JP5723553B2 - Oxide superconducting wire manufacturing apparatus and oxide superconducting wire manufacturing method - Google Patents

Description

  The present invention relates to an oxide superconducting wire, an oxide superconducting wire manufacturing apparatus, and an oxide superconducting wire manufacturing method.

As an example, the oxide superconducting wire is manufactured by providing a thin film of a rare earth-based (Re123) superconductor such as an yttrium-based material on a tape-shaped metal substrate. As this kind of oxide superconducting wire, as shown in FIG. 13, a superconducting wire having a structure in which an inexpensive copper stabilization layer is provided on a silver stabilization layer via solder is known (for example, Patent Documents). 1). In this conventional superconducting wire 200, an intermediate layer 202, a cap layer 203, a superconducting layer 204, and a protective layer 205 are provided in this order on a substrate 201, and a metal stabilization layer 206 is provided on the surface of the protective layer 205. The whole is covered with an insulating film 210.
Here, for example, the stabilization layer 206 is made of a metal layer such as copper having good conductivity. For example, a soldered copper metal tape is bonded to the surface 205a of the protective layer 205 made of silver and soldered. It is formed with.

  Moreover, in the high-temperature superconducting wire described in Patent Document 2, two high-temperature superconducting wire parts are arranged in parallel with the stabilizing metal layer between the two stabilizing metal layers. The space between the high-temperature superconducting wire member and the two stabilized metal layers is filled with solder. In the high-temperature superconducting wire component, a high-temperature superconducting layer containing a high-temperature superconducting material such as Re123 is formed on a metal substrate via an intermediate layer.

Also in the structure described in Patent Document 3, two high temperature superconductor (HTS) inserts are arranged side by side perpendicular to the stabilizer strip between the two stabilizer strips that are conductive and formed in a plate shape. Has been proposed. The space between the two stabilizer strips is filled with a conductive and non-breathable filler material. The HTS insert is formed in a multilayer structure including a substrate, one or more buffer layers, an HTS layer, and a cap layer.
In the conductor described in Patent Document 4, a sheet is disposed around the superconducting composite ceramic tape. A sealing structure can be formed by welding the sheets together.

JP 2008-60074 A JP 2008-243588 A Special table 2009-503794 gazette Japanese Patent No. 3949960

The copper used as the stabilizing layer 206 is required to have a thickness of 20 μm to 150 μm in order to be used as a bypass for an accident current. Since plating is crystal growth using an electric field, the process takes time. In addition, since it is difficult to perform batch processing in order to plate a long material such as a superconducting wire, a plating bath larger than usual must be used. Further, since it is inevitable that the superconducting layer is damaged by moisture, it is necessary to devise measures such as preliminarily protecting the peripheral surface of the superconducting layer before being immersed in an aqueous solution such as a plating bath by a liquid phase process or the like.
There has also been proposed a method in which a wire containing a superconducting layer is directly put into a solder bath. However, in this method, solder is placed on the entire wire, and it is difficult to control the thickness of the wire. In addition, large power is required to maintain the solder bath, and unnecessary power is consumed when a copper sheet is bonded to each other, resulting in a large environmental load.

In the high-temperature superconducting wires and the like in Patent Documents 2 and 3, the high-temperature superconducting wire parts are arranged in the solder filled between the two plate-like members. It is difficult to arrange with high accuracy.
In the conductor described in Patent Document 4, since the sheet is disposed around the ceramic tape, the position of the end of the sheet with respect to the ceramic tape is not stable, and the conductor cannot be manufactured with high reproducibility.

  The present invention has been made in view of such problems, and can easily and accurately position the superconducting laminate relative to the protective wire while maintaining the airtightness of the superconducting laminate to the outside air. It is an object of the present invention to provide an oxide superconducting wire, an oxide superconducting wire manufacturing apparatus for manufacturing the oxide superconducting wire, and a method for manufacturing the oxide superconducting wire.

In order to solve the above problems, the present invention proposes the following means.
The method for producing an oxide superconducting wire according to the present invention includes a protective wire having a tape-shaped stabilization layer and a solder layer formed on the stabilization layer, and the protective wire having the solder layer on the inside. A tape-like superconducting laminate comprising a folding step of forming a bent body having a bent portion by bending the intermediate portion in the width direction of the metal, and a metal substrate, an intermediate layer, an oxide superconducting layer, and a protective layer laminated An accommodating step of accommodating the superconducting laminate inside the bent body along the inner surface of the bent body, and surrounding the superconducting laminate by the bent body, and the solder existing around the superconducting laminate And a fixing step of fixing the superconducting laminate by melting and solidifying the layer.

In the method for manufacturing an oxide superconducting wire according to the present invention, in the housing step, it is preferable that one side surface of the superconducting laminate is abutted against the inner surface of the bent portion.
In the method for manufacturing an oxide superconducting wire according to the present invention, in the bending step, the protective wire is bent so that both end portions in the width direction are aligned to form the bent body, and in the fixing step, the bent body is It is preferable to block between the both end portions with the solder layer.
In the method for manufacturing an oxide superconducting wire according to the present invention, the method includes a dividing step of dividing the superconducting laminate in the width direction before the accommodating step, and in the accommodating step, the superconducting laminate after the division is bent. It is preferable to follow the inner surface of the body.
In the method for manufacturing an oxide superconducting wire according to the present invention, in the housing step, after the division, the side surface on the divided side of the divided superconducting laminate is the bent portion side. It is preferable to arrange the superconducting laminate.

