JP5760260B2 - Printed circuit board with built-in component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a component-embedded printed circuit board in which electronic components are incorporated and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, a multilayer printed circuit board with a built-in electronic component is disclosed in Patent Document 1 below. This component built-in substrate has a structure in which electrodes of a semiconductor component embedded in an interlayer insulating layer are connected to a wiring layer through via holes, and a heat sink is provided on a non-circuit surface.

JP 2006-49762 A

  However, the one disclosed in Patent Document 1 is manufactured by forming an interlayer insulating layer on the electrode surface side of a semiconductor component after attaching a metal plate to the back surface of the semiconductor component. It is located on one surface side of the laminate of the interlayer insulating film, and it is difficult to embed it at an arbitrary position inside the interlayer insulating film. For this reason, the thing of patent document 1 has the problem that no consideration is made about the heat dissipation when it embed | buries in the intermediate position of the laminated body of an interlayer insulator.

  The present invention eliminates the above-described problems caused by the prior art, enables a reduction in height, and can improve heat dissipation even when an electronic component is embedded in a resin base material, and a method for manufacturing the same The purpose is to provide.

  The printed circuit board with a built-in component according to the present invention includes a resin base material having a cavity formed therein, an electronic component built in the cavity formed in the resin base material, and a through hole formed in the resin base material. A wiring including an electrode, the electrode of the electronic component and the through-hole electrode formed at a position corresponding to the electrode are directly bonded, and an electrode pad connected to the wiring is provided on at least one surface of the resin base material. It is formed in a state of being embedded in the resin base material, and a wiring continuous to the surface side of the resin base material is in contact with the surface and side surface opposite to the electrode forming surface of the electronic component. .

  According to the printed circuit board with a built-in component according to the present invention, the electrode of the electronic component built in the cavity and the through-hole electrode are directly bonded, and an electrode pad connected to the wiring is provided on at least one surface of the resin substrate. As a result, the overall height can be reduced. In addition, since the continuous wiring to the surface side of the resin base material is in contact with not only the surface opposite to the electrode formation surface of the electronic component, but also the side surface of the resin base material, this wiring functions as a heat dissipation wiring. Can be improved. Thereby, it becomes possible to arrange the electronic component at an arbitrary position inside the resin base material, and it is possible to mount the electronic component with high efficiency and high flexibility.

  In one embodiment of the present invention, the wiring has a metal layer formed on the inner wall surface of the cavity and in contact with the surface and side surface opposite to the electrode forming surface of the electronic component. If it does in this way, since the back surface and the whole side surface of an electronic component and a metal layer will contact, heat dissipation will improve further.

  In the method for manufacturing a printed circuit board with built-in components according to the present invention, a circuit pattern including a through hole is formed on a plurality of resin substrates by imprinting, and an electronic component is embedded in at least one of the plurality of resin substrates. In the process of forming a cavity to be formed and sequentially laminating the plurality of resin substrates, the circuit pattern of each resin substrate is filled with a conductive paste to form a wiring including a through-hole electrode, and the electronic component And connecting the electrode of the electronic component directly with the through-hole electrode, and further continuing to the surface and the side opposite to the electrode forming surface of the electronic component up to the surface side of the resin substrate. It is made to contact.

  According to the method of manufacturing a component-embedded printed circuit board according to the present invention, in the process of sequentially laminating a plurality of resin base materials, a circuit pattern formed by imprinting each resin base material is filled with a conductive paste and passed through. Since the wiring including the hole electrode is formed and the electronic component is accommodated in the cavity and the electrode of the electronic component is directly joined to the through-hole electrode, the height can be easily reduced. In addition, since the surface and side opposite to the electrode forming surface of the electronic component are in contact with the continuous wiring up to the surface side of the resin substrate, sufficient heat dissipation is possible even when the electronic component is built in any position. Sex can be secured.

  According to the present invention, it is possible to improve heat dissipation while enabling a reduction in height.

It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing process of the multilayer printed circuit board with the same components. It is sectional drawing which shows the same component built-in multilayer printed circuit board in order of a 1st manufacturing process. It is sectional drawing which shows the same component built-in multilayer printed circuit board in order of a 1st manufacturing process. It is sectional drawing which shows the electronic component of the multilayer printed circuit board with a built-in component in order of a one part manufacturing process. It is sectional drawing which shows the other structure of the multilayer printed circuit board with the same components. It is sectional drawing which shows the same component built-in multilayer printed circuit board in order of a 2nd manufacturing process. It is sectional drawing which shows the same component built-in multilayer printed circuit board in order of a 2nd manufacturing process. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the multilayer printed circuit board with the same components in order of a manufacturing process. It is sectional drawing which shows the multilayer printed circuit board with the same components in order of a manufacturing process. It is sectional drawing which shows the other structure of the multilayer printed circuit board with the same components. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 4th Embodiment of this invention. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 5th Embodiment of this invention. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 6th Embodiment of this invention. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 7th Embodiment of this invention. It is sectional drawing which shows the structure of the multilayer printed circuit board with a built-in component which concerns on the 8th Embodiment of this invention.

