by adhering ink. Alternatively, the mark may be drawn by physically cutting the surface of the substrate C to be exposed, or the medium such as a seal to which information is added may be attached to the substrate C to be exposed. good.

  And in the exposure drawing apparatus 2 which concerns on 1st Embodiment, when adding the information which shows that the particle number is more than a threshold value to the to-be-exposed board | substrate C, the mark M is formed in the to-be-exposed surface of the to-be-exposed board | substrate C. However, the surface to which information is added is not limited to the exposed surface, and may be the back surface of the exposed surface.

  In step 113, the control unit 50 determines whether or not the exposure completion timing has come. At this time, the control unit 50 receives information indicating completion timing when the exposure has been completed for all of the plurality of predetermined substrates C to be exposed, or through the input unit 43 or the operation device 53 by a user operation. In this case, it is determined that the exposure completion timing has come.

  When it is determined in step S113 that the exposure completion timing has not arrived, the process proceeds to step S107, and the control unit 50 repeats the processes in steps S107 to S113, and in step S113, it is determined that the exposure completion timing has arrived. In the case where it is detected, the control unit 50 ends the execution of the exposure processing program. At this time, the control unit 50 sends a signal to stop exposure to the exposure drawing apparatus 2. The exposed drawing apparatus 2 that has received the signal stops the exposure of the substrate C to be exposed.

  Thus, in the exposure drawing system 1 according to the first embodiment, the number of fine particles in the apparatus is measured during the exposure processing of each substrate C to be exposed, and the measured number of particles is equal to or greater than a reference threshold value. In this case, by forming a predetermined mark M on the substrate C to be exposed, information indicating that it is equal to or greater than the threshold value is added. The user can confirm the dust level during the exposure process for the exposed substrate C by confirming the presence or absence of the mark M in the exposed substrate C that has been exposed.

  In the exposure drawing apparatus 2 according to the first embodiment, the ultraviolet light source 21 is fixed and provided in the vicinity of the exposure unit 16. However, the invention is not limited to this, and the ultraviolet light source 21 is provided on the stage 10 and the stage. It may be configured to move in conjunction with 10 movements. In this case, the ultraviolet light source 21 can form the mark M on the exposed substrate C at an arbitrary position based on the control of the control device 3 without depending on the position of the stage 10.

  In the exposure drawing system 1 according to the first embodiment, when it is determined that the number of particles measured in step S109 is equal to or larger than the threshold value, the mark M is drawn on the exposed substrate C in step S111. When the exposure process for the substrate C to be exposed during the exposure process is completed, the exposure process is stopped, and the measurement of the number of particles by the dust measuring device 4 is continued with the exposure process stopped. You may make it start an exposure process again in the step which became smaller than a threshold value. Thereby, exposure to the to-be-exposed board | substrate C can be performed only when the particle number of the microparticles | fine-particles in the apparatus of the exposure drawing apparatus 2 is smaller than a threshold value.

[Second Embodiment]
Hereinafter, the exposure drawing system 1 according to the second embodiment will be described in detail with reference to the accompanying drawings. Since the exposure / drawing system 1 according to the second embodiment has the configuration shown in FIGS. 1 to 6 as in the exposure / drawing system 1 according to the first embodiment, overlapping description of the configuration is given. Omitted.

  In addition to the functions of the exposure drawing system 1 according to the first embodiment, the exposure drawing system 1 according to the second embodiment stores the measured number of fine particles and the identification information of the exposed substrate C in association with each other. It has a function to do.

  The operation of the exposure drawing system 1 according to the second embodiment will be described.

  FIG. 10 is a flowchart showing a flow of processing of the exposure processing program according to the second embodiment, and the program is stored in advance in a predetermined area of a ROM that is a recording medium provided in the storage unit 51 of the control device 3. Yes.

  The control unit 50 of the control device 3 performs the exposure at a predetermined timing (in this embodiment, a timing at which processing for continuously exposing a plurality of predetermined substrates C to be exposed is started). Execute the processing program.

  In steps S201 to S213, the control unit 50 performs processes similar to those in steps S101 to S113 described above. In step S205, when the system control unit 50 receiving the exposure start instruction draws the circuit pattern on the exposed surface of the substrate C to be exposed, or before and after the drawing, the circuit on the exposed surface is further provided. A serial number, which is identification information for identifying each substrate to be exposed, is drawn by exposing a light beam to the outside of the pattern drawing target area.

  FIG. 11 is a front view showing an example of a substrate to be exposed C on which a mark is formed by the exposure drawing apparatus 2 according to the second embodiment. As shown in FIG. 11, a serial number N is printed on the surface of the substrate C to be exposed, and a mark M is formed at a position that does not overlap the serial number N in step S211.