  The apparatus for manufacturing an oxide superconducting wire according to the present invention includes a protective wire having a tape-shaped stabilization layer and a solder layer formed on the stabilization layer, the protection layer having the solder layer on the inside. A tape-like structure comprising a bending mechanism for forming a bent body having a bent portion by bending the intermediate portion in the width direction of the wire, and a metal substrate, an intermediate layer, an oxide superconducting layer, and a protective layer. An accommodation mechanism for accommodating the superconducting laminate along the inner surface of the bent body and accommodating the superconducting laminate inside the bent body, and surrounding the superconducting laminate by the bent body and existing around the superconducting laminate And a fixing mechanism for fixing the superconducting laminate by melting and solidifying the solder layer.

  In the oxide superconducting wire manufacturing apparatus of the present invention, the tape-shaped superconducting laminate is wound and provided, the first reel device capable of feeding the superconducting laminate, and the tape-shaped protective wire is wound and provided. A second reel device capable of feeding the protective wire, a transport roller for guiding the fed superconducting laminate and the folded body so that the superconducting laminate is disposed inside the folded body, and A winding device that winds up the oxide superconducting wire formed by a fixing mechanism, and the bending mechanism has a bent support portion bent in an intermediate portion in a direction orthogonal to a feeding direction for feeding the bent body. A support base and a pressing member that can be moved toward and away from the inner surface of the bent support portion, and the storage mechanism includes the superconducting product. An extruding member that moves the body along the inner surface of the bent body, and the fixing mechanism includes a heating unit that heats the bent body and the superconducting laminate housed inside the bent body, and the superconducting member. It is preferable to have a pressure roller that presses the bent body against the laminate.

  The oxide superconducting wire of the present invention includes a tape-shaped superconducting laminate comprising a metal substrate, an intermediate layer, an oxide superconducting layer, and a protective layer, a tape-shaped stabilizing layer, and the stabilizing layer. A protective wire having a solder layer formed on the layer, and a bent body in which a bent portion is formed by bending the intermediate portion in the width direction of the protective wire so that the solder layer is inside. An oxide superconducting wire, characterized in that the superconducting laminate is connected to the stabilization layer by the solder layer in a state of being surrounded by the protective wire while being along the inner surface of the bent body. And

  In the oxide superconducting wire of the present invention, it is preferable that the bent body is formed with both end portions in the width direction aligned, and the end portions are closed by the solder layer.

According to the oxide superconducting wire manufacturing method and the oxide superconducting wire manufacturing apparatus of the present invention, the superconducting laminate is positioned along the inner surface of the bent body in which the bent portion is formed, and the superconducting laminate is positioned with respect to the bent body. To do. For this reason, it is possible to easily and accurately position the superconducting laminate. In a state where the superconducting laminate is surrounded by the bent body, the stabilization layer of the bent body can be hermetically connected to the outer peripheral surface of the superconducting laminate by the solder layer.
In the accommodating step, the superconducting laminate is abutted against the inner surface of the bent portion, so that the superconducting laminate can be reliably positioned with respect to the bent body.
Further, in the manufacturing method of the oxide superconducting wire, the bent body is bent so that both ends in the width direction are aligned in the bending process, and the both ends of the bent body are closed by the solder layer in the fixing process. Therefore, the superconducting laminate can be reliably kept airtight, and the outer shape of the manufactured oxide superconducting wire can be made compact.

A dividing step is provided before the accommodating step, and in the accommodating step, the divided superconducting laminate is aligned with the inner surface of the bent body, so that the width dimension is suitably adjusted even when the superconducting laminate is long in the width direction. be able to.
In the method for manufacturing an oxide superconducting wire, in the housing step, the superconducting laminate is arranged so that the side surface of the divided superconducting laminate is the bent portion side. Since the protective layer is not formed on the side surface on the divided side of the superconducting laminate, the side surface on the divided side of the superconducting laminate is arranged on the bent portion side to ensure the side surface on the divided side. Can be protected.
Since the oxide superconducting wire manufacturing apparatus includes the first reel device, the second reel device, the transport roller, and the winding device, the superconducting laminate, the protective wire, and the oxide superconducting wire can be easily transported and wound. Can do.

Further, according to the oxide superconducting wire of the present invention, the superconducting laminate is positioned with respect to the folded body by placing the superconducting laminate along the inner surface of the folded body. Since the superconducting laminate is surrounded by the bent body and connected to the stabilization layer of the folded body by the solder layer, the superconducting laminate can be sealed from the outside air.
The folded body is formed with both ends in the width direction aligned, and the gap between both ends is closed by a solder layer, so that the superconducting laminate is securely held airtight and the outer shape of the oxide superconducting wire is made compact. Can do.

