JP5670277B2 - Substrate processing apparatus, program, computer storage medium, alarm display method, and substrate processing apparatus inspection method - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate, a program, a computer storage medium, an alarm display method in the substrate processing apparatus, and an inspection method for the substrate processing apparatus.

  For example, in a photolithography process in a semiconductor device manufacturing process, a resist coating process for coating a resist solution on a wafer to form a resist film, an exposure process for exposing the resist film to a predetermined pattern, and developing the exposed resist film A series of processing such as development processing is sequentially performed, and a predetermined resist pattern is formed on the wafer. A series of these processes is performed by a coating and developing treatment apparatus which is a substrate processing apparatus equipped with various processing units for processing a wafer, a transfer unit for transferring a wafer, and the like.

  By the way, when an abnormality occurs in the coating and developing treatment apparatus, the wafer processing usually stops. Therefore, it is desirable to quickly identify the site where the abnormality has occurred and perform recovery work. However, generally, an alarm that is issued when an abnormality occurs only displays the name of the unit in which the abnormality occurred and the content of the abnormality. Therefore, identification of the cause of the unit abnormality is largely dependent on the experience of the worker.

  In addition, although it can be specified from the contents of the alarm which processing unit has failed, supply of utilities related to wafer processing, such as cooling water, power supply, or processing liquid, is also required outside each processing unit. Since facilities are arranged and an abnormality occurs in these, the processing unit also becomes abnormal. Therefore, the part that caused the abnormality is not necessarily arranged in the processing unit in which the abnormality has occurred. Therefore, experience is required to quickly identify where in the coating and developing treatment apparatus the part that caused the abnormality is located.

  Therefore, for example, Patent Document 1 acquires identification information for identifying the position where an abnormality has occurred based on alarm information as a method for identifying the position where the abnormality has occurred, without depending on the experience of the worker, It has been proposed to display positional information associated with this identification information on an image.

JP 2011-14658 A

  By the way, in recent years, wafer processing is performed in parallel by a plurality of processing units arranged in parallel to the coating and developing treatment apparatus so that the wafer processing can be continued even when an abnormality occurs in the coating and developing processing apparatus. When it occurs, a processing method is employed in which the wafer processing is continued with another healthy processing unit bypassing the processing unit determined to be abnormal.

  However, even in such a coating and developing treatment apparatus, a decrease in productivity due to a part of the processing unit being stopped is still unavoidable. For this reason, it is preferable to quickly identify the cause of the occurrence of abnormality and perform inspection work and recovery work. However, in order to work without affecting other processing units that are still in operation, utilities related to power supply systems and cooling water systems that are shared with other processing units that are still in operation It is necessary to block the abnormal part from the equipment.

  In order to perform this inspection work and recovery work, it is necessary to operate a wide variety of devices. However, although the method of Patent Document 1 described above can identify an abnormal site, it is necessary to shut down in relation to the inspection work and recovery work. It is not possible to identify devices that require operation.

  Even if the device that needs to be operated to shut off can be identified, if the work procedure is incorrect, the processing unit that is in operation may be affected, leading to a problem that the entire coating and developing apparatus stops. There is also. For this reason, the experience of skilled workers is still necessary for such work, and the work currently takes a long time.

  The present invention has been made in view of this point, and an object of the present invention is to perform inspection work quickly and without error when an abnormality occurs in a substrate processing apparatus.

In order to achieve the above object, the present invention provides a substrate processing apparatus comprising: a plurality of processing units that process a plurality of substrates in parallel; and a display unit that displays an alarm when an abnormality occurs in each processing unit. In addition, the plurality of processing units include processing units that perform different processes, information that associates the content of the alarm of occurrence of an abnormality with a part that needs to be inspected due to the occurrence of the abnormality, and the inspection is necessary. When performing inspection work, which is set for each part, an operation is performed to isolate the part that needs to be inspected from other parts so as not to affect other parts where no abnormality has occurred. Information of the device to be performed, position information of the part that needs to be inspected and position information of the device operated for the isolation, information of the operation procedure of the device operated for the isolation, Remember memorize And detecting an abnormality that has occurred in each of the processing units, and identifying a part that needs to be inspected due to the occurrence of the abnormality and a device that is operated for the isolation based on the information in the storage unit, and An abnormality specifying means for specifying the positions of these parts and devices and outputting them to the display means, and an operation procedure for the equipment specified by the abnormality specifying means based on the information of the storage means to specify the display means And an operation procedure specifying means for outputting to.