  Hereinafter, a component-embedded printed circuit board and a manufacturing method thereof according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a cross-sectional view showing a component built-in multilayer printed board having a multilayer structure, which is a component built-in printed board according to the first embodiment of the present invention. The component-embedded multilayer printed circuit board 100 according to the first embodiment is formed on the first resin base material 10, the second resin base material 20, the third resin base material 30, and the second resin base material 20. And an electronic component 40 built in a state sandwiched between the first and third resin base materials 10 and 30.

  The component built-in multilayer printed circuit board 100 includes a through-hole electrode 12 in the through-hole 19 formed in the first resin base material 10 as a wiring formed in the resin base materials 10, 20, and 30, a heat dissipation wiring. 11, backside wiring 13, heat radiation wiring 21, interlayer wiring 23 formed on second resin base material 20, heat radiation via 32 formed on third resin base material 30, heat radiation wiring 31, surface Wiring 33 is provided. The surface layer circuit 17 connected to the surface wiring 33 and the surface layer heat dissipation circuit 18 connected to the heat dissipation wiring 31 and the heat dissipation via 32 are formed on the upper surface 30a of the third resin base material 30. Yes.

  Each of the first to third resin base materials 10, 20, and 30 is made of, for example, a resin film having a thickness of about 25 μm. As the resin film, for example, a resin film made of thermoplastic polyimide, polyolefin, liquid crystal polymer, or the like, or a resin film made of a thermosetting epoxy resin can be used.

  The electronic component 40 is, for example, a semiconductor component such as an IC chip, a passive component, or the like, and a plurality of mounting electrodes 41 are provided on the electrode forming surface 41b facing the upper surface 10a of the first resin base material 10, and the electrode forming surface 41b. And an electrode surface 41a parallel to each other. The through-hole electrode 12, the heat radiation wirings 11, 21, 31, the back surface wiring 13, the interlayer wiring 23, the heat radiation via 32, and the front surface wiring 33 are through holes formed in the first to third resin base materials 10 to 30. 19 is formed of a conductive paste filled in an imprint type uneven circuit pattern including 19, respectively.

  The conductive paste is, for example, at least one kind of low electrical resistance metal particles selected from nickel, gold, silver, zinc, aluminum, iron, tungsten and the like, and at least one kind selected from bismuth, indium, lead and the like. Low melting point metal particles. The conductive paste is made of a paste in which tin is contained as a component in these metal particles and a binder component mainly composed of epoxy, acrylic, urethane, or the like is mixed.

  The conductive paste configured as described above can form an alloy by melting the contained tin and the low melting point metal at 200 ° C. or less, and particularly can form an intermetallic compound with copper or silver. With characteristics. Note that the conductive paste can also be formed of a nanopaste in which fillers such as gold, silver, copper, and nickel having a nanometer particle size are mixed with the binder component as described above. In addition, the conductive paste can also be composed of a paste in which metal particles such as nickel are mixed with the binder component as described above. In this case, the conductive paste has a characteristic that electrical connection is made when metal particles come into contact with each other.

  The through-hole electrode 12 of the first resin substrate 10 includes an electrode 12a formed on the upper surface 10a side of the first resin substrate 10 and a lower surface 10b opposite to the upper surface 10a of the first resin substrate 10. And an electrode pad 12b formed on the side. The lower surface 10 b of the first resin base material 10 is the back surface of the component built-in multilayer printed board 100.

  In the through-hole electrode 12, the heat radiation wiring 11, and the back surface wiring 13 of the first resin base material 10, the electrode portion and the electrode pad portion do not protrude from the upper surface 10a and the lower surface 10b of the first resin base material 10, respectively. And embedded in the base material. Here, the electrode pad portion will be described by taking the electrode pad 12b of the through-hole electrode 12 as an example. As shown in the figure, the electrode pad portion has a larger area on the base material surface (area of the bonding portion) than the electrode 12a portion. .

  In the electronic component 40 built in the cavity 60 of the second resin base material 20, the electrode 41 and the electrode 12 a of the through-hole electrode 12 formed in the first resin base material 10 are interposed via solder bumps or the like. Without being directly joined. The electronic component 40 is connected by an adhesive layer 50 formed between the electrode forming surface 41 b and the mounting surface (upper surface) 10 a of the first resin base material 10.