It is a cross-sectional view of the oxide superconducting wire according to the first embodiment of the present invention. It is a perspective view of the superconducting laminated body of the oxide superconducting wire. It is a cross-sectional view showing an example of a protective wire. It is a block diagram which shows an example of the manufacturing apparatus of this invention which manufactures the oxide superconducting wire. It is a figure explaining an example of the bending mechanism of the manufacturing apparatus. It is a figure explaining an example of the accommodation mechanism of the manufacturing apparatus. It is a flowchart which shows the manufacturing method of the oxide superconducting wire of embodiment of this invention. It is a figure explaining the other example of the bending mechanism of the manufacturing apparatus which concerns on this invention. It is a figure which shows an example of the manufacturing method of the oxide superconducting wire which uses the manufacturing apparatus. It is a cross-sectional view of the oxide superconducting wire according to the second embodiment of the present invention. It is a figure which shows an example in the case of dividing | segmenting a superconducting laminated body in the manufacturing method of the oxide superconducting wire which concerns on this invention. It is a figure which shows the case where the superconducting laminated body is made into the narrow structure in the manufacturing method of the oxide superconducting wire which concerns on this invention. It is a perspective view of the conventional oxide superconducting wire.

(First embodiment)
Hereinafter, a first embodiment of an oxide superconducting wire according to the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of the oxide superconducting wire 1 according to the first embodiment of the present invention, and FIG. 2 is a perspective view of a superconducting laminate 10 constituting a part of the oxide superconducting wire 1.
As shown in FIG. 1, the oxide superconducting wire 1 includes a tape-shaped superconducting laminate 10 and a bent body 20 </ b> A attached so as to surround the outer peripheral surface of the superconducting laminate 10.

  As shown in FIG. 2, the superconducting laminate 10 of the present embodiment has a diffusion prevention layer 12, a bed layer 13, an intermediate layer 14, a cap layer 15, and an oxide superconducting layer 16 on a tape-like metal substrate 11. The protective layer 17 is laminated in this order.

The metal substrate 11 applicable to the superconducting laminate 10 of the present embodiment can be used as a substrate of a normal superconducting laminate, has only to have high strength and certain flexibility, and is a tape for making a long cable. It is preferably in the form of a heat-resistant metal. For example, various metal materials such as nickel alloys such as stainless steel and Hastelloy (registered trademark, trade name manufactured by Haynes, USA), or ceramics disposed on these various metal materials can be used. Among various heat resistant metals, nickel alloys are preferable.
Especially, if it is a commercial item, Hastelloy is suitable, and any kind of Hastelloy B, C, G, N, W, etc. which have different amounts of components such as molybdenum, chromium, iron and cobalt can be used as Hastelloy. . What is necessary is just to adjust the thickness of the metal base material 11 suitably according to the objective, and it is 10-500 micrometers normally.

The bed layer 13 has high heat resistance and is used for reducing interfacial reactivity, and is used for obtaining the orientation of a film disposed thereon. Such a bed layer 13 is arranged as necessary, and is made of, for example, yttria (Y ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ , also referred to as “alumina”), or the like. Composed. The bed layer 13 is formed by a film forming method such as sputtering, and has a thickness of 10 to 200 nm, for example.
In the present embodiment, the diffusion prevention layer 12 is interposed between the metal substrate 11 and the bed layer 13, but the diffusion prevention layer 12 is not an essential configuration. The diffusion prevention layer 12 is formed for the purpose of preventing the diffusion of the constituent elements of the metal substrate 11, and is made of silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), rare earth metal oxide, or the like. It is comprised and the thickness is 10-400 nm, for example. Note that since the crystallinity of the diffusion preventing layer is not questioned, it may be formed by a film forming method such as a normal sputtering method.

The diffusion preventing layer 12 is interposed between the metal substrate 11 and the bed layer 13 in this way when the other layers such as the intermediate layer 14, the cap layer 15, and the oxide superconducting layer 16 are formed. In order to suppress diffusion of some of the constituent elements of the metal substrate 11 to the oxide superconducting layer 16 side through the bed layer 13 at that time. is there. The element diffusion from the metal substrate 11 side can be effectively suppressed by adopting the two-layer structure of the diffusion prevention layer 12 and the bed layer 13 as in the present embodiment. An example of the case where the diffusion preventing layer 12 is interposed between the metal substrate 11 and the bed layer 13 includes a combination using Al ₂ O ₃ as the diffusion preventing layer 12 and Y ₂ O ₃ as the bed layer 13. it can.

The intermediate layer 14 may have either a single layer structure or a multilayer structure, and is selected from materials that are biaxially oriented in order to control the crystal orientation of the oxide superconducting layer 16 laminated thereon. Specifically, preferred materials for the intermediate layer 14 are Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ), SrTiO ₃ , CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd _2. Examples thereof include metal oxides such as O ₃ , Zr ₂ O ₃ , Ho ₂ O ₃ , and Nd ₂ O ₃ .
If the intermediate layer 14 is formed with good crystal orientation (for example, a crystal orientation degree of 15 ° or less) by ion beam assisted deposition (IBAD method), the crystal orientation of the cap layer 15 formed on the intermediate layer 14 Therefore, the oxide superconducting layer 16 formed on the cap layer 15 has a good crystal orientation and excellent superconducting characteristics. Can be demonstrated.

