JP5727433B2 - 超短パルスレーザでの透明材料処理 - Google Patents

超短パルスレーザでの透明材料処理 Download PDF

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JP5727433B2
JP5727433B2 JP2012194091A JP2012194091A JP5727433B2 JP 5727433 B2 JP5727433 B2 JP 5727433B2 JP 2012194091 A JP2012194091 A JP 2012194091A JP 2012194091 A JP2012194091 A JP 2012194091A JP 5727433 B2 JP5727433 B2 JP 5727433B2
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laser
pulse
welding
ridge
materials
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JP2013031879A (ja
JP2013031879A5 (https=
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マイケル ボヴァツェック ジェームズ
マイケル ボヴァツェック ジェームズ
ワイ． アライ アラン
ワイ． アライ アラン
ヨシノ フミヨ
ヨシノ フミヨ
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イムラ アメリカ インコーポレイテッド
イムラ アメリカ インコーポレイテッド
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  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2012194091A 2012-09-04 2012-09-04 超短パルスレーザでの透明材料処理 Active JP5727433B2 (ja)

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JP2012194091A JP5727433B2 (ja) 2012-09-04 2012-09-04 超短パルスレーザでの透明材料処理

Related Parent Applications (1)

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JP2006241654A Division JP5522881B2 (ja) 2006-09-06 2006-09-06 材料を接合するための方法

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JP2014258750A Division JP6005125B2 (ja) 2014-12-22 2014-12-22 超短パルスレーザでの透明材料処理

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JP2013031879A5 JP2013031879A5 (https=) 2013-06-27
JP5727433B2 true JP5727433B2 (ja) 2015-06-03

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EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP5836998B2 (ja) * 2013-04-23 2015-12-24 株式会社豊田中央研究所 クラックの生成方法、レーザによる割断方法およびクラック生成装置
JP6141715B2 (ja) * 2013-07-31 2017-06-07 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法
US9102007B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
JP6207306B2 (ja) * 2013-08-30 2017-10-04 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
JP6270520B2 (ja) * 2014-02-07 2018-01-31 株式会社ディスコ ウェーハの加工方法
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
DE102020134197A1 (de) * 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
CN117799173B (zh) * 2024-03-01 2024-06-14 珠海市申科谱工业科技有限公司 一种微型塑料件激光焊接系统以及焊接方法

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JP3530114B2 (ja) * 2000-07-11 2004-05-24 忠弘 大見 単結晶の切断方法
JP2004337902A (ja) * 2003-05-14 2004-12-02 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP4709482B2 (ja) * 2003-08-22 2011-06-22 一良 伊東 超短光パルスによる透明材料の接合方法、物質接合装置、接合物質
JP2005268752A (ja) * 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ
JP4631044B2 (ja) * 2004-05-26 2011-02-16 国立大学法人北海道大学 レーザ加工方法および装置
JP2006007619A (ja) * 2004-06-25 2006-01-12 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置
JP2006150385A (ja) * 2004-11-26 2006-06-15 Canon Inc レーザ割断方法

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