JP5738600B2 - 緩衝層蒸着のための加熱 - Google Patents
緩衝層蒸着のための加熱 Download PDFInfo
- Publication number
- JP5738600B2 JP5738600B2 JP2010549667A JP2010549667A JP5738600B2 JP 5738600 B2 JP5738600 B2 JP 5738600B2 JP 2010549667 A JP2010549667 A JP 2010549667A JP 2010549667 A JP2010549667 A JP 2010549667A JP 5738600 B2 JP5738600 B2 JP 5738600B2
- Authority
- JP
- Japan
- Prior art keywords
- web
- solution
- temperature
- thin film
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 100
- 230000008021 deposition Effects 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims description 68
- 150000004770 chalcogenides Chemical class 0.000 claims description 58
- 239000010409 thin film Substances 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 38
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 230000007246 mechanism Effects 0.000 claims description 30
- 229910052798 chalcogen Inorganic materials 0.000 claims description 26
- 150000001787 chalcogens Chemical class 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 20
- 238000012546 transfer Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052793 cadmium Inorganic materials 0.000 claims description 8
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052717 sulfur Inorganic materials 0.000 claims description 8
- 239000011593 sulfur Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 7
- 229910052753 mercury Inorganic materials 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052711 selenium Inorganic materials 0.000 claims description 6
- 239000011669 selenium Substances 0.000 claims description 6
- 229910052714 tellurium Inorganic materials 0.000 claims description 6
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 230000004044 response Effects 0.000 claims description 5
- 229910052716 thallium Inorganic materials 0.000 claims description 5
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 5
- 239000010408 film Substances 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims 8
- 239000012266 salt solution Substances 0.000 claims 2
- 230000007723 transport mechanism Effects 0.000 claims 1
- 239000000376 reactant Substances 0.000 description 41
- 238000000151 deposition Methods 0.000 description 31
- 238000005755 formation reaction Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 6
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 5
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000000908 ammonium hydroxide Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- KNYGDGOJGQXAMH-UHFFFAOYSA-N aluminum copper indium(3+) selenium(2-) Chemical compound [Al+3].[Cu++].[Se--].[Se--].[In+3] KNYGDGOJGQXAMH-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- -1 chalcogen ion Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000005328 architectural glass Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 1
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000013404 process transfer Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- NWJUKFMMXJODIL-UHFFFAOYSA-N zinc cadmium(2+) selenium(2-) Chemical compound [Zn+2].[Se-2].[Se-2].[Cd+2] NWJUKFMMXJODIL-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- UQMZPFKLYHOJDL-UHFFFAOYSA-N zinc;cadmium(2+);disulfide Chemical compound [S-2].[S-2].[Zn+2].[Cd+2] UQMZPFKLYHOJDL-UHFFFAOYSA-N 0.000 description 1
