JP5747596B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device including a semiconductor module containing a semiconductor element and a cooler that cools the semiconductor module.

  In hybrid vehicles having both an internal combustion engine and an electric motor as drive sources, and electric vehicles equipped with an electric motor as a drive source, both the direct current supplied from the battery and the alternating current output to the electric motor A power conversion device that performs direction conversion is provided. As the power conversion device, for example, as disclosed in Patent Document 1, one of the stacking directions of a stacked body in which a semiconductor module containing a semiconductor element and a cooler that cools the semiconductor module are alternately stacked. Some end members are provided with a pressure member including a spring member. And the pin-shaped fixing member distribute | arranged to the anti-lamination body side of the pressurization member has fixed the pressurization member. Thereby, the spring member of the pressurizing member pressurizes the stacked body in the stacking direction.

JP 2009-27805 A

  A power conversion device including a stacked body in which semiconductor modules and coolers are alternately stacked as described above is compared with a power conversion device including a structure in which semiconductor modules are arranged in a planar shape on a rectangular cooling plate. Thus, there is a tendency that the total length in the stacking direction of the stacked body is increased. Further, in the case of the power conversion device described in Patent Document 1, it is necessary to dispose a pressure member that pressurizes the laminate and a fixing member that fixes the pressurization member at an end of the laminate in the stacking direction. There was a problem that the total length in the stacking direction of the film was further increased.

  Then, this invention is made | formed in view of such a problem, and it aims at providing the power converter device which can reduce the full length of the lamination direction of a laminated body provided with a semiconductor module and a cooler. To do.

In order to solve the above-mentioned problem, the invention described in claim 1 includes a stacked body in which a semiconductor module containing a semiconductor element and a cooler for cooling the semiconductor module are stacked, and the stacked body is accommodated. A power conversion device including a container, wherein a pressure member that pressurizes the stacked body in the stacking direction is disposed at one end in the stacking direction of the stacked body, and the pressurizing member is A first abutting portion that abuts one end of the laminate in the laminating direction; and a fixing portion that fixes the pressure member to the container, and one end in the laminating direction of the laminate , When the direction in which the laminate is present is the other end direction, and the direction in which the laminate is not present is the one end direction, the fixed portion is the other of the first abutting portion. Arranged in the end direction, the pressure member is In a state where the applied tensile load to endwise, to press the laminate by the first contact portion to the other end direction, the container, when containing the above laminate to the container A pair of opposing wall portions positioned in the stacking direction of the stacked body, and a pair of side wall portions formed at an end of the facing wall portion and positioned in a direction orthogonal to the stacking direction of the stacked body, A connection part for fixing the fixing part is formed on the side wall part .

  If comprised in this way, a fixing | fixed part will be arrange | positioned in the other edge part direction rather than the arrangement position of a 1st contact part. Thereby, the pressurizing member can press the laminated body in the direction of the other end by the first contact portion in a state where a tensile load in the direction of the one end is applied to the fixed portion. Therefore, it is not necessary to arrange a fixing member that fixes the pressure member to the container in the direction of one end where the stacked body does not exist when viewed from the arrangement position of the first contact portion. Therefore, according to the present invention, the pressurizing member that pressurizes the laminated body in the direction of one end where the laminated body does not exist with reference to one end in the laminated direction of the laminated body including the semiconductor module and the cooler. Compared with the structure which arrange | positions the fixing member which fixes this to a container, the full length of the lamination direction of a laminated body can be reduced in size.

Further, the prior SL container, upon accommodating the laminate in the housing body, and a pair of opposing wall positioned in the stacking direction of the laminate is formed at the end of the opposite wall portion, said lamination A pair of side wall portions positioned in a direction orthogonal to the body stacking direction, and a connection portion for fixing the fixing portion is formed on the side wall portion.

  If comprised in this way, the fixing | fixed part of a pressurization member will be fixed to the connection part formed in the side wall part located in the direction orthogonal to the lamination direction of a laminated body. Therefore, it is not necessary to arrange a fixing member that fixes the pressure member to the container in the direction of one end where the stacked body does not exist when viewed from the arrangement position of the first contact portion. Therefore, according to the present invention, the pressurizing member that pressurizes the laminated body in the direction of one end where the laminated body does not exist with reference to one end in the laminated direction of the laminated body including the semiconductor module and the cooler. Compared with the structure which arrange | positions the fixing member which fixes this to a container, the full length of the lamination direction of a laminated body can be reduced in size.

