JP5689724B2

JP5689724B2 - Copper alloy plate for electrical and electronic parts

Info

Publication number: JP5689724B2
Application number: JP2011073292A
Authority: JP
Inventors: 進也桂; 三輪　洋介; 洋介三輪
Original assignee: Kobe Steel Ltd
Current assignee: Kobe Steel Ltd
Priority date: 2011-03-29
Filing date: 2011-03-29
Publication date: 2015-03-25
Anticipated expiration: 2031-03-29
Also published as: JP2012207261A

Description

本発明は、端子、コネクタ及びリレー等の電気電子部品用材料、リードフレーム及び放熱板等の半導体機器に使用される部品用材料、並びに自動車用ジャンクションブロック及び民生用電気機器等に使用される電気回路用材料等に使用される電気電子部品用銅合金板に関し、特に、強度、導電性、曲げ加工性及び耐応力緩和特性を向上させた電気電子部品用銅合金板に関する。 The present invention relates to materials for electrical and electronic parts such as terminals, connectors and relays, material for parts used for semiconductor equipment such as lead frames and heat sinks, and electrical equipment used for automobile junction blocks and consumer electrical equipment. More particularly, the present invention relates to a copper alloy plate for electric and electronic parts having improved strength, conductivity, bending workability and stress relaxation resistance.

近時、例えば自動車分野においては、環境規制への対応又は快適性及び安全性等の向上への要求から、多くの電気電子機器が搭載されるようになり、使用される端子、コネクタ及びリレー等の電気電子部品、リードフレーム及び放熱板等の半導体機器用部品、並びに自動車用ジャンクションブロック及び民生用電気機器等に使用される電気回路は、挟ピッチ化及び小型化が進められている。また、情報通信分野及び民生分野等においても、同様の要求により、電気電子部品等における挟ピッチ化及び小型化が進められている。 Recently, in the automotive field, for example, many electrical and electronic devices have been installed to meet environmental regulations or to improve comfort and safety. Terminals, connectors, relays, etc. used The electrical circuits used in such electrical and electronic parts, semiconductor frame parts such as lead frames and heat sinks, and automobile junction blocks and consumer electrical equipment have been increasingly reduced in pitch and size. In the information communication field and the consumer field, etc., a narrow pitch and a small size are being promoted in electrical and electronic parts and the like due to similar requirements.

これらの電気電子部品等には、高強度のみならず、高い導電率、プレス成形時の優れた曲げ加工性が要求され、更に、例えばエンジンルーム等の高温環境化における通電性を維持するために、耐応力緩和特性が高いことが要求される。 These electrical and electronic parts are required to have not only high strength but also high electrical conductivity and excellent bending workability at the time of press molding. In addition, high stress relaxation resistance is required.

よって、電気電子部品等に使用される銅合金材料において、強度特性、導電性、曲げ加工性又は耐応力緩和特性を向上させる技術が種々提案されている。例えば、特許文献１乃至３において、本願出願人は、Ｃｕ−Ｆｅ−Ｐ系合金において、組成制御を行うことにより、電気電子部品用の銅合金材料において、強度特性、導電性、曲げ加工性又は耐応力緩和性の２以上の項目を両立させる技術を提案した。 Therefore, various techniques for improving strength characteristics, conductivity, bending workability, or stress relaxation resistance have been proposed for copper alloy materials used for electrical and electronic parts and the like. For example, in Patent Documents 1 to 3, the applicant of the present application performs composition control in a Cu-Fe-P-based alloy, so that the strength characteristics, conductivity, bending workability or We proposed a technique to achieve two or more items of stress relaxation resistance.

即ち、特許文献１において、本願出願人は、Ｆｅ：０．５乃至２．４質量％、Ｓｉ：０．０２乃至０．１質量％、Ｍｇ：０．０１乃至０．２質量％、Ｓｎ：０．０１乃至０．７質量％、Ｚｎ：０．０１乃至０．２質量％、Ｐ：０．０３質量％未満、Ｎｉ：０．０３質量％以下及びＭｎ：０．０３質量％を含有し、残部がＣｕ及び不可避的不純物からなる電気電子部品用銅合金を提案し、電気電子部品用の銅合金材料において、耐力、導電率、ばね限界値、耐応力緩和特性及び曲げ加工性を向上させる技術を提案した。 That is, in Patent Document 1, the applicant of the present application is Fe: 0.5 to 2.4 mass%, Si: 0.02 to 0.1 mass%, Mg: 0.01 to 0.2 mass%, Sn: 0.01 to 0.7% by mass, Zn: 0.01 to 0.2% by mass, P: less than 0.03% by mass, Ni: 0.03% by mass or less, and Mn: 0.03% by mass , Proposing a copper alloy for electric and electronic parts with the balance being Cu and inevitable impurities, and improving the yield strength, conductivity, spring limit value, stress relaxation resistance and bending workability in copper alloy materials for electric and electronic parts Proposed technology.

また、特許文献２において、本願出願人は、Ｆｅ：１．０乃至２．５質量％、Ｓｉ：０．００５乃至０．１質量％、Ｓｎ：０．０５乃至０．５質量％、Ｍｇ：０．０５乃至０．５質量％、Ｚｎ：０．０１乃至１．０質量％、Ｈ：０．０００１質量％以下及びＯ：０．００４質量％以下を含有し、残部がＣｕ及び不可避的不純物からなる銅合金板又は銅合金条を提案し、特に自動車用の高電圧環境化で使用される端子用材料において、曲げ加工性、ばね限界値、耐応力緩和特性等を向上させる技術を提案した。 In Patent Document 2, the applicant of the present application is Fe: 1.0 to 2.5% by mass, Si: 0.005 to 0.1% by mass, Sn: 0.05 to 0.5% by mass, Mg: 0.05 to 0.5% by mass, Zn: 0.01 to 1.0% by mass, H: 0.0001% by mass or less and O: 0.004% by mass or less, with the balance being Cu and inevitable impurities We proposed a copper alloy plate or copper alloy strip made of the above, and in particular, a technology for improving bending workability, spring limit value, stress relaxation resistance, etc. in terminal materials used in high voltage environments for automobiles. .

更に、特許文献３において、本願出願人は、Ｆｅ：１．６乃至２．４質量％、Ｓｉ：０．０２乃至０．２質量％、Ｚｎ：０．２乃至３．０質量％、Ｍｇ：０．０１乃至０．４質量％、Ｓｎ：０．０１乃至０．２質量％、Ｐ：０．０１質量％未満、Ｎｉ：０．０３質量％以下、Ｍｎ：０．０３質量％以下を含有し、残部がＣｕ及び不可避的不純物からなる銅合金を提案し、配線接続用の銅合金において、耐力、導電率、耐応力緩和特性を向上させる技術を提案した。 Furthermore, in Patent Document 3, the applicant of the present application is Fe: 1.6 to 2.4 mass%, Si: 0.02 to 0.2 mass%, Zn: 0.2 to 3.0 mass%, Mg: 0.01 to 0.4% by mass, Sn: 0.01 to 0.2% by mass, P: less than 0.01% by mass, Ni: 0.03% by mass or less, Mn: 0.03% by mass or less And the copper alloy which remainder consists of Cu and an unavoidable impurity was proposed, and the technique which improves a yield strength, electrical conductivity, and stress relaxation resistance was proposed in the copper alloy for wiring connection.

また、特許文献４及び５において、本願発明者はＣｕ−Ｆｅ−Ｐ系合金において、組成に加えて、更に、圧延表面における板幅方向の平均結晶粒径を３乃至６０μｍとすることにより、プレス打ち抜き加工性及び曲げ加工性を向上させる技術を提案した。 In addition, in Patent Documents 4 and 5, the inventor of the present application, in addition to the composition, in the Cu-Fe-P alloy, further presses the average grain size in the plate width direction on the rolled surface to 3 to 60 μm. A technique to improve punching and bending workability was proposed.

特開２００１−１３１６５７号公報JP 2001-131657 A 特開２００２−２９４３６２号公報JP 2002-294362 A 特開２００３−３２１７２０号公報JP 2003-321720 A 特開２０００−１０４１３１号公報JP 2000-104131 A 特開２００６−３７２３７号公報JP 2006-37237 A

しかしながら、上述の従来技術には、以下に示すような問題点がある。特許文献１乃至３の銅合金においては、組成制御により強度特性を向上させているが、銅合金組織における検討が不十分である。即ち、Ｃｕ−Ｆｅ−Ｐ系合金においては、Ｆｅ−Ｐ化合物の第二相粒子が析出することにより銅合金の強度特性を向上させることができるが、特許文献１乃至３の技術は、銅合金組織の制御についての検討が不十分であり、Ｆｅ−Ｐ系析出物を銅合金組織中に分散させるための析出物制御についての検討も不十分である。 However, the above-described prior art has the following problems. In the copper alloys of Patent Documents 1 to 3, the strength characteristics are improved by composition control, but studies on the copper alloy structure are insufficient. That is, in the Cu-Fe-P alloy, the strength characteristics of the copper alloy can be improved by precipitation of the second phase particles of the Fe-P compound. The study on the structure control is insufficient, and the study on the precipitate control for dispersing the Fe—P-based precipitate in the copper alloy structure is also insufficient.

特許文献４及び５の技術は、銅合金組織の制御について、圧延表面における平均結晶粒径を所定値に制御することにより、プレス打ち抜き加工性及び曲げ加工性を向上させることが開示されているものの、上述の如く、Ｃｕ−Ｆｅ−Ｐ系合金においては、Ｃｕ母相中にＦｅ−Ｐ系の第二相粒子が析出した二相組織が形成される。よって、圧延表面における銅合金組織を規定するだけでは、所定の曲げ加工性が得られない場合がある。 Although the techniques of Patent Documents 4 and 5 are disclosed to improve the press punching workability and the bending workability by controlling the average crystal grain size on the rolled surface to a predetermined value for the control of the copper alloy structure. As described above, in the Cu—Fe—P based alloy, a two-phase structure is formed in which Fe—P based second phase particles are precipitated in the Cu matrix. Therefore, the predetermined bending workability may not be obtained only by defining the copper alloy structure on the rolled surface.