  Further, the heat radiation wiring 21 and the interlayer wiring 23 of the second resin base material 20 are such that the electrode portion and the electrode pad portion do not protrude from the upper surface 20 a and the lower surface 20 b of the second resin base material 20, respectively. It is formed in a state of being embedded in the material. Each of the heat dissipation wiring 21 and the interlayer wiring 23 is directly joined to the electrode portions of the heat dissipation wiring 11 and the back surface wiring 13 of the first resin base material 10. The heat radiation wiring 21 of the second resin base material 20 is formed in contact with the side surface 41 d of the electronic component 40 in the cavity 60.

  The heat radiation via 32 of the third resin base material 30 is formed on the via electrode pad 32b formed on the upper surface 30a side of the third resin base material 30 and the lower surface 30b side of the third resin base material 30. A via electrode 32a. The upper surface 30 a of the third resin base material 30 is the surface opposite to the back surface of the component built-in multilayer printed board 100.

  In the heat dissipation via 32, the heat dissipation wiring 31, and the surface wiring 33 of the third resin base material 30, the electrode pad portion and the electrode portion do not protrude from the upper surface 30a and the lower surface 30b of the third resin base material 30, respectively. And embedded in the base material. Each of the heat radiation wiring 31 and the surface wiring 33 is directly joined to the electrode portions of the heat radiation wiring 21 and the interlayer wiring 23 of the second resin base material 20. In addition, the electrode pads of the heat radiation wiring 31 and the surface wiring 33 are directly joined to the surface layer heat radiation circuit 18 and the surface layer circuit 17.

  The heat radiating via 32 is formed in a state in which the electrode 32 a is in contact with the upper surface 41 c of the electronic component 40. Therefore, the heat dissipation via 32 constitutes a part of the heat dissipation wiring 31. The side surface 41d and the top surface 41c of the electronic component 40 constitute a non-circuit surface 42 other than the electrode formation surface 41b. The heat radiation via 32 is formed so that the electrode pad 32 b portion is directly joined to the surface heat radiation circuit 18.

  The surface layer circuit 17 and the surface layer heat dissipation circuit 18 are formed by stacking the third resin base material 30 on the second resin base material 20 to form the heat dissipation via 32, the heat dissipation wiring 31, and the surface wiring 33. On the upper surface 30a of the resin base material 30, it consists of conductive members, such as copper by which pattern formation was carried out by methods, such as photolithography, printing, and an inkjet. The adhesive layer 50 is made of an epoxy resin or the like.

  The component built-in multilayer printed circuit board 100 according to the first embodiment is configured in this manner, so that the electrode 41 of the electronic component 40 and the electrode 12a of the through-hole electrode 12 are directly bonded without using a solder bump or the like. Is done. Moreover, each wiring etc. which were formed in each resin base material 10-30 are formed in the state embedded in the base material, without protruding from both surfaces, respectively. For this reason, it is possible to reduce the overall height of the component built-in multilayer printed circuit board 100, and to reduce the arrangement pitch of the electrodes 41 and 12a, so that high-density mounting is possible.

  Further, since the non-circuit surface 42 of the electronic component 40 built in the cavity 60 is in contact with the heat radiation wiring 21 and the heat radiation via 32, the heat of the electronic component 40 is effectively transmitted through the surface heat radiation circuit 18. It is possible to dissipate heat. The surface heat dissipation circuit 18 and the surface layer circuit 17 may not be formed. In this case, the surface layer wiring 33 is patterned so as to constitute the surface layer circuit 17, and the electrode pads 32b of the heat dissipation via 32 and the heat dissipation circuit are formed. The electrode pad portion of the wiring 31 directly radiates the heat of the electronic component 40. If comprised in this way, it will become possible to aim at the further shortening.

Next, a manufacturing method of the component built-in multilayer printed board according to the first embodiment will be described.
FIG. 2 is a flowchart showing a manufacturing process of the component built-in multilayer printed board. 3 and 4 are cross-sectional views showing the component built-in multilayer printed circuit board in the order of the first manufacturing process. FIG. 5 is a cross-sectional view showing the electronic components of the component built-in multilayer printed circuit board in the order of part of the manufacturing steps.

  First, as shown in FIG. 3A, for example, a first imprint mold 70 of a mold having a convex circuit shape pattern or protrusions and a first resin base material 10 made of a thermoplastic polyimide resin film are prepared. (Step S100).

  The imprint mold 70 is made of, for example, a silicon mold having a circuit shape pattern with a minimum line / space of 5 μm / 5 μm and a height of 5 μm. The imprint mold 70 may be formed of nickel, copper, diamond-like carbon (DLC), or the like in addition to silicon, or may be a mold that has been subjected to easy release treatment by coating the surface with a fluorine-based resin.