Further, the prior SL cooler, and the refrigerant introduction tube for introducing a cooling medium into the laminate, and a coolant discharge pipe for discharging the coolant from the stack, the coolant inlet tube and the refrigerant discharge pipe, the It arrange | positions at one edge part of the lamination direction of a laminated body, and the said 1st contact part is arrange | positioned between the said refrigerant | coolant inlet tube and the said refrigerant | coolant exhaust pipe, It is characterized by the above-mentioned.

  If comprised in this way, the 1st contact part of a pressurization member will be arrange | positioned between the refrigerant | coolant inlet tube and refrigerant | coolant exhaust pipe arrange | positioned at one edge part of the lamination direction of a laminated body. Therefore, according to this invention, the 1st contact part of a pressurization member is arrange | positioned in the other edge part different from one edge part of the lamination direction of the laminated body in which a refrigerant | coolant inlet tube and a refrigerant | coolant discharge pipe are arrange | positioned. In comparison with the above, the total length in the stacking direction of the stacked body can be reduced.

The front asked member is formed by linear elastic members, wherein the fixing portion is formed at both ends of the pressure member, the first contact portion is formed in a central portion of the pressure member, the 2 abutting portions are formed between the first abutting portion and the fixing portion, and when the two opposing surfaces having the largest area of the laminate are the main surfaces, the second abutting portion is Further, it is in contact with the main surface of the laminate.

  If comprised in this way, a pressurization member is formed with a linear elastic member, and is provided with the 2nd contact part which contact | abuts the main surface of a laminated body between a fixing | fixed part and a 1st contact part. Therefore, according to this invention, compared with the structure which does not have a site | part which a pressurization member contact | abuts with the main surface of a laminated body, the earthquake resistance performance with respect to the main surface direction of a laminated body can be improved.

Further, the prior SL first contact portion, wherein the first contact portion is provided with a folded shape along the end portion of the stack abuts. Further, two opposing surfaces having the largest area of the laminate are main surfaces, and one end portion in the stacking direction of the laminate in which the pressure member is disposed, the method of the principal surface of the laminate One end in the linear direction is one end in the short direction of the laminate, and one end in the stacking direction of the laminate in which the pressure member is disposed, and the method of the principal surface of the laminate When the other end portion in the linear direction is the other end portion in the short-side direction of the laminate, the first contact portion is disposed along one end portion in the short-side direction of the laminate. A first rail line portion and a first rail line portion connected to the first rail line portion and arranged from one end portion in the short direction of the laminate toward the other end portion in the short direction of the laminate. A connection line part, a central line part connected to the first connection line part and disposed along the other end in the lateral direction of the laminate, and the central line part A second connection line portion that is connected to a first end portion in the short direction of the laminated body from the other end portion in the short side direction of the laminated body, and the second connection line And a second rail line portion disposed along one end portion in the short direction of the laminate.

  If comprised in this way, a 1st contact part will be provided with the folding | turning shape along the edge part of the laminated body which a 1st contact part contacts. Therefore, according to the present invention, the contact area between the first contact portion and the end of the laminate can be increased as compared with the configuration in which the first contact portion does not have a folded shape. It is possible to disperse the load of the pressure member applied to the end of the.

The circuit diagram which shows the power converter device in a present Example. The top view of a power converter device. AA sectional drawing of FIG. The AA sectional view of Drawing 2 in other examples. The top view of the power converter device in another Example. The top view of the power converter device in another Example.

Example 1
Embodiments of the present invention will be described below with reference to the drawings. In the description after FIG. 1, the same components are denoted by the same reference numerals and description thereof is omitted.

  FIG. 1 is a diagram illustrating a circuit diagram of the power conversion device 1. A power conversion device 1 illustrated in FIG. 1 is an inverter for a vehicle including a boost converter unit (DC-DC converter) 10 and an inverter unit 11. The power conversion device 1 is used to generate a drive current that energizes an AC motor 12 that is a power source of an electric vehicle, a hybrid vehicle, or the like.

  Boost converter unit 10 is connected to external power supply 13, and filter capacitor 14 is connected between boost converter unit 10 and external power supply 13. The filter capacitor 14 absorbs a ripple current included in the power supply current input from the DC external power supply 13 to the boost converter unit 10 and stabilizes the power supply current.