- UMJICYDOGPFMOB-UHFFFAOYSA-N zinc;cadmium(2+);oxygen(2-) Chemical compound [O-2].[O-2].[Zn+2].[Cd+2] UMJICYDOGPFMOB-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Description
本出願は、米国特許法第119条ならびに適用外国法および国内法に基づき、参照により全体が本明細書に組み込まれている、2008年3月5日に出願された米国仮特許出願第61/068,451号の優先権を主張する。
フレキシブルな薄膜PVセルの製造は、ロールツーロール法によって行うことができる。硬質基板と比較すると、薄いフレキシブル基板のロールツーロール加工では、コンパクトで安価な真空システムを使用することができ、また他の薄膜業界向けにすでに開発されている専用でないいくつかの機器を利用できる。フレキシブル基板材料は、本質的に、ガラスに比べて熱容量が低いため、温度を上げるのに必要なエネルギー量が少なくてすむ。これらは、急速な加熱および冷却に、また大きな温度勾配に対して比較的高い耐性も呈示し、その結果、加工中の破砕もしくは故障が発生する可能性は低い。それに加えて、活性のPV材料がフレキシブル基板材料上に蒸着された後、その結果得られる未積層のセルまたはセルのストリングを別の設備へと輸送し、そこで、積層および/または組み立てを行ってフレキシブルな、または硬質の太陽電池モジュールを形成することができる。この戦略的オプションは、輸送コストを低減するだけでなく(ガラスに対して軽量フレキシブルな基板)、世界中でPVモジュールの仕上げおよび販売を行うためにパートナービジネスを確立することができる。
この節では、基板材料のウェブを蒸着領域に通して移送し、蒸着領域を実質的に均一に加熱してウェブの所望の領域内にある薄膜緩衝および/または窓層の化学成分を含むさまざまな反応物質溶液の間の化学反応を促進するための方法および装置について説明する。
12 上面
14 底面
16 リーディングエッジ
18 トレーリングエッジ
30 装置
32 ウェブ
34 蒸着領域
36 反応物質溶液
40 移送機構
42 移送ローラー
44 溶液分注装置
45 供給容器
46 ウェブ加熱機構
47 ポリマー薄膜のシート
47 ポリマー薄膜溶液散布器
48 個別加熱装置ブロック
50 測定デバイス
52 溶液予熱器
54 プロセッサ
Claims (18)
- フレキシブル基板上に薄膜カルコゲニド緩衝層を成膜する方法であって、
成膜領域を通して薄膜基板材料のウェブを移送させるステップと、
平均のウェブ温度を維持するために、少なくとも1つが前記カルコゲニド緩衝層の放射率に実質的に類似する放射率を有するコーティングを含む複数の加熱装置ブロックから放出される赤外線を前記ウェブに照射して、前記ウェブを実質的に非伝導的に加熱するステップと、
銅、銀、金、亜鉛、カドミウム、水銀、鉛、ホウ素、アルミニウム、ガリウム、インジウム、およびタリウムからなる群から選択された金属を含む第1の溶液を前記ウェブの上面上に分注するステップと、
酸素、硫黄、セレン、およびテルルからなる群から選択されたカルコゲンを含む第2の溶液を前記ウェブの前記上面上に分注するステップと、
前記金属と前記カルコゲンとの結合を通じて形成された薄膜の少なくとも1つの特性を測定するステップと、
前記少なくとも1つの測定された特性に応じて前記平均のウェブ温度を調節するステップと、を含む方法。 - フレキシブル基板上に薄膜カルコゲニド緩衝層を成膜する方法であって、
成膜領域を通して薄膜基板材料のウェブを移送させるステップと、
平均のウェブ温度を維持するために、少なくとも1つが前記カルコゲニド緩衝層の放射率に実質的に類似する放射率を有するコーティングを含む複数の加熱装置ブロックから放出される赤外線を前記ウェブに照射して、前記ウェブを実質的に非伝導的に加熱するステップと、
銅、銀、金、亜鉛、カドミウム、水銀、鉛、ホウ素、アルミニウム、ガリウム、インジウム、およびタリウムからなる群から選択された金属を含む第1の溶液を前記ウェブの上面上に分注するステップと、
酸素、硫黄、セレン、およびテルルからなる群から選択されたカルコゲンを含む第2の溶液を前記ウェブの前記上面上に分注するステップと、
前記金属と前記カルコゲンの反応速度を測定するステップと、前記測定された反応速度に応じて前記平均のウェブ温度を調節するステップと、を含む方法。 - 前記第1の溶液を前記ウェブ上に分注する前に、前記平均のウェブ温度より高い温度まで前記第1の溶液を予熱するステップをさらに含む請求項1または2に記載の方法。
- 前記加熱装置ブロックのうちの少なくとも1つは、カルコゲニドの成膜を抑止するように構成されたコーティングを含む請求項1または2に記載の方法。
- 前記加熱装置ブロックのうちの少なくとも1つは、取り外し可能な蓋を備える請求項1または2に記載の方法。
- 前記ウェブを移送させるステップは、複数の同期された移送ローラー上に前記ウェブを通すステップを含み、それぞれの加熱装置ブロックは、一対の移送ローラーの間に配設されている請求項1または2に記載の方法。
- 前記ウェブを加熱するステップは、複数の熱源の上に前記ウェブを通すステップを含み、それぞれの熱源は独立制御可能な温度を有し、前記平均のウェブ温度を調節するステップは、前記熱源のうちの少なくとも1つの前記温度を調節するステップを含む請求項1に記載の方法。
- 前記少なくとも1つの特性は、前記薄膜の厚さである請求項1に記載の方法。
- 前記少なくとも1つの特性は、前記薄膜の均一さである請求項1に記載の方法。
- フレキシブル基板上に薄膜カルコゲニド緩衝層を成膜するための装置であって、
成膜領域を通して長手方向に基板材料の連続的なフレキシブルのウェブを搬送するための移送機構と、
前記成膜領域内で、(i)銅、銀、金、亜鉛、カドミウム、水銀、鉛、ホウ素、アルミニウム、ガリウム、インジウム、およびタリウムからなる群から選択された金属を含む金属塩溶液、ならびに(ii)酸素、硫黄、セレン、およびテルルからなる群から選択されたカルコゲンを含むカルコゲン溶液を前記ウェブ上に分注するように構成された少なくとも1つの分注装置と、
前記ウェブと物理的に接触しないように配設され、平均のウェブ温度を維持するために、少なくとも1つが前記カルコゲニド緩衝層の放射率に実質的に類似する放射率を有するコーティングを含み、赤外線を前記ウェブに照射して前記ウェブを加熱するように構成されている、加熱機構と、
前記ウェブ上に形成された薄膜緩衝層の少なくとも1つの特性を測定するための測定デバイスと、を備えている装置。 - 前記少なくとも1つの分注装置は、前記成膜領域内で第1の長手方向位置に前記金属塩溶液を分注するように構成された第1の分注装置と、前記成膜領域内で第2の長手方向位置に前記カルコゲン溶液を分注するように構成された第2の分注装置と、を備えている請求項10に記載の装置。
- 前記加熱機構は、前記ウェブの下に配設されている複数の加熱装置ブロックを備えている請求項10に記載の装置。
- 前記移送機構は、複数の移送ローラーを備えており、前記加熱装置ブロックおよび移送ローラーは、交互構成で前記ウェブの下の長手方向に配設されている請求項12に記載の装置。
- 前記加熱装置ブロックのそれぞれは、独立制御可能な温度を有する請求項12に記載の装置。
- 前記加熱機構は、前記ウェブの上に配設されている複数の加熱装置ブロックを備えている請求項10に記載の装置。
- 前記加熱装置ブロックのそれぞれは、独立制御可能な温度を有する請求項15に記載の装置。