The thickness of the intermediate layer 14 may be adjusted as appropriate according to the purpose, but is usually in the range of 0.005 to 2 μm.
The intermediate layer 14 is formed by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, electron beam vapor deposition, ion beam assisted vapor deposition (hereinafter abbreviated as IBAD), chemical vapor deposition (CVD). Method: coating pyrolysis method (MOD method); lamination can be performed by a known method for forming an oxide thin film such as thermal spraying. In particular, the metal oxide layer formed by the IBAD method is preferable in that it has a high crystal orientation and a high effect of controlling the crystal orientation of the oxide superconducting layer 16 and the cap layer 15. The IBAD method is a method of orienting crystal axes by irradiating an ion beam at a predetermined angle with respect to an underlying vapor deposition surface during vapor deposition. Usually, an argon (Ar) ion beam is used as the ion beam. For example, the intermediate layer 14 made of Gd ₂ Zr ₂ O ₇ , MgO or ZrO ₂ —Y ₂ O ₃ (YSZ) has a small value of ΔΦ (FWHM: full width at half maximum), which is an index representing the degree of crystal orientation in the IBAD method. This is particularly preferable because it can be performed.

The cap layer 15 is preferably formed through a process of epitaxial growth on the surface of the intermediate layer 14 and selective growth of crystal grains in the in-plane direction. Such a cap layer 15 has a higher in-plane orientation than the intermediate layer 14 made of the metal oxide layer.
The material of the cap layer 15 is not particularly limited as long as it can exhibit the above functions, but specific examples of preferable materials include CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , and Zr _2. Examples thereof include O ₃ , Ho ₂ O ₃ and Nd ₂ O ₃ . When the material of the cap layer 15 is CeO ₂ , the cap layer 15 may include a Ce—M—O-based oxide in which part of Ce is substituted with another metal atom or metal ion.

The cap layer 15 can be formed by a PLD method (pulse laser deposition method), a sputtering method, or the like. Film formation conditions for the cap layer 15 by the PLD method can be performed in an oxygen gas atmosphere at a temperature of about 500 to 1000 ° C. and about 0.6 to 100 Pa of the metal substrate 11.
The film thickness of the cap layer 15 may be 50 nm or more, but is preferably 100 nm or more, and more preferably 300 nm or more in order to obtain sufficient orientation. However, if the thickness is too thick, the crystal orientation deteriorates, so the thickness is preferably 300 to 1000 nm.

The oxide superconducting layer 16 may be a known material, and specifically, a material made of REBa ₂ Cu ₃ O _y (RE represents a rare earth element such as Y, La, Nd, Sm, Er, Gd) is exemplified. it can. Other examples of the oxide superconducting layer 16 include Y123 (YBa ₂ Cu ₃ O _7-X ) and Gd123 (GdBa ₂ Cu ₃ O _7-X ). Further, other oxide superconductors, for _{example, Bi 2 Sr 2 Ca n-} 1 Cu n for _{O 4 + 2n + δ} becomes may be used in compositions such as those made of other oxide superconductors having high critical temperatures representative Of course.
The oxide superconducting layer 16 has a thickness of about 0.5 to 5 μm and preferably a uniform thickness.
The oxide superconducting layer 16 is laminated by a physical vapor deposition method such as sputtering, vacuum vapor deposition, laser vapor deposition, electron beam vapor deposition, chemical vapor deposition (CVD), or coating pyrolysis (MOD). In particular, from the viewpoint of productivity, it is preferable to use the TFA-MOD method (organic metal deposition method using trifluoroacetate, coating pyrolysis method), PLD method or CVD method.

  As described above, when the oxide superconducting layer 16 is formed on the cap layer 15 having good orientation, the oxide superconducting layer 16 laminated on the cap layer 15 also matches the orientation of the cap layer 15. Crystallize as follows. Therefore, the oxide superconducting layer 16 formed on the cap layer 15 is hardly disturbed in the crystal orientation, and the thickness of the metal substrate 11 is one for each crystal grain constituting the oxide superconducting layer 16. The c-axis is oriented in the vertical direction, and the a-axis or the b-axis is oriented in the length direction of the metal substrate 11. Therefore, since the obtained oxide superconducting layer 16 is hardly deteriorated in superconducting characteristics at the crystal grain boundary, it becomes easy to flow electricity in the length direction of the metal substrate 11, and a sufficiently high critical current density can be obtained.

The protective layer 17 laminated on the oxide superconducting layer 16 is formed as a layer made of a metal material that has good conductivity such as Ag and has low contact resistance with the oxide superconducting layer 16 and is compatible. . The protective layer 17 is made of a highly conductive metal material and functions as a bypass through which the current of the oxide superconducting layer 16 commutates when the oxide superconducting layer 16 attempts to transition from the superconducting state to the normal conducting state.
Of each configuration of the superconducting laminate 10 described so far, the diffusion prevention layer 12, the bed layer 13, and the cap layer 15 are not essential elements, and are appropriately used depending on the design conditions of the superconducting laminate 10.

As shown in FIG. 1, the bent body 20 </ b> A has a tape-shaped stabilization layer 21 and a solder layer 22 formed on the stabilization layer 21. In the bent body 20A, a bent portion 23 is formed by folding the bent body 20A in a folding manner about an intermediate portion in the width direction of a protective wire 20 to be described later so that the solder layer 22 is on the inner side. As shown in FIG. 3, the protective wire 20 has a solder layer 22 disposed on a tape-shaped stabilization layer 21 and is formed into a flat sheet as a whole.
The metal material constituting the stabilization layer 21 is not particularly limited as long as it has good conductivity, but it is preferable to use a relatively inexpensive material such as Cu. This makes it possible to increase the thickness of the stabilization layer 21 while keeping the material cost low. The thickness of the stabilization layer 21 is preferably 20 to 150 μm, and more preferably about 50 μm.
The solder layer 22 is made of tin, for example, and the thickness is preferably 2 to 10 μm, and more preferably about 6 μm.