  The step-up converter unit 10 includes a reactor coil unit 15, an IGBT (Insulated Gate Bipolar Transistor) element 161A (semiconductor element), and two semiconductor modules 16A incorporating a diode 162A, and boosts the input voltage. The reactor coil unit 15 is connected to the external power supply 13 side. The IGBT element 161A of the boost converter unit 10 is connected to the AC motor 12 side of the reactor coil unit 15, and a pair of diodes 162A is connected to each IGBT element 161A. The IGBT element 161A performs a switching operation under the control of a control unit (not shown).

  A smoothing capacitor 17 is connected between the IGBT element 161 </ b> A of the boost converter unit 10 and the inverter unit 11. The smoothing capacitor 17 smoothes the output current of the boost converter unit 10 that becomes an intermittent current, and causes the inverter unit 11 to input a stable DC current.

  The inverter unit 11 includes six semiconductor modules 16B including a IGBT element 161B (semiconductor element) and a diode 162B, and a snubber capacitor 18. The IGBT element 161B of the inverter unit 11 is connected to the smoothing capacitor 17, and a pair of diodes 162B is connected to each IGBT element 161B. The IGBT element 161B performs a switching operation under the control of a control unit (not shown). The snubber capacitor 18 is connected to the IGBT element 161B, suppresses a voltage surge generated during the operation of the IGBT element 161B, and prevents the IGBT element 161B from being damaged due to an overvoltage.

  Further, a three-phase AC motor 12 is connected to the inverter unit 11, and the drive current generated by the inverter unit 11 is supplied to the AC motor 12.

  FIG. 2 shows a plan view of the power conversion device 1. FIG. 3 is a cross-sectional view taken along the line AA in FIG.

  As illustrated in FIG. 2, the power conversion device 1 includes semiconductor modules 16 </ b> A and 16 </ b> B, a cooler 3, and a container 4. The cooler 3 includes a cooling pipe 31, a communication pipe 32, a refrigerant introduction pipe 33, and a refrigerant discharge pipe 34.

  The semiconductor modules 16A and 16B include a signal terminal 163 connected to a control circuit (not shown) that controls the semiconductor modules 16A and 16B, and a main electrode terminal 164 that inputs and outputs power to the semiconductor modules 16A and 16B. Yes. The signal terminals 163 and the main electrode terminals 164 are formed so as to protrude in directions different by 180 degrees with respect to the semiconductor modules 16A and 16B. The semiconductor module 16A includes an IGBT element 161A and a diode 162A, which are semiconductor elements. Similarly, the semiconductor module 16B includes an IGBT element 161B and a diode 162B, which are semiconductor elements. The IGBT elements 161A and 161B and the diodes 162A and 162B are entirely molded. Therefore, the semiconductor modules 16A and 16B are of a so-called 1in1 type in which two elements are housed in one package.

  The cooling pipe 31 is disposed so as to sandwich the semiconductor modules 16A and 16B from both sides. In the first embodiment, two semiconductor modules 16 </ b> A and 16 </ b> B are sandwiched between adjacent cooling pipes 31. As a whole, the laminate 2 is formed by alternately arranging the cooling pipes 31 and the semiconductor modules 16A and 16B. Thereby, all the semiconductor modules 16 </ b> A and 16 </ b> B are in a state where both surfaces thereof are sandwiched by the cooling pipe 31. Therefore, the cooling pipes 31 disposed at both ends in the stacking direction of the multilayer body 2 are provided with the heat radiation surfaces 35 on which the semiconductor modules 16A and 16B are closely disposed on only one side, and the cooling pipes 31 disposed on both sides are radiated on both sides. A surface 35 is provided. In addition, a plurality of cooling pipes 31 adjacent to each other in the stacking direction of the stacked body 2 communicate with each other through a communication pipe 32 at a refrigerant introduction port (not shown) and a refrigerant discharge port (not shown) provided at both ends in the longitudinal direction. Has been. The cooling pipe 31 disposed at one end of the stack 2 in the stacking direction includes a refrigerant introduction pipe 33 that introduces a cooling medium into the stack 2 and a refrigerant discharge pipe 34 that discharges the cooling medium from the stack 2. Has been placed.