- 前記測定デバイスは、前記ウェブの表面から画像データを取り込むように構成されたカメラを備えている請求項10に記載の装置。
- 前記カメラによって取り込まれた前記画像データから前記薄膜緩衝層の厚さを決定し、前記測定された厚さに基づいて前記加熱機構の少なくとも一部によって供給される熱を制御するように構成されたプロセッサをさらに備えている請求項17に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6845108P | 2008-03-05 | 2008-03-05 | |
US61/068,451 | 2008-03-05 | ||
PCT/US2009/001427 WO2009111052A1 (en) | 2008-03-05 | 2009-03-04 | Heating for buffer layer deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011513992A JP2011513992A (ja) | 2011-04-28 |
JP5738600B2 true JP5738600B2 (ja) | 2015-06-24 |
Family
ID=41056316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010549667A Expired - Fee Related JP5738600B2 (ja) | 2008-03-05 | 2009-03-04 | 緩衝層蒸着のための加熱 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8277869B2 (ja) |
JP (1) | JP5738600B2 (ja) |
DE (1) | DE112009000532T5 (ja) |
WO (1) | WO2009111052A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2257970A4 (en) | 2008-03-05 | 2015-09-02 | Hanergy Hi Tech Power Hk Ltd | BUFFER LAYER DEPOSITION FOR THIN FILM SOLAR CELLS |
US9252318B2 (en) | 2008-03-05 | 2016-02-02 | Hanergy Hi-Tech Power (Hk) Limited | Solution containment during buffer layer deposition |
US20100087015A1 (en) | 2008-03-05 | 2010-04-08 | Global Solar Energy, Inc. | Feedback for buffer layer deposition |
JP2011091229A (ja) * | 2009-10-23 | 2011-05-06 | Kyocera Corp | 光電変換体の製造方法および光電変換装置の製造方法 |
WO2012103551A1 (en) * | 2011-01-28 | 2012-08-02 | Greentech Solutions, Inc. | Heating layers containing volatile components at elevated temperatures |
WO2014196311A1 (ja) * | 2013-06-03 | 2014-12-11 | 東京応化工業株式会社 | 錯体およびその溶液の製造方法、太陽電池用光吸収層の製造方法および太陽電池の製造方法 |
CN105980067B (zh) * | 2013-12-16 | 2018-08-28 | 环球太阳能公司 | 在缓冲层沉积期间的溶液遏制 |
EP3084038B1 (en) | 2013-12-20 | 2018-05-23 | Nuvosun, Inc. | Web based chemical bath deposition apparatus |
US20190301022A1 (en) * | 2018-04-03 | 2019-10-03 | Global Solar Energy, Inc. | Systems and methods for depositing a thin film onto a flexible substrate |
CN109358041B (zh) * | 2018-09-19 | 2024-04-30 | 信阳师范学院 | 一种硫化镉薄膜比色装置及制备硫化镉薄膜的方法 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE621339A (ja) * | 1961-08-30 | 1900-01-01 | ||
EP0002109B1 (en) * | 1977-11-15 | 1981-12-02 | Imperial Chemical Industries Plc | A method for the preparation of thin photoconductive films and of solar cells employing said thin photoconductive films |
US4143235A (en) * | 1977-12-30 | 1979-03-06 | Chevron Research Company | Cadmium sulfide photovoltaic cell and method of fabrication |
US4673801A (en) * | 1979-08-17 | 1987-06-16 | Raychem Corporation | PTC heater assembly |
IT1163710B (it) * | 1979-09-10 | 1987-04-08 | Anic Spa | Celle fotovoltaiche |
US4778478A (en) * | 1981-11-16 | 1988-10-18 | University Of Delaware | Method of making thin film photovoltaic solar cell |
US4642140A (en) * | 1985-04-30 | 1987-02-10 | The United States Of America As Represented By The United States Department Of Energy | Process for producing chalcogenide semiconductors |
US5112410A (en) * | 1989-06-27 | 1992-05-12 | The Boeing Company | Cadmium zinc sulfide by solution growth |
US5501744A (en) * | 1992-01-13 | 1996-03-26 | Photon Energy, Inc. | Photovoltaic cell having a p-type polycrystalline layer with large crystals |
JPH07133102A (ja) * | 1993-11-04 | 1995-05-23 | Asahi Chem Ind Co Ltd | 金属カルコゲナイド膜の製造方法 |