As shown in FIG. 1, the superconducting laminate 10 is formed along the inner surface of the bent body 20A and with one side surface 10a abutting against the inner surface of the bent portion 23 and surrounded by the bent body 20A. In the state, it is integrally connected to the stabilization layer 21 by the solder layer 22 covering the periphery thereof.
Both end portions 21 a and 21 b of the stabilization layer 21 of the bent body 20 </ b> A extend beyond the other side surface 10 b of the superconducting laminate 10 in a uniform shape. Between both end portions 21a and 21b, one end edge 22a of the solder layer 22 is closed.

Next, an oxide superconducting wire manufacturing apparatus 30 (hereinafter referred to as “manufacturing apparatus 30”) for manufacturing the oxide superconducting wire 1 configured as described above will be described.
As shown in FIG. 4, the manufacturing apparatus 30 of the present embodiment includes a bending mechanism 40 that bends a tape-shaped protective wire 20 to form a bent body 20A having a bent portion 23, and a superconducting laminate inside the bent body 20A. A housing mechanism 50 for housing the body 10 and a fixing mechanism 60 for fixing the superconducting laminate 10 to the bent body 20A are provided.
More specifically, the manufacturing apparatus 30 is provided with the superconducting laminate 10 wound around, the first reel device 31 capable of feeding the superconducting laminate 10 and the protection wire 20 wound around, and the protection wire 20 can be sent out. It is formed by the second reel device 32, a transport roller 51 that guides the superconducting laminate 10 and the folded body 20 </ b> A that are fed out so that the superconducting laminate 10 is disposed inside the folded body 20 </ b> A, and a fixing mechanism 60. A winding device 33 for winding the oxide superconducting wire 1 is provided.

  The first reel device 31 is disposed on the upstream D1 side in the delivery direction D for delivering the superconducting laminate 10 to the accommodation mechanism 50, and the second reel device 32 is disposed on the upstream D1 side with respect to the bending mechanism 40. The first reel device 31 and the second reel device 32 are arranged so as to be shifted in the width direction of the superconducting laminate 10 (the direction along the horizontal plane).

As shown in FIG. 5, the bending mechanism 40 includes a support base 41 that supports the protective wire 20 and a pressing member 42 that presses an intermediate portion in the width direction of the protective wire 20. The support base 41 is connected to a curved portion (bending support portion) 41a that is disposed in an intermediate portion of the support base 41 in a direction orthogonal to the feeding direction D and is bent downward, and to an end portion of the curved portion 41a. It is comprised with a pair of linear part 41b extended in the tangent direction in an edge part.
The pressing member 42 is disposed above the support base 41 and is formed to extend in the vertical direction. The pressing member 42 has a tip end portion 42a formed in a shape obtained by dividing the cylinder into two in the axial direction with a smaller radius of curvature than the surface above the curved portion 41a at the lower end. The pressing member 42 can move toward and away from the inner surface of the bending portion 41a by moving in the vertical direction by a drive mechanism (not shown).

As shown in FIG. 4, the accommodation mechanism 50 and the fixing mechanism 60 are disposed in this order on the downstream D2 side of the bending mechanism 40 opposite to the upstream D1.
As shown in FIG. 6, the accommodation mechanism 50 includes an extrusion member 52 that extends in a direction along the horizontal plane, and a drive mechanism (not shown) that moves the extrusion member 52 in a direction along the horizontal plane. In addition, you may comprise so that the accommodating mechanism 50 may have the bending shape holding mechanism which hold | maintains the bending body 20A folded in half by forming the bending part 23. FIG.

As shown in FIG. 4, the fixing mechanism 60 includes a main heating mechanism (heating unit) 61 that heats the bent body 20 </ b> A and the superconducting laminate 10 to a temperature equal to or higher than the melting point of the solder layer 22, and the bent body 20 </ b> A on the superconducting laminate 10. And a pair of pressure rollers 62 for gradually cooling the bent body 20A.
Superconducting laminate 10 and bent body 20 </ b> A are heated to a predetermined temperature by being inserted through main heating mechanism 61. The pressure roller 62 has a heater (not shown) and a brush (not shown) attached on the outer peripheral surface of the pressure roller 62.

Next, the manufacturing method of the oxide superconducting wire 1 of this embodiment is demonstrated. Below, the manufacturing method using the manufacturing apparatus 30 is demonstrated. FIG. 7 is a flowchart showing a method for manufacturing the oxide superconducting wire 1 of this embodiment.
This manufacturing method includes a folding step S1 for bending the protective wire 20 to form a folded body 20A having a folded portion 23, a housing step S2 for housing the superconducting laminate 10 inside the folded body 20A, and the folded body 20A. And a fixing step S3 for fixing the superconducting laminate 10.
The superconducting laminate 10 and the protective wire 20 are respectively passed between the pair of transport rollers 51 and the pair of pressure rollers 62, and are transported to the downstream D2 side by the pair of transport rollers 51 and the winding device 33.

