JP5771272B2 - 溶融シリコンを流し精製するためのガスリフトポンプ - Google Patents
溶融シリコンを流し精製するためのガスリフトポンプ Download PDFInfo
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- 229910052710 silicon Inorganic materials 0.000 title claims description 50
- 239000010703 silicon Substances 0.000 title claims description 50
- 239000000155 melt Substances 0.000 claims description 184
- 239000007789 gas Substances 0.000 claims description 58
- 238000001816 cooling Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 20
- 230000008014 freezing Effects 0.000 claims description 19
- 238000007710 freezing Methods 0.000 claims description 19
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 238000011144 upstream manufacturing Methods 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052756 noble gas Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 150000002835 noble gases Chemical class 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 230000004936 stimulating effect Effects 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 43
- 239000007788 liquid Substances 0.000 description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 12
- 239000013078 crystal Substances 0.000 description 11
- 230000005499 meniscus Effects 0.000 description 7
- 238000005086 pumping Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/007—Mechanisms for moving either the charge or the heater
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/06—Non-vertical pulling
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/08—Germanium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
- C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
- C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
- C03B29/08—Glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1036—Seed pulling including solid member shaping means other than seed or product [e.g., EDFG die]
- Y10T117/1044—Seed pulling including solid member shaping means other than seed or product [e.g., EDFG die] including means forming a flat shape [e.g., ribbon]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1036—Seed pulling including solid member shaping means other than seed or product [e.g., EDFG die]
- Y10T117/1044—Seed pulling including solid member shaping means other than seed or product [e.g., EDFG die] including means forming a flat shape [e.g., ribbon]
- Y10T117/1048—Pulling includes a horizontal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
Description
Claims (15)
- シート形成装置であって、
材料の融液を保持するように構成される容器であって、凍結領域に対応する高さの流路を有する前記容器と、
前記融液に近接して配置される冷却プレートであって、前記凍結領域における前記融液上に前記材料のシートを形成するように構成される前記冷却プレートと、
前記融液を保持するように構成される戻りであって、前記戻りの第1の端部は前記流路の下流に接続され、前記戻りの第2の端部は前記流路の上流に接続される前記戻りと、
ガス源と、該ガス源と流体連結する第1の導管及び第2の導管とを備えるポンプであって、前記第1の導管の一端は前記ガス源に接続され、前記第1の導管の他の一端は前記第2の導管の内部に配置され、前記第2の導管の一端は前記戻りに接続され、前記第2の導管の他の一端は前記凍結領域に接続され、前記第1の導管の少なくとも一部は前記融液の表面の上に配置され、前記ガス源は、前記融液を前記戻りから前記凍結領域へ持ち上げるように構成される、前記ポンプと、
前記融液の中に部分的に、かつ、前記融液の外に部分的に配置され、前記ポンプの下流に、かつ、前記冷却プレートの上流に配置される、第1のバッフルと、
前記融液の中の前記高さの流路の部分の上面に配置され、前記ポンプの下流に、かつ、前記冷却プレートの上流に配置され、前記第1のバッフルに近接する、第2のバッフルと、を備え、
前記第1のバッフル及び前記第2のバッフルは、前記融液が前記ポンプから前記凍結領域へ流れる時に、前記融液を圧縮し膨張するように構成される、シート形成装置。 - 前記材料は、シリコン又はシリコンとゲルマニウムである、請求項1に記載の装置。
- 前記ガス源は、前記第1の導管の中に気泡を形成し、該気泡は、前記第2の導管の中で上がるように構成される、請求項1に記載の装置。
- 前記ポンプは、前記凍結領域の中で前記融液を水平運動させるように構成される、請求項1に記載の装置。
- 前記第1及び第2の導管は、石英から作られる、請求項1に記載の装置。
- シート形成装置であって、
材料の融液を保持するように構成される容器と、
前記融液に近接して配置される冷却プレートであって、前記融液上に前記材料のシートを形成するように構成される前記冷却プレートと、
ガス源を備えるポンプであって、前記ガス源は、ガスを前記融液の表面と平行な方向に前記融液の中へ注入するように前記容器内に位置付けた出口を有し、それにより、前記ガスは、前記融液を前記方向に運動させるポンプと、
前記融液の中に部分的に、かつ、前記融液の外に部分的に配置され、前記ポンプの下流に、かつ、前記冷却プレートの上流に配置される、第1のバッフルと、
前記融液の中の前記容器の底面に配置され、前記ポンプの下流に、かつ、前記冷却プレートの上流に配置され、多角形状を有し、前記第1のバッフルに近接する、第2のバッフルと、を備え、
前記第1のバッフル及び前記第2のバッフルは、前記融液が前記ポンプから前記冷却プレートへ流れる時に、前記融液を圧縮し膨張するように構成される、シート形成装置。 - 前記材料は、シリコン又はシリコンとゲルマニウムである、請求項6に記載の装置。
- 前記融液のレベルは、前記冷却プレートに近接するのと、ほぼ同じに、前記ポンプに近接する、請求項6に記載の装置。
- 前記融液を保持するように構成される戻りを、さらに備え、該戻りは、前記冷却プレートの下流に及び前記ポンプの上流に接続される、請求項6に記載の装置。
- 前記融液のレベルは、ほぼ同じに、前記ポンプに近接し、前記冷却プレートに近接し、前記融液は前記戻りの中にある、請求項9に記載の装置。
- 請求項1または請求項6に記載の前記シート形成装置を使用するシート形成方法であって、
ガスを前記融液の表面と平行な方向に材料の融液の中へ注入するステップと、
前記ガスで前記融液を刺激し、それにより、前記ガスの気泡は、前記融液に前記方向に運動量を供給するステップと、
前記材料のシートを前記融液上で凍結するステップと、
前記シートを前記融液から取り出すステップと、
を含む、シート形成方法。 - 前記ガスは、希ガス、窒素及び水素から成るグループから選択される、請求項11に記載の方法。