  Next, as shown in FIG. 3B, the imprint mold 70 is pressed against the first resin base material 10 while being heated to a predetermined temperature, and the circuit pattern constituted by the circuit shape pattern is transferred (step). S102). At this time, preferably, the first resin base material 10 and the imprint mold 70 are heated to a temperature at which the resin material constituting the first resin base material 10 becomes soft, and then the circuit pattern is transferred.

  Then, as shown in FIG. 3 (c), the electrode 41 of the electronic component 40 is aligned with the through hole 19 of the circuit pattern, and then the electronic component 40 is attached to the first resin base material 10. The mounting surface (upper surface) 10a is adhered and mounted via the adhesive layer 50 (step S104).

  In this step S104, since the first resin substrate 10 is made of a thermoplastic polyimide resin film, for example, the electronic component 40 is mounted after being heated to a temperature equal to or higher than the glass transition point, and is cooled after mounting. . As a result, together with the adhesive layer 50, a part of the electrode surface 41a of the electrode 41 and the mounting surface (upper surface) 10a of the first resin base material 10 are adhered, so that the electronic component 40 is attached to the first resin base material 10. Can be mounted securely.

  On the other hand, when the 1st resin base material 10 consists of a thermosetting resin film, resin is hardened by heating and both are adhere | attached. In the first manufacturing process, since the electronic component 40 is mounted before the imprint mold 70 is released from the first resin substrate 10, the first resin substrate 10 at the time of mounting is mounted on the first resin substrate 10. It is possible to more reliably prevent the formed circuit pattern from being deformed.

  In addition, prior to mounting the electronic component 40 on the first resin base material 10 in the above step S104, apart from the main manufacturing process of the component built-in multilayer printed board 100 shown in FIGS. 3 and 4, FIG. ), An electronic component 40 having a plurality of electrodes 41 formed on the electrode formation surface 41b is prepared.

  Next, as shown in FIG. 5B, an adhesive is applied (or laminated) to the electrode forming surface 41 b of the electronic component 40. The adhesive applied or laminated here is preferably a liquid or film adhesive made of the thermoplastic resin as described above or a semi-cured thermosetting resin.

  Thereafter, as shown in FIG. 5C, the electrode surface 41a of the electrode 41 is exposed and etching or polishing is performed so that the adhesive does not protrude from the side surface 41d of the electronic component 40, thereby performing a smoothing process. The electronic component 40 on which the adhesive layer 50 is formed is prepared. When the electronic component 40 thus prepared is mounted on the first resin base material 10 in step S104, as shown in FIG. 3D, the first resin base material 10 is cooled and the first resin base material 10 is cooled. The imprint mold 70 is released from the material 10, and the concave circuit pattern 71 is formed on the first resin substrate 10 (step S106). When the circuit pattern 71 is formed, the first resin base material 10 is inverted.

  Next, as shown in FIG. 3 (e), for example, it is composed of another imprint mold 72 having a convex circuit shape pattern or protrusions, or a mold having a concave cavity shape pattern, and a thermoplastic polyimide resin film. A second resin base material 20 is prepared (step S108). Then, as shown in FIG. 3 (f), the other imprint mold 72 is pressed against the second resin base material 20 while being heated to a predetermined temperature to transfer a circuit pattern constituted by a circuit shape pattern or the like. (Step S110). At this time, similarly to the above, the second resin base material 20 and the other imprint mold 72 are preferably heated to a temperature at which the resin material constituting the second resin base material 20 becomes soft, and then the circuit pattern is formed. Transcript.

  Thereafter, as shown in FIG. 3 (g), the second resin base material 20 is cooled, and the other imprint mold 72 is released from the second resin base material 20. A concave circuit pattern 73 is formed (step S112). After the circuit pattern 73 is formed, as shown in FIG. 4 (h), the conductive paste is filled into the circuit pattern 73 from the lower surface 20b side of the second resin base material 20 by plating, inkjet, printing, etc. The wiring 23 and the heat radiation wiring 21 are formed (step S114).

  In step S114, excess portions of the conductive paste that protrude from the surfaces 20a and 20b of the second resin base material 20 are removed by etching or the like. As a result, the electrode portions and electrode pad portions of the interlayer wiring 23 and the heat radiation wiring 21 can be formed flat with the respective surfaces 20 a and 20 b of the second resin base material 20.

  Then, as shown in FIG. 4 (i), the second resin base material 20 corresponding to the location where the electronic component 40 is accommodated is removed by cutting or laser processing, and the second resin base material 20. A cavity 60 is formed in the substrate (step S116). Next, as shown in FIG. 4 (j), the electronic component 40 and the cavity 60 are arranged while the lower surface 20 b of the second resin substrate 20 faces the mounting surface (upper surface) 10 a of the first resin substrate 10. Positioning is performed so that the positions of the circuit patterns 71 and 73 are aligned with each other, and the second resin base material 20 is heated and laminated on the first resin base material 10 as shown in FIG. S118).