  According to the present invention, an abnormality that has occurred in the processing unit is detected, a part that requires inspection due to the occurrence of the abnormality and a device that is operated for the isolation are identified, and the identified part and the position of the device The information and the operation procedure of these specified devices are specified and output to the display means. Therefore, by checking the position and operation procedure of each device displayed on the display means, the inspection work can be performed quickly and without error.

  “Isolate” means, for example, that an abnormality has occurred and no abnormality has occurred so as not to affect the part where the abnormality has not occurred during the inspection of the part where the abnormality has occurred. Breaking the electrical and physical connection with a part.

The device operated for isolation is at least one of the following (1) to (6).
(1) Circuit breaker that cuts off the electrical connection between the part that needs to be inspected and other parts where no abnormality has occurred (2) The part that needs to be inspected and other parts that do not have any abnormality Fluid shut-off mechanism for shutting off the flow of fluid flowing between the parts (3) A switch for shutting off an alarm signal for occurrence of abnormality output to the display means (4) A part requiring inspection and driving the part Driving force transmission member (5) provided between the driving mechanism and the environment mechanism (6) that shuts off the site requiring inspection from the external environment (6) Accessible to the site requiring inspection Another circuit breaker that cuts off power supply to another drive mechanism, or an operation mechanism that stops the operation of the other drive mechanism

  The display unit may be a user interface including any one of a touch panel, a monitor, and a liquid crystal display, and the device operated for the isolation may be remotely operated from the user interface.

  The apparatus further includes a substrate transport mechanism that transports the substrate, and a transport control unit that controls transport of the substrate by the substrate transport mechanism, and the transport control unit transports the substrate bypassing the processing unit in which an abnormality has occurred. The substrate transport mechanism may be controlled to do so.

  According to another aspect of the present invention, there is provided a method for displaying an alarm in the substrate processing apparatus, wherein the abnormality specifying unit detects an abnormality that has occurred in a processing unit, and then detects the abnormality based on information in the storage unit. A part that needs to be inspected due to occurrence and a device operated for the isolation, and a position of the part and the device are specified and output to the display unit, and further, the storage unit is operated by the operation procedure specifying unit. The operation procedure of the device operated for the isolation is specified based on the information, and is output to the display means.

Another aspect of the present invention is a method for inspecting a substrate processing apparatus, comprising: a plurality of processing units that process a plurality of substrates in parallel; and a display unit that displays an alarm when an abnormality occurs in each processing unit. The plurality of processing units include processing units that perform different processes, and issues an alarm when an abnormality occurs in at least one of the processing units. based on the contents to identify the site will require inspection by the abnormality, the inspection is set for each portion is required, when performing inspection work, the site where the inspection is required, the abnormality has occurred The device to be operated for isolation from the other part so as not to affect the other part which is not present , the operation procedure of the specified equipment are specified, and the inspection is performed. The location of the required part and The position of the specified device is specified, the position of the part requiring inspection, the position of the specified device, and the operation procedure of the specified device are displayed on the display means, and the display means In accordance with the displayed site where the inspection is required, the position of the specified device, and the operation procedure of the specified device, the operation of the specified device and the site where the inspection is required are performed. It is characterized by that.

According to another aspect of the present invention, there is provided a program that operates on a computer of a control device that controls the substrate processing apparatus so that the alarm display method is executed by the substrate processing apparatus.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to the present invention, it is possible to perform inspection work quickly and without error when an abnormality occurs in the substrate processing apparatus.

It is a top view which shows the outline of the internal structure of the application | coating development processing apparatus concerning this Embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment apparatus concerning this Embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment apparatus concerning this Embodiment. It is explanatory drawing which shows the outline of a structure of the control apparatus concerning this Embodiment. It is explanatory drawing which shows an example of the alarm table concerning this Embodiment. It is a single line connection figure which shows the outline of a structure of a power supply system. It is a systematic diagram which shows the outline of a structure of a cooling water system. It is a block diagram which shows the outline of a structure of an interlock circuit. It is explanatory drawing which shows the content of the positional information memorize | stored in the alarm table. It is explanatory drawing which shows the state by which the positional information on the operation target apparatus was displayed on the display means. It is a flowchart of the check work in a substrate processing apparatus.