US6109912A (en) * | 1993-12-06 | 2000-08-29 | International Thermal Investments Ltd. | Fuel vaporizer |
JP4074672B2 (ja) * | 1995-08-22 | 2008-04-09 | 富士電機ホールディングス株式会社 | スパッタリング方法 |
JP3332700B2 (ja) * | 1995-12-22 | 2002-10-07 | キヤノン株式会社 | 堆積膜形成方法及び堆積膜形成装置 |
JP3413072B2 (ja) * | 1997-09-08 | 2003-06-03 | キヤノン株式会社 | 酸化亜鉛薄膜の製造方法 |
US6268014B1 (en) * | 1997-10-02 | 2001-07-31 | Chris Eberspacher | Method for forming solar cell materials from particulars |
US6617671B1 (en) * | 1999-06-10 | 2003-09-09 | Micron Technology, Inc. | High density stackable and flexible substrate-based semiconductor device modules |
US6281098B1 (en) * | 1999-06-15 | 2001-08-28 | Midwest Research Institute | Process for Polycrystalline film silicon growth |
US6428851B1 (en) * | 2000-03-01 | 2002-08-06 | Bethlehem Steel Corporation | Method for continuous thermal deposition of a coating on a substrate |
US6310281B1 (en) * | 2000-03-16 | 2001-10-30 | Global Solar Energy, Inc. | Thin-film, flexible photovoltaic module |
US7194197B1 (en) * | 2000-03-16 | 2007-03-20 | Global Solar Energy, Inc. | Nozzle-based, vapor-phase, plume delivery structure for use in production of thin-film deposition layer |
EP1215048B1 (en) * | 2000-12-15 | 2007-06-06 | Samsung Electronics Co. Ltd. | Bubble-jet type ink-jet printhead and manufacturing method thereof |
US6537845B1 (en) * | 2001-08-30 | 2003-03-25 | Mccandless Brian E. | Chemical surface deposition of ultra-thin semiconductors |
US20030059526A1 (en) * | 2001-09-12 | 2003-03-27 | Benson Martin H. | Apparatus and method for the design and manufacture of patterned multilayer thin films and devices on fibrous or ribbon-like substrates |
JP4240933B2 (ja) * | 2002-07-18 | 2009-03-18 | キヤノン株式会社 | 積層体形成方法 |
WO2004073021A2 (en) * | 2003-01-31 | 2004-08-26 | Arizona Board Of Regents, Acting For And On Behalf Of, Arizona State University | Preparation of metal chalcogenides from reactions of metal compounds and chalcogen |
CN100490205C (zh) * | 2003-07-10 | 2009-05-20 | 国际商业机器公司 | 淀积金属硫族化物膜的方法和制备场效应晶体管的方法 |
JP2005086168A (ja) * | 2003-09-11 | 2005-03-31 | Matsushita Electric Ind Co Ltd | 太陽電池の製造方法および製造装置 |
WO2005036607A2 (en) * | 2003-10-08 | 2005-04-21 | Deposition Sciences, Inc. | System and method for feedforward control in thin film coating processes |
US20070169809A1 (en) * | 2004-02-19 | 2007-07-26 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of low-melting chalcogenides |
US7306823B2 (en) * | 2004-09-18 | 2007-12-11 | Nanosolar, Inc. | Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells |
US7663057B2 (en) * | 2004-02-19 | 2010-02-16 | Nanosolar, Inc. | Solution-based fabrication of photovoltaic cell |
SE0400582D0 (sv) * | 2004-03-05 | 2004-03-05 | Forskarpatent I Uppsala Ab | Method for in-line process control of the CIGS process |
WO2005109486A1 (en) * | 2004-05-12 | 2005-11-17 | Viatron Technologies Inc. | System for heat treatment of semiconductor device |
US7606697B2 (en) * | 2004-06-01 | 2009-10-20 | Quickturn Design Systems, Inc. | System and method for resolving artifacts in differential signals |
JP2008504845A (ja) * | 2004-06-07 | 2008-02-21 | バイオプロセッサーズ コーポレイション | リアクター環境条件の制御 |
JP2006032811A (ja) * | 2004-07-21 | 2006-02-02 | Fuji Electric Holdings Co Ltd | 太陽電池素子・太陽電池モジュールの製造方法、および太陽電池モジュール |