  In step S118, it is preferable that the lamination process is performed at a heating temperature at which the resin materials of the first and second resin base materials 10 and 20 are bonded to each other and the resin material is softened. Thereafter, as shown in FIG. 4 (l), from the lower surface 10b side of the first resin substrate 10, the circuit pattern 71 is filled with a conductive paste by plating, inkjet, printing, etc. Wiring 11 and backside wiring 13 are formed (step S120), the electrode 41 of the electronic component 40 and the through-hole electrode 12 are directly joined, and the heat radiation wirings 11 and 21 and the backside wiring 13 and the interlayer wiring 23 are connected. Join directly. In this step S120, excess portions of the conductive paste protruding from the lower surface 10b of the first resin base material 10 are removed by etching or the like in the same manner as described above, and the electrode pads 12b and the like of the through-hole electrode 12 are 1 is made flat with the lower surface 10 b of the resin base material 10.

  Next, although not shown in the drawings, the imprint mold 70 and a third resin base material 30 made of a thermoplastic polyimide resin film are prepared (step S122), and the imprint mold 70 is heated to a predetermined temperature. The circuit pattern constituted by the circuit shape pattern is transferred by pressing against the third resin substrate 30 (step S124). At this time, as described above, the circuit pattern is transferred after preferably heating the third resin base material 30 and the imprint mold 70 to a temperature at which the resin material constituting the third resin base material 30 becomes soft. .

  Then, the third resin base material 30 is cooled to release the imprint mold 70 from the third resin base material 30, and the first resin base material 10 is formed on the third resin base material 30. A concave circuit pattern 71 similar to the above is formed (step S126).

  Next, while the lower surface 30b of the third resin substrate 30 is opposed to the upper surface 20a of the second resin substrate 20, the circuit patterns 71 and 73 are aligned so that the positions of the circuit patterns 71 and 73 are aligned with each other. ), The third resin base material 30 is heated and laminated on the second resin base material 20 (step S128).

  As described above, the heating temperature is preferably a temperature at which the resin materials of the second and third resin base materials 20 and 30 are bonded to each other and the resin material is softened. Then, as shown in FIG. 4 (n), from the upper surface 30a side of the third resin base material 30, the circuit pattern 71 is filled with a conductive paste by plating, ink jetting, printing, etc. The wiring 31 and the surface wiring 33 are formed (step S130), and the upper surface 41c of the electronic component 40 and the heat radiating via 32 are directly joined, and the heat radiating wirings 21, 31 and the interlayer wiring 23 and the surface wiring 33 are connected. The multilayer printed circuit board 100 with a built-in component is manufactured by direct bonding.

  In this step S130, the surplus portion of the conductive paste that protrudes from the upper surface 30a of the third resin base material 30 is removed by etching or the like in the same manner as described above, and the electrode pad portion and the like of the heat dissipation via 32 are removed. The upper surface 30a of the third resin substrate 30 is formed in a flat state. Further, the surface layer circuit 17 and the surface layer heat radiation circuit 18 as described above are formed as necessary.

  The component built-in multilayer printed circuit board 100 according to the first embodiment manufactured as described above can improve heat dissipation while reducing the height as described above, and can be mounted at higher density. The heat dissipation via 32 and the heat dissipation wirings 11, 21, 31 may have a configuration to which a ground potential is applied, for example.

  In addition, the component built-in multilayer printed board 100 may be configured as shown in FIG. A multilayer printed circuit board 100 with a built-in component shown in FIG. 6 includes an in-layer circuit 15 formed of a signal transmission line, a ground line, a power line, and the like, formed on the third resin base material 30 instead of the heat dissipation via 32. This is different from the previous multilayer printed circuit board with built-in components.

  Even in this case, the electronic component 40 accommodated in the cavity 60 of the second resin base material 20 has a high heat dissipation performance together with the above-described effects because the non-circuit surface 42 is in contact with the heat dissipation wirings 21 and 31. Can be provided. Further, the component built-in multilayer printed board 100 may be manufactured as follows.

  7 and 8 are cross-sectional views showing the component-embedded multilayer printed circuit board in the order of the second manufacturing process. That is, the second manufacturing process is characterized in that the order of processing is changed mainly so that step S120 in the first manufacturing process is performed after step S106 and step S114 is performed after step S118. Yes.