  Embodiments of the present invention will be described below. FIG. 1 is an explanatory diagram showing an outline of the internal configuration of the substrate processing apparatus 1 according to the present embodiment. 2 and 3 are side views showing an outline of the internal configuration of the substrate processing apparatus 1. In the present embodiment, a case where the substrate processing apparatus 1 is, for example, a coating and developing processing apparatus that performs photolithography processing of a substrate will be described as an example.

  As shown in FIG. 1, the substrate processing apparatus 1 includes, for example, a cassette station 2 in which a cassette C containing a plurality of wafers W in one lot is carried in and out, and a predetermined one in a photolithography process. A configuration in which a processing station 3 including a plurality of various processing units as processing units that perform processing and an interface station 5 that transfers the wafer W between the exposure apparatus 4 adjacent to the processing station 3 are integrally connected. Have. The substrate processing apparatus 1 also has a control device 6 that controls various processing units.

  The cassette station 2 is divided into, for example, a cassette carry-in / out unit 10 and a wafer transfer unit 11. For example, the cassette loading / unloading unit 10 is provided at the end of the substrate processing apparatus 1 on the Y direction negative direction (left direction in FIG. 1) side. The cassette loading / unloading unit 10 is provided with a cassette mounting table 12. A plurality, for example, four mounting plates 13 are provided on the cassette mounting table 12. The mounting plates 13 are arranged in a line in the horizontal X direction (up and down direction in FIG. 1). The cassettes C can be placed on these placement plates 13 when the cassettes C are carried in and out of the substrate processing apparatus 1.

  The wafer transfer unit 11 is provided with a wafer transfer mechanism 21 that is movable on a transfer path 20 extending in the X direction as shown in FIG. The wafer transfer mechanism 21 is also movable in the vertical direction and the vertical axis (θ direction), and is provided between a cassette C on each mounting plate 13 and a delivery device for a third block G3 of the processing station 3 to be described later. Wafers W can be transferred between them.

  A processing station 3 adjacent to the cassette station 2 is provided with a plurality of, for example, four blocks G1, G2, G3, and G4 having various units. A first block G1 is provided on the front side of the processing station 3 (X direction negative direction side in FIG. 1), and on the back side of the processing station 3 (X direction positive direction side in FIG. 1), the second block G1 is provided. A block G2 is provided. Further, a third block G3 is provided on the cassette station 2 side (Y direction negative direction side in FIG. 1) of the processing station 3, and the processing station 3 interface station 5 side (Y direction positive direction side in FIG. 1). Is provided with a fourth block G4.

  For example, in the first block G1, as shown in FIG. 2, a plurality of liquid processing units, for example, a development processing unit 30 for developing the wafer W, an antireflection film (hereinafter referred to as “lower antireflection”) under the resist film of the wafer W. A lower antireflection film forming unit 31 for forming a film ”, a resist coating unit 32 for applying a resist solution to the wafer W to form a resist film, and an antireflection film (hereinafter referred to as“ upper reflection ”on the resist film of the wafer W). An upper antireflection film forming unit 33 for forming an “antireflection film” is stacked in four stages in order from the bottom.

  For example, each of the units 30 to 33 of the first block G1 has a plurality of cups F that accommodate the wafers W in the horizontal direction during processing as shown in FIG. 2, and can process a plurality of wafers W in parallel. .

  For example, the second block G2 is provided with a plurality of heat treatment units 40 to 46 including a heat treatment plate for performing heat treatment such as heating and cooling of the wafer W as shown in FIG. The heat treatment units 40 to 46 are provided in the order of the heat treatment units 40 to 46 from the bottom.

  For example, in the third block G3, a plurality of delivery units 50, 51, 52, 53, 54, 55, and 56 are provided in order from the bottom.

  For example, in the fourth block G4, a plurality of delivery units 60, 61, 62 and a defect inspection unit 100 are provided in order from the bottom.