本発明はかかる問題点に鑑みてなされたものであって、Ｃｕ−Ｆｅ−Ｐ系銅合金板において、高強度、高導電性、良好な曲げ加工性及び高い耐応力緩和特性を両立させた電気電子部品用銅合金板を提供することを目的とする。 The present invention has been made in view of such a problem, and in a Cu-Fe-P-based copper alloy plate, an electric power having both high strength, high conductivity, good bending workability and high stress relaxation resistance. It aims at providing the copper alloy plate for electronic components.

本発明に係る電気電子部品用銅合金板は、
Ｆｅ：２．５乃至３．５質量％及びＰ：０．００１乃至０．０５０質量％を含有し、残部が銅及び不可避的不純物からなる組成を有し、
又は、
Ｆｅ：２．５乃至３．５質量％及びＰ：０．００１乃至０．０５０質量％を含有し、更に、Ｍｇ：０．０５質量％以上０．４０質量％以下であり、残部が銅及び不可避的不純物からなる組成を有し、
又は、
Ｆｅ：２．５乃至３．５質量％及びＰ：０．００１乃至０．０５０質量％を含有し、更に、Ｓｎ：０．１質量％以上１．０質量％以下であり、残部が銅及び不可避的不純物からなる組成を有し、
又は、
Ｆｅ：２．５乃至３．５質量％及びＰ：０．００１乃至０．０５０質量％を含有し、更に、Ｚｎ：０．５質量％以上２．０質量％以下であり、残部が銅及び不可避的不純物からなる組成を有し、
又は、
Ｆｅ：２．５乃至３．５質量％及びＰ：０．００１乃至０．０５０質量％を含有し、更に、Ｍｇ：０．０１質量％以上０．４０質量％以下、Ｓｎ：０．０３質量％以上１．５０質量％以下及びＺｎ：０．５質量％以上２．０質量％以下であり、残部が銅及び不可避的不純物からなる組成を有し、
Ｃｕ母相中に第二相粒子が析出した二相組織を有する電気電子部品用銅合金板であって、
圧延方向及び板厚方向を含む断面において、前記母相の前記板厚方向における平均結晶粒径Ｄ_ｎが２乃至１５μｍであり、前記母相の前記圧延方向における平均結晶粒径をＤ_Ｌとして、前記板厚方向における平均結晶粒径をＤ_ｎに対する比Ｄ_Ｌ／Ｄ_ｎが１．５以上であり、前記第二相粒子の前記圧延方向における平均結晶粒径をＤ_Ｌ２、前記第二相粒子の前記板厚方向における平均結晶粒径をＤ_ｎ２として、比Ｄ_Ｌ２／Ｄ_ｎ２が５以下であることを特徴とする。 The copper alloy plate for electrical and electronic parts according to the present invention is:
Fe: 2.5 to 3.5 mass% and P: 0.001 to contain 0.050 wt%, has a composition remaining portion is made of copper and unavoidable impurities,
Or
Fe: 2.5 to 3.5 mass% and P: 0.001 to 0.050 mass%, Mg: 0.05 mass% or more and 0.40 mass% or less, with the balance being copper and Having a composition consisting of inevitable impurities,
Or
Fe: 2.5 to 3.5% by mass and P: 0.001 to 0.050% by mass, Sn: 0.1% by mass to 1.0% by mass, with the balance being copper and Having a composition consisting of inevitable impurities,
Or
Fe: 2.5 to 3.5% by mass and P: 0.001 to 0.050% by mass, Zn: 0.5% by mass to 2.0% by mass, the balance being copper and Having a composition consisting of inevitable impurities,
Or
Fe: 2.5 to 3.5 mass% and P: 0.001 to 0.050 mass%, Mg: 0.01 mass% to 0.40 mass%, Sn: 0.03 mass% %: 1.50% by mass or less and Zn: 0.5% by mass or more and 2.0% by mass or less, with the balance being composed of copper and inevitable impurities,
A copper alloy plate for electrical and electronic parts having a two-phase structure in which second phase particles are precipitated in a Cu matrix,
In the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is D _L , the ratio D _{L /} D _n the average crystal grain size in the thickness direction with respect to D _n is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles D _L2, the second-phase particles the average crystal grain size in the thickness direction _{D n2} of the ratio _D L2 _{/ D n2} is equal to or more than 5.

本発明に係る電気電子部品用銅合金板は、更に、Ｓｉ：０．０１乃至０．１０質量％及びＮｉ：０．０１乃至０．５０質量％からなる群から選択された１種以上を含有する組成を有することが好ましい。また、電気電子部品用銅合金板は、更に、Ｃｒ：０．００１乃至０．３００質量％及びＭｎ：０．０１乃至０．５０質量％からなる群から選択された１種以上を含有する組成を有することができる。更にまた、電気電子部品用銅合金板は、更に、Ｓの含有量を０．００５質量％以下に規制した組成を有することが好ましい。 The copper alloy plate for electrical and electronic parts according to the present invention further contains one or more selected from the group consisting of Si: 0.01 to 0.10% by mass and Ni: 0.01 to 0.50% by mass. It is preferable to have a composition that Moreover, the copper alloy plate for electrical and electronic parts further contains one or more selected from the group consisting of Cr: 0.001 to 0.300 mass% and Mn: 0.01 to 0.50 mass%. Can have. Furthermore, the copper alloy plate for electrical and electronic parts preferably further has a composition in which the S content is regulated to 0.005 mass% or less.

上述の電気電子部品用銅合金板は、更に、Ｂ、Ｃ、Ｃａ、Ｖ、Ｇａ、Ｇｅ、Ｎｂ、Ｍｏ、Ｈｆ、Ｔａ、Ｂｉ及びＰｂからなる群から選択された１種以上を夫々０．０００１質量％以上含有し、総量で０．１質量％以下含有する組成を有することができ、更に、Ｂｅ、Ａｌ、Ｔｉ、Ｃｏ、Ｚｒ、Ａｇ、Ｃｄ、Ｉｎ、Ｓｂ、Ｔｅ、及びＡｕからなる群から選択された１種以上を夫々０．００１質量％以上含有し、総量で０．９００質量％以下含有する組成を有することが好ましい。 The above-described copper alloy plate for electric and electronic parts is further provided with one or more selected from the group consisting of B, C 1 , Ca, V, Ga, Ge, Nb, Mo, Hf, Ta, Bi, and Pb. 0.001% by mass or more, and 0.1% by mass or less in total, and further, Be, Al, Ti , Co, Zr, Ag, Cd, In, Sb, Te, and Au It is preferable to have a composition containing 0.001% by mass or more of at least one selected from the group consisting of 0.900% by mass or less in total.

本発明によれば、Ｆｅ及びＰを含有し、Ｃｕ母相中に第二相粒子が析出した二相組織を有する電気電子部品用銅合金板において、Ｆｅ、Ｐ、Ｍｇ、Ｓｎ及びＺｎの含有量を適正範囲とし、更に、圧延方向及び板厚方向を含む断面において、母相の平均結晶粒径及び各方向における平均結晶粒比、並びに第二相粒子の各方向における平均結晶粒比を適正範囲に規定している。よって、電気電子部品用銅合金板において、Ｆｅ−Ｐの析出物により高強度を得ながら、高導電性、良好な曲げ加工性及び高い耐応力緩和特性を両立させることができる。 According to the present invention, in a copper alloy plate for electrical and electronic parts containing Fe and P and having a two-phase structure in which second phase particles are precipitated in a Cu matrix, Fe, P, Mg, Sn and Zn are contained. In the cross-section including the rolling direction and the plate thickness direction, the amount is in an appropriate range, and the average crystal grain size of the parent phase and the average crystal grain ratio in each direction, and the average crystal grain ratio in each direction of the second phase particles are appropriate. Stipulated in the scope. Therefore, in the copper alloy plate for electric and electronic parts, it is possible to achieve both high conductivity, good bending workability, and high stress relaxation resistance while obtaining high strength by the Fe-P precipitate.

以下、本発明の実施の形態について具体的に説明する。本願発明者等は、Ｃｕ−Ｆｅ−Ｐ系合金板において、高強度、高導電性、良好な曲げ加工性及び高い耐応力緩和特性を両立させるべく、種々実験検討を行った。その結果、Ｆｅ及びＰを所定範囲で添加すれば、Ｆｅ−Ｐの第二相粒子がＣｕ母相中に析出し、これにより、強度特性及び導電性が向上し、Ｃｕ合金中に固溶したＰにより耐応力緩和特性が向上することを知見した。また、曲げ加工性及び導電率の低下を抑制するためには、Ｍｇ、Ｓｎ及びＺｎの添加量を所定範囲とすればよいことを知見した。即ち、本発明の電気電子部品用銅合金板は、Ｆｅ：２．５乃至３．５質量％、Ｐ：０．００１乃至０．０５０質量％を含有し、更に、Ｍｇ：０質量％以上０．４０質量％以下、Ｓｎ：０質量％以上１．５０質量％以下及びＺｎ：０質量％以上２．０質量％以下であり、残部が銅及び不可避的不純物からなる組成を有する。 Hereinafter, embodiments of the present invention will be specifically described. The inventors of the present application conducted various experimental studies in order to achieve both high strength, high conductivity, good bending workability and high stress relaxation resistance in the Cu—Fe—P alloy plate. As a result, if Fe and P are added in a predetermined range, the second phase particles of Fe-P are precipitated in the Cu matrix, thereby improving the strength characteristics and conductivity and dissolving in the Cu alloy. It has been found that the stress relaxation resistance is improved by P. Moreover, in order to suppress the fall of bending workability and electrical conductivity, it discovered that the addition amount of Mg, Sn, and Zn should just be made into a predetermined range. That is, the copper alloy plate for electrical and electronic parts of the present invention contains Fe: 2.5 to 3.5% by mass, P: 0.001 to 0.050% by mass, and Mg: 0% by mass to 0% by mass. .40 mass% or less, Sn: 0 mass% or more and 1.50 mass% or less and Zn: 0 mass% or more and 2.0 mass% or less, with the balance being composed of copper and inevitable impurities.