First, in the bending step S1, as shown in FIG. 5, in a state where the protective wire 20 is disposed on the support base 41 so that the stabilization layer 21 is located on the support base 41 side, a drive mechanism (not shown) The tip end portion 42a of the pressing member 42 is pressed against the solder layer 22 from above. Thereby, the protective wire 20 is bent around the intermediate portion in the width direction of the protective wire 20 so that the solder layer 22 is inside, and a bent body 20A having a bent portion 23 is formed. At this time, the bent body 20A is bent so that both end portions 21a and 21b in the width direction are aligned.
In the present embodiment, the bent portion 23 has a shape curved in the width direction of the protective wire 20.
Next, in the accommodating step S2, as shown in FIG. 6, the pushing member 52 is moved by a drive mechanism (not shown), and the superconducting laminate 10 is inserted along the inner surface of the bent body 20A. One side surface 10 a is abutted against the inner surface of the bent portion 23.

Subsequently, in the fixing step S3, the solder layer 22 is heated by the main heating mechanism 61 to a temperature equal to or higher than the melting point of tin, so that the solder layer 22 existing around the superconducting laminate 10 is melted. Then, by pressing the protective wire 20 from both sides of the superconducting laminate 10 with the pressure roller 62, the bent body 20A is deformed along the outer shape of the superconducting laminate 10, and the superconducting laminate 10 is surrounded by the bent body 20A. Make it. Then, the temperature of the heater is adjusted to gradually cool the temperature of the solder layer 22 to a temperature lower than the melting point of tin, thereby solidifying the molten solder layer 22. As shown in FIG. 1, the gap between both end portions 21 a and 21 b of the stabilization layer 21 is closed by one end edge 22 a of the solder layer 22, and the both end portions 21 a and 21 b are pressure-bonded. The stabilizing layer 21 of the bent body 20A is hermetically connected.
At this time, the solder layer 22 that protrudes outward from both end portions 21 a and 21 b is removed with a brush attached on the outer peripheral surface of the pressure roller 62.
The oxide superconducting wire 1 is manufactured through the above steps.

As described above, according to the manufacturing method of the oxide superconducting wire 1 and the manufacturing apparatus 30 of the oxide superconducting wire according to the present embodiment, the superconducting laminate 10 is placed along the inner surface of the bent body 20A in which the bent portion 23 is formed. Then, the superconducting laminate 10 is positioned with respect to the bent body 20A. For this reason, the superconducting laminate 10 can be easily positioned. In a state where the superconducting laminate 10 is surrounded by the bent body 20A, the stabilization layer 21 of the bent body 20A can be hermetically connected to the outer peripheral surface of the superconducting laminate 10 by the solder layer 22.
In the housing step S2, since one side surface 10a of the superconducting laminate 10 is abutted against the inner surface of the bent portion 23, the superconducting laminate 10 can be reliably positioned with respect to the bent body 20A.
Further, in the manufacturing method of the present oxide superconducting wire, the bent body 20A is bent so that both ends 20a, 20b are aligned in the bending step S1, and the solder layer 22 is provided between the both ends 20a, 20b of the bent body 20A in the fixing step S3. It is blocked by. Therefore, the superconducting laminate 10 can be reliably kept airtight, and the outer shape of the manufactured oxide superconducting wire 1 can be made compact.

Since the superconducting laminate 10 includes the diffusion preventing layer 12, the bed layer 13, and the cap layer 15, the crystal orientation of the manufactured oxide superconducting layer 16 is improved, and the electrical characteristics of the oxide superconducting wire 1 are improved. Can be improved.
Since the manufacturing apparatus 30 includes the first reel device 31, the second reel device 32, the transport roller 51, and the winding device 33, the superconducting laminate 10, the protective wire 20, and the oxide superconducting wire 1 can be easily transported. Can be wound up.

Moreover, according to the oxide superconducting wire 1 of this embodiment, the superconducting laminate 10 is positioned with respect to the bent body 20A by placing the superconducting laminate 10 along the inner surface of the bent body 20A. Since the superconducting laminate 10 is surrounded by the bent body 20A and connected to the stabilization layer 21 of the bent body 20A by the solder layer 22, the superconducting laminate 10 can be sealed from the outside air.
The bent body 20A is formed with both end portions 20a and 20b aligned, and the end portions 20a and 20b are closed by the solder layer 22, so that the superconducting laminate 10 can be reliably kept airtight and the oxide superconductivity can be maintained. The external shape of the wire 1 can be made compact.

In addition, in the manufacturing apparatus 30 of this embodiment, it may replace with the bending mechanism 40 and may be equipped with the bending mechanism 70 as shown in FIG. The bending mechanism 70 includes a support base 71 having a bent portion (bend support portion) 71a bent downward instead of the curved portion 41a of the support base 41, and a substantially V-shape downward instead of the pressing member 42. And a pressing member 72 having a tip portion 72a formed in a sharp shape.
By configuring the bending mechanism 70 in this way, the bent portion 73 formed in the protective wire 20 by the bending mechanism 70 is bent in the width direction of the protective wire 20, and the bent body 20B having the bent portion 73 is formed. Is formed.