  In step S213, the control unit 50 acquires identification information such as a serial number of the substrate C to be exposed. At this time, the control unit 50 transmits a signal instructing acquisition of identification information to the system control unit 40 of the exposure drawing apparatus 2. The system control unit 40 that has received the signal acquires the serial number drawn on the exposed substrate C in step S205 as identification information. Then, the system control unit 40 transmits the acquired identification information to the control unit 50 of the control device 3. The control unit 50 acquires the identification information of the substrate C to be exposed by receiving the transmitted identification information.

  Note that the method for acquiring the identification information is not limited to the above method, and the stage 10 is moved so that the serial number drawn in step 205 is located in the shooting target area of the shooting unit 23. Then, the identification information may be obtained by character-recognizing the serial number by image processing from a photographed image in which the serial number of the substrate C to be exposed is photographed.

  In step S215, the control unit 50 stores, in the storage unit 51, measurement result information 50 obtained by associating the number of particles measured in step S207 with the identification information acquired in step S213.

  FIG. 12 is a schematic diagram showing an example of measurement result information 60 created in the exposure drawing apparatus 2 according to the second embodiment. As shown in FIG. 12, the measurement result information 60 is information in which the number of fine particles 60b is associated with the identification information 60a. According to the measurement result information 60 shown in FIG. 12 shown in FIG. 12, it can be seen that three fine particles were measured in the apparatus when the exposure substrate C having the identification information “X0000001” was exposed.

  In step 217, the control unit 50 determines whether or not the exposure completion timing has come. At this time, when the control unit 50 completes exposure for all of the exposed substrates C of one group or when information indicating completion timing is input through the input unit 43 or the operation device 53 by a user operation, It is determined that the exposure completion timing has arrived.

  When it is determined in step S217 that the exposure completion timing has not arrived, the process proceeds to step S207, and the control unit 50 repeats the processing of steps S207 to S217, and in step S217, it is determined that the exposure completion timing has arrived. In the case where it is detected, the control unit 50 ends the execution of the exposure processing program.

  Thus, in the exposure drawing system 1 according to the second embodiment, the exposure is performed after the exposure process from the relationship between the identification information of the substrate C to be exposed indicated by the measurement result information 60 and the number of particles of the fine particles during the exposure process. It is possible to grasp the correlation between the substrate to be exposed C determined to be defective in the inspection process and the number of fine particles during the exposure process.

  Further, in the exposure drawing system 1 according to the second embodiment, the measurement result information 60 associates and stores the time at which each exposed substrate C is exposed, so that the number of fine particles in the apparatus can be determined in advance. The exposure target substrate C is less than a predetermined threshold value, and is exposed before and after it is determined that the number of fine particles in the apparatus is equal to or greater than a predetermined threshold value. The number of particles is determined in advance at the time of the exposure. It is possible to identify the exposed substrate C that may exceed the threshold value.

  Further, in the exposure drawing system 1 according to the second embodiment, when performing exposure of a plurality of layers on the substrate C to be exposed, the measurement result information 60 indicates that the exposure processing for each layer of each substrate C to be exposed is performed. By storing the number of fine particle particles in association with each other, it is possible to determine in which layer of the substrate C to be exposed that is a multilayer substrate that a defect may occur.

[Third Embodiment]
Hereinafter, the exposure drawing system 1 according to the third embodiment will be described in detail with reference to the accompanying drawings. In addition, since the exposure drawing system 1 which concerns on 3rd Embodiment has the structure shown in FIG. 1 thru | or FIG. 6 similarly to the exposure drawing system 1 which concerns on 1st Embodiment and 2nd Embodiment, the said structure The overlapping description is omitted.

  In addition to the functions of the exposure drawing system 1 according to the first embodiment, the exposure drawing system 1 according to the third embodiment ranks the number of measured fine particles, and indicates a rank to which the number of particles belongs. A function of forming MR on the substrate C to be exposed is provided.

  The operation of the exposure drawing system 1 according to the third embodiment will be described.

  FIG. 13 is a flowchart showing the flow of processing of the exposure processing program according to the third embodiment. The program is stored in advance in a predetermined area of a ROM that is a recording medium provided in the storage unit 51 of the control device 3. Yes.

  The control unit 50 of the control device 3 performs the exposure at a predetermined timing (in this embodiment, a timing at which processing for continuously exposing a plurality of predetermined substrates C to be exposed is started). Execute the processing program.

  In steps S301 to S309, the control unit 50 performs processes similar to those in steps S101 to S109 described above.

  In step S311, the control unit 50 determines to which of a plurality of ranks the number of fine particles measured in step S307 belongs. At this time, based on Table 6 above, the control unit 50 determines that the number of fine particles having a particle size of 0.5 μm or more measured in step S307 is 43 or less, rank A, greater than 43, and 179. If it is less than B, it is determined as B rank, and if it is greater than 179 and less than 410, it is determined as C rank.