そして、この二相組織を有するＣｕ−Ｆｅ−Ｐ系の合金板において、組織制御を適正に行うことにより、電気電子部品用の合金板として曲げ加工性も向上することを知見し、本発明を見出した。即ち、本発明においては、圧延方向及び板厚方向を含む断面において、母相の板厚方向における平均結晶粒径Ｄ_ｎは、２乃至１５μｍであり、母相の圧延方向における平均結晶粒径をＤ_Ｌとして、板厚方向における平均結晶粒径Ｄ_ｎに対する比Ｄ_Ｌ／Ｄ_ｎが１．５以上であり、第二相粒子の圧延方向における平均結晶粒径をＤ_Ｌ２、第二相粒子の板厚方向における平均結晶粒径をＤ_ｎ２として、比Ｄ_Ｌ２／Ｄ_ｎ２が５以下である。 And in the Cu-Fe-P alloy plate having this two-phase structure, it has been found that bending workability is improved as an alloy plate for electric and electronic parts by appropriately controlling the structure. I found it. That is, in the present invention, in the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is as D _L, the ratio _D L / _{D n} to the average grain size _{D n} in the sheet thickness direction is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles _{D L2,} of the second-phase particles the average grain size in the sheet thickness direction _{D n2,} the ratio _D L2 _{/ D n2} is 5 or less.

以下、本発明における数値限定理由について説明する。 Hereinafter, the reason for the numerical limitation in the present invention will be described.

「Ｆｅ：２．５乃至３．５質量％」
Ｆｅは銅合金板の製造工程において、熱処理により、Ｐと結びついてＦｅ−Ｐ系化合物を生成し、銅合金組織内にＦｅ−Ｐ系化合物が析出して第二相粒子が形成されることにより、強度特性及び導電性が向上する。また、Ｆｅの添加により、銅合金の耐熱性も改善される。更に、Ｃｕ合金中にＦｅ単体を分散させることによっても、強度特性が向上する。Ｆｅの含有量が２．５質量％を下回ると、銅合金材料の強度特性を向上させる効果を十分に得られなくなる。一方、Ｆｅの含有量が３．５質量％を超えると、銅合金板の曲げ加工性が低下しやすくなる。よって、本発明においては、電気電子部品用銅合金に必要な強度特性を得るために、Ｆｅの添加量を２．５乃至３．５質量％とする。Ｆｅの添加量は、望ましくは２．６乃至３．０質量％である。 “ Fe: 2.5 to 3.5 mass% ”
In the manufacturing process of the copper alloy sheet, Fe is combined with P by heat treatment to form an Fe—P compound, and the Fe—P compound is precipitated in the copper alloy structure to form second phase particles. , Strength characteristics and conductivity are improved. Moreover, the heat resistance of a copper alloy is also improved by addition of Fe. Further, the strength characteristics are improved by dispersing Fe alone in the Cu alloy. When the Fe content is less than 2.5% by mass, the effect of improving the strength characteristics of the copper alloy material cannot be obtained sufficiently. On the other hand, if the Fe content exceeds 3.5% by mass, the bending workability of the copper alloy plate tends to be lowered. Therefore, in the present invention, in order to obtain the strength characteristics necessary for the copper alloy for electric and electronic parts, the additive amount of Fe is set to 2.5 to 3.5% by mass. The amount of Fe added is desirably 2.6 to 3.0% by mass.

「Ｐ：０．００１乃至０．０５０質量％」
Ｐは銅合金板の製造工程において、熱処理により、Ｆｅと結びついてＦｅ−Ｐ系化合物を生成し、銅合金組織内にＦｅ−Ｐ系の第二相粒子が析出することにより、強度特性及び導電性が向上する。また、Ｐの添加により、銅合金の耐熱性も改善される。更に、Ｃｕ合金に固溶したＰは耐応力緩和特性を向上させる。Ｐの含有量が０．００１質量％を下回ると、Ｆｅ−Ｐ系化合物の生成が不十分となり、銅合金材料の強度特性を向上させる効果を十分に得られなくなり、Ｐの含有量が０．０５０質量％を上回ると、銅合金板の導電性、曲げ加工性が低下しやすくなる。よって、本発明においては、電気・電子部品用銅合金に必要な強度特性を得るために、Ｐの添加量を０．００１乃至０．０５０質量％とする。 “ P: 0.001 to 0.050 mass% ”
In the copper alloy sheet manufacturing process, P is combined with Fe to form an Fe—P compound by heat treatment, and Fe—P system second phase particles are precipitated in the copper alloy structure. Improves. Moreover, the heat resistance of a copper alloy is also improved by addition of P. Furthermore, P dissolved in the Cu alloy improves the stress relaxation resistance. When the P content is less than 0.001% by mass, the generation of Fe—P compounds becomes insufficient, and the effect of improving the strength characteristics of the copper alloy material cannot be sufficiently obtained. When it exceeds 050 mass%, the electrical conductivity and bending workability of the copper alloy plate tend to decrease. Therefore, in the present invention, in order to obtain the strength characteristics necessary for the copper alloy for electric / electronic parts, the addition amount of P is set to 0.001 to 0.050 mass%.

「母相の板厚方向における平均結晶粒径Ｄ _ｎ：２乃至１５μｍ」
端子等の電気電子部品用銅合金に要求される曲げ加工性は、一般的には、平均結晶粒径が小さく、かつ結晶粒径のばらつきが小さいほど良好となる。平均結晶粒径を小さくするためには、再結晶を伴う焼鈍温度を比較的低温に制御する方法があるが、Ｃｕ−Ｆｅ−Ｐ系合金の結晶粒成長は局部的に不均一になることが多く、そのため、ある程度結晶粒を成長させた組織の方が、曲げ加工性の確保には好適である。圧延方向及び板厚方向を含む断面において、母相の板厚方向における平均結晶粒径Ｄ_ｎが２μｍ未満であると、組織中に再結晶前の圧延組織が残留し、曲げ加工性及び耐応力緩和特性が劣化する。また、再結晶後の冷間加工量が大きいことにより、母相の板厚方向における平均結晶粒径Ｄ_ｎが２μｍ未満となる場合においても、組織中に過剰な歪みが蓄積されて曲げ加工性が劣化する。一方、母相の平均結晶粒径Ｄ_ｎが１５μｍを超えると、結晶粒界への応力集中が顕著となり、曲げ加工性が劣化する。よって、本発明においては、母相の板厚方向における平均結晶粒径Ｄ_ｎを２乃至１５μｍとする。母相の板厚方向における平均結晶粒径Ｄ_ｎは、望ましくは５乃至１０μｍである。 “ Average crystal grain size D _n in the thickness direction of the parent phase : 2 to 15 μm ”
The bending workability required for copper alloys for electrical and electronic parts such as terminals generally becomes better as the average crystal grain size is smaller and the variation in crystal grain size is smaller. In order to reduce the average crystal grain size, there is a method of controlling the annealing temperature with recrystallization to a relatively low temperature, but the crystal grain growth of the Cu-Fe-P alloy may be locally non-uniform. For this reason, a structure in which crystal grains are grown to some extent is more suitable for securing bending workability. In the rolling direction and the cross section including a thickness direction, the average crystal grain size D _n in the thickness direction of the matrix phase is less than 2 [mu] m, recrystallization previous rolled structure remains in the tissue, bending workability and stress The relaxation characteristics deteriorate. Further, by cold working amount after recrystallization is large, when the average crystal grain size D _n in the thickness direction of the matrix phase is less than 2μm is also bent is excessive strain accumulates in the tissue processability Deteriorates. On the other hand, when the average crystal grain size D _{n of} the parent phase exceeds 15 μm, the stress concentration at the crystal grain boundary becomes remarkable, and the bending workability deteriorates. Therefore, in the present invention, the average crystal grain size D _n in the thickness direction of the parent phase is set to 2 to 15 μm. The average crystal grain size D _n in the thickness direction of the mother phase is desirably 5 to 10 μm.

「母相の板厚方向における平均結晶粒径Ｄ _ｎに対する圧延方向における平均結晶粒径Ｄ _Ｌの比Ｄ _Ｌ／Ｄ _ｎ：１．５以上」
銅合金板において、結晶粒の形状は曲げ加工性に大きな影響を与える。即ち、一般的には、圧延が施された銅合金板は、曲げ加工の際に、圧延方向に平行方向の曲げ軸を中心とした曲げ加工（Ｂ．Ｗ．（ＢａｄＷａｙ）曲げ）が施されるが、近時の電気電子部品への小型化への要求から、圧延方向に垂直な（板厚）方向の曲げ軸を中心とした曲げ加工（Ｇ．Ｗ．（ＧｏｏｄＷａｙ）曲げ）における加工性の向上も望まれている。よって、本発明においては、特に、Ｇ．Ｗ．曲げ加工性に優れた銅合金板を得るために、圧延方向及び板厚方向を含む断面において、母相の圧延方向における平均結晶粒径Ｄ_Ｌを、母相の板厚方向における平均結晶粒径Ｄ_ｎに対する比Ｄ_Ｌ／Ｄ_ｎで１．５以上に制御する。この比Ｄ_Ｌ／Ｄ_ｎが１．５未満であると、Ｇ．Ｗ曲げ加工性が低下し、例えば曲げ加工後の銅合金材料の外表面に割れが発生する。 “ Ratio D _L / D _n of average crystal grain size D _L in the rolling direction to average crystal grain size D _n in the thickness direction of the parent phase : 1.5 or more ”
In a copper alloy plate, the shape of crystal grains has a great influence on the bending workability. That is, in general, a rolled copper alloy sheet is subjected to a bending process (BW (Bad Way) bending) around a bending axis parallel to the rolling direction. However, due to the recent demand for miniaturization of electric and electronic parts, in bending work (GW (Good Way) bending) around the bending axis in the (plate thickness) direction perpendicular to the rolling direction. Improvement of workability is also desired. Therefore, in the present invention, in particular, G.I. W. To obtain a bending excellent in the copper alloy sheet, in a cross section including the rolling direction and the thickness direction, the average crystal grain size D _L in the rolling direction of the matrix, the average crystal grain size in the thickness direction of the matrix The ratio D _L / D _n with respect to D _n is controlled to 1.5 or more. When this ratio D _L / D _n is less than 1.5, G.I. W bending workability falls, for example, a crack generate | occur | produces in the outer surface of the copper alloy material after bending.

「第二相粒子の板厚方向における平均結晶粒径Ｄ _ｎ２に対する圧延方向における平均結晶粒径Ｄ _Ｌ２の比Ｄ _Ｌ２／Ｄ _ｎ２：５以下」
Ｃｕ−Ｆｅ−Ｐ系合金においては、Ｆｅ−Ｐ化合物又はＦｅが母相中に析出して第二相粒子が形成され、これがＣｕ母相中に分散することによって高い強度特性が得られる。この第二相中のＦｅ−Ｐ化合物及びＦｅに起因する第二相粒子は、銅合金の曲げ加工性に大きく影響を及ぼす。本発明においては、圧延方向及び板厚方向を含む断面において、第二相粒子の圧延方向における平均結晶粒径Ｄ_Ｌ２を板厚方向における平均結晶粒径Ｄ_ｎ２に対する比Ｄ_Ｌ２／Ｄ_ｎ２で最適化することにより、電気電子部品用材料として使用される銅合金板において、特に、Ｇ．Ｗ．曲げの際に有用な曲げ加工性が得られる。即ち、第二相粒子の圧延方向における平均結晶粒径Ｄ_Ｌ２は、第二相粒子の板厚方向における平均結晶粒径Ｄ_ｎ２に対する比Ｄ_Ｌ２／Ｄ_ｎ２が５以下であり、望ましくはＤ_Ｌ２／Ｄ_ｎ２が４以下、更に望ましくはＤ_Ｌ２／Ｄ_ｎ２が２以下である。この比Ｄ_Ｌ２／Ｄ_ｎ２が５を超えると、例えば曲げ加工後の銅合金材料の外表面に割れが発生する。 “ Ratio of average crystal grain size D _L2 in rolling direction to average crystal grain size D _n2 in plate thickness direction of second phase particles D _L2 / D _n2 : 5 or less ”
In the Cu—Fe—P based alloy, Fe—P compound or Fe precipitates in the parent phase to form second phase particles, which are dispersed in the Cu parent phase, thereby obtaining high strength characteristics. The Fe—P compound in the second phase and the second phase particles resulting from Fe greatly affect the bending workability of the copper alloy. In the present invention, in the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _L2 in the rolling direction of the second phase particles is optimal at the ratio D _L2 / D _n2 to the average crystal grain size D _n2 in the plate thickness direction. In the copper alloy plate used as a material for electrical and electronic parts, the G. W. Bending workability useful for bending can be obtained. That is, the average crystal grain size D _L2 in the rolling direction of the second phase particles is such that the ratio D _L2 / D _n2 to the average crystal grain size D _n2 in the plate thickness direction of the second phase particles is 5 or less, preferably D _L2 / D _n2 is 4 or less, more preferably D _L2 / D _n2 is 2 or less. When this ratio D _L2 / D _n2 exceeds 5, for example, cracks occur on the outer surface of the copper alloy material after bending.

「Ｚｎ：０質量％以上２．０質量％以下」
本発明の銅合金材料を電気電子部品に加工した際には、例えばその表面には、Ｓｎめっきが施されるが、Ｚｎを添加することによって、Ｓｎめっきの耐熱剥離性が向上する。このＳｎめっきの耐熱剥離性を向上させるために、Ｚｎを添加する場合には、０．５質量％以上添加することが好ましい。一方、Ｚｎの含有量が２．０質量％を超えると、銅合金板の曲げ加工性及び導電率が低下しやすくなるため、Ｚｎの含有量は０質量％以上２．０質量％以下とする。 “ Zn: 0 to 2.0% by mass ”
When the copper alloy material of the present invention is processed into an electric / electronic component, for example, the surface thereof is Sn-plated. By adding Zn, the heat-resistant peelability of Sn-plating is improved. In order to improve the heat-resistant peelability of this Sn plating, when adding Zn, it is preferable to add 0.5 mass% or more. On the other hand, if the Zn content exceeds 2.0% by mass, the bending workability and conductivity of the copper alloy plate are likely to be lowered. Therefore, the Zn content is 0% by mass to 2.0% by mass. .

「Ｍｇ：０質量％以上０．４０質量％以下」
Ｍｇは組織中に固溶することによって、銅合金板の強度特性及び耐応力緩和特性を向上させる。その効果を得るために、Ｍｇを添加する場合には、０．０１質量％以上添加することが好ましい。一方、Ｍｇの添加量が０．４０質量％を超えると、曲げ加工性及び導電率が低下しやすくなるため、Ｍｇの含有量は０質量％以上０．４０質量％以下とする。また、Ｍｇの添加量は０．０５乃至０．４０質量％であることが好ましい。 “ Mg: 0% by mass to 0.40% by mass ”
Mg improves the strength characteristics and stress relaxation resistance of the copper alloy sheet by dissolving in the structure. In order to acquire the effect, when adding Mg, it is preferable to add 0.01 mass% or more. On the other hand, when the added amount of Mg exceeds 0.40% by mass, bending workability and electrical conductivity are liable to decrease, so the Mg content is set to 0% by mass to 0.40% by mass. The amount of Mg added is preferably 0.05 to 0.40% by mass.

「Ｓｎ：０質量％以上１．５０質量％以下」
Ｓｎは、Ｍｇと同様に、組織中に固溶することによって、銅合金板の強度特性及び耐応力緩和特性を向上させる。その効果を得るために、Ｓｎを添加する場合には、０．０３質量％以上添加することが好ましい。一方、Ｓｎの添加量が１．５０質量％を超えると、曲げ加工性及び導電率が低下しやすくなるため、Ｓｎの含有量は０質量％以上１．５０質量％以下とする。また、Ｓｎの添加量は０．１乃至１．０質量％であることがより好ましく、更に好ましくは０．２乃至０．７質量％である。 “ Sn: 0 to 1.50% by mass ”
Sn, like Mg, improves the strength characteristics and stress relaxation resistance of the copper alloy sheet by dissolving in the structure. In order to acquire the effect, when adding Sn, it is preferable to add 0.03 mass% or more. On the other hand, if the added amount of Sn exceeds 1.50% by mass, bending workability and electrical conductivity are likely to be lowered. Therefore, the Sn content is set to 0% by mass to 1.50% by mass. Further, the addition amount of Sn is more preferably 0.1 to 1.0% by mass, and still more preferably 0.2 to 0.7% by mass.

「Ｃｒ：０．００１乃至０．３００質量％」
Ｃｒは、銅合金板の熱間加工性を向上させる。その効果を得るために、本発明においては、Ｃｒを０．００１質量％以上添加することが好ましい。一方、０．３００質量％を超えるＣｒは、銅合金組織中に晶出物を生成させて、銅合金板の曲げ加工性が低下しやすくなる。従って、Ｃｒの含有量は０．００１乃至０．３００質量％であり、更に０．００１乃至０．１００質量％であることが好ましい。 “ Cr: 0.001 to 0.300 mass% ”
Cr improves the hot workability of the copper alloy plate. In order to acquire the effect, in this invention, it is preferable to add 0.001 mass% or more of Cr. On the other hand, Cr exceeding 0.300% by mass generates a crystallized substance in the copper alloy structure, and the bending workability of the copper alloy plate tends to be lowered. Accordingly, the Cr content is preferably 0.001 to 0.300% by mass, and more preferably 0.001 to 0.100% by mass.

「Ｍｎ：０．０１乃至０．５０質量％」
Ｍｎは、銅合金板の熱間加工性を向上させる。その効果を得るために、本発明においては、Ｍｎを０．０１質量％以上添加することが好ましい。一方、Ｍｎの添加量が０．５０質量％を超えると、銅合金板の導電率が低下しやすくなる。従って、Ｍｎの含有量は０．０１乃至０．５０質量％であり、更に０．０１乃至０．３０質量％であることが好ましい。 “ Mn: 0.01 to 0.50 mass% ”
Mn improves the hot workability of the copper alloy sheet. In order to acquire the effect, in this invention, it is preferable to add Mn 0.01 mass% or more. On the other hand, when the addition amount of Mn exceeds 0.50 mass%, the electrical conductivity of a copper alloy plate will fall easily. Therefore, the content of Mn is 0.01 to 0.50% by mass, and preferably 0.01 to 0.30% by mass.

「Ｓｉ：０．０１乃至０．１０質量％」
Ｓｉは、銅合金板の強度特性及び耐応力緩和特性を改善させる。その効果を得るために、本発明においては、Ｓｉを０．０１質量％以上添加することが好ましい。一方、Ｓｉの添加量が０．１０質量％を超えると、銅合金板の導電性が低下しやすくなる。従って、Ｓｉの含有量は０．０１乃至０．１０質量％であることが好ましい。 “ Si: 0.01 to 0.10 mass% ”
Si improves the strength characteristics and stress relaxation resistance characteristics of the copper alloy sheet. In order to acquire the effect, in this invention, it is preferable to add Si 0.01 mass% or more. On the other hand, when the addition amount of Si exceeds 0.10% by mass, the conductivity of the copper alloy plate tends to be lowered. Therefore, the Si content is preferably 0.01 to 0.10% by mass.

「Ｎｉ：０．０１乃至０．５０質量％」
Ｎｉは、強度特性を改善させるために、０．０１質量％以上添加することが好ましい。一方、Ｎｉの添加量が０．５０質量％を超えると、銅合金板の導電性が低下しやすくなる。従って、Ｎｉの含有量は０．０１乃至０．５０質量％であることが好ましい。 “ Ni: 0.01 to 0.50 mass% ”
Ni is preferably added in an amount of 0.01% by mass or more in order to improve strength characteristics. On the other hand, when the addition amount of Ni exceeds 0.50 mass%, the conductivity of the copper alloy plate tends to be lowered. Therefore, the Ni content is preferably 0.01 to 0.50% by mass.

「Ｓ：０．００５質量％以下に規制」
Ｓは、他の固溶元素との間で化合物を形成することにより、銅合金板の耐応力緩和特性及び曲げ加工性を低下させやすくする。そのためＳの含有量は０．００５質量％以下に規制することが好ましく、更に好ましくは０．００２質量％以下に規制する。 " S: Restricted to 0.005 mass% or less "
S forms a compound with other solid solution elements, thereby making it easy to reduce the stress relaxation resistance and bending workability of the copper alloy sheet. Therefore, the S content is preferably regulated to 0.005 mass% or less, more preferably 0.002 mass% or less.

「Ｂ、Ｃ、Ｃａ、Ｖ、Ｇａ、Ｇｅ、Ｎｂ、Ｍｏ、Ｈｆ、Ｔａ、Ｂｉ及びＰｂ：１種以上を夫々０．０００１質量％以上、総量で０．１質量％以下」
Ｂ、Ｃ、Ｃａ、Ｖ、Ｇａ、Ｇｅ、Ｎｂ、Ｍｏ、Ｈｆ、Ｔａ、Ｂｉ及びＰｂの各元素は、プレス打ち抜き性を向上させる作用を有する。その効果を得るために、本発明においては、これらの元素を添加する場合には、１種以上の元素を夫々０．０００１質量％以上添加することが好ましい。一方、これらの元素の添加量が総量で０．１質量％を超えると、銅合金板の熱間加工性が低下しやすくなる。従って、上記元素を添加する場合には、１種以上を夫々０．０００１質量％以上、総量で０．１質量％以下含有させることが好ましい。 “ B, C, Ca, V, Ga, Ge, Nb, Mo, Hf, Ta, Bi, and Pb: each one or more of 0.0001 mass% or more, and the total amount is 0.1 mass% or less ”
Each element of B, C 2 , C a, V, Ga, Ge, Nb, Mo, Hf, Ta, Bi, and Pb has an effect of improving press punchability. In order to obtain the effect, in the present invention, when adding these elements, it is preferable to add one or more elements in an amount of 0.0001% by mass or more. On the other hand, when the added amount of these elements exceeds 0.1% by mass, the hot workability of the copper alloy plate tends to be lowered. Therefore, when adding the said element, it is preferable to contain 1 or more types by 0.0001 mass% or more and 0.1 mass% or less in total amount, respectively.

「Ｂｅ、Ａｌ、Ｔｉ、Ｃｏ、Ｚｒ、Ａｇ、Ｃｄ、Ｉｎ、Ｓｂ、Ｔｅ、及びＡｕ：１種以上を夫々０．００１質量％以上、総量で０．９質量％以下」
Ｂｅ、Ａｌ、Ｔｉ、Ｃｏ、Ｚｒ、Ａｇ、Ｃｄ、Ｉｎ、Ｓｂ、Ｔｅ、及びＡｕの各元素は、プレス打ち抜き性を向上させる作用を有する。また、Ｔｉ及びＺｒについては、更に熱間加工性を向上させる効果がある。その効果を得るために、本発明においては、これらの元素を添加する場合には、１種以上の元素を夫々０．００１質量％以上添加することが好ましい。一方、これらの元素の添加量が総量で０．９質量％を超えると、熱間及び冷間加工性が低下しやすくなる。従って、上記元素を添加する場合は、１種以上の元素を夫々０．００１質量％以上、総量で０．９質量％以下含有させることが好ましい。なお、Ｂｅ、Ａｌ、Ｔｉ、Ｃｏ、Ｚｒ、Ａｇ、Ｃｄ、Ｉｎ、Ｓｂ、Ｔｅ、及びＡｕからなる群から選択された１種以上の元素に加えて、Ｂ、Ｃ、Ｃａ、Ｖ、Ｇａ、Ｇｅ、Ｎｂ、Ｍｏ、Ｈｆ、Ｔａ、Ｂｉ及びＰｂからなる群から選択された１種以上の元素を添加する場合には、これらの元素の添加量は、総量で１．０質量以下とする。 “ Be, Al, Ti, Co, Zr, Ag, Cd, In, Sb, Te, and Au: 0.001 mass% or more for each of one or more kinds, and 0.9 mass% or less in total amount ”
Each element of Be, Al, Ti , Co, Zr, Ag, Cd, In, Sb, Te, and Au has an effect of improving press punchability. Further, Ti and Zr have an effect of further improving the hot workability. In order to obtain the effect, in the present invention, when adding these elements, it is preferable to add 0.001% by mass or more of one or more elements. On the other hand, when the added amount of these elements exceeds 0.9% by mass, the hot and cold workability tends to be lowered. Therefore, when adding the said element, it is preferable to contain 1 or more types of elements 0.001 mass% or more and 0.9 mass% or less in total amount, respectively. In addition to one or more elements selected from the group consisting of Be, Al, Ti , Co, Zr, Ag, Cd, In, Sb, Te, and Au , B, C 2 , C a, V, When one or more elements selected from the group consisting of Ga, Ge, Nb, Mo, Hf, Ta, Bi and Pb are added, the total amount of these elements is 1.0 mass or less. To do.

次に、本発明に係る電気電子部品用銅合金板の製造方法について説明する。本発明においては、所定の組成を有する材料を溶解・鋳造し、均熱処理後、熱間圧延により板材に成形し、この熱間圧延後の板材を急冷した後、１回目の冷間圧延（以下、１次冷間圧延）を施す。そして、冷間圧延後の板材に１次焼鈍による熱処理を施した後、２回目の冷間圧延（以下、２次冷間圧延）により、所定形状に成形し、その後、２次焼鈍を施すことにより、銅合金組織内の歪みを除去する。本発明においては、母相及び第二相粒子からなる金属組織において、圧延方向及び板厚方向を含む断面に所望の結晶粒組織を得るために、上記均熱処理工程、熱間加工工程、急冷工程、１次冷間圧延工程、１次焼鈍工程、２次冷間圧延工程及び２次焼鈍工程のうち、特に、均熱処理工程、熱間加工工程、１次焼鈍工程、２次冷間圧延工程及び２次焼鈍工程における処理条件を調整する。以下、各工程について説明する。 Next, the manufacturing method of the copper alloy plate for electrical and electronic parts according to the present invention will be described. In the present invention, a material having a predetermined composition is melted and cast, after soaking, formed into a plate material by hot rolling, the plate material after the hot rolling is rapidly cooled, (First cold rolling). And after giving the heat processing by primary annealing to the board | plate material after cold rolling, it shape | molds by the 2nd cold rolling (henceforth, secondary cold rolling), and gives secondary annealing after that. Thus, the strain in the copper alloy structure is removed. In the present invention, in the metal structure composed of the parent phase and the second phase particles, in order to obtain a desired crystal grain structure in the cross section including the rolling direction and the plate thickness direction, the soaking process, the hot working process, the rapid cooling process. Among primary cold rolling process, primary annealing process, secondary cold rolling process and secondary annealing process, in particular, soaking process, hot working process, primary annealing process, secondary cold rolling process and The processing conditions in the secondary annealing process are adjusted. Hereinafter, each step will be described.

均熱処理は８５０℃以上で１０分間以上保持する条件で行い、引き続き、熱間圧延を行う。この熱間圧延は、成形された板材が例えば大気により冷却されても、その実体温度が７００℃以上であるうちに終了する。熱間圧延を終了する温度が７００℃未満であると、銅合金組織内に析出する第二相粒子が粗大化して、品質の局所的なばらつきが生じやすくなる。次に、熱間圧延後の板材を水冷等により急冷する。 The soaking process is performed under the condition of holding at 850 ° C. or more for 10 minutes or more, followed by hot rolling. This hot rolling is completed while the actual temperature is 700 ° C. or higher even if the formed plate material is cooled by, for example, the atmosphere. When the temperature of terminating the hot rolling is lower than 700 ° C., the second-phase particles are coarsened to precipitate into the copper alloy structure, it is likely to occur the station plant specific variations in quality. Next, the plate material after hot rolling is rapidly cooled by water cooling or the like.

次に、急冷後の板材に冷間で１次冷間圧延を施す。この際、圧延加工率は任意であるが、最終的な板材の板厚及び２次冷間加工における圧延加工率に合わせて調節する。 Next, the cold-cooled plate material is subjected to primary cold rolling in the cold. At this time, the rolling rate is arbitrary, but is adjusted in accordance with the final plate thickness and the rolling rate in the secondary cold working.

本発明においては、１次冷間圧延後の板材に例えば４５０乃至６５０℃で３０分間乃至２４時間の１次焼鈍処理を施すことにより、金属組織内に析出を伴う再結晶処理を施す。即ち、この焼鈍処理により、金属組織内には、「銅合金組織の再結晶」と「Ｆｅ−Ｐ系化合物の析出」が同時に発生し、「銅合金組織の再結晶」により、製品の曲げ加工性、耐応力緩和特性が改善され、「Ｆｅ−Ｐ系化合物の析出」により、製品の導電性、耐熱性及び強度特性が向上する。焼鈍温度が４５０℃未満又は焼鈍時間が３０分未満であると、加熱処理不足により、銅合金内に１次冷間圧延後の組織が残留し、母相の平均結晶粒径が例えば２μｍ未満となる。よって、銅合金板の曲げ加工性及び耐応力緩和特性が低下する。またＦｅ−Ｐ系化合物の析出が不十分となり、銅合金板の導電性、耐熱性及び強度特性が低下する。一方、焼鈍温度が６５０℃を超えると、銅合金の組織が粗大となり、例えば母相の平均結晶粒径が１５μｍを超え、その結果、曲げ加工性が低下する。また、Ｆｅ−Ｐ系化合物が粗大となり、強度特性が低下する。また、焼鈍時間が２４時間を超える場合は、エネルギーロスが高くなり経済的に非効率的である。 In the present invention, the plate material after the primary cold rolling is subjected to a primary annealing treatment at 450 to 650 ° C. for 30 minutes to 24 hours, for example, thereby performing a recrystallization treatment accompanied by precipitation in the metal structure. That is, by this annealing treatment, "recrystallization of copper alloy structure" and "precipitation of Fe-P-based compound" occur simultaneously in the metal structure, and the product is bent by "recrystallization of copper alloy structure". And stress relaxation resistance are improved, and the “deposition of Fe—P compound” improves the electrical conductivity, heat resistance and strength characteristics of the product. When the annealing temperature is less than 450 ° C. or the annealing time is less than 30 minutes, the structure after primary cold rolling remains in the copper alloy due to insufficient heat treatment, and the average crystal grain size of the parent phase is, for example, less than 2 μm. Become. Therefore, the bending workability and stress relaxation resistance of the copper alloy plate are deteriorated. In addition, precipitation of the Fe—P-based compound becomes insufficient, and the conductivity, heat resistance and strength characteristics of the copper alloy plate are deteriorated. On the other hand, when the annealing temperature exceeds 650 ° C., the structure of the copper alloy becomes coarse. For example, the average crystal grain size of the parent phase exceeds 15 μm, and as a result, bending workability decreases. In addition, the Fe—P-based compound becomes coarse and the strength characteristics are deteriorated. Moreover, when annealing time exceeds 24 hours, energy loss becomes high and it is economically inefficient.

次に、焼鈍処理後の板材に、２次冷間圧延処理を施す。このときの圧延加工率を所定範囲にすることにより、銅合金組織内における各結晶粒の形状が本発明の範囲となるように調節される。また、２次冷間圧延により、金属組織内に加工歪みが蓄積し、銅合金板の強度特性が改善される。即ち、２次冷間圧延工程における圧延加工率は、例えば２５乃至７０％である。この２次冷間圧延工程における加工率が２５％未満であると、圧延方向及び板厚方向を含む断面において、母相の平均結晶粒径比Ｄ_Ｌ／Ｄ_ｎが１．５未満となり、Ｇ．Ｗ曲げ加工性の優位性が得にくくなる。また、圧延により金属組織内に蓄積される歪み量が低下し、十分な強度特性が得にくくなる。２次冷間圧延工程における加工率が７０％を超えると、金属組織内に蓄積される歪み量は飽和して、強度特性の向上が得にくくなる一方、例えば第二相粒子の平均結晶粒径比が５を超えるか、又は母相の板厚方向における平均結晶粒径が２μｍ未満となり、曲げ加工性が著しく低下する。 Next, a secondary cold rolling process is performed on the plate material after the annealing process. By setting the rolling rate at this time within a predetermined range, the shape of each crystal grain in the copper alloy structure is adjusted to be within the range of the present invention. In addition, the secondary cold rolling accumulates processing strain in the metal structure and improves the strength characteristics of the copper alloy sheet. That is, the rolling rate in the secondary cold rolling process is, for example, 25 to 70%. When the processing rate in the secondary cold rolling step is less than 25%, the average crystal grain size ratio D _L / D _n of the parent phase is less than 1.5 in the cross section including the rolling direction and the plate thickness direction, and G . It becomes difficult to obtain the superiority of W bending workability. In addition, the amount of strain accumulated in the metal structure is reduced by rolling, and it becomes difficult to obtain sufficient strength characteristics. When the processing rate in the secondary cold rolling process exceeds 70%, the strain amount accumulated in the metal structure is saturated and it is difficult to improve the strength characteristics. The ratio exceeds 5, or the average crystal grain size in the thickness direction of the matrix becomes less than 2 μm, and the bending workability is remarkably lowered.

次に、２次冷間圧延処理後の銅合金板に、２５０乃至４５０℃、２０乃至１０００秒の熱処理条件により歪取り焼鈍を施し、２５０乃至４５０℃の低温下で可動する歪の除去を行い、耐応力緩和特性を改善させる。熱処理温度が２５０℃未満又は熱処理時間が２０秒未満の場合には、可動歪の除去が不十分となり、耐応力緩和特性が低下しやすくなる。一方、熱処理温度が４５０℃を超えるか、又は熱処理時間が１０００秒を超える場合には、歪の除去が過剰となり強度特性が低下しやすくなる。 Next, the copper alloy sheet after the secondary cold rolling treatment is subjected to strain relief annealing under the heat treatment conditions of 250 to 450 ° C. for 20 to 1000 seconds, and the movable strain is removed at a low temperature of 250 to 450 ° C. Improve stress relaxation resistance. When the heat treatment temperature is less than 250 ° C. or the heat treatment time is less than 20 seconds, the removal of the movable strain becomes insufficient, and the stress relaxation resistance is likely to be lowered. On the other hand, when the heat treatment temperature exceeds 450 ° C. or the heat treatment time exceeds 1000 seconds, the strain is excessively removed and the strength characteristics are liable to deteriorate.

以上のようにして、本発明の電気電子部品用銅合金板が製造される。この銅合金板は、Ｆｅ−Ｐの析出により、強度が高く、また、圧延方向及び板厚方向からなる断面において、母相の平均結晶粒径及び各方向における平均結晶粒比並びに第二相粒子の各方向における平均結晶粒比が所定範囲内であり、高い導電率、良好な曲げ加工性及び高い耐応力緩和特性が両立されたものとなる。 As described above, the copper alloy plate for electric and electronic parts of the present invention is manufactured. This copper alloy sheet has high strength due to the precipitation of Fe-P, and in the cross section composed of the rolling direction and the plate thickness direction, the average crystal grain size of the parent phase, the average crystal grain ratio in each direction, and the second phase particles The average crystal grain ratio in each direction is within a predetermined range, and high conductivity, good bending workability and high stress relaxation resistance are compatible.

以下、本発明による効果について、本発明を満足する実施例をその比較例と対比して説明する。 In the following, the effects of the present invention will be described in comparison with an example that satisfies the present invention.

（第１実施例）
第１実施例においては、同一の製造条件により製造された電気電子部品用銅合金について、組成又は結晶粒径を変化させた実施例である。先ず、表１−１及び表１−２に示す組成を有する銅合金をクリプトル炉に投入し、大気中、木炭被覆下で溶解・鋳造を行った。次に、鋳塊に９５０℃の温度で１時間均熱処理を行い、続いて熱間圧延加工を施した。このとき、熱間圧延終了温度を７００℃とし、その後、速やかに水冷を行い、厚さ２０ｍｍの銅合金板を得た。次に板の両面を１ｍｍずつ面削加工した後、１次冷間圧延加工により、銅合金板の厚さを０．５ｍｍまで圧延した。その後、５５０℃の温度で２４０分間焼鈍処理を行い、焼鈍処理後の銅合金板の表面を研磨して酸化物を除去した。引き続き、加工率５０％の条件で２次冷間圧延加工を施すことにより、板厚が０．２５ｍｍの薄板を得た。この薄板に対して、３５０℃の温度で６０秒の歪取焼鈍を行い、実施例及び比較例の供試材とした。 (First embodiment)
The first embodiment is an embodiment in which the composition or crystal grain size of the copper alloy for electric and electronic parts manufactured under the same manufacturing conditions is changed. First, a copper alloy having the composition shown in Table 1-1 and Table 1-2 was put into a kryptor furnace and melted and cast in the atmosphere under charcoal coating. Next, the ingot was subjected to a soaking treatment at a temperature of 950 ° C. for 1 hour, followed by hot rolling. At this time, the hot rolling end temperature was set to 700 ° C., and then water cooling was performed promptly to obtain a copper alloy plate having a thickness of 20 mm. Next, both sides of the plate were chamfered by 1 mm each, and then the thickness of the copper alloy plate was rolled to 0.5 mm by primary cold rolling. Then, the annealing process was performed for 240 minutes at the temperature of 550 degreeC, the surface of the copper alloy plate after an annealing process was grind | polished, and the oxide was removed. Subsequently, a secondary cold rolling process was performed under the condition of a processing rate of 50% to obtain a thin sheet having a thickness of 0.25 mm. The thin plate was subjected to strain relief annealing for 60 seconds at a temperature of 350 ° C. to obtain test materials for Examples and Comparative Examples.

そして、各実施例及び比較例の供試材から切り出した試験片について、下記の要領にて結晶粒径を測定し、また、引張試験（０．２％耐力測定）、導電率測定、Ｗ曲げ試験及び耐応力緩和特性試験に供した。 And about the test piece cut out from the test material of each Example and a comparative example, a crystal grain size is measured in the following way, and also a tensile test (0.2% yield strength measurement), electrical conductivity measurement, W bending It used for the test and the stress relaxation characteristic test.

（結晶粒径の測定）
各試験片を、圧延方向及び板厚方向を含む断面が観察面となるように冷間埋め込み樹脂に埋め込み、２４００番の耐水研磨紙で研磨後、１μｍのダイヤモンドスプレーを塗布したバフにて仕上げ研磨を行った。そして、研磨後の各試験片をクロム酸及び塩化第二鉄により結晶粒界を腐食させて観察試料を得た。各実施例及び比較例の観察試料について、光学顕微鏡を用いて４００倍の倍率の組織写真を得、組織写真から結晶粒径を測定した。板厚方向の結晶粒径は、切断法により、１０００μｍの範囲における結晶粒径を測定し、その平均値を算出して母相の板厚方向における平均結晶粒径Ｄ_ｎとした。また、圧延方向についても、同様の方法により平均結晶粒径Ｄ_Ｌを算出し、この算出結果を基に、比Ｄ_Ｌ／Ｄ_ｎを算出した。第二相粒子については、１００μｍ四方の範囲内で観察される直径が１μｍ以上の結晶粒子について、夫々板厚方向及び圧延方向の粒径を測定し、その平均値を算出して板厚方向における平均結晶粒径Ｄ_ｎ２及び圧延方向における平均結晶粒径Ｄ_Ｌ２とし、この算出結果を基に、比Ｄ_Ｌ２／Ｄ_ｎ２を算出した。各実施例及び比較例について、母相の圧延方向における平均結晶粒径Ｄ_ｎ及び平均結晶粒径比Ｄ_Ｌ／Ｄ_ｎと、第二相粒子の平均結晶粒径比Ｄ_Ｌ２／Ｄ_ｎ２を表１−２にあわせて示す。 (Measurement of crystal grain size)
Each test piece is embedded in cold embedding resin so that the cross section including the rolling direction and the plate thickness direction becomes the observation surface, polished with No. 2400 water-resistant abrasive paper, and then finished with a buff coated with 1 μm diamond spray. Went. And each crystal | crystallization test piece after grinding | polishing has corroded the crystal grain boundary with chromic acid and ferric chloride, and obtained the observation sample. About the observation sample of each Example and a comparative example, the structure | tissue photograph of 400 time magnification was obtained using the optical microscope, and the crystal grain diameter was measured from the structure | tissue photograph. As for the crystal grain size in the plate thickness direction, the crystal grain size in the range of 1000 μm was measured by a cutting method, and the average value was calculated as the average crystal grain size D _n in the plate thickness direction of the parent phase. Further, for the rolling direction, the average crystal grain size _DL was calculated by the same method, and the ratio D _L / D _n was calculated based on the calculation result. For the second phase particles, for the crystal particles having a diameter of 1 μm or more observed within a 100 μm square range, the particle size in the plate thickness direction and the rolling direction is measured, and the average value is calculated to calculate the average value in the plate thickness direction. The average crystal grain size D _n2 and the average crystal grain size D _L2 in the rolling direction were set, and the ratio D _L2 / D _n2 was calculated based on this calculation result. For each example and comparative example, the average crystal grain size D _n and the average crystal grain size ratio D _L / D _n in the rolling direction of the parent phase, and the average crystal grain size ratio D _L2 / D _n2 of the second phase particles are shown. It shows together with 1-2.

（引張試験）
上記板厚が０．２５ｍｍの薄板を、夫々圧延方向に垂直の方向が長手方向となるように、ＪＩＳＺ２２０１に規定された５号試験片に加工し、各実施例及び比較例の試験片に対してＪＩＳＺ２２４１に規定された引張試験を行い、各試験片の０．２％耐力を測定した。そして、０．２％耐力が４５０Ｎ／ｍｍ^２であった場合を合格（○）とした。 (Tensile test)
The above-mentioned thin plate having a thickness of 0.25 mm is processed into No. 5 test pieces specified in JIS Z2201 so that the direction perpendicular to the rolling direction is the longitudinal direction. On the other hand, the tensile test prescribed | regulated to JISZ2241 was done, and 0.2% yield strength of each test piece was measured. And the case where 0.2% yield strength was 450 N / mm < ² > was set as the pass ((circle)).

（導電率測定）
上記板厚が０．２５ｍｍの薄板を、夫々圧延方向が長手方向となるように幅１０ｍｍ、長さ３０ｍｍの試験片に加工し、各実施例及び比較例の試験片に対してＪＩＳＨ０５０５に規定された非鉄金属材料導電率測定法に準拠し、ダブルブリッジ式電気抵抗測定装置により電気抵抗を測定し、平均断面積法により導電率を算出した。そして、導電率が４５％ＩＡＣＳ以上であった場合を合格（○）とした。 (Conductivity measurement)
The above-mentioned thin plate having a thickness of 0.25 mm is processed into a test piece having a width of 10 mm and a length of 30 mm so that the rolling direction is the longitudinal direction, respectively. The test piece of each example and comparative example is specified in JIS H0505. In accordance with the measured non-ferrous metal material conductivity measurement method, the electrical resistance was measured by a double bridge type electrical resistance measurement device, and the conductivity was calculated by the average cross-sectional area method. And the case where electrical conductivity was 45% IACS or more was set as the pass ((circle)).

（Ｗ曲げ試験）
各実施例及び比較例の薄板を、夫々圧延方向が長手方向となるようにＬ．Ｄ．（ＬｏｎｇｉｔｕｄｉｎａｌＤｉｒｅｃｔｉｏｎ）試験片、及び圧延方向に垂直の方向が長手方向となるようにＴ．Ｄ．（ＴｒａｎｓｖｅｒｓｅＤｉｒｅｃｔｉｏｎ）試験片に切り出し、幅１０ｍｍ、長さ３０ｍｍの各試験片に対して、ＪＣＢＡＴ３０７に規定されたＷ曲げ試験を行った。この際、曲げ試験に使用した治具のＲ部の半径は、０．２５ｍｍとした。そして、Ｗ曲げ試験後のＬ．Ｄ．試験片及びＴ．Ｄ．試験片について、曲げ部外側の表面を光学顕微鏡（倍率５０倍）で観察した。そして、いずれの試験片にも割れが発生しなかった場合を合格（○）と判定し、いずれか一方でも割れが発生した場合を不合格（×）と判定した。 (W bending test)
The thin plates of each of the examples and comparative examples were subjected to L.C. so that the rolling direction was the longitudinal direction. D. (Longitudinal Direction) test piece, and T. so that the direction perpendicular to the rolling direction is the longitudinal direction. D. (Transverse Direction) Cut into test pieces, and subjected to a W-bend test defined in JCBA T307 for each test piece having a width of 10 mm and a length of 30 mm. At this time, the radius of the R part of the jig used for the bending test was 0.25 mm. And after the W bending test, the L.P. D. Specimens and T. D. About the test piece, the surface outside a bending part was observed with the optical microscope (50-times multiplication factor). And the case where the crack did not generate | occur | produce in any test piece was determined as the pass ((circle)), and the case where the crack generate | occur | produced in any one was determined as the disqualification (x).

（耐応力緩和特性試験）
各実施例及び比較例の薄板を、夫々圧延方向に垂直の方向が長手方向となるように幅１０ｍｍ、長さ６０ｍｍの短冊状の試験片を切り出し、日本電子材料工業会標準規格ＥＭＡＳ１０１１に規定されている片持ち梁方式による応力緩和率の測定を行った。即ち、各試験片について、下記数式１により算出される負荷応力が０．２％耐力の８０％の大きさとなるようにスパン長さを設定し、試験片をジグに固定した。 (Stress relaxation resistance test)
A strip-shaped test piece having a width of 10 mm and a length of 60 mm was cut out from the thin plate of each Example and Comparative Example so that the direction perpendicular to the rolling direction was the longitudinal direction, and specified in the Japan Electronic Materials Manufacturers Association Standard EMAS 1011. The stress relaxation rate was measured by the cantilever method. That is, for each test piece, the span length was set so that the load stress calculated by the following formula 1 was 80% of the 0.2% proof stress, and the test piece was fixed to a jig.

そして、各試験片をジグに固定した状態で、オーブンにより１５０℃の温度で１０００時間の過熱を行った。加熱後のジグから負荷応力を除荷し、除荷後のたわみ変位［ｍｍ］を測定し、下記数式２により、応力緩和率を測定した。そして、応力緩和率が３０％以下であった場合を耐応力緩和特性が良好（○）であると評価した。 And in the state which fixed each test piece to the jig, overheating for 1000 hours was performed by the oven at the temperature of 150 degreeC. The applied stress was unloaded from the heated jig, the deflection displacement [mm] after unloading was measured, and the stress relaxation rate was measured by the following formula 2. When the stress relaxation rate was 30% or less, the stress relaxation resistance was evaluated as good (◯).

上記各引張試験（０．２％耐力測定）、導電率測定、Ｗ曲げ試験及び耐応力緩和特性試験の結果を表２に示す。

Table 2 shows the results of the above tensile tests (0.2% yield strength measurement), conductivity measurement, W bending test, and stress relaxation resistance test.

表２に示すように、実施例Ｎｏ．１乃至２３は、本発明の範囲を満足するので、０．２％耐力が高く、高導電率、良好な曲げ加工性及び高い耐応力緩和特性を両立できており、電気電子部品用の銅合金板として好適に使用することができる。 As shown in Table 2, Example No. Nos. 1 to 23 satisfy the scope of the present invention, so that 0.2% proof stress is high, high conductivity, good bending workability, and high stress relaxation characteristics are compatible, and a copper alloy for electric and electronic parts. It can be suitably used as a plate.

この実施例Ｎｏ．１乃至２３のうち、実施例Ｎｏ．４乃至２３は、Ｍｇ及びＳｎを適量含有することにより、他の実施例に比して、０．２％耐力が大きく、耐応力緩和特性も高かった。 In this Example No. 1 to 23, Example No. Nos. 4 to 23 contained Mg and Sn in appropriate amounts, so that the 0.2% proof stress was large and the stress relaxation resistance was high as compared with other examples.

比較例Ｎｏ．２４は、Ｆｅの含有量が本発明の範囲を超え、また、第二相中における圧延方向及び板厚方向の平均結晶粒径比Ｄ_Ｌ２／Ｄ_ｎ２も本発明の範囲を超えたので、曲げ加工性が劣化した。比較例Ｎｏ．２５は、Ｆｅの含有量が本発明の範囲未満であったため、Ｆｅ−Ｐ系の第二相の析出を観察できず、銅合金板の０．２％耐力が低下した。 Comparative Example No. 24, the content of Fe exceeded the range of the present invention, and the average grain size ratio D _L2 / D _n2 in the rolling direction and the plate thickness direction in the second phase also exceeded the range of the present invention. Workability deteriorated. Comparative Example No. No. 25, since the Fe content was less than the range of the present invention, the precipitation of the Fe-P second phase could not be observed, and the 0.2% proof stress of the copper alloy sheet was lowered.

比較例Ｎｏ．２６は、Ｐの含有量が本発明の範囲未満であったため、銅合金板の０．２％耐力及び導電率が低下した。比較例Ｎｏ．２７は、Ｐの含有量が本発明の範囲を超えていたので、銅合金板の曲げ加工性が劣化した。 Comparative Example No. In No. 26, since the content of P was less than the range of the present invention, the 0.2% yield strength and conductivity of the copper alloy plate were lowered. Comparative Example No. In No. 27, since the content of P exceeded the range of the present invention, the bending workability of the copper alloy plate was deteriorated.

比較例Ｎｏ．２８は、Ｚｎの含有量が過多となったことにより、曲げ加工性が劣化した。比較例Ｎｏ．２９及び３０は、Ｍｇ又はＳｎの含有量が多く、曲げ加工性が低下し、比較例Ｎｏ．３０は、Ｓｎ量過多により導電率も低下した。 Comparative Example No. In No. 28, bending workability deteriorated due to excessive Zn content. Comparative Example No. Nos. 29 and 30 have a high Mg or Sn content, resulting in a decrease in bending workability. In No. 30, the conductivity also decreased due to an excessive amount of Sn.

（第２実施例）
第２実施例においては、同一の組成を有する銅合金から製造される銅合金板について、１次冷間圧延後に行う熱処理（１次焼鈍）条件及び２次冷間加工率の変化が、製造される銅合金板の結晶粒径及び各特性に及ぼす影響を調査した。即ち、表３に示すように、本実施例においては、Ｃｕ−２．８Ｆｅ−０．０３Ｐ−１．０Ｚｎ−０．１０Ｍｇ−０．１０Ｓｎの組成を有する銅合金から、第１実施例と同様に、板厚が０．２５ｍｍの試験片を製造した。本実施例においては、水冷工程後の面削加工までの加工条件は、第１実施例と同様であり、２次冷間圧延における加工率を変化させるが、最終的な銅合金板の板厚を０．２５ｍｍとするために、１次冷間圧延における加工率を９５乃至９８％の範囲で変化させた。そして、表３に示すように、１次焼鈍における焼鈍条件及び２次冷間圧延における加工率を種々変化させた。そして、製造された各試験片について、第１実施例と同様に結晶粒径を測定し、また、引張試験（０．２％耐力測定）、導電率測定、Ｗ曲げ試験及び応力緩和特性試験に供した。結晶粒径の測定値及び各試験結果を表４に示す。なお、評価方法については、第１実施例と同一である。

(Second embodiment)
In the second embodiment, the heat treatment (primary annealing) conditions performed after the primary cold rolling and the change in the secondary cold working rate are produced for the copper alloy sheet produced from the copper alloy having the same composition. The effect of the copper alloy sheet on the grain size and each characteristic was investigated. That is, as shown in Table 3, in this example, a copper alloy having a composition of Cu-2.8Fe-0.03P-1.0Zn-0.10Mg-0.10Sn was used, as in the first example. A test piece having a plate thickness of 0.25 mm was produced. In this example, the processing conditions up to the chamfering after the water cooling step are the same as in the first example, and the processing rate in the secondary cold rolling is changed, but the final thickness of the copper alloy plate In order to set the thickness to 0.25 mm, the processing rate in the primary cold rolling was changed in the range of 95 to 98%. And as shown in Table 3, the annealing conditions in primary annealing and the processing rate in secondary cold rolling were changed variously. And about each manufactured test piece, a crystal grain diameter is measured similarly to 1st Example, and also in a tensile test (0.2% yield strength measurement), electrical conductivity measurement, W bending test, and stress relaxation characteristic test. Provided. Table 4 shows the measured values of the crystal grain size and the test results. The evaluation method is the same as in the first example.

表４に示すように、実施例Ｎｏ．３１乃至３８は、母相の平均結晶粒径Ｄ_ｎ、母相の圧延方向及び板厚方向における平均結晶粒径比Ｄ_Ｌ／Ｄ_ｎ、並びに第二相粒子の圧延方向及び板厚方向における平均結晶粒径比Ｄ_Ｌ２／Ｄ_ｎ２が本発明の範囲を満足するので、０．２％耐力が高く、高導電率、良好な曲げ加工性及び耐応力緩和特性が得られ、比較例Ｎｏ．３９乃至４３に比して、１以上の項目で優れていた。このように、本発明においては、組成に加えて、銅合金組織中の結晶粒径を圧延方向及び板厚方向の双方の関係により規定することにより、電気電子部品用の銅合金板として最適な材料を得ることができる。 As shown in Table 4, Example No. 31 to 38 are the average crystal grain size D _{n of} the parent phase, the average crystal grain size ratio D _L / D _n in the rolling direction and the plate thickness direction of the parent phase, and the average in the rolling direction and the plate thickness direction of the second phase particles. Since the crystal grain size ratio D _L2 / D _n2 satisfies the range of the present invention, 0.2% yield strength is high, high conductivity, good bending workability and stress relaxation resistance are obtained. Compared to 39 to 43, one or more items were superior. Thus, in the present invention, in addition to the composition, the crystal grain size in the copper alloy structure is regulated by the relationship in both the rolling direction and the plate thickness direction, so that it is optimal as a copper alloy plate for electric and electronic parts. Material can be obtained.

これに対して、比較例Ｎｏ．３９は、１次焼鈍温度が４００℃と低く、加熱処理不足により、銅合金内に１次冷間圧延後の組織が残留し、母相の板厚方向における平均結晶粒径Ｄ_ｎが小さくなり、これにより、曲げ加工性及び耐応力緩和特性が劣化した。一方、比較例Ｎｏ．４０は、１次焼鈍における加熱温度が高く、銅合金の組織が粗大となり、母相の板厚方向における平均結晶粒径Ｄ_ｎが１６μｍまで大きくなり、曲げ加工性が劣化した。 In contrast, Comparative Example No. No. 39 has a primary annealing temperature as low as 400 ° C., and due to insufficient heat treatment, the structure after primary cold rolling remains in the copper alloy, and the average grain size D _n in the thickness direction of the parent phase becomes small. As a result, bending workability and stress relaxation resistance were deteriorated. On the other hand, Comparative Example No. In No. 40, the heating temperature in the primary annealing was high, the structure of the copper alloy became coarse, the average crystal grain size D _n in the thickness direction of the parent phase increased to 16 μm, and the bending workability deteriorated.

比較例Ｎｏ．４１は、１次焼鈍時間が短く、加熱処理不足により、銅合金内に１次冷間圧延後の組織が残留し、母相の板厚方向における平均結晶粒径Ｄ_ｎが小さくなり、これにより、曲げ加工性及び耐応力緩和特性が劣化した。また、Ｃｕ母相中へのＦｅ−Ｐ系の第二相が十分に析出できず、銅合金板の導電率が低下した。 Comparative Example No. No. 41 has a short primary annealing time, and due to insufficient heat treatment, the structure after the primary cold rolling remains in the copper alloy, and the average crystal grain size D _n in the thickness direction of the parent phase becomes small. Further, bending workability and stress relaxation resistance were deteriorated. Further, the Fe—P second phase could not be sufficiently precipitated in the Cu matrix, and the conductivity of the copper alloy plate was lowered.

比較例Ｎｏ．４２は、２次冷間工程における加工率が小さく、金属組織内における加工歪みの蓄積不足により０．２％耐力が低下した。一方、比較例Ｎｏ．４３は、２次冷間工程における加工率が大きく、母相の板厚方向における平均結晶粒径Ｄ_ｎが１．８μｍまで小さくなり、曲げ加工性が劣化した。 Comparative Example No. No. 42 had a small working rate in the secondary cold process, and 0.2% yield strength decreased due to insufficient accumulation of working strain in the metal structure. On the other hand, Comparative Example No. No. 43 has a high processing rate in the secondary cold process, and the average crystal grain size D _n in the thickness direction of the parent phase has decreased to 1.8 μm, and the bending workability deteriorated.

Claims

Fe: 2.5 to 3.5 mass% and P: containing 0.001 to 0.050 wt%, has a composition remaining portion is made of copper and unavoidable impurities, a second phase in the Cu matrix phase A copper alloy plate for electric and electronic parts having a two-phase structure in which particles are deposited,
In the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is D _L , the ratio D _{L /} D _n the average crystal grain size in the thickness direction with respect to D _n is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles D _L2, the second-phase particles It said plate an average crystal grain size as D _n2 in the thickness direction, specific electrical electronic component copper alloy sheet, wherein D _{L2 /} D _n2 is less than 5%.

Fe: 2.5 to 3.5 mass% and P: containing 0.001 to 0.050 wt%, further, Mg: 0.05 the mass% 0.40 mass% or less, the balance being copper And a copper alloy plate for electric and electronic parts having a two-phase structure in which second phase particles are precipitated in a Cu matrix,
In the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is D _L , the ratio D _{L /} D _n the average crystal grain size in the thickness direction with respect to D _n is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles D _L2, the second-phase particles It said plate an average crystal grain size as D _n2 in the thickness direction, specific electrical electronic component copper alloy sheet, wherein D _{L2 /} D _n2 is less than 5%.

Fe: 2.5 to 3.5 mass% and P: containing 0.001 to 0.050 wt%, further, S n: a below 0.1 wt% to 1.0 wt%, the balance being A copper alloy plate for electrical and electronic parts having a composition composed of copper and inevitable impurities and having a two-phase structure in which second phase particles are precipitated in a Cu matrix,
In the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is D _L , the ratio D _{L /} D _n the average crystal grain size in the thickness direction with respect to D _n is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles D _L2, the second-phase particles It said plate an average crystal grain size as D _n2 in the thickness direction, specific electrical electronic component copper alloy sheet, wherein D _{L2 /} D _n2 is less than 5%.

Fe: 2.5 to 3.5 mass% and P: containing 0.001 to 0.050 wt%, further, Z n: not more than 0.5 mass% to 2.0 mass%, the balance being copper And a copper alloy plate for electric and electronic parts having a two-phase structure in which second phase particles are precipitated in a Cu matrix,
In the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is D _L , the ratio D _{L /} D _n the average crystal grain size in the thickness direction with respect to D _n is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles D _L2, the second-phase particles It said plate an average crystal grain size as D _n2 in the thickness direction, specific electrical electronic component copper alloy sheet, wherein D _{L2 /} D _n2 is less than 5%.

Fe: 2.5 to 3.5% by mass and P: 0.001 to 0.050% by mass, Mg: 0.01 % by mass to 0.40% by mass, Sn: 0.03 % by mass %: 1.50% by mass or less and Zn: 0.5 % by mass or more and 2.0% by mass or less, with the balance being composed of copper and inevitable impurities, and second phase particles in the Cu matrix A copper alloy plate for electrical and electronic parts having a deposited two-phase structure,
In the cross section including the rolling direction and the plate thickness direction, the average crystal grain size D _n in the plate thickness direction of the matrix phase is 2 to 15 μm, and the average crystal grain size in the rolling direction of the matrix phase is D _L , the ratio D _{L /} D _n the average crystal grain size in the thickness direction with respect to D _n is not less than 1.5, the average crystal grain size in the rolling direction of the second-phase particles D _L2, the second-phase particles It said plate an average crystal grain size as D _n2 in the thickness direction, specific electrical electronic component copper alloy sheet, wherein D _{L2 /} D _n2 is less than 5%.

Furthermore, Si: 0.01 to 0.10 wt% and Ni: 1 to claim characterized in that it has a composition containing one or more selected from the group consisting of 0.01 to 0.50 wt% The copper alloy plate for electrical and electronic parts according to any one of 5 .

Furthermore, Cr: 0.001 to 0.300 wt% and Mn: 1 to claim characterized in that it has a composition containing one or more selected from the group consisting of 0.01 to 0.50 wt% The copper alloy plate for electrical and electronic parts according to any one of 6 .

Furthermore, it has the composition which controlled content of S to 0.005 mass% or less, The copper alloy plate for electrical and electronic components of any one of the Claims 1 thru | or 5 characterized by the above-mentioned.

Furthermore, 0.0001 mass% or more of 1 or more types selected from the group which consists of B, C , Ca, V, Ga, Ge, Nb, Mo, Hf, Ta, Bi, and Pb is contained, respectively, and the total amount is 0 The copper alloy plate for electric and electronic parts according to any one of claims 1 to 8 , wherein the copper alloy sheet has a composition containing not more than 1% by mass.

Furthermore, each contains at least 0.001% by mass of at least one selected from the group consisting of Be, Al, Ti , Co, Zr, Ag, Cd, In, Sb, Te, and Au . The copper alloy sheet for electric and electronic parts according to any one of claims 1 to 9 , wherein the copper alloy sheet has a composition containing 900% by mass or less.