As shown in FIG. 9, the bent body 20B is moved in the accommodating step S2 by inserting the superconducting laminate 10 along the inner surface of the bent body 20B in the accommodating step S2, as in this embodiment. One side surface 10 a of the body 10 is abutted against the inner surface of the bent portion 73.
Also in this case, in the fixing step S3, the folded body 20B is deformed along the outer shape of the superconducting laminate 10 by pressing the folded body 20B from both sides of the superconducting laminate 10 with the pressure roller 62, and FIG. The oxide superconducting wire 1 shown is manufactured.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. 10 to FIG. explain.
As shown in FIG. 10, the oxide superconducting wire 81 of this embodiment is different only in that the width is narrower than that of the oxide superconducting wire 1 of the above embodiment.
The oxide superconducting wire 81 has a tape-shaped superconducting laminate 90 formed so as to be half the width of the superconducting laminate 10 (half cut) and an outer peripheral surface of the superconducting laminate 90. And an attached bent body 100A.
The folded body 100A includes a tape-shaped stabilization layer 101 and a solder layer 102 formed on the stabilization layer 101. In the bent body 100A, a bent portion 103 is formed by bending the intermediate portion in the width direction of the protective wire 100 so that the solder layer 102 is on the inner side.

Next, the manufacturing method of the oxide superconducting wire 81 of this embodiment is demonstrated.
The manufacturing method of the oxide superconducting wire 81 includes a dividing step of dividing the superconducting laminate 10 in the width direction before the housing step S2, in addition to the steps of the manufacturing method of the oxide superconducting wire 1 of the embodiment. I have.
First, as shown in FIG. 11, the superconducting laminate 10 is divided in the width direction to form a pair of superconducting laminates 90. Then, as shown in FIG. 4, the superconducting laminate 90 is wound around the first reel device 31 of the manufacturing apparatus 30, and the protective wire 100 is wound around the second reel device 32. Here, the protective wire 100 is obtained by dividing the protective wire 20 into two in the width direction.

The subsequent bending step S1 is the same as that in the first embodiment, and a description thereof will be omitted.
Next, in the accommodating step S2, as shown in FIG. 12, the superconducting laminate 90 is inserted along the inner surface of the bent body 100A, and the side surface 90a on the divided side of the superconducting laminate 90 is inserted into the inner surface of the bent portion 103. Hit it.
The subsequent fixing step S3 is the same as that in the first embodiment, and a description thereof will be omitted.

As described above, according to the method for manufacturing the oxide superconducting wire 81 of the present embodiment, the superconducting laminate 90 can be easily positioned while maintaining the airtightness of the superconducting laminate 90 with respect to the outside air.
Further, a splitting step is provided before the housing step S2, and the superconducting laminate 90 is made to follow the inner surface of the bent body 100A in the housing step. Therefore, even if the superconducting laminate 10 is long in the width direction, the width dimension is suitably set. Can be adjusted.
In the housing step S2, the superconducting laminate 90 is arranged so that the side surface 90a on the divided side of the superconducting laminate 90 is on the bent portion 103 side. Since the protective layer 17 is not formed on the side surface 90a of the superconducting laminate 90, the side surface 90a of the divided side is reliably protected by arranging the side surface 90a of the superconducting laminate 90 on the bent portion 103 side. be able to.

  In the present embodiment, the side surface 90a on the divided side of the superconducting laminate 90 may be arranged on the side opposite to the bent portion 103 in the bent body 100A. This is because, in the fixing step S <b> 3, there may be a case where the superconducting laminate 90 can be sufficiently closed by the solder layer 22.

As mentioned above, although 1st Embodiment and 2nd Embodiment of this invention were explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The structure of the range which does not deviate from the summary of this invention Changes are also included.
For example, in the first embodiment and the second embodiment, tin is used as the solder layer. However, the material of the solder layer is not particularly limited, and a tin-silver alloy, a tin-bismuth alloy, or the like is appropriately used. it can.
In the first embodiment and the second embodiment, the superconducting laminate is inserted along the inner surface of the bent body, and one side surface of the superconducting laminate is abutted against the inner surface of the bent portion. However, it is not essential that one side surface of the superconducting laminate is abutted against the inner surface of the bent portion. This is because the superconducting laminate can be positioned with respect to the bent body without abutting against the inner surface of the bent portion.

EXAMPLES Hereinafter, although an Example is shown and this invention is demonstrated further in detail, this invention is not limited to these Examples.
The oxide superconducting wire 81 of the second embodiment was produced by the procedure as described below.
As the protective wire 100, a wire having a Cu stabilization layer 101 having a thickness of 50 μm and a solder layer 102 having a thickness of 10 μm was used.
Gd ₂ Zr ₂ O ₇ (GZO; intermediate layer 14) having a thickness of 1.2 μm is formed on a metal substrate 11 made of hastelloy (trade name, USA) having a width of 10 mm and a thickness of 0.1 mm by the IBAD method. Then, CeO ₂ (cap layer 15) having a thickness of 1.0 μm was formed on the intermediate layer 14 by the PLD method. Next, a 1.0 μm thick GdBa ₂ Cu ₃ O _7-X (oxide superconducting layer 16) is formed on the cap layer 15 by the PLD method, and a 10 μm thick silver layer is further formed on the oxide superconducting layer 16. (Protective layer 17) was formed to produce superconducting laminate 10.
A superconducting laminate 90 having a width of 5 mm was produced by half-cutting the superconducting laminate 10 in the width direction. The critical current of superconducting laminate 90 (the maximum amount of current that can flow in the superconducting state) was 100 A.
A bent portion 103 is formed in the protective wire 100 to form a bent body 100A, the superconducting laminate 90 is surrounded by the bent body 100A, and the bent body 100A is connected to the superconducting laminate 90 by a solder layer 22 which is oxidized. 10 m of the superconducting wire 81 was produced. The critical current of the superconducting laminate 90 in the produced oxide superconducting wire 81 was not lowered from the critical current of the superconducting laminate 90 alone.