  In step S313, the control unit 50 irradiates the exposed surface of the substrate C to be exposed placed on the stage 10 or the surface facing the exposed surface with the ultraviolet beam generated by the ultraviolet light source 21 during exposure. A mark MR indicating the rank determined in step S307 is formed on the exposed substrate C.

  FIG. 14 is a front view showing an example of the substrate to be exposed C on which the mark MR is formed by the exposure drawing apparatus 2 according to the third embodiment. As shown in FIG. 14, a mark MR indicating a rank (A rank in the example shown in FIG. 15) is formed at the end of the substrate C to be exposed. The method for forming the mark on the exposed substrate C is not limited to the method of irradiating the ultraviolet beam, and may be a method of drawing by attaching ink, and the surface of the exposed substrate C is physically scraped. The drawing method may be used.

  In step 315, the control unit 50 determines whether or not the exposure completion timing has come. At this time, when the control unit 50 completes exposure for all of the exposed substrates C of one group or when information indicating completion timing is input through the input unit 43 or the operation device 53 by a user operation, It is determined that the exposure completion timing has arrived.

  When it is determined in step S315 that the exposure completion timing has not arrived, the process proceeds to step S307, and the control unit 50 repeats the processing of steps S307 to S315, and in step S315, it is determined that the exposure completion timing has arrived. In the case where it is detected, the control unit 50 ends the execution of the exposure processing program.

  In this way, in the exposure drawing system 1 according to the third embodiment, the number of particles in the apparatus is measured during the exposure processing of each substrate to be exposed C, the rank of the measured number of particles is determined, and the exposure object A mark MR indicating a rank is drawn on the substrate C. By checking the mark MR on the exposed substrate C that has been exposed, the user can check the dust state during the exposure process for the exposed substrate C.

[Fourth Embodiment]
Hereinafter, the exposure drawing system 1 according to the fourth embodiment will be described in detail with reference to the accompanying drawings. In addition, since the exposure drawing system 1 which concerns on 4th Embodiment has the structure shown in FIG. 1 thru | or FIG. 6 similarly to the exposure drawing system 1 which concerns on 1st Embodiment thru | or 3rd Embodiment, the said structure The overlapping description is omitted.

  The exposure drawing system 1 according to the fourth embodiment has a function of aligning the exposed substrate C according to the rank of the number of particles of fine particles, in addition to the function of the exposure drawing system 1 according to the third embodiment. .

  The operation of the exposure drawing system 1 according to the fourth embodiment will be described.

  FIG. 15 is a flowchart showing the flow of processing of the alignment processing program according to the fourth embodiment. The program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. Yes.

  The control unit 50 of the control device 3 executes the alignment processing program at a predetermined timing (in this embodiment, the timing at which the exposure processing program is ended).

  In step S401, the control unit 50 determines whether there is an exposed substrate C that has been exposed. At this time, the control unit 50 determines in advance that the substrate C to be exposed passes through while the substrate C exposed by the exposure drawing apparatus 2 is being transported by the transport device (not shown). The presence / absence of the substrate C to be exposed is determined by a photosensor (not shown) at the spot, and if it is determined that the substrate C to be exposed exists, it is determined that there is an exposed substrate C to be exposed.

  When it is determined in step S401 that there is an exposed substrate C that has been exposed, the control unit 50 acquires rank information of the exposed substrate C that has been exposed in step S403. At this time, the control unit 50 stores rank information indicating the determined rank in the recording medium or the storage unit 51 included in the system control unit 40 in step S311, and in step S403, the stored rank information is stored. get. The method for acquiring the rank information is not limited to this, and the rank information is acquired by photographing the mark MR formed on the substrate C to be exposed with a photographing apparatus (not shown) and recognizing characters by image processing. You may do it.

  In step S405, the control unit 50 aligns the exposed substrate C that has been exposed according to the rank information acquired in step S403. At this time, the control unit 50 causes the substrate to be exposed C to be transported at a predetermined position different for each rank in a direction perpendicular to the transport direction on the transport device. The method of aligning is not limited to this, and may be a method of changing the transport path for each rank.

  The exposure drawing system 1 according to the fourth embodiment has been described on the assumption that the mark MR indicating the rank is drawn on the substrate C to be exposed by the processing of the exposure drawing system 1 according to the third embodiment. It is not limited. For example, the exposure drawing system 1 according to the fourth embodiment has a function of aligning the substrate to be exposed C according to the rank of the number of particles of fine particles in addition to the function of the exposure drawing system 1 according to the first embodiment. May be. In this case, the control device 3 determines in step S403 whether or not the mark M is drawn on the substrate C to be exposed, and in step S405, the exposed exposure object is exposed depending on whether or not the mark M is drawn. The substrate C may be aligned.