- 前記シート及び前記融液は、等しい速度で平行移動する、請求項11に記載の方法。
- 前記材料は、シリコン又はシリコンとゲルマニウムである、請求項11に記載の方法。
- 前記ガスはアルゴンであり、前記融液の中の酸素の含有量を下げるステップを、さらに含む、請求項11に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33206810P | 2010-05-06 | 2010-05-06 | |
US61/332,068 | 2010-05-06 | ||
US13/039,789 US9267219B2 (en) | 2010-05-06 | 2011-03-03 | Gas-lift pumps for flowing and purifying molten silicon |
US13/039,789 | 2011-03-03 | ||
PCT/US2011/027198 WO2011139406A1 (en) | 2010-05-06 | 2011-03-04 | Gas-lift pumps for flowing and purifying molten silicon |
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JP2013525257A JP2013525257A (ja) | 2013-06-20 |
JP5771272B2 true JP5771272B2 (ja) | 2015-08-26 |
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JP2013509054A Expired - Fee Related JP5771272B2 (ja) | 2010-05-06 | 2011-03-04 | 溶融シリコンを流し精製するためのガスリフトポンプ |
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US (1) | US9267219B2 (ja) |
EP (1) | EP2567002B1 (ja) |
JP (1) | JP5771272B2 (ja) |
KR (1) | KR101781398B1 (ja) |
CN (1) | CN102959137B (ja) |
TW (1) | TWI611052B (ja) |
WO (1) | WO2011139406A1 (ja) |
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US9464364B2 (en) * | 2011-11-09 | 2016-10-11 | Varian Semiconductor Equipment Associates, Inc. | Thermal load leveling during silicon crystal growth from a melt using anisotropic materials |
US20150176151A1 (en) * | 2013-12-20 | 2015-06-25 | Energy Materials Research, LLC | System and method for forming a silicon wafer |
CN107217296B (zh) * | 2017-04-28 | 2019-05-07 | 常州大学 | 一种硅片水平生长设备和方法 |
US11661672B2 (en) * | 2018-08-06 | 2023-05-30 | Carnegie Mellon University | Method for producing a sheet from a melt by imposing a periodic change in the rate of pull |
WO2021168244A1 (en) * | 2020-02-19 | 2021-08-26 | Leading Edge Equipment Technologies, Inc. | Controlling the thickness and width of a crystalline sheet formed on the surface of a melt using combined surface cooling and melt heating |
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US2008114A (en) | 1933-05-10 | 1935-07-16 | George K Taggart | Air or gas lift pump |
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JPS5261180A (en) | 1975-11-14 | 1977-05-20 | Toyo Shirikon Kk | Horizontal growth of crystal ribbons |
DE2608052C2 (de) | 1976-02-27 | 1982-12-30 | Vereinigte Glaswerke Gmbh, 5100 Aachen | Flüssigkeitspumpe für das schmelzflüssige Metall einer Floatglasanlage |
US4289571A (en) * | 1979-06-25 | 1981-09-15 | Energy Materials Corporation | Method and apparatus for producing crystalline ribbons |
JPS6068142A (ja) * | 1983-09-26 | 1985-04-18 | Nippon Steel Corp | 気泡ポンプによる溶融金属の移送方法 |
GB9110678D0 (en) * | 1991-05-17 | 1991-07-10 | Boc Group Plc | Treatment of longitudinally expanding members |
JPH05295506A (ja) * | 1992-04-23 | 1993-11-09 | Nkk Corp | めっき浴清浄化装置 |
JPH0668142A (ja) | 1992-08-24 | 1994-03-11 | Sanyo Electric Co Ltd | 機械翻訳システム |
US5993540A (en) | 1995-06-16 | 1999-11-30 | Optoscint, Inc. | Continuous crystal plate growth process and apparatus |
US7608146B2 (en) | 2006-09-28 | 2009-10-27 | Bp Corporation North America Inc. | Method and apparatus for the production of crystalline silicon substrates |
US20090039478A1 (en) * | 2007-03-10 | 2009-02-12 | Bucher Charles E | Method For Utilizing Heavily Doped Silicon Feedstock To Produce Substrates For Photovoltaic Applications By Dopant Compensation During Crystal Growth |
US7855087B2 (en) * | 2008-03-14 | 2010-12-21 | Varian Semiconductor Equipment Associates, Inc. | Floating sheet production apparatus and method |
US7816153B2 (en) | 2008-06-05 | 2010-10-19 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for producing a dislocation-free crystalline sheet |
TWI531691B (zh) | 2009-03-09 | 2016-05-01 | 1366科技公司 | 從熔融材料製作半導體薄體的方法和裝置 |
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WO2011139406A1 (en) | 2011-11-10 |
TWI611052B (zh) | 2018-01-11 |
CN102959137B (zh) | 2015-08-19 |
US9267219B2 (en) | 2016-02-23 |
TW201200639A (en) | 2012-01-01 |
KR101781398B1 (ko) | 2017-09-25 |
CN102959137A (zh) | 2013-03-06 |
US20110271897A1 (en) | 2011-11-10 |
KR20130100064A (ko) | 2013-09-09 |
EP2567002B1 (en) | 2017-12-06 |
JP2013525257A (ja) | 2013-06-20 |
EP2567002A1 (en) | 2013-03-13 |
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