JP5757628B2 - 界面層削減方法、高誘電率ゲート絶縁膜の形成方法、高誘電率ゲート絶縁膜、高誘電率ゲート酸化膜、及び高誘電率ゲート酸化膜を有するトランジスタ - Google Patents
界面層削減方法、高誘電率ゲート絶縁膜の形成方法、高誘電率ゲート絶縁膜、高誘電率ゲート酸化膜、及び高誘電率ゲート酸化膜を有するトランジスタ Download PDFInfo
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- JP5757628B2 JP5757628B2 JP2011544252A JP2011544252A JP5757628B2 JP 5757628 B2 JP5757628 B2 JP 5757628B2 JP 2011544252 A JP2011544252 A JP 2011544252A JP 2011544252 A JP2011544252 A JP 2011544252A JP 5757628 B2 JP5757628 B2 JP 5757628B2
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- dielectric constant
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- high dielectric
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- 238000000034 method Methods 0.000 title claims description 58
- 230000009467 reduction Effects 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 73
- 239000002184 metal Substances 0.000 claims description 73
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 49
- 239000001301 oxygen Substances 0.000 claims description 49
- 229910052760 oxygen Inorganic materials 0.000 claims description 49
- 239000004065 semiconductor Substances 0.000 claims description 41
- 229910044991 metal oxide Inorganic materials 0.000 claims description 35
- 150000004706 metal oxides Chemical class 0.000 claims description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 31
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 22
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 22
- 230000007547 defect Effects 0.000 claims description 17
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 16
- 229910052715 tantalum Inorganic materials 0.000 claims description 16
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 15
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 229910052735 hafnium Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000010955 niobium Substances 0.000 claims description 8
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 7
- 238000000137 annealing Methods 0.000 claims description 6
- 230000002950 deficient Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 84
- 230000015572 biosynthetic process Effects 0.000 description 23
- 239000000758 substrate Substances 0.000 description 21
- 150000004767 nitrides Chemical class 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 5
- 238000011068 loading method Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000004549 pulsed laser deposition Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- REUJRJRXRFOLBZ-UHFFFAOYSA-N CC[Hf](C)(CC)(CC)CC Chemical compound CC[Hf](C)(CC)(CC)CC REUJRJRXRFOLBZ-UHFFFAOYSA-N 0.000 description 1