  DESCRIPTION OF SYMBOLS 1 ... Exposure drawing system, 2 ... Exposure drawing apparatus, 3 ... Control apparatus, 4 ... Dust measuring device, 5 ... 1st conveyance part, 6 ... 2nd conveyance part, 10 ... Stage, 11 ... Base | substrate, 12 ... Base, DESCRIPTION OF SYMBOLS 14 ... Guide rail, 15 ... Gate, 16 ... Exposure part, 16a ... Exposure head, 17 ... Light source unit, 18 ... Optical fiber, 19 ... Image processing unit, 20 ... Signal cable, 21 ... Ultraviolet light source, 22 ... Gate, 23 DESCRIPTION OF SYMBOLS ... Shooting unit, 24 ... AC hand, 25 ... Suction unit, 26 ... Pushing unit, 30 ... Suction window, 31 ... Ejection window, 32 ... Laser generator, 33 ... Emission window, 34 ... Incident window, 35 ... Condensing lens , 36 ... detection device, 40 ... system control unit, 41 ... stage drive unit, 42 ... operation device, 43 ... movement drive unit, 50 ... control unit, 51 ... storage unit, 52 ... display unit, 53 ... input unit, 54 ... communication interface, 60 ... total Result information, 61 ... corresponding information, C ... substrate to be exposed, L ... laser, M, MR ... Mark, N ... serial number.

Claims (11)

Exposure means for drawing a circuit pattern by exposing a substrate to be exposed;
A counting means for counting the number of fine particles in the exposure drawing apparatus;
A determination unit that determines whether or not the number of particles counted by the counting unit during the exposure process by the exposure unit is greater than or equal to a threshold value determined based on a size related to the pattern of the circuit pattern;
An adding unit that adds predetermined information to the substrate to be exposed when the determination unit determines that the threshold value is equal to or greater than a threshold;
An exposure drawing apparatus comprising: The exposure drawing apparatus according to claim 1, wherein the size related to the pattern is at least one of a minimum value of a pitch width between adjacent patterns in the circuit pattern, a minimum value of a pattern width, and a minimum value of a land diameter. The counting means counts the number of particles for each particle size range of the fine particles,
The threshold is determined for each particle size range;
The determination means determines whether the number of particles is equal to or greater than a predetermined threshold value for each particle size range, and the number of particles in one or more particle size ranges is determined for each particle size range. The exposure drawing apparatus according to claim 1, wherein when it is equal to or greater than the threshold value, it is determined that the value is equal to or greater than the threshold value. Obtaining means for obtaining identification information of the exposed substrate;
Storage means for storing the particle number counted by the counting means in association with the identification information acquired by the acquisition means;
The exposure drawing apparatus according to any one of claims 1 to 3, further comprising: The determination means further determines which of the plurality of predetermined categories the number of particles counted by the counting means belongs;
The exposure drawing apparatus according to claim 1, wherein the adding unit adds information indicating the classification determined by the determination unit to the substrate to be exposed as the predetermined information. The exposure drawing apparatus according to claim 5, further comprising an aligning unit that aligns the substrate to be exposed to which the information indicating the section is added by the adding unit for each section. When it is determined by the determination means that the value is equal to or greater than the threshold value, the exposure process is stopped when the exposure process performed at that time is completed, and after the stop, the determination means determines that the value is not equal to or greater than the threshold value The exposure drawing apparatus according to claim 1, further comprising an exposure control unit that restarts the exposure process. It has a receiving means for receiving an input of a defect occurrence rate due to allowable dust,
The exposure drawing apparatus according to claim 1, wherein the threshold value is determined based on a size related to the pattern and a defect occurrence rate received by the receiving unit. Receiving means for receiving an input of a ratio of the number of fine particles adhering to the exposed substrate to the number of floating fine particles;
The exposure drawing apparatus according to claim 1, wherein the threshold is determined based on a size related to the pattern and a ratio received by the receiving unit. Computer
A counting means for counting the number of fine particles in an exposure drawing apparatus having an exposure means for drawing a circuit pattern by exposing a substrate to be exposed;
A determination unit that determines whether or not the number of particles counted by the counting unit during an exposure process by the exposure unit is greater than or equal to a threshold value determined based on a size related to the pattern of the circuit pattern;
An adding unit that adds predetermined information to the substrate to be exposed when the determination unit determines that the threshold value is equal to or greater than a threshold;
Program to function as. A counting step for counting the number of fine particles in an exposure drawing apparatus having exposure means for drawing a circuit pattern by exposing a substrate to be exposed;
A determination step of determining whether or not the number of particles counted in the counting step during the exposure process by the exposure unit is equal to or greater than a threshold value determined based on a size related to the pattern of the circuit pattern;
An addition step of adding predetermined information to the substrate to be exposed when it is determined by the determination step that the value is equal to or greater than a threshold value;
An exposure drawing method comprising: