JP5691833B2 - Thermosetting resin composition, prepreg and laminate - Google Patents

Description

  The present invention relates to a thermosetting resin composition, a prepreg having the thermosetting resin composition and glass fiber, and a laminate obtained by laminating the prepreg, and more specifically for a semiconductor package or a printed wiring board. The present invention relates to a suitable thermosetting resin composition, prepreg and laminate.

In recent years, downsizing and thinning of electronic devices such as mobile phones and mobile devices have been remarkable. As a result, electronic components such as ICs and LSIs mounted on a printed wiring board inside the electronic device have been increased in density, and accordingly, the heat generation density inside the electronic device has also increased.
When the heat generation density in the electronic device increases, the temperature rise accompanying heat generation in the electronic device becomes significant, and the operation reliability of the electronic component decreases. Therefore, it is necessary to improve the heat dissipation of the printed wiring board in order to quickly release the heat generated from the electronic components and conductors to the outside.
Various methods have been proposed as means for solving the above problems. For example, Patent Document 1 describes a multilayer printed wiring board in which an inner layer circuit board is laminated with a semi-cured adhesive layer in which an electrically insulating filler is dispersed in a thermosetting resin.

JP 2000-349446 A

When filler is added as in Patent Document 1, the heat dissipation (thermal conductivity) is improved, but since the addition ratio is limited, further improvement of the thermal conductivity of the thermosetting resin is desired. Yes.
However, even when a resin composition having excellent thermal conductivity is obtained, thermal conductivity may be greatly reduced when a prepreg or laminate obtained by impregnating a glass fiber fabric is used. In particular, when the thermal conductivity of the resin composition exceeds the thermal conductivity of the glass fiber woven fabric, there is a tendency that the thermal conductivity when the prepreg or the laminated plate is made is remarkably lowered. In addition, when the thermal conductivity of the resin composition exceeds the thermal conductivity of the glass fiber fabric, the thermal conductivity is improved by reducing the proportion of the glass fiber fabric and increasing the resin composition. The rigidity of a board falls or a thermal expansion coefficient increases, and a thin laminated board cannot be made.

  The present invention has been made in view of such circumstances, a resin composition capable of producing a prepreg having a high thermal conductivity because a decrease in the thermal conductivity of the prepreg when impregnated into a glass fiber fabric is small, and An object is to provide a prepreg and a laminate using the resin composition.

  As a result of intensive studies to achieve the above object, the present inventors have found that a resin composition containing a specific epoxy resin and a polyhydric phenolic compound can achieve the above object. The present invention has been completed based on such findings.

That is, the present invention provides the following [1] to [7].
[1] An epoxy resin represented by the following general formula (1) and a phenolic compound having a repeating structure represented by the following general formula (2) and / or a repeating structure represented by the following general formula (3) A thermosetting resin composition.

[In the formula (1), m is an integer of 0, n is an integer of 0, R ₁ and R ₂ are each independently hydrogen or an alkyl group having 1 to 10 carbon atoms. ]
[2] The thermosetting property according to [1], wherein the number average molecular weight of the phenolic compound is 300 to 600, and the abundance ratio of resorcinol to the total number of catechol and resorcinol in the phenolic compound is 80% or more. Resin composition.
[3] The thermosetting resin composition contains an inorganic filler composed of one or more selected from aluminum oxide, magnesium oxide, magnesium hydroxide, silicon oxide, and boron nitride. The thermosetting resin composition according to [1] or [2], wherein a content of the filler with respect to the entire thermosetting resin composition is 30 to 70% by volume.
[4] The thermosetting resin composition according to [3], wherein the inorganic filler is surface-treated with a surface treatment agent.
[5] A prepreg containing the thermosetting resin composition according to any one of [1] to [4] and a glass fiber substrate.
[6] The prepreg according to [5], wherein the content of the thermosetting resin composition with respect to the entire prepreg is 60 to 90% by volume.
[7] A laminate obtained by laminating the prepreg according to [5] or [6].

  According to the present invention, the thermal conductivity of the thermosetting resin composition with a small decrease in the thermal conductivity of the prepreg when impregnated into the glass fiber and the high thermal conductivity are suitable for semiconductor packages and printed wiring boards. Prepregs and laminates can be provided.

Hereinafter, the thermosetting resin composition of the present invention, a prepreg using the same, and a laminate obtained by laminating the prepreg will be described in detail.
<Thermosetting resin composition>
The resin composition of the present invention is obtained by blending an epoxy resin and a phenolic compound.

[Epoxy resin]
The epoxy resin used in the present invention includes an epoxy resin represented by the following general formula (1).

[In the formula (1), m is an integer of 0, n is an integer of 0, R ₁ and R ₂ are each independently hydrogen or an alkyl group having 1 to 10 carbon atoms. ]

  The thermosetting resin composition blended with the epoxy resin represented by the general formula (1) has a small decrease in thermal conductivity when it is made into a prepreg by impregnating the glass fiber base material, etc. Large prepregs and laminates can be obtained. Moreover, since it is excellent in the solubility with respect to a solvent, the varnish for prepreg manufacture can be obtained easily. Furthermore, it has a low melt viscosity, excellent filler filling properties, and excellent heat resistance.

  In the formula (1), when m is larger than 10, the molecular weight is increased and the viscosity is increased, which is disadvantageous in terms of workability, fluidity, blocking resistance, and storage stability. The same applies when n is greater than 10. This m is preferably 1, and this n is preferably 1.

In formula (1), R ₁ and R ₂ are preferably both hydrogen.
In addition, as an epoxy resin, epoxy resins other than the epoxy resin represented by General formula (1) may be mix | blended with the epoxy resin represented by General formula (1). In that case, it is preferable that the ratio of the epoxy resin represented by General formula (1) in epoxy resin total amount is 30 weight% or more, and it is more preferable that it is 50 weight%. Examples of this epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol. A novolak type epoxy resin, bisphenol F novolak type epoxy resin, dicyclopentadiene type epoxy resin, polyfunctional aromatic compounds such as glycidyl ether compounds such as polyfunctional phenols and anthracene.

[Phenolic compounds]
The phenolic compound used in the present invention has a repeating structure represented by the following general formula (2) and / or a repeating structure represented by the following general formula (3).

  The thermosetting resin composition containing the phenolic compound has high thermal conductivity. Although the reason is not clear, it is considered that high thermal conductivity is imparted by the reaction of the hydroxyl group of the phenolic compound with the epoxy group of the epoxy resin represented by the general formula (1).

  Resorcinol is superior in thermal conductivity to catechol, and catechol is superior in stability. Therefore, a novolak mixture of resorcinol and catechol is preferred. Specifically, the ratio of resorcinol to the total number of catechol and resorcinol is preferably 80% or more and less than 100%, and more preferably 85% or more and less than 98%. It is also effective to contain a certain amount of resorcinol or catechol monomer in order to improve the flexibility of the prepreg.

The number average molecular weight of the phenolic compound is preferably 300 to 600, more preferably 350 to 575, and still more preferably 400 to 550. When the ratio is 300 or less, the presence ratio of the monomer is increased, and it tends to be hard to be cured or the Tg tends to be low. When the ratio is 600 or more, the flexibility of the prepreg tends to be lost.
The blending ratio of this phenolic compound to the epoxy resin represented by the general formula (1) is preferably 0.85 to 1.25 equivalent to 1 epoxy equivalent of the epoxy resin. 2 is more preferable.

[Inorganic filler]
The thermosetting resin composition of the present invention preferably further contains an inorganic filler. Thereby, the thermal conductivity of a prepreg or a laminated body improves.
As the material for the inorganic filler, an insulating material having a strong adsorptivity and reactivity of an alkoxy group of a silane coupling agent or a silicone oligomer or a silanol group formed by hydrolysis is preferable. It is an inorganic material having an OH group on the surface. For example, silicon oxide, aluminum oxide, etc. have a remarkable effect of a silane coupling agent or a silicone oligomer. Among them, it is preferable to use an inorganic filler having a high thermal conductivity of 3 W / mK or higher at 25 ° C., and aluminum oxide (thermal conductivity at 25 ° C .: 20 to 30 W / mK) is a preferable inorganic filler. is there. In addition, magnesium oxide, magnesium hydroxide, and boron nitride are also preferably used. These inorganic fillers may be used alone or in combination of two or more.
Here, since the thermal conductivity is temperature dependent, the thermal conductivity at 25 ° C., which is a temperature that is less constrained in measurement and easy to manage, is used for inorganic fillers, resin compositions, prepregs, laminates, Used as thermal conductivity.

Moreover, the shape of the inorganic filler is preferably spherical particles with little decrease in fluidity when the resin is highly filled. The particle size of the inorganic filler is preferably 0.1 to 10 μm with a cumulative 50% particle size. In this particle size region, the filler filling property is improved as the particle size is increased. However, when the particle size is 5 μm or more, the thickness of the prepreg including the glass fiber fabric can be reduced. The thing of 5 micrometers is preferable.
Here, the cumulative 50% particle diameter is the particle diameter at a point corresponding to a volume of 50% when a cumulative frequency distribution curve based on the particle diameter is obtained with the total volume of the powder as 100%. It can be measured by a particle size distribution measuring apparatus using a method.

In the present invention, the content of the inorganic filler in the thermosetting resin composition is preferably 30 to 80% by volume, more preferably 30 to 70% by volume, based on the entire resin composition. Preferably it is 40-65 volume%, Most preferably, it is 45-60 volume%. When the content of the inorganic filler is 30 to 80% by volume of the entire resin composition, the effect of increasing the thermal conductivity of the resin composition by the inorganic filler is large, and the thermal expansion coefficient of the resin composition is reduced. This is because a resin composition having appropriate fluidity and excellent moldability can be obtained. Specifically, if the content of the inorganic filler is 30% by volume or more of the entire resin composition, the heat conduction effect is sufficient, and if it is 80% by volume or less, the fluidity is maintained and the moldability is improved. .
Here, the volume% of the inorganic filler is a percentage of the volume occupied by the inorganic filler with respect to the total volume of the resin composition.

  As described above, the inorganic filler is preferably pretreated with a surface treatment agent or subjected to an integral blend treatment. Examples of the surface treatment agent include a silane coupling agent and a silicone oligomer.

Of these, specific examples of silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyl (methyl) dimethoxysilane, and 2- (2,3-epoxycyclohexyl) ethyltrimethoxy. Epoxy group-containing silane such as silane; 3-aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyl (methyl) Amino group-containing silanes such as dimethoxysilane; cationic silanes such as 3- (trimethoxylyl) propyltetramethylammonium chloride; vinyl group-containing silanes such as vinyltriethoxysilane; 3-methacryloxypropyltrimethoxysilane Acrylic group-containing silanes such as; and 3- Mercapto group-containing silane such as Le mercaptopropyl trimethoxysilane.
In addition to the silane coupling agent, a titanate-based coupling agent may be used.

[Other ingredients]
You may mix | blend components other than the said component with the thermosetting resin composition of this invention. For example, you may mix | blend hardeners other than the said phenolic compound. Moreover, you may mix | blend a hardening accelerator, a thermoplastic resin, an elastomer, a flame retardant, a ultraviolet absorber, antioxidant, an adhesive improvement agent, etc.

  Examples of curing accelerators include, for example, epoxy resin curing accelerators such as imidazoles and derivatives thereof; organophosphorus compounds; secondary amines, tertiary amines, and quaternary ammonium salts; It is done.

Examples of such imidazoles and derivatives thereof include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methyl. Imidazole, 2-heptadecylimidazole, 4,5-diphenylimidazole, 2-methylimidazoline, 2-phenylimidazoline, 2-undecylimidazoline, 2-heptadecylimidazoline, 2-isopropylimidazole, 2,4-dimethylimidazole, 2 -Phenyl-4-methylimidazole, 2-ethylimidazoline, 2-isopropylimidazoline, 2,4-dimethylimidazoline, 2-phenyl-4-methylimidazoline and the like. These imidazole compounds may be masked with a masking agent.
Examples of such a masking agent include acrylonitrile, phenylene diisocyanate, toluidine isocyaninate, naphthalene diisocyanate, methylene bisphenyl isocyanate, melamine acrylate and the like.

  Examples of organophosphorus compounds include ethylenephosphine, propylphosphine, butylphosphine, phenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, trioctylphosphine, triphenylphosphine, tricyclohexylphosphine, triphenylphosphine / triphenylborane complex, tetra Examples include phenylphosphonium tetraphenylborate.

Secondary amines include morpholine, piperidine, pyrrolidine, dimethylamine, diethylamine, dicyclohexylamine, N-alkylarylamine, piperazine, diallylamine, thiazoline, thiomorpholine and the like.
Tertiary amines include benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (diaminomethyl) phenol, and the like.
Quaternary ammonium salts include tetrabutylammonium iodide, tetrabutylammonium bromide, tetrabutylammonium chloride, tetrabutylammonium fluoride, benzalkonium chloride, benzyldi (2-hydroxyethyl) ethylammonium chloride, decyldi (2- And hydroxyethyl) methylammonium bromide.
In addition, the said hardening accelerator may use 2 or more types together.

Examples of flame retardants include halogen-containing flame retardants containing bromine and chlorine, phosphorus flame retardants such as triphenyl phosphate, tricresyl phosphate, trisdichloropropyl phosphate, phosphazene, red phosphorus; antimony trioxide; An inorganic flame retardant is mentioned.
Other examples of UV absorbers include benzotriazole UV absorbers, examples of antioxidants include hindered phenols and styrenated phenols, and examples of adhesion improvers include urea compounds such as urea silane. And silane coupling agents.

[varnish]
Since the thermoplastic resin composition of the present invention is used for a prepreg, it is preferable that each component is blended in a state of being dissolved or dispersed in an organic solvent, and finally provided in a varnish state.

Examples of the organic solvent used here include alcohols such as methanol, ethanol, propanol and butanol; glycol ethers such as methyl cellosolve, butyl cellosolve and propylene glycol monomethyl ether; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; Esters such as butyl acetate and propylene glycol monomethyl ether acetate; Ethers such as tetrahydrofuran; Aromatic hydrocarbons such as toluene and xylene; Nitrogen-containing solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone; Dimethyl sulfoxide and the like Or a mixture of two or more of them.
Among these, methyl isobutyl ketone, methyl ethyl ketone, propylene glycol monomethyl ether and methyl cellosolve are preferable from the viewpoint of solubility, and methyl isobutyl ketone and propylene glycol monomethyl ether are more preferable from the viewpoint of low toxicity.

The blending order is preferably blended with components other than the inorganic filler after the inorganic filler is previously dispersed in the organic solvent.
When dispersing the inorganic filler in the organic solvent, a disperser such as a bead mill, a homogenizer, or a jet mill can be used to improve dispersibility. In addition, as described above, it is also preferable that the inorganic filler is pretreated with an silane or titanate coupling agent, or a surface treatment agent such as a silicone oligomer, or an integral blend treatment.

  It is preferable that the resin composition in the varnish finally obtained is 40 to 90 mass% of the whole varnish, and it is more preferable that it is 50 to 80 mass%. When the content of the resin composition in the varnish is 50% by mass or more, it becomes easy to prepare a prepreg having an appropriate resin composition adhesion amount, and when it is 80% by mass or less, the viscosity of the varnish becomes low. Coating property is improved.

<Prepreg>
Next, a prepreg using the above thermosetting resin composition will be described.
The prepreg of the present invention can be produced by coating the above-mentioned thermosetting resin composition on a glass fiber substrate by a method such as impregnation, spraying or extrusion, and semi-curing by heating or the like. In particular, a method of impregnating a substrate with the resin composition varnish and heating and semi-curing is preferable because it is excellent in productivity.

  The content ratio of the thermosetting resin composition with respect to the entire prepreg is preferably 60 to 90% by volume, more preferably 65 to 85% by volume, and still more preferably 70 to 85% by volume. In particular, when the content is 70% by volume or more, since the content ratio of the thermosetting resin composition having a large thermal conductivity is large, the thermal conductivity of the prepreg is increased. When the content is 60% by volume or less, since the content ratio of the glass fiber base material is large, rigidity and thermal expansibility are increased, but thermal conductivity is impaired.

[Glass fiber substrate]
Examples of the glass fiber substrate used for the prepreg of the present invention include E glass, D glass, S glass, and Q glass.
These glass fiber base materials have shapes such as woven fabric, non-woven fabric, robink, chopped strand mat, and surfacing mat, but the material and shape are selected depending on the intended use and performance of the laminated board, and if necessary A single material or a combination of two or more materials and shapes can be used. Those subjected to surface treatment with a silane coupling agent or the like, or those subjected to mechanical opening treatment are preferred from the viewpoints of heat resistance, moisture resistance and processability. Moreover, when improving thermal conductivity, it is preferable to use an unopened fiber.
The thickness of the glass fiber substrate is preferably 0.01 to 0.2 mm, more preferably 0.02 to 0.15 mm, and still more preferably 0.02 to 0.1 mm.

<Laminated plate>
The laminate of the present invention is formed by laminate molding using the prepreg of the present invention. For example, 1 to 20 prepregs of the present invention are stacked, and a metal foil such as copper or aluminum is arranged on one or both sides thereof, and a multistage press, a multistage vacuum press, a continuous molding machine, an autoclave molding machine, etc. are used. A metal foil-clad laminate can be produced by laminate molding at a temperature of 100 to 250 ° C., a pressure of 0.2 to 10 MPa, and a heating time of 0.1 to 5 hours. The metal foil is not particularly limited as long as it is used for electronic parts. Moreover, the prepreg of the present invention and the inner layer wiring board can be laminated and molded to produce a multilayer board.

<Method of evaluating thermal conductivity>
The thermal conductivity of the thermosetting resin composition, prepreg, and laminate can be determined by the product of thermal diffusivity, constant pressure specific heat capacity, and density. The thermal diffusivity and the constant pressure specific heat capacity can be measured by a flash method. The flash method includes a laser flash method and a xenon flash method. The constant pressure specific heat capacity can also be determined by differential scanning calorimetry (DSC). The density can be measured by the Archimedes method or the like. Since thermal conductivity is temperature dependent, all measurements are preferably made at the same temperature.

  EXAMPLES Hereinafter, although this invention is demonstrated based on an Example, this invention is not limited by these Examples.

[component]
In addition, the following were used as each component.
<Epoxy resin A>
Naphthalene type epoxy resin (manufactured by DIC Corporation, trade name: EPICLON HP4032D)
<Epoxy resin B>
Naphthalene type epoxy resin (manufactured by DIC Corporation, trade name: EPICLON EXA4070)
<Epoxy resin C>
Biphenyl type epoxy resin (product name: YL6121H, manufactured by Japan Epoxy Resin)
<Epoxy resin D>
Phenol novolac type epoxy resin (manufactured by DIC Corporation, trade name: N770M70)
<Phenolic compound (curing agent) E>
Catechol / resorcinol novolak (manufactured by Hitachi Chemical Co., Ltd., material name: A-4, number average molecular weight: 430, ratio of resorcinol to the total number of catechol and resorcinol novolak: 95%,
Cyclohexanone 50% dilution)
<Phenolic compound (curing agent) F>
Cresol novolac type phenolic resin (Dainippon Ink Chemical Co., Ltd., trade name: KA-1165)
<Curing accelerator G>
2-Ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd., trade name: 2E4MZ)
<Inorganic filler H>
Aluminum oxide Al ₂ O ₃
(Product name: AA-1.5, AA-0.4, manufactured by Sumitomo Chemical Co., Ltd.)
<Surface treatment agent I>
Silane coupling agent (trade name: KBM573, manufactured by Shin-Etsu Chemical Co., Ltd.)

Example 1
(Preparation of varnish of thermosetting resin composition)
Of the resin compositions shown in Table 1, first, 1000 g of inorganic filler H (aluminum oxide) was used, and 10 g of surface treatment agent I (silane coupling agent) satisfying the minimum covering area was added and dry-treated. . Next, 193.3 g of epoxy resin A (epoxy resin having a naphthalene skeleton) as an epoxy resin and 84.1 g of phenolic compound E (catechol / resorcinol novolak) (weight not including cyclohexanone) are mixed solvent of 200 g of cyclohexanone and 125 g of methyl ethyl ketone. The mixture was stirred until it was uniformly dispersed. Further, the inorganic filler H (aluminum oxide) is added with stirring, and after the dispersion and other components are sufficiently mixed, 0.83 g of a curing accelerator G (2-ethyl-4-methylimidazole) is added to the whole. Was stirred until. Finally, 25 g of methyl ethyl ketone and 50 g of cyclohexanone were added to adjust the concentration so that the viscosity was appropriate for coating, and a varnish of the resin composition was obtained.

(Preparation of resin plate for thermal conductivity evaluation)
Moreover, the resin composition powder was obtained from a film obtained by coating the varnish of the resin composition on a glass plate and heating and drying at 150 ° C. for 5 minutes. The resin composition powder was molded at a temperature of 185 ° C. and a pressure of 4 MPa for 1.5 hours to obtain a resin plate having a thickness of 1 mm. The resin plate was cut to a size of 10 mm square to produce a resin plate for thermal conductivity evaluation.

(Preparation of prepreg)
Next, the varnish of the resin composition is impregnated with E glass cloth (Asahi Kasei E-Materials Co., Ltd., trade name: AS750, thickness 0.06 mm, thermal conductivity of E glass 1.03 W / mK). And dried by heating at 160 ° C. for 5 minutes to obtain a prepreg having a resin composition content of 70% by volume.

(Preparation of thermal conductivity evaluation board)
Next, 6 sheets of this prepreg are stacked, 18 μm electrolytic copper foils are arranged on the top and bottom, and laminated molding is performed at a temperature of 185 ° C. and a pressure of 4 MPa for 1.5 hours to obtain a copper clad laminate (thickness 0.45 mm) It was. After removing the copper foil of the copper-clad laminate with an etching solution, it was cut into a 10 mm square size to produce a thermal conductivity evaluation substrate.

(Evaluation of thermal conductivity)
The thermal conductivity was evaluated using a xenon flash method (Nano Flash LEA447, manufactured by NETZSCH), a constant pressure specific heat capacity using DSC (PE Pyris Series Pyris1, manufactured by PerkinElmer), and a density measured by an electronic hydrometer. (SD-200L, manufactured by Alpha Mirage) and calculated by the product of these. The thermal diffusivity and density were measured at 25 ° C., and the specific heat capacity at 25 ° C. was also derived by measurement for the constant pressure specific heat capacity measurement.

Examples 2-3 and Comparative Examples 1-5
The operation was performed in the same manner as in Example 1 except that the types and mixing ratios of the components were as shown in Table 1.

(result)
As is clear from the comparison between Examples 1 and 2 and Comparative Examples 1 to 4, the resin composition of the present invention has a small decrease in thermal conductivity when impregnated into a glass fiber substrate to form a laminate, and the laminate The thermal conductivity of increases.

That is, Examples 1-2 and Comparative Examples 1-4 have the same content of the resin composition and the glass fiber substrate in the laminate (resin composition 70% by mass, glass fiber substrate 30% by mass). ). And the difference (1)-(2) of the thermal conductivity (1) of a resin composition and the thermal conductivity (2) of a laminated board is 0.27-0.32 W / mK in Examples 1-2. On the other hand, in Comparative Examples 1-4, it is 0.34-0.48 W / mK, and the resin composition of Examples 1-2 has a small decrease in thermal conductivity when used as a laminate. In other words, as described in the bottom column of Table 1, the rate of decrease in thermal conductivity {(1)-(2)} / (1) is 15 to 18% in Examples 1-2. On the other hand, in Comparative Examples 1-4, it is 21-26%, and the resin composition of Examples 1-2 has a small decrease rate of the thermal conductivity when it is used as a laminate. Therefore, the thermal conductivity of a laminated board is larger in Examples 1-2 than Comparative Examples 1-4.
Further, when Example 1 and Comparative Example 2 are compared, the thermal conductivity of the resin composition is the same as 1.85 W / mK, whereas the thermal conductivity in the case of the laminated plate is 1 in Example 1. .58 W / mK (reduction amount (1)-(2) = 0.27), while in Comparative Example 2, 1.37 W / mK (reduction amount (1)-(2) = 0.48) And compared with the resin composition of Comparative Example 2, the resin composition of Example 1 has a small decrease in thermal conductivity when used as a laminate. In other words, the rate of decrease in thermal conductivity {(1)-(2)} / (1) is 15% in Example 1, compared with 26% in Comparative Example 2, and Example 1 Compared with the resin composition of Comparative Example 2, this resin composition has a lower rate of decrease in thermal conductivity when used as a laminate. Therefore, the thermal conductivity of the laminate is higher in Example 1 than in Comparative Example 2.
Furthermore, when Example 1 and Comparative Example 5 are compared, although the content of the resin composition in the laminated plate is less than 10% by volume in Example 1 than in Comparative Example 5, the rate of decrease in thermal conductivity is {(1)-(2)} / (1) is the same as 15%.
Therefore, according to the present invention, a thermosetting resin composition excellent in thermal conductivity and suitable for semiconductor packages and printed wiring boards, a prepreg using the same, and a laminate can be obtained.

  The thermosetting resin composition of the present invention, the prepreg using the same, and the laminate are suitably used for the production of semiconductor packages and printed wiring boards.

Claims (7)

An epoxy resin represented by the following general formula (1):
Following general formula (2) Ri greens by blending a phenolic compound having a repeating structure represented by the repeating structural及beauty under following general formula (3) represented by the sum of catechol and resorcinol in the phenolic compound The thermosetting resin composition whose abundance ratio of resorcinol with respect to number is 80% or more and less than 100% .

[In the formula (1), m is an integer of 0, n is an integer of 0, R ₁ and R ₂ are each independently hydrogen or an alkyl group having 1 to 10 carbon atoms. ] The thermosetting resin composition according to claim 1, wherein the average molecular weight the phenolic compound has a number is 300 to 600. The thermosetting resin composition contains an inorganic filler composed of one or more selected from aluminum oxide, magnesium oxide, magnesium hydroxide, silicon oxide, and boron nitride,
The thermosetting resin composition according to claim 1 or 2, wherein a content of the inorganic filler with respect to the entire thermosetting resin composition is 30 to 70% by volume.   The thermosetting resin composition according to claim 3, wherein the inorganic filler is surface-treated with a surface treatment agent. The thermosetting resin composition according to any one of claims 1 to 4,
A prepreg containing a glass fiber substrate.   The prepreg according to claim 5, wherein the content of the thermosetting resin composition with respect to the entire prepreg is 60 to 90% by volume.   A laminate obtained by laminating the prepreg according to claim 5 or 6.