  With this configuration, the cooling medium introduced from the refrigerant introduction pipe 33 is distributed to each cooling pipe 31. The cooling medium is introduced from a refrigerant inlet (not shown) in each cooling pipe 31 and flows in the direction of the refrigerant outlet (not shown) of each cooling pipe 31. At this time, the cooling medium exchanges heat with the semiconductor modules 16 </ b> A and 16 </ b> B disposed in close contact with the heat radiation surface 35 of each cooling pipe 31. The cooling medium after the heat exchange reaches the refrigerant discharge pipe 34 from the refrigerant discharge port (not shown) of each cooling pipe 31 through the communication pipe 32 and is discharged out of the stacked body 2.

  Cooling media include natural refrigerants such as water and ammonia, water mixed with ethylene glycol antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, alcohol refrigerants such as methanol and alcohol, A ketone-based refrigerant such as acetone can be used.

  The container 4 has a rectangular outer shape as a whole. The container 4 is formed at a pair of opposed wall portions 41 positioned in the lamination direction of the laminated body 2 when the laminated body 2 is accommodated in the containing body 4, and at the end of the opposed wall portion 41. And a pair of side wall portions 42 located in a direction orthogonal to the direction. In addition, the container 4 is provided with an open portion at a position facing the main surface of the stacked body 2, which is an end of the facing wall portion 41 and the side wall portion 42. Here, the main surface of the laminate 2 refers to two opposing surfaces having the largest area. In addition, two placement portions 43 on which the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are placed are formed on one opposing wall portion 41 of the container 4. And when the laminated body 2 is accommodated in the container 4, the refrigerant | coolant introduction pipe | tube 33 and the refrigerant | coolant discharge pipe 34 are each mounted in the mounting part 43, and the lamination | stacking in which the refrigerant | coolant introduction pipe 33 and the refrigerant | coolant discharge pipe 34 are not arrange | positioned. The end portion of the body 2 in the stacking direction is in contact with the opposing wall portion 41 facing the body 2. The container 4 is made of aluminum having a high thermal conductivity.

  Next, the main part of a present Example is demonstrated.

  As shown in FIGS. 2 and 3, a pressing member 5 that pressurizes the stacked body 2 in the stacking direction is provided at one end in the stacking direction of the stacked body 2 including the semiconductor modules 16 </ b> A and 16 </ b> B and the cooling pipe 31. Has been placed. The pressing member 5 in the first embodiment is formed by a linear spring member. The pressure member 5 includes a first contact portion 51 formed at the center of the pressure member 5, a fixed portion 52 formed at both ends of the pressure member 5, a fixed portion 52, and the first contact portion 51. And a second contact portion 53 formed between the two. Further, the first contact portion 51 and the second contact portion 53 are connected via a bent portion 54. The second contact part 53 and the fixed part 52 are connected via a bent part 55.

  In the first embodiment, each side wall portion 42 of the container 4 is formed with one boss 44 that protrudes in the outer direction of the container 4. Specifically, the boss 44 has a cylindrical shape, and is formed so that a side surface portion having a cylindrical curved surface is joined to the side wall portion 42 of the container 4. The boss 44 is formed on each side wall 42 adjacent to the third semiconductor module 16B from the end of the stacked body 2 where the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are arranged to the other end. Yes. That is, the bosses 44 formed on the side wall portions 42 of the container 4 are arranged side by side in a direction perpendicular to the lamination direction of the laminate 2 and perpendicular to the normal direction of the main surface of the laminate 2. . Each boss 44 is formed with an insertion hole 441 from one main surface of the laminate 2 to the other main surface direction, and a fixing portion 52 of the pressurizing member 5 described later is inserted therethrough. In the first embodiment, the boss 44 corresponds to the connection portion described in claim 1.

  The first contact portion 51 in the first embodiment contacts the cooling pipe 31 at the end in the stacking direction of the stacked body 2 in which the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are arranged, and the refrigerant introduction pipe 33 and the refrigerant discharge. It arrange | positions so that it may be located between the pipe | tubes 34. FIG. The first contact portion 51 is disposed along one end portion in the short direction of the cooling pipe 31 in the normal direction of the main surface of the laminate 2 (hereinafter referred to as one end portion in the short direction). And the other end portion in the short direction of the cooling pipe 31 in the normal direction of the main surface of the laminate 2 (hereinafter referred to as the other end portion in the short direction). ) Arranged along the central line portion 513, the first connection line portion 514 connecting the first line portion 511 and the central line portion 513, the second line portion 512 and the central line portion 513 connecting the first line portion 513. 2 connecting line portions 515. In addition, the first line portion 511 and the first connection line portion 514 are connected via a first right angle portion 516. The first connection line portion 514 and the central line portion 513 are connected via a second right angle portion 517. The central line portion 513 and the second connection line portion 515 are connected via a third right angle portion 518. The second connection line portion 515 and the second along-line portion 512 are connected via a fourth right angle portion 519.