- -1 HfO 2 Chemical class 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- KUVFGOLWQIXGBP-UHFFFAOYSA-N hafnium(4+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Hf+4] KUVFGOLWQIXGBP-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02181—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing hafnium, e.g. HfO2
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02183—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing tantalum, e.g. Ta2O5
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
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- H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823828—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/823842—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823857—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
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- H01—ELECTRIC ELEMENTS
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
- H01L29/513—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being perpendicular to the channel plane
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
Description
即ち、(a)半導体層上に、界面層としての前記半導体の酸化膜を形成するステップと、(b)前記界面層上に、第1の金属の酸化物の膜を形成するステップと、(c)アニール処理を行うことにより、前記界面層の厚みを増膜させるステップと、(d)前記第1の金属の酸化物の膜上に、前記第1の金属よりも価数が大きく、かつ、化学量論的組成よりも酸素が欠損している第2の金属の酸化物の膜を形成することにより、増膜された前記界面層の厚みを削減させるステップとを有する界面層削減方法である。
(d−1)前記第1の金属の酸化物の膜上に前記第2の金属の膜を形成するステップ。
(d−2)前記第2の金属の膜を酸化するステップ。
ここでは、本発明による界面層厚さの低減効果を奏する実施例を、従来技術に基づく比較例と対比しながら説明する。
希釈フッ酸溶液で前記Si基板表面の自然酸化膜を除去した後に、950℃以上の高温度熱処理酸化方法で処理し、前記薄い酸化シリコン膜を作製した。なお、シリコン(Si基板)をあらかじめ酸化し、前記薄い酸化シリコン層を作製するのは、前記酸化ハフニウム膜(第1の金属の酸化物の膜)との間に欠陥の少ない良好な界面を形成するためであり、本発明によれば、後工程のPDA(Post Deposition Annealing)処理において増膜する界面層としての前記酸化シリコン膜の厚みを削減することができる。
酸素原料としてH2Oを、ハフニウム原料としてTEMAHf(Tetrakis−Ethylmethylamido−Hafnium:Hf(NEtMe)4)を用いて、原子層制御成膜(ALD:Atomic Layer Deposition)法によって、前記酸化シリコン膜上に酸化ハフニウム膜を堆積した。その後、堆積された膜中の欠陥などを低減させるべく1,050℃でPDA(Post Deposition Annealing)処理を施した。
酸化タンタルターゲットを用いた低酸素分圧化のパルスレーザ蒸着(Pulsed Laser deposition)法で、前記酸化ハフニウム膜上に酸素欠損型の前記酸化タンタル(Ta2O5−x)膜を約5nm堆積した。
なお、前記酸化タンタル膜におけるタンタルの濃度は、1020〜1022個/cm3であることが好ましい。
前記タンタルの濃度が、1020個/cm3未満であると、前記酸化ハフニウム膜(第1の金属の酸化物の膜)中へのタンタルの拡散が不十分となることがあり、1022個/cm3を超えると、前記酸化ハフニウム膜から酸素を吸収してしまうため、前記酸化ハフニウム膜中に欠陥が増えて膜質が劣化することがある。
Ta2O5−x膜を設けないこと以外は、実施例1の層構造と同じ方法により、比較例に係る層構造を作製した。実施例1の写真と同一の条件で作製したTEM写真を図1の左側に示す。
図2(a)及び図2(b)に、比較例の層構造(図2(a))と実施例1の層構造(図2(b))のSIMS(二次イオン質量分析)測定結果のグラフを示す。これらのグラフからわかるように、実施例1の層構造のグラフでは、HfO2膜の上に積載(堆積)されたTa2O5−x膜からTaがHfO2中に拡散している様子がわかる。逆にHfもTa2O5−x膜側に拡散しているため、Ta2O5−x膜中ではその右端(図1のTEM写真では上)でもかなりの量のHfが存在している。図1の右側においてHfO2の上の層が全てTaHfOxと表記されているのはこのような状況を表すためである。