  Specifically, as shown in FIG. 7A, first, an imprint mold 70 and a first resin base material 10 are prepared, and as shown in FIG. 1 is pressed against the resin substrate 10 to transfer the circuit pattern. Next, as shown in FIG. 7C, the electrode 41 is aligned with the through hole 19, and the electronic component 40 is attached to the mounting surface (upper surface) 10 a of the first resin base material 10. Glued and mounted through.

  Then, as shown in FIG. 7 (d), the imprint mold 70 is released from the first resin base material 10 to form a concave circuit pattern 71, the first resin base material 10 is inverted, 7 (e), the conductive paste is filled in the circuit pattern 71 to form the through hole electrode 12, the heat radiation wiring 11 and the back surface wiring 13, and the electrode 41 of the electronic component 40, the through hole electrode 12, Are joined directly.

  Next, although not shown, another imprint mold 72 and the second resin base material 20 are prepared, and the other imprint mold 72 is pressed against the second resin base material 20 to transfer the circuit pattern. Then, another imprint mold 72 is released from the second resin base material 20 to form a concave circuit pattern 73 on the second resin base material 20.

  Then, the portion of the second resin base material 20 corresponding to the place where the electronic component 40 is accommodated is removed to form a cavity 60 in the second resin base material 20, and as shown in FIG. The lower surface 20b of the second resin substrate 20 faces the mounting surface (upper surface) 10a of the first resin substrate 10, and the positions of the electronic component 40 and the cavity 60 and the positions of the circuit patterns 71 and 73 are matched. The second resin base material 20 is heated and laminated on the first resin base material 10 as shown in FIG.

  In the second manufacturing process, the upper and lower surfaces 20a and 20b of the second resin base material 20 laminated on the first resin base material 10 are formed in consideration of the subsequent conductive paste filling process. The upper and lower surfaces 20a and 20b of the second resin base material 20 in the manufacturing process and the top and bottom are reversed.

  Thereafter, as shown in FIG. 8H, the conductive paste is filled from the upper surface 20a side of the second resin base material 20 to form the interlayer wiring 23 and the heat radiation wiring 21, and the imprint mold 70 and the first 3 resin base materials 30 are prepared, and the circuit pattern constituted by the circuit shape pattern of the imprint mold 70 is transferred to the third resin base material 30.

  Then, the imprint mold 70 is released from the third resin base material 30 to form the circuit pattern 71, and the lower surface 30 b of the third resin base material 30 faces the upper surface 20 a of the second resin base material 20. On the other hand, the circuit patterns 71 and 73 are aligned so that the positions of the circuit patterns 71 and 73 are aligned, and the third resin substrate 30 is heated and laminated on the second resin substrate 20 as shown in FIG.

  Finally, as shown in FIG. 8 (j), the conductive paste is filled from the upper surface 30a side of the third resin base material 30 to form the heat radiation via 32, the heat radiation wiring 31 and the surface wiring 33, and the components The built-in multilayer printed circuit board 100 is manufactured. Even if it manufactures in this way, as above-mentioned, the multilayer printed circuit board 100 with a built-in component which can be shortened, an improvement in heat dissipation, and high-density mounting can be manufactured.

  In the component built-in multilayer printed circuit board 100 according to the first embodiment, in addition to the above-described effects, the built-in electronic component 40 is surrounded by the heat radiation via 32 and the heat radiation wirings 11, 21, 31. Therefore, it is possible to improve electromagnetic compatibility (EMC: Electro-Magnetic Compatibility).

[Second Embodiment]
FIG. 9 is a cross-sectional view showing the structure of a component built-in multilayer printed board according to the second embodiment of the present invention. In the component-embedded multilayer printed circuit board 100 </ b> A according to the second embodiment, a metal layer 61 that contacts the non-circuit surface 42 of the electronic component 40 accommodated in the cavity 60 is formed on the inner wall surface constituting the cavity 60. This is different from the component built-in multilayer printed circuit board 100 according to the first embodiment.

  That is, the electrode formation of the electronic component 40 is performed such that the metal layer 61 is interposed between the side surface 41 d of the electronic component 40 and the heat radiation wiring 21 and between the upper surface 41 c of the electronic component 40 and the heat radiation via 32. It forms in the state which contacts surfaces other than the surface 41b. Accordingly, the same effect as the component built-in multilayer printed circuit board 100 according to the first embodiment is obtained, and the heat dissipation via 32 and the heat dissipation wiring are provided from the electronic component 40 in the cavity 60 through the metal layer 61. Since the thermal conductivity to 11, 21, 31 increases, the heat dissipation can be further improved.

Next, a manufacturing method of the component built-in multilayer printed board according to the second embodiment will be described.
10 and 11 are cross-sectional views showing the multilayer printed circuit board with built-in components in the order of the manufacturing process. First, as shown in FIG. 10A, an imprint mold 74 and a third resin substrate 30 are prepared, and as shown in FIG. 10B, the imprint mold 74 is replaced with a third resin substrate. 30 to transfer the circuit pattern.