  As shown in FIG. 3, the first rail portion 511 is arranged along one end portion in the short direction of the cooling pipe 31 from the refrigerant introduction pipe 33 toward the refrigerant discharge pipe 34. The first right angle portion 516 is bent at a right angle from one end portion in the short direction of the cooling pipe 31 toward the other end portion in the short direction of the cooling pipe 31. The first connecting line part 514 connected to the first along-line part 511 via the first right-angled part 516 is the cooling pipe 31 from one end part in the short direction of the cooling pipe 31 toward the other end part. Are arranged along. The second right angle portion 517 is bent at a right angle with respect to the direction orthogonal to the stacking direction of the stacked body 2 and orthogonal to the main surface direction of the stacked body 2. The central line portion 513 connected to the first connection line portion 514 via the second right angle portion 517 is the other end portion in the short direction of the cooling pipe 31 from the refrigerant introduction pipe 33 toward the refrigerant discharge pipe 34. Are arranged along. The third right angle portion 518 is bent at a right angle from the other end portion in the short direction of the cooling pipe 31 toward one end portion in the short direction of the cooling pipe 31. The second connection line portion 515 connected to the central line portion 513 via the third right angle portion 518 is connected to the cooling pipe 31 from the other end in the short direction of the cooling pipe 31 toward the one end. Are arranged along. The fourth right angle portion 519 is bent at a right angle with respect to the direction orthogonal to the stacking direction of the stacked body 2 and orthogonal to the main surface direction of the stacked body 2. The second line portion 512 connected to the second connection line portion 515 via the fourth right angle portion 519 is one end in the short direction of the cooling pipe 31 from the refrigerant introduction pipe 33 toward the refrigerant discharge pipe 34. It is arranged along the part. Therefore, the first contact portion 51 is disposed along both ends of the cooling pipe 31 in the short direction in the normal direction of the main surface of the laminate 2. Further, as shown in FIG. 3, a U-shaped folded shape is provided at a substantially intermediate position between the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34.

  The second contact portion 53 is disposed on one main surface of the laminate 2 and extends from the bent portions 54 at both ends of the first contact portion 51 to the bosses 44 formed on the adjacent side wall portions 42. Yes. Therefore, the second contact portion 53 is disposed so as to intersect the stacking direction of the stacked body 2. In the first embodiment, as shown in FIG. 2, when viewed from the main surface direction of the laminate 2, a half straight line (second contact portion 53) from the bent portion 54 to the boss 44 formed on the adjacent side wall portion 42. Is a side of one corner, and an imaginary line extending from the bent portion 54 at both ends of the first contact portion 51 is a side of the other corner, the angle formed by the two corner sides is an acute angle. In this way, the second contact portion 53 is arranged. The second contact portion 53 is disposed so as to contact the cooling pipe 31 protruding in the normal direction of the main surface of the laminate 2 when passing over one main surface of the laminate 2. . In the first embodiment, the cooling pipe 31 at the end in the stacking direction of the stacked body 2 in which the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are arranged, and two locations of the cooling pipe 31 adjacent to the cooling pipe 31 at the end, The second contact portion 53 is in contact.

  The bent portion 55 that connects the second contact portion 53 and the fixed portion 52 is bent from the main surface of the laminate 2 on the side where the second contact portion 53 is disposed to the other main surface direction. Is formed. Each fixing portion 52 facing the normal direction of the main surface of the laminate 2 is inserted and fixed in the insertion hole 441 of each boss 44.

  Thereby, with one end in the stacking direction of the stacked body 2 as a reference, the direction in which the stacked body 2 exists is the other end direction, and the direction in which the stacked body 2 does not exist is the one end direction. The fixed part 52 is arranged in the other end part direction than the first contact part 51. Therefore, the pressurizing member 5 presses the stacked body 2 in the direction of the other end by the first contact portion 51 in a state in which a tensile load in the direction of one end is applied to the fixed portion 52.

  Next, the effect of Example 1 is demonstrated.