A 30-cm sample was cut out from the 10-m oxide superconducting wire 81, and a silver sputter was applied to the end face of the sample, and the end face was sealed with a rubber cap. The sample prepared in this manner was held for 1000 hours in an atmosphere at a temperature of 85 ° C. and a humidity of 85%, but no decrease in critical current was observed.
From this test progress, it was found that the oxide superconducting wire 81 has sufficient airtightness (waterproofness).

DESCRIPTION OF SYMBOLS 1,81 Oxide superconducting wire 10, 90 Superconducting laminated body 10a, 90a Side 11 Metal base material 14 Intermediate layer 16 Oxide superconducting layer 17 Protective layer 20, 100 Protective wire 20A, 20B, 100A Bending body 21, 101 Stabilization Layers 22, 102 Solder layers 23, 73 Bending portion 30 Oxide superconducting wire manufacturing apparatus 31 First reel device 32 Second reel device 33 Winding device 40, 70 Bending mechanism 41a Bending portion (bending support portion)
42, 72 Pushing member 50 Housing mechanism 51 Conveying roller 52 Extruding member 60 Fixing mechanism 61 Heating mechanism (heating unit)
62 Pressure roller 71 Support base 71a Bending part (bending support part)
D Delivery direction S1 Bending process S2 Accommodation process S3 Fixing process

Claims (4)

A protective wire having a tape-shaped stabilization layer and a solder layer formed on the stabilization layer is bent by bending the intermediate portion in the width direction of the protective wire so that the solder layer is inside. A folding step of forming a folded body having a portion;
A tape-shaped superconducting laminate comprising a metal substrate, an intermediate layer, an oxide superconducting layer and a protective layer is laminated along the inner surface of the bent body, and the superconducting laminate is accommodated inside the bent body. A containment process;
A fixing step of fixing the superconducting laminate by surrounding the superconducting laminate by the bent body, and melting and solidifying the solder layer present around the superconducting laminate;
Equipped with a,
In the bending step, a pressing member is pressed in a state where the protective wire is disposed on a support base, and the bent body is formed by bending the protective wire so that both ends in the width direction are aligned,
In the accommodating step, the pushing member is moved so that one side surface of the superconducting laminate is abutted against the inner surface of the folded body, and the superconducting laminate is accommodated in the folded body,
In the fixing step, after the solder layer is melted, the bent body is pressed to surround the superconducting laminate by the bent body, the solder layer is solidified, and the solder layer is sandwiched between the both ends. method of manufacturing an oxide superconducting wire which is characterized that you closed by. A protective wire having a tape-shaped stabilization layer and a solder layer formed on the stabilization layer is bent by bending the intermediate portion in the width direction of the protective wire so that the solder layer is inside. A folding step of forming a folded body having a portion;
A tape-shaped superconducting laminate comprising a metal substrate, an intermediate layer, an oxide superconducting layer and a protective layer is laminated along the inner surface of the bent body, and the superconducting laminate is accommodated inside the bent body. A containment process;
A fixing step of fixing the superconducting laminate by surrounding the superconducting laminate by the bent body, and melting and solidifying the solder layer present around the superconducting laminate;
With
Before the housing step, comprising a dividing step of dividing the superconducting laminate in the width direction,
Wherein in the receiving step, the manufacturing method of the oxides superconducting wire which comprises bringing along the superconducting laminate after the division on the inner surface of the folding body. In the housing step, the divided superconducting laminate is arranged with respect to the bent body so that a side surface of the divided superconducting laminate after the division is on the bent portion side. A method for producing an oxide superconducting wire according to claim 2 . A protective wire having a tape-shaped stabilization layer and a solder layer formed on the stabilization layer is bent by bending the intermediate portion in the width direction of the protective wire so that the solder layer is inside. A folding mechanism for forming a folded body having a portion;
A tape-shaped superconducting laminate comprising a metal substrate, an intermediate layer, an oxide superconducting layer and a protective layer is laminated along the inner surface of the bent body, and the superconducting laminate is accommodated inside the bent body. A containment mechanism;
A fixing mechanism that surrounds the superconducting laminate by the bent body and fixes the superconducting laminate by melting and solidifying the solder layer present around the superconducting laminate;
A first reel device capable of delivering the superconducting laminate by winding the superconducting laminate in the form of a tape;
A second reel device capable of delivering the protective wire, the tape-shaped protective wire being wound around;
A transport roller that guides the superconducting laminate and the folded body that are fed out so that the superconducting laminate is disposed inside the folded body;
A winding device for winding the oxide superconducting wire formed by the fixing mechanism;
Equipped with a,
The bending mechanism is capable of approaching and separating from a support base having a bent support portion bent in an intermediate portion in a direction orthogonal to a delivery direction for sending out the protective wire, and an inner surface of the bent support portion. A pressing member,
The accommodation mechanism has an extrusion member that moves the superconducting laminate along the inner surface of the bent body,
The fixing mechanism, characterized in that the organic a heating unit for heating the superconducting laminate housed inside the folded body and the folding body, a pressure roller pressing said folding body to said superconducting laminate, the An oxide superconducting wire manufacturing apparatus.

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