  Next, as shown in FIG. 10C, the imprint mold 74 is released from the third resin base material 30 to form a concave circuit pattern 75, and as shown in FIG. The pattern 75 is filled with a conductive paste to form the heat radiation via 32, the heat radiation wiring 31 and the in-layer wiring 34. Next, although not shown, another imprint mold and the second resin base material 20 are prepared, and the other imprint mold is pressed against the second resin base material 20 to transfer the circuit pattern.

  Then, another imprint mold is released from the second resin base material 20 to form a concave circuit pattern 77 on the second resin base material 20, and a portion corresponding to a portion that accommodates the electronic component 40. The second resin base material 20 is removed to be larger than the outer diameter of the electronic component 40, and the cavity 60 is formed in the second resin base material 20.

  Thereafter, the lower surface 30b of the third resin base material 30 is opposed to the upper surface 20a of the second resin base material 20 on which the cavity 60 and the circuit pattern 77 are formed, the positions of the heat radiation vias 32 and the cavities 60, and the circuit. The second resin base material 20 is heated and laminated on the third resin base material 30 as shown in FIG.

  Next, as shown in FIG. 10 (f), the conductive paste is filled from the lower surface 20b side of the second resin base material 20 to form the in-layer wiring 24 and the heat radiation wiring 21, and the third resin substrate The wiring of the material 30 and the second resin base material 20 is directly joined to each other, and as shown in FIG. 11G, a metal layer 61 made of a conductive paste is formed in the cavity 60 by plating, inkjet, printing, or the like. To do. As a result, the electrode pads of the heat radiation wiring 21 and the heat radiation via 32 are joined to the metal layer 61.

  After the metal layer 61 is formed, the electrode is formed so that the metal layer 61 and the non-circuit surface 42 are in contact with each other and the electrode surface 41a and the lower surface 20b of the electrode 41 are flat as shown in FIG. The electronic component 40 in which the adhesive layer 50 is formed in advance on the surface 41 b is mounted in the cavity 60 of the second resin base material 20.

  Thereafter, although not shown, the imprint mold 74 and the first resin base material 10 are prepared, the imprint mold 74 is pressed against the first resin base material 10, the circuit pattern is transferred, and the first The imprint mold 74 is released from the resin substrate 10 to form a concave circuit pattern 75. Then, as shown in FIG. 11 (i), alignment is performed so that the positions of the through holes 19 of the circuit pattern 75 and the circuit patterns 75 and 77 are aligned with the electrode 41 of the electronic component 40. The upper surface 10a of the first resin base material 10 is opposed to the lower surface 20b of the second resin base material 20, and both are heated and laminated.

  Finally, as shown in FIG. 11 (j), the conductive paste is filled from the lower surface 10b side of the first resin base material 10 to form the through-hole electrode 12, the heat radiation wiring 11 and the back surface wiring 14, In addition to directly bonding the wirings of the second resin base material 20 and the first resin base material 10 together, the through-hole electrode 12 and the electrode 41 of the electronic component 40 are directly bonded to manufacture the component built-in multilayer printed circuit board 100A. . Thereby, the multilayer printed circuit board 100A with a built-in component capable of reducing the height, improving the heat dissipation, and mounting at a high density as described above can be manufactured. Moreover, you may form the surface layer thermal radiation circuit 18 as mentioned above as needed.

  Note that the component built-in multilayer printed circuit board 100A according to the second embodiment may have the following structure, for example. FIG. 12 is a cross-sectional view showing another structure of the component built-in multilayer printed board. As shown in FIG. 12, the multilayer printed circuit board 100A with built-in component of this example is a metal having high thermal conductivity connected to the heat radiation via 32 together with the surface heat radiation circuit 18 on the upper surface 30a side of the third resin base material 30. A heat sink 16 made of metal is provided. Even if comprised in this way, the further improvement of heat dissipation can be aimed at with the said effect.

[Third Embodiment]
FIG. 13 is a cross-sectional view showing the structure of a component-embedded multilayer printed board according to the third embodiment of the present invention. In the component-embedded multilayer printed board 100B according to the third embodiment, other electronic components 79 are mounted on the surface layer circuit 17 formed on the upper surface 30a of the third resin base material 30 via solder bumps 78. This is different from the component built-in multilayer printed boards 100 and 100A according to the first and second embodiments. In this way, the developability and versatility of the component built-in multilayer printed circuit board can be improved while providing the above-described effects.