  In the first embodiment, the first contact portion 51 of the pressurizing member 5 is in contact with the cooling pipe 31 at the end in the stacking direction of the stacked body 2 where the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are arranged, and the refrigerant It arrange | positions so that it may be located between the introduction pipe | tube 33 and the refrigerant | coolant discharge pipe 34. FIG. Further, the fixing portion 52 of the pressurizing member 5 is inserted and fixed in the insertion hole 441 of the boss 44 formed in the side wall portion 42 adjacent to the communication pipe 32. Therefore, according to the first embodiment, the pressing member 5 causes the first contact portion 51 to move the laminate 2 in the direction of the other end while the tensile load in the direction of one end is applied to the fixed portion 52. Can be pressed. Therefore, pressurization for pressurizing the laminate 2 in the direction of one end where the laminate 2 does not exist, with one end in the laminate direction of the laminate 2 including the semiconductor modules 16A and 16B and the cooler 3 as a reference. Compared with a configuration in which a fixing member that fixes the member 5 to the container 4 is disposed, the total length of the stacked body 2 in the stacking direction can be reduced.

  The pressurizing member 5 is formed of a linear elastic member, and a second contact that contacts the cooling pipe 31 from one main surface side of the laminate 2 between the fixed portion 52 and the first contact portion 51. A portion 53 is formed. Therefore, the seismic performance with respect to the main surface direction of the laminated body 2 can be improved as compared with the configuration in which the pressing member 5 does not have a portion that contacts the main surface side of the laminated body 2.

  Further, the first abutment portion 51 is bent at a right angle from one end portion in the short direction of the cooling pipe 31 to the other end portion at a substantially intermediate position between the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34. Also, a U-shaped folded shape that is bent at a right angle from the other end to the one end is provided. Therefore, the contact area between the first contact portion 51 and the end portion of the stacked body 2 can be increased as compared with a configuration in which the contact portion 51 does not have a folded shape. The applied load of the pressing member 5 can be dispersed.

  As mentioned above, although the preferable Example of this invention was described, this invention is not limited to the said Example, As long as it exists in the technical scope of this invention, you may deform | transform as follows.

  -In the said Example, although the container 4 is formed with aluminum, you may form from members with high heat conductivity, such as iron and copper.

  -In the said Example, although the pressurization member 5 is comprised by the linear elastic member, you may use a flat plate-shaped or polygonal elastic member.

  In the above embodiment, the boss 44 is the side wall 42 adjacent to the third semiconductor module 16B from the end of the stacked body 2 in which the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are arranged to the other end. However, it may be formed at any position as long as the side wall portion 42 is located in a direction perpendicular to the lamination direction of the laminate 2 and perpendicular to the normal direction of the main surface of the laminate 2.

  In the above embodiment, the semiconductor modules 16A and 16B are 1 in 1 type. However, the 2 in 1 type in which two switching elements are housed in one package, and the 3 in 1 type in which three switching elements are housed in one package. 6-in-1 type in which six switching elements are housed in one package may be used.

  In the above embodiment, the boss 44 is formed so as to protrude in the outer direction of the container 4, but the boss 44 may be formed so as to protrude in the inner direction of the container 4.

  In the above embodiment, the insertion hole 441 is formed in the boss 44, but an insertion hole penetrating from one main surface of the laminate 2 to the other main surface direction may be formed. Then, after the fixing portion 52 is inserted into the insertion hole of the boss 44, the fixing portion 52 is joined to the insertion hole 441 of the boss 44 by brazing and joining the end portion of the fixing portion 52 on the side opposite to the second contact portion 53. It may be fixed. Alternatively, bonding may be performed by bonding with an adhesive, screwing, TIG welding, MIG welding, laser welding or electron beam welding, or fitting by fitting means formed on the fixing portion 52 and the boss 44.

  -In the said Example, the 1st contact part 51 follows the other edge part from one edge part of the transversal direction of the cooling pipe 31 in the substantially intermediate position of the refrigerant | coolant introduction pipe | tube 33 and the refrigerant | coolant discharge pipe 34. Although it is provided with a folded shape that bends at right angles to each other and bends at right angles from the other end portion to one end portion, it may be bent at an acute angle or an obtuse angle.

  In the above embodiment, the first contact portion 51 has a folded shape at one place, but a plurality of folded shapes may be formed. Further, the first contact portion 51 may not be provided with a folded shape, and may be disposed along one end portion in the short direction of the cooling pipe 31 from the refrigerant introduction pipe 33 to the refrigerant discharge pipe 34. Moreover, you may arrange | position between the one edge part of the transversal direction of the cooling pipe 31, and the other edge part from the refrigerant | coolant inlet pipe 33 to the refrigerant | coolant discharge pipe 34. FIG.