US7465352B2 (en) * | 2004-07-23 | 2008-12-16 | University Of Florida Research Foundation, Inc. | One-pot synthesis of high-quality metal chalcogenide nanocrystals without precursor injection |
US7674713B2 (en) * | 2004-08-18 | 2010-03-09 | Calyxo Gmbh | Atmospheric pressure chemical vapor deposition |
JP2008520101A (ja) * | 2004-11-10 | 2008-06-12 | デイスター テクノロジーズ,インコーポレイティド | Cigsにおいて現場接合層を作製するための熱プロセス |
JP2006344741A (ja) * | 2005-06-08 | 2006-12-21 | Sharp Corp | 有機太陽電池とその製造方法 |
JP2009528680A (ja) * | 2006-02-23 | 2009-08-06 | デューレン、イェルーン カー.イェー. ファン | カルコゲン層の高スループット印刷および金属間化合物材料の使用 |
WO2007121383A2 (en) * | 2006-04-13 | 2007-10-25 | Solopower, Inc. | Method and apparatus to form thin layers of materials on a base |
WO2007146964A2 (en) * | 2006-06-12 | 2007-12-21 | Robinson Matthew R | Thin-film devices fromed from solid particles |
US7670584B2 (en) * | 2007-06-01 | 2010-03-02 | International Business Machines Corporation | Inorganic metal chalcogen cluster precursors and methods for forming colloidal metal chalcogenide nanoparticles using the same |
EP2200790A1 (en) * | 2007-08-31 | 2010-06-30 | Applied Materials, Inc. | Production line module for forming multiple sized photovoltaic devices |
-
2009
- 2009-03-04 WO PCT/US2009/001427 patent/WO2009111052A1/en active Application Filing
- 2009-03-04 JP JP2010549667A patent/JP5738600B2/ja not_active Expired - Fee Related
- 2009-03-04 DE DE112009000532T patent/DE112009000532T5/de not_active Ceased
- 2009-03-04 US US12/397,873 patent/US8277869B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100086673A1 (en) | 2010-04-08 |
DE112009000532T5 (de) | 2011-03-10 |
WO2009111052A1 (en) | 2009-09-11 |
US8277869B2 (en) | 2012-10-02 |
JP2011513992A (ja) | 2011-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5738600B2 (ja) | 緩衝層蒸着のための加熱 | |
JP5738601B2 (ja) | 薄膜太陽電池セルのための緩衝層蒸着 | |
JP5908513B2 (ja) | 薄膜太陽電池セルを製造するための装置および方法 | |
US9640705B2 (en) | Feedback for buffer layer deposition | |
US8609182B2 (en) | Solution containment during buffer layer deposition | |
US20070243657A1 (en) | Method and Apparatus to Form Thin Layers of Materials on a Base | |
CN102844838A (zh) | 辊到辊蒸发系统和制造ibiiiavia族光电装置的方法 | |
CN104169459B (zh) | 在柔性衬底上形成光伏电池的系统 | |
US20100186812A1 (en) | Photovoltaic devices including copper indium gallium selenide | |
US9252318B2 (en) | Solution containment during buffer layer deposition | |
KR101093677B1 (ko) | 평탄 기판의 표면 개질 방법 및 장치 | |
WO2015092543A2 (en) | Solution containment during buffer layer deposition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120229 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130612 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130618 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130906 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130913 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140526 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20140613 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140808 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141208 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150122 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150323 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150422 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5738600 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |