JP5704927B2 - マイクロシステムのためのカバー及びカバーを製造する方法 - Google Patents

マイクロシステムのためのカバー及びカバーを製造する方法 Download PDF

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Publication number
JP5704927B2
JP5704927B2 JP2010549031A JP2010549031A JP5704927B2 JP 5704927 B2 JP5704927 B2 JP 5704927B2 JP 2010549031 A JP2010549031 A JP 2010549031A JP 2010549031 A JP2010549031 A JP 2010549031A JP 5704927 B2 JP5704927 B2 JP 5704927B2
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Japan
Prior art keywords
substrate
layer
cover
region
wafer
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JP2010549031A
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Japanese (ja)
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JP2011517626A5 (enExample
JP2011517626A (ja
Inventor
ヨアヒム クヴェンツァー ハンス
ヨアヒム クヴェンツァー ハンス
オルトゼン マルテン
オルトゼン マルテン
ホーフマン ウルリヒ
ホーフマン ウルリヒ
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0369—Static structures characterized by their profile
    • B81B2203/0384—Static structures characterized by their profile sloped profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/031—Anodic bondings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
JP2010549031A 2008-03-04 2009-02-13 マイクロシステムのためのカバー及びカバーを製造する方法 Active JP5704927B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008012384A DE102008012384A1 (de) 2008-03-04 2008-03-04 Deckel für Mikro-Systeme und Verfahren zur Herstellung eines Deckels
DE102008012384.6 2008-03-04
PCT/EP2009/001024 WO2009112138A2 (de) 2008-03-04 2009-02-13 Deckel für mikro-systeme und verfahren zur herstellung eines deckels

Publications (3)

Publication Number Publication Date
JP2011517626A JP2011517626A (ja) 2011-06-16
JP2011517626A5 JP2011517626A5 (enExample) 2012-03-29
JP5704927B2 true JP5704927B2 (ja) 2015-04-22

Family

ID=40936171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010549031A Active JP5704927B2 (ja) 2008-03-04 2009-02-13 マイクロシステムのためのカバー及びカバーを製造する方法

Country Status (5)

Country Link
US (1) US8517545B2 (enExample)
EP (1) EP2262720B1 (enExample)
JP (1) JP5704927B2 (enExample)
DE (1) DE102008012384A1 (enExample)
WO (1) WO2009112138A2 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008001075B4 (de) 2008-04-09 2018-09-20 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauteil und entsprechendes mikromechanisches Bauteil
DE102010062009B4 (de) 2010-11-26 2019-07-04 Robert Bosch Gmbh Verfahren zum Herstellen von Schrägflächen in einem Substrat und Wafer mit Schrägfläche
DE102010062118B4 (de) 2010-11-29 2018-09-27 Robert Bosch Gmbh Herstellungsverfahren für eine Abdeckvorrichtung für ein mikro-opto-mechanisches Bauteil
DE102011120660A1 (de) * 2011-11-28 2013-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrospiegelanordnung
DE102011119610A1 (de) 2011-11-29 2013-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung strukturierter optischer Komponenten
US20140355095A1 (en) * 2012-01-16 2014-12-04 Maradin Technologies Ltd. Multi-purpose optical cap and apparatus and methods useful in conjunction therewith
US8947755B2 (en) * 2012-02-21 2015-02-03 Hitachi-Lg Data Storage Inc. Optical scanning device and image display apparatus
DE102012206858B4 (de) 2012-04-25 2021-05-20 Robert Bosch Gmbh Verfahren zum Herstellen einer optischen Fenstervorrichtung für eine MEMS-Vorrichtung
DE102012207376B3 (de) * 2012-05-03 2013-08-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuse zur Verkapselung einesMikroscannerspiegels
DE102012217793A1 (de) 2012-09-28 2014-04-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Herstellungsverfahren
DE102014202220B3 (de) 2013-12-03 2015-05-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Deckelsubstrats und gehäustes strahlungsemittierendes Bauelement
DE102014210986A1 (de) * 2014-06-10 2015-12-17 Robert Bosch Gmbh Mikromechanische Schichtenanordnung
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器
DE102015213473A1 (de) 2015-07-17 2017-01-19 Robert Bosch Gmbh Herstellungsverfahren für eine mikromechanische Fensterstruktur und entsprechende mikromechanische Fensterstruktur
JP6511368B2 (ja) * 2015-09-01 2019-05-15 アズビル株式会社 微細機械装置
DE102016105440A1 (de) 2016-03-23 2017-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Komponenten unter Verwendung von Funktionselementen
KR102625267B1 (ko) * 2016-06-17 2024-01-12 엘지전자 주식회사 멤스 스캐너 패키지 및 이를 포함하는 스캐닝 프로젝터
US10570010B1 (en) * 2016-06-17 2020-02-25 National Technology & Engineering Solutions Of Sandia, Llc Fabrication of multilayered carbon MEMS devices
CN108069388B (zh) * 2016-11-14 2019-11-12 上海新微技术研发中心有限公司 在基体的表面形成斜面的方法
DE102017213070A1 (de) 2017-07-28 2019-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer MEMS Spiegelanordnung und MEMS Spiegelanordnung
US10678046B2 (en) * 2018-03-21 2020-06-09 Infineon Technologies Ag Packages for microelectromechanical system (MEMS) mirror and methods of manufacturing the same
DE102018211548A1 (de) * 2018-07-11 2020-01-16 Robert Bosch Gmbh Herstellungsverfahren für eine mikromechanische Vorrichtung mit geneigten optischen Fenstern und mikromechanische Vorrichtung mit geneigten optischen Fenstern
DE102019207073B4 (de) 2019-05-15 2021-02-18 OQmented GmbH Bilderzeugungseinrichtung für ein scannendes Projektionsverfahren mit Bessel-ähnlichen Strahlen
DE102019208373A1 (de) * 2019-06-07 2020-12-10 Infineon Technologies Ag Herstellen eines MEMS-Bauelements mit Glasabdeckung und MEMS-Bauelement
CN113031254A (zh) * 2019-12-09 2021-06-25 觉芯电子(无锡)有限公司 微镜装置、微镜晶圆级封装方法及光学窗口雏形制作方法
KR102390808B1 (ko) 2020-04-29 2022-05-04 주식회사 위멤스 정전형 광스캐너 패키지 및 제조 방법
CN111847375B (zh) * 2020-07-02 2024-03-15 上海集成电路研发中心有限公司 一种红外探测器结构及其制造方法
IT202000016855A1 (it) 2020-07-10 2022-01-10 St Microelectronics Srl Dispositivo a microspecchio mems chiuso in un involucro dotato di una superficie trasparente e avente una piattaforma orientabile
DE102020211884A1 (de) 2020-09-23 2022-03-24 Robert Bosch Gesellschaft mit beschränkter Haftung Trägerplatte für eine mikrofluidische Analysekartusche, Analysekartusche mit Trägerplatte und Verfahren zum Herstellen einer Trägerplatte
US12100686B2 (en) * 2020-10-30 2024-09-24 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package structure and semiconductor manufacturing apparatus
DE102021206477B4 (de) * 2021-06-23 2023-01-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben
JPWO2023153373A1 (enExample) * 2022-02-10 2023-08-17
DE102023132003A1 (de) * 2023-11-16 2025-05-22 OQmented GmbH Mehrstrahliges mikroscannersystem sowie verfahren und schichtanordnung zu seiner herstellung
DE102023131997A1 (de) * 2023-11-16 2025-05-22 OQmented GmbH Microscannersystem sowie verfahren und substratstapel zu seiner herstellung
EP4603446A1 (en) 2024-02-16 2025-08-20 Murata Manufacturing Co., Ltd. Glass cover manufacturing using a single-crystal silicon mold

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0753588B2 (ja) * 1992-06-12 1995-06-07 本田工業株式会社 平板ガラスの局部曲げ加工装置並びに模様型板ガラスの加工装置
US6146917A (en) 1997-03-03 2000-11-14 Ford Motor Company Fabrication method for encapsulated micromachined structures
DE19746558C1 (de) * 1997-10-22 1999-03-04 Sekurit Saint Gobain Deutsch Verfahren und Formring zum Biegen und Vorspannen von Glasscheiben
US6452238B1 (en) 1999-10-04 2002-09-17 Texas Instruments Incorporated MEMS wafer level package
DE19956654B4 (de) * 1999-11-25 2005-04-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Strukturierung von Oberflächen von mikromechanischen und/oder mikrooptischen Bauelementen und/oder Funktionselementen aus glasartigen Materialien
DE10039027C1 (de) * 2000-08-10 2002-01-17 Schott Glas Verfahren zur Herstellung gebogener Glaskeramikplatten durch Biegen der zu keramisierenden Grünglasplatten und Vorrichtung zur Durchführung des Verfahrens
US6896821B2 (en) * 2002-08-23 2005-05-24 Dalsa Semiconductor Inc. Fabrication of MEMS devices with spin-on glass
WO2004068665A2 (en) 2003-01-24 2004-08-12 The Board Of Trustees Of The University Of Arkansas Research And Sponsored Programs Wafer scale packaging technique for sealed optical elements and sealed packages produced thereby
US20050184304A1 (en) 2004-02-25 2005-08-25 Gupta Pavan O. Large cavity wafer-level package for MEMS
KR100707179B1 (ko) 2005-02-07 2007-04-13 삼성전자주식회사 광스캐너 패키지 및 그 제조방법
KR100667291B1 (ko) * 2005-07-27 2007-01-12 삼성전자주식회사 마이크로 미러 소자 패키지 및 그 제조방법
US20080316562A1 (en) 2005-12-15 2008-12-25 Koninklijke Philips Electronics, N.V. Mems Scanner System and Method
JP2009069457A (ja) * 2007-09-13 2009-04-02 Seiko Epson Corp 光走査素子及び画像表示装置

Also Published As

Publication number Publication date
EP2262720B1 (de) 2019-04-17
DE102008012384A1 (de) 2009-09-10
WO2009112138A3 (de) 2010-05-06
WO2009112138A2 (de) 2009-09-17
EP2262720A2 (de) 2010-12-22
US20100330332A1 (en) 2010-12-30
US8517545B2 (en) 2013-08-27
JP2011517626A (ja) 2011-06-16

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