  -In the said Example, although the contact part 51 of the pressurization member 5 is provided with the return | turnback shape along the cooling pipe 31 of the edge part of the lamination direction of the laminated body 2, as shown in FIG. A plate-like member 55 covering the cooling pipe 31 is arranged from one end in the short direction of the cooling pipe 31 to the other end at a substantially intermediate position between the pipe 33 and the refrigerant discharge pipe 34, and the laminate 2 is laminated. You may pressurize in the direction. By comprising in this way, the contact area of the 1st contact part 51 and the cooling pipe 31 of the edge part of the laminated body 2 can be enlarged compared with the shape which bends a linear elastic member. Therefore, the load of the pressure member 5 applied to the cooling pipe 31 at the end of the laminate 2 can be dispersed.

  -In the said Example, although the boss | hub 44 is formed in the side wall part 42, as shown in FIG. 5, the edge part of the lamination direction of the laminated body 2 in which the refrigerant | coolant introduction pipe | tube 33 and the refrigerant | coolant discharge pipe 34 are not arrange | positioned. You may form the boss | hub 44 which protrudes with respect to the outer side of the container 4 in the opposing wall part 41 which opposes.

  In the above embodiment, the refrigerant introduction pipe 33 and the refrigerant discharge pipe 34 are arranged at one end in the lamination direction of the laminate 2, but the refrigerant introduction pipe 33 is connected to the laminate 2 as shown in FIG. 6. The refrigerant discharge pipe 34 may be disposed at one end portion in the stacking direction and the other end portion in the stacking direction of the stacked body 2.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Laminate body 16A, 16B Semiconductor module 31 Cooling pipe 32 Communication pipe 33 Refrigerant introduction pipe 34 Refrigerant discharge pipe 4 Container 41 Opposite wall part 42 Side wall part 44 Boss 441 Insertion hole 5 Pressure member 51 1st contact Part 511 First line part 512 Second line part 513 Central line part 514 First connection line part 515 Second connection line part 52 Fixed part 53 Second contact part 54 Bending part 55 Bending part

Claims (4)

A laminate (2) formed by laminating a semiconductor module (16A, 16B) containing a semiconductor element and a cooler (3) for cooling the semiconductor module (16A, 16B);
A power converter (1) comprising a container (4) for housing the laminate (2),
A pressure member (5) that pressurizes the laminated body (2) in the laminating direction is disposed at one end of the laminated body (2) in the laminating direction,
The pressure member (5) includes a first abutting portion (51) that abuts one end of the laminated body (2) in the laminating direction, and the pressure member (5) includes the container (4). A fixing portion (52) for fixing to
Based on one end in the stacking direction of the laminate (2), the direction in which the laminate (2) is present is the other end, and the direction in which the laminate (2) is not present is the one end. When the direction
The fixed portion (52) is disposed in the other end direction than the first contact portion (51),
The pressurizing member (5) is configured such that the laminate (2) is moved to the other side by the first contact portion (51) in a state where a tensile load in one end direction is applied to the fixed portion (52). Press in the end direction,
The container (4) has a pair of opposing wall portions (41) positioned in the stacking direction of the laminate (2) when the laminate (2) is accommodated in the container (4); A pair of side wall portions (42) formed at an end of the opposing wall portion (41) and positioned in a direction orthogonal to the stacking direction of the stacked body (2),
A connection part for fixing the fixing part (52) is formed on the side wall part (42),
The power converter device (1) characterized by these. A laminate (2) formed by laminating a semiconductor module (16A, 16B) containing a semiconductor element and a cooler (3) for cooling the semiconductor module (16A, 16B);
A power converter (1) comprising a container (4) for housing the laminate (2),
A pressure member (5) that pressurizes the laminated body (2) in the laminating direction is disposed at one end of the laminated body (2) in the laminating direction,
The pressure member (5) includes a first abutting portion (51) that abuts one end of the laminated body (2) in the laminating direction, and the pressure member (5) includes the container (4). A fixing portion (52) for fixing to
Based on one end in the stacking direction of the laminate (2), the direction in which the laminate (2) is present is the other end, and the direction in which the laminate (2) is not present is the one end. When the direction
The fixed portion (52) is disposed in the other end direction than the first contact portion (51),
The pressurizing member (5) is configured such that the laminate (2) is moved to the other side by the first contact portion (51) in a state where a tensile load in one end direction is applied to the fixed portion (52). Press in the end direction,
The cooler (3) includes a refrigerant introduction pipe (33) for introducing a cooling medium into the laminate (2), and a refrigerant discharge pipe (34) for discharging the cooling medium from the laminate (2),
The refrigerant introduction pipe (33) and the refrigerant discharge pipe (34) are arranged at one end in the lamination direction of the laminate (2),
The first contact portion (51) is disposed between the refrigerant introduction pipe (33) and the refrigerant discharge pipe (34);
The power converter device (1) characterized by these. A laminate (2) formed by laminating a semiconductor module (16A, 16B) containing a semiconductor element and a cooler (3) for cooling the semiconductor module (16A, 16B);
A power converter (1) comprising a container (4) for housing the laminate (2),
A pressure member (5) that pressurizes the laminated body (2) in the laminating direction is disposed at one end of the laminated body (2) in the laminating direction,
The pressure member (5) includes a first abutting portion (51) that abuts one end of the laminated body (2) in the laminating direction, and the pressure member (5) includes the container (4). A fixing portion (52) for fixing to
Based on one end in the stacking direction of the laminate (2), the direction in which the laminate (2) is present is the other end, and the direction in which the laminate (2) is not present is the one end. When the direction
The fixed portion (52) is disposed in the other end direction than the first contact portion (51),
The pressurizing member (5) is configured such that the laminate (2) is moved to the other side by the first contact portion (51) in a state where a tensile load in one end direction is applied to the fixed portion (52). Press in the end direction,
The pressure member (5) is formed of a linear elastic member,
The fixing part (52) is formed at both ends of the pressure member (5), the first contact part (51) is formed at the center part of the pressure member (5), and the second contact part ( 53) is formed between the first contact part (51) and the fixing part (52),
When two opposing surfaces having the largest area of the laminate (2) are the main surfaces,
The second contact portion (53) is in contact with the main surface of the laminate (2);
The power converter device (1) characterized by these. A laminate (2) formed by laminating a semiconductor module (16A, 16B) containing a semiconductor element and a cooler (3) for cooling the semiconductor module (16A, 16B);
A power converter (1) comprising a container (4) for housing the laminate (2),
A pressure member (5) that pressurizes the laminated body (2) in the laminating direction is disposed at one end of the laminated body (2) in the laminating direction,
The pressure member (5) includes a first abutting portion (51) that abuts one end of the laminated body (2) in the laminating direction, and the pressure member (5) includes the container (4). A fixing portion (52) for fixing to
Based on one end in the stacking direction of the laminate (2), the direction in which the laminate (2) is present is the other end, and the direction in which the laminate (2) is not present is the one end. When the direction
The fixed portion (52) is disposed in the other end direction than the first contact portion (51),
The pressurizing member (5) is configured such that the laminate (2) is moved to the other side by the first contact portion (51) in a state where a tensile load in one end direction is applied to the fixed portion (52). Press in the end direction,
The first contact portion (51) has a folded shape along the end of the laminate (2) with which the first contact portion (51) contacts.
The two opposite surfaces having the largest area of the laminate (2) are the main surfaces, and one end of the laminate (2) in which the pressure member (5) is disposed, One end portion in the normal direction of the main surface of the laminate (2) is one end portion in the short direction of the laminate (2), and the laminate (2) in which the pressure member (5) is disposed. When one end in the stacking direction and the other end in the normal direction of the main surface of the stack (2) is the other end in the short direction of the stack (2),
The first contact portion (51) is a first line portion (511) disposed along one end portion in the short direction of the laminate (2),
It connects with the said 1st along-line part (511), and is arrange | positioned toward the other edge part direction of the transversal direction of the said laminated body (2) from one edge part of the transversal direction of the said laminated body (2). A first connecting line portion (514),
A central line portion (513) connected to the first connection line portion (514) and disposed along the other end portion in the short direction of the laminate (2);
It connects with the said center line part (513), and is arrange | positioned toward the one edge part direction of the transversal direction of the said laminated body (2) from the other end part of the transversal direction of the said laminated body (2). A second connecting line portion (51 5 );
A second line portion (512) connected to the second connection line portion (51 5 ) and disposed along one end portion in the short direction of the laminate (2);
The power converter device (1) characterized by these.

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