これはHfO2がSi基板上に成膜されることを考慮するためである。よって形成エネルギーはフェルミエネルギーのみの関数として表される。この形成エネルギーを使って下記の数式のうち下枠内の式から欠陥密度を計算する。温度は1,000℃に設定した。
以下に、本発明をnチャネル型およびpチャネル型MOSトランジスタから構成されるCMOS(Complementary Metal Oxide Semiconductor)集積回路の製造方法に適用した実施例を、図6〜図15を参照して説明する。実際には半導体基板上には多数のトランジスタが作成されるが、説明をわかりやすくするため、以下の実施例ではnチャネル型MOSトランジスタとpチャネル型MOSトランジスタを夫々1つずつ作製するものとして説明を進める。
602 素子分離溝
603 p型ウエル
604 n型ウエル
701 ゲート絶縁膜
801 金属窒化物膜
802 ハードマスク
901 金属窒化物膜
1101 キャップ層
1102 ゲート電極
1103 ゲート電極
1201 n−型半導体領域
1202 p−型半導体領域
1203 サイドウォールスペーサ
1301 n+型半導体領域
1302 p+型半導体領域
1303 nチャネル型MOSトランジスタ
1304 pチャネル型MOSトランジスタ
1401 層間絶縁膜
1402 コンタクトホール
1501 プラグ
1502 メタル配線
Claims (16)
- (a)半導体層上に、界面層としての前記半導体の酸化膜を形成するステップと、
(b)前記界面層上に、第1の金属の酸化物の膜を形成するステップと、
(c)アニール処理を行うことにより、前記界面層の厚みを増膜させるステップと、
(d)前記第1の金属の酸化物の膜上に、前記第1の金属よりも価数が大きく、かつ、化学量論的組成よりも酸素が欠損している第2の金属の酸化物の膜を形成することにより、増膜された前記界面層の厚みを削減させるステップとを有する界面層削減方法。 - 前記第2の金属の酸化物の膜を形成するステップは、前記第1の金属の酸化物の膜上に前記第2の金属の酸化物を蒸着するステップを有する、請求項1に記載の界面層削減方法。
- 前記第2の金属の酸化物の膜を形成するステップは、以下のステップ(d−1)及び(d−2)を有する、請求項1に記載の界面層削減方法。
(d−1)前記第1の金属の酸化物の膜上に前記第2の金属の膜を形成するステップ。
(d−2)前記第2の金属の膜を酸化するステップ。 - 前記半導体層の形成材料がシリコンであり、前記界面層が酸化シリコンである、請求項1から3の何れかに記載の界面層削減方法。
- 前記第1の金属の酸化物は、酸化シリコンよりも大きな誘電率を有する、請求項1から4の何れかに記載の界面層削減方法。
- 前記半導体層の形成材料がIII−V系化合物半導体であり、前記半導体層と前記第1の金属の酸化物膜との間に界面欠陥軽減層を設ける、請求項1から3の何れかの界面層削減方法。
- 前記第1の金属は、ハフニウム(Hf)、ジルコニウム(Zr)及びチタン(Ti)から選ばれた少なくとも1種類の金属であり、前記第2の金属は、タンタル(Ta)、ニオブ(Nb)及びバナジウム(V)から選ばれた少なくとも1種類の金属である、請求項1から6の何れかに記載の界面層削減方法。
- (e)前記第1の金属の酸化物の膜上に形成された前記第2の金属の酸化物の膜の少なくとも一部を除去するステップを設けた、請求項1から7の何れかに記載の界面層削減方法。
- 前記第2の金属の酸化物の膜を形成するステップは、前記第2の金属の酸化物の膜として、タンタルの濃度が10 20 〜10 22 個/cm 3 である酸化タンタル膜を形成するステップである、請求項7から8の何れかに記載の界面層削減方法。
- 請求項1から9の何れかに記載の界面層削減方法を使用して高誘電率ゲート絶縁膜を形成する高誘電率ゲート絶縁膜の形成方法。
- 請求項1から9の何れかの界面層削減方法により作製された高誘電率ゲート絶縁膜。
- 請求項1から9の何れかの界面層削減方法により作製され、
第1の金属の酸化物と、前記第1の金属の酸化物中に拡散された前記第1の金属よりも大きな価数を有する少なくとも1種類の金属である第2の金属とを含む高誘電率ゲート酸化膜であって、
前記第1の金属の酸化物は、前記高誘電率ゲート酸化膜の下にある半導体層または前記半導体層と前記高誘電率ゲート酸化膜との間に設けられた層の酸化物よりも大きな誘電率を有する少なくとも1種類の金属の酸化物である、
高誘電率ゲート酸化膜。 - 前記半導体層の形成材料は、シリコンであり、
第1の金属の酸化物は、酸化シリコンよりも大きな誘電率を有する少なくとも1種類の金属の酸化物である、
請求項12に記載の高誘電率ゲート酸化膜。 - 前記第1の金属は、ハフニウム(Hf)、ジルコニウム(Zr)及びチタン(Ti)から選ばれた少なくとも1種類の金属であり、前記第2の金属は、タンタル(Ta)、ニオブ(Nb)及びバナジウム(V)から選ばれた少なくとも1種類の金属である、請求項12または13に記載の高誘電率ゲート酸化膜。
- 前記第1の金属の酸化物が酸化ハフニウムであり、前記第2の金属がタンタルである、請求項14に記載の高誘電率ゲート酸化膜。
- 請求項11から15の何れかに記載の高誘電ゲート絶縁膜または高誘電率ゲート酸化膜を有するトランジスタ。
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US9515186B2 (en) | 2014-01-23 | 2016-12-06 | Samsung Electronics Co., Ltd. | Semiconductor device and method of fabricating the same |
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