[Fourth Embodiment]
FIG. 14 is a cross-sectional view showing the structure of a component built-in multilayer printed board according to the fourth embodiment of the present invention. The component-embedded multilayer printed circuit board 100C according to the fourth embodiment has a multilayer structure in which first to sixth layers of resin base materials 1 to 6 are laminated, and the electronic component 40 is formed into a fourth layer of resin base material 4. The point housed in the formed cavity 60 is different from the component built-in multilayer printed boards 100 and 100A according to the first and second embodiments. Even if comprised in this way, it can have the said effect.

[Fifth Embodiment]
FIG. 15 is a cross-sectional view showing the structure of a component-embedded multilayer printed board according to the fifth embodiment of the present invention. The component-embedded multilayer printed board 100D according to the fifth embodiment has a multilayer structure in which first to sixth layers of resin base materials 1 to 6 are laminated, and the electronic component 40A is a resin of the fourth and fifth layers. It is different from the component-embedded multilayer printed board 100C according to the fourth embodiment in that it is accommodated in a cavity 60A formed over the base materials 4 and 5. If comprised in this way, the large electronic component 40A thicker than the electronic component 40 can be similarly incorporated, and it can have the said effect.

[Sixth Embodiment]
FIG. 16 is a sectional view showing the structure of a component built-in multilayer printed board according to the sixth embodiment of the present invention. The component-embedded multilayer printed board 100E according to the sixth embodiment has a multilayer structure in which first to third resin base materials 10 to 30 are stacked, and is accommodated in a cavity 62 formed in the second resin base material 20. In addition to the electronic component 40, the first and second embodiments are that an electronic component 49 made of a resistor, a capacitor, or the like is built in a cavity 63 formed in the second resin base material 20 in the same manner. This is different from the component built-in multilayer printed circuit board 100, 100A according to the embodiment. Even if comprised in this way, it can have the said effect.

[Seventh Embodiment]
FIG. 17 is a sectional view showing the structure of a component built-in multilayer printed circuit board according to the seventh embodiment of the present invention. The component-embedded multilayer printed board 100F according to the seventh embodiment has a multilayer structure in which first to seventh layers of resin base materials 1 to 7 are laminated, and the electronic component 40 is a second layer and a fourth layer of resin. The point which is accommodated in the cavity 60 formed in the base materials 2 and 4 is different from the component-embedded multilayer printed board 100C according to the fourth embodiment. Even if comprised in this way, it can have the said effect.

[Eighth Embodiment]
FIG. 18 is a sectional view showing the structure of a component built-in multilayer printed circuit board according to the eighth embodiment of the present invention. The component-embedded multilayer printed circuit board 100G according to the eighth embodiment has a multilayer structure in which first to sixth layers of resin bases 1 to 6 are laminated, and a plurality of electronic components 40 are fourth-layer resin bases. The component-embedded multilayer printed board according to the fourth embodiment is that the electronic component 49 is accommodated in the cavity 60 formed in the second layer resin base material 2. It is different from 100C. Even if comprised in this way, it can have the said effect.

1 to 7 Resin base material 10 First resin base material 11 Heat dissipating wiring 12 Through hole electrode 12a Electrode 12b Electrode pad 13, 14 Back surface wiring 15 In-layer circuit 16 Heat sink 17 Surface layer circuit 18 Surface heat dissipating circuit 19 Through hole 20 1st 2 resin base material 21 heat radiation wiring 23 interlayer wiring 24 in-layer wiring 30 third resin base material 31 heat radiation wiring 32 heat radiation via 33 surface wiring 34 intra-layer wiring 40 electronic component 41 electrode 41a electrode surface 41b electrode formation surface 41c upper surface 41d side surface 42 non-circuit surface 50 adhesive layer 60 cavity 61 metal layer 100 multilayer printed circuit board with built-in components

Claims (1)

Three or more layers of resin substrate including at least one layer of resin substrate having a cavity formed therein;
An electronic component built in a cavity formed in the resin substrate;
And wiring including through-hole electrodes respectively formed on the resin base material,
The electrode of the electronic component and the through-hole electrode formed at a position corresponding to the electrode are directly joined,
On at least one surface of the resin base material, an electrode pad connected to the wiring is formed in a state embedded in the resin base material,
Wiring continuous to the surface side of the resin base material is in contact with the surface and side surface opposite to the electrode forming surface of the electronic component, and the wiring is formed on the inner wall surface of the cavity. Having a metal layer in contact with a surface other than the electrode forming surface;
The electronic component is connected by an adhesive layer formed between the mounting surface of the resin substrate on which it is mounted and the electrode forming surface of the electronic component,
The electronic component covered with the metal layer and its electrode are within the height of the cavity formed in the resin base material,
The wiring formed in the resin base material having the cavity is embedded in the resin base material without protruding from the upper surface and the lower surface of the resin base material .

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