JP5789684B2 - ベーパーチャンバー - Google Patents
ベーパーチャンバー Download PDFInfo
- Publication number
- JP5789684B2 JP5789684B2 JP2014003052A JP2014003052A JP5789684B2 JP 5789684 B2 JP5789684 B2 JP 5789684B2 JP 2014003052 A JP2014003052 A JP 2014003052A JP 2014003052 A JP2014003052 A JP 2014003052A JP 5789684 B2 JP5789684 B2 JP 5789684B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- container
- fins
- working fluid
- sintered body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (2)
- 上板と下板とによって密閉して形成された中空平板状のコンテナ内に、加熱されて蒸発し放熱して凝縮する作動流体を封入して構成されており、前記上板と下板とのうちいずれか一方に熱伝達可能に接続される発熱源の熱を前記作動流体の潜熱によって前記上板と下板とのうちいずれか他方に拡散させるベーパーチャンバーにおいて、
前記コンテナ内の前記上板と下板とのうちいずれか一方の面に、前記コンテナの厚さ方向に起立して、かつ、前記発熱源に対応している部分ではその他の部分に比較して高い密度で設けられている多数のフィンと、
多数の前記フィンの間であってかつ前記上板と下板とのうちいずれか一方の面に密着して配置される多孔質焼結体とを備え、
前記コンテナの厚さ方向で多数の前記フィンの端部が、前記コンテナ内の前記上板と下板とのうちいずれか他方の面に熱伝達可能に接合されており、
前記多孔質焼結体は前記フィンの密度が低い部分のみに設けられている
ことを特徴とするベーパーチャンバー。 - 複数の前記フィンは、前記上板と下板とのうちいずれか一方の面を削り起こすことにより形成されていることを特徴とする請求項1に記載のベーパーチャンバー。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014003052A JP5789684B2 (ja) | 2014-01-10 | 2014-01-10 | ベーパーチャンバー |
US14/592,506 US10514211B2 (en) | 2014-01-10 | 2015-01-08 | Vapor chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014003052A JP5789684B2 (ja) | 2014-01-10 | 2014-01-10 | ベーパーチャンバー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015132399A JP2015132399A (ja) | 2015-07-23 |
JP5789684B2 true JP5789684B2 (ja) | 2015-10-07 |
Family
ID=53521066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014003052A Active JP5789684B2 (ja) | 2014-01-10 | 2014-01-10 | ベーパーチャンバー |
Country Status (2)
Country | Link |
---|---|
US (1) | US10514211B2 (ja) |
JP (1) | JP5789684B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10502498B2 (en) * | 2015-07-20 | 2019-12-10 | Delta Electronics, Inc. | Slim vapor chamber |
CN114760824A (zh) * | 2017-01-18 | 2022-07-15 | 台达电子工业股份有限公司 | 均热板 |
JP6963740B2 (ja) * | 2017-01-18 | 2021-11-10 | 大日本印刷株式会社 | ベーパーチャンバおよびベーパーチャンバの製造方法 |
JP6988170B2 (ja) * | 2017-04-28 | 2022-01-05 | 株式会社村田製作所 | ベーパーチャンバー |
CN107228585A (zh) * | 2017-07-27 | 2017-10-03 | 中国科学院长春光学精密机械与物理研究所 | 一种辐冷板的腔体结构 |
US10849217B2 (en) * | 2018-07-02 | 2020-11-24 | Aptiv Technologies Limited | Electrical-circuit assembly with heat-sink |
JP7123675B2 (ja) * | 2018-07-20 | 2022-08-23 | 株式会社フジクラ | 放熱モジュール |
US20200116436A1 (en) * | 2018-10-12 | 2020-04-16 | Htc Corporation | Heat transferring module and manufacturing method thereof |
JP7244375B2 (ja) * | 2019-07-10 | 2023-03-22 | 株式会社フジクラ | ベーパーチャンバー |
US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
EP3893274A1 (en) * | 2020-04-07 | 2021-10-13 | ABB Schweiz AG | Cooling element and method of manufacturing a cooling element |
US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
WO2022082352A1 (zh) * | 2020-10-19 | 2022-04-28 | 欧菲光集团股份有限公司 | 均热板及散热装置 |
TWI742993B (zh) * | 2021-01-28 | 2021-10-11 | 大陸商廣州力及熱管理科技有限公司 | 應用於薄型均溫板之複合式毛細結構 |
JP7079361B1 (ja) | 2021-03-31 | 2022-06-01 | 古河電気工業株式会社 | ベーパーチャンバ |
WO2022255081A1 (ja) * | 2021-06-02 | 2022-12-08 | 株式会社村田製作所 | 電子機器 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06291480A (ja) * | 1993-04-05 | 1994-10-18 | Mitsubishi Electric Corp | 電子回路モジュール |
JP3654323B2 (ja) * | 1996-11-25 | 2005-06-02 | 株式会社デンソー | 沸騰冷却装置 |
JP3654326B2 (ja) * | 1996-11-25 | 2005-06-02 | 株式会社デンソー | 沸騰冷却装置 |
JP3920977B2 (ja) | 1997-12-29 | 2007-05-30 | 株式会社フジクラ | ヒートシンクおよびその製造方法 |
JP2000161879A (ja) | 1998-11-20 | 2000-06-16 | Fujikura Ltd | 平板状ヒートパイプ |
JP2002062072A (ja) * | 2000-08-21 | 2002-02-28 | Fujikura Ltd | 平板状ヒートパイプおよびその製造方法 |
US6591897B1 (en) * | 2002-02-20 | 2003-07-15 | Delphi Technologies, Inc. | High performance pin fin heat sink for electronics cooling |
US6880626B2 (en) * | 2002-08-28 | 2005-04-19 | Thermal Corp. | Vapor chamber with sintered grooved wick |
JP2004238672A (ja) | 2003-02-05 | 2004-08-26 | Fujikura Ltd | 平板型ヒートパイプの製造方法 |
US6901994B1 (en) * | 2004-01-05 | 2005-06-07 | Industrial Technology Research Institute | Flat heat pipe provided with means to enhance heat transfer thereof |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
US20080068802A1 (en) * | 2006-09-19 | 2008-03-20 | Inventec Corporation | Heatsink device with vapor chamber |
US20140182132A1 (en) * | 2013-01-01 | 2014-07-03 | Asia Vital Components Co., Ltd. | Method of manufacturing a vapor chamber structure |
-
2014
- 2014-01-10 JP JP2014003052A patent/JP5789684B2/ja active Active
-
2015
- 2015-01-08 US US14/592,506 patent/US10514211B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10514211B2 (en) | 2019-12-24 |
US20150198375A1 (en) | 2015-07-16 |
JP2015132399A (ja) | 2015-07-23 |
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