  As shown in FIG. 1, a wafer transfer region D is formed in a region surrounded by the first block G1 to the fourth block G4. In the wafer transfer area D, for example, as shown in FIG. 3, wafer transfer mechanisms 70, 71, 72, 73 are provided in order from the bottom. The wafer transfer mechanisms 70, 71, 72, and 73 can transfer the wafer W to a predetermined unit having the same height of each of the blocks G1 to G4, for example.

  Further, in the wafer transfer region D, a shuttle transfer device 80 that transfers the wafer W linearly between the third block G3 and the fourth block G4 is provided.

  The shuttle conveyance device 80 is linearly movable in the Y direction of FIG. 3, for example. The shuttle transfer device 80 moves in the Y direction while supporting the wafer W, and can transfer the wafer W between the transfer unit 52 of the third block G3 and the transfer unit 62 of the fourth block G4.

  As shown in FIG. 1, a wafer transport mechanism 90 is provided on the positive side in the X direction of the third block G3. The wafer transfer mechanism 90 has a transfer arm that is movable in the front-rear direction, the θ direction, and the vertical direction, for example. The wafer transfer mechanism 90 moves up and down while supporting the wafer W, and can transfer the wafer W to each delivery unit in the third block G3.

  The interface station 5 is provided with a wafer transfer mechanism 91. The wafer transfer mechanism 91 has a transfer arm that is movable in the front-rear direction, the θ direction, and the vertical direction, for example. The wafer transfer mechanism 91 can transfer the wafer W to the transfer units and the exposure apparatus 4 in the fourth block G4, for example, by supporting the wafer W on the transfer arm.

  As shown in FIG. 4, the control device 6 includes a transfer control unit 200 that controls the operation of the wafer transfer mechanism, a wafer processing control unit 201 that controls the operation of various processing units, the content of the alarm for occurrence of abnormality, and the abnormality. Storage means 202 that stores information that associates a part that needs to be inspected due to occurrence, and an abnormality that detects an abnormality that has occurred in various processing units and identifies a part that needs to be inspected based on the information in storage means 202 The specifying unit 203, the operation procedure specifying unit 204 for specifying the operation procedure of the part specified by the abnormality specifying unit 203, and the display unit 205 for displaying various information such as the processing status and alarm output in the substrate processing apparatus 1 are provided. ing. The display unit 205 is a so-called graphical user interface provided with, for example, a touch panel, a monitor, or a liquid crystal display. The display unit 205 issues an alarm that informs the content of the abnormality detected by the control device 6, an abnormality identification unit 203, and an operation procedure identification. Along with the output display of various types of information specified by the means 204, an input operation to the control device 6 is possible.

  The control device 6 is configured by a computer including, for example, a CPU and a memory. The control device 6 is provided in the substrate processing apparatus 1 and the substrate processing apparatus 1 by executing a program stored in the memory, for example. An abnormality can be detected based on signals input from various sensors, and an alarm can be output to the display means 205. Various programs for realizing coating processing and abnormality detection in the substrate processing apparatus 1 are, for example, a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnet optical desk (MO), What is stored in the storage medium H such as a memory card and installed in the control device 6 from the storage medium H is used.

  In the storage unit 202, information associating the content of an alarm generated due to an abnormality of each processing unit and a part that needs to be inspected to eliminate the abnormality is stored as an alarm table 210 as shown in FIG. 5, for example. ing. In the horizontal column of the alarm table 210 shown in FIG. 5, for example, from the left to the right, the processing unit (“abnormal unit”) in which the processing of the wafer W is stopped due to the occurrence of an abnormality, and the content of the alarm issued due to the occurrence of the abnormality ("Alarm item"), parts that need to be inspected ("inspection part") are stored in this order in order to eliminate the abnormality that caused the alarm. In addition, as shown in FIG. 5, the alarm table 210 includes information on devices that need to be operated in order to isolate parts that need to be inspected from other parts where no abnormality has occurred (see FIG. 5). “Isolated device”), information on the operation procedure of the device operated for isolation (“Operation procedure” in FIG. 5), the part that needs to be inspected, and the position of the device operated for the isolation Information ("position information" in FIG. 5) is also stored.

  Isolate here means, for example, when performing an inspection work on a site where an abnormality has occurred, the site where the abnormality has occurred and the abnormality have occurred so as not to affect other sites where the abnormality has not occurred. Breaking the electrical and physical connection between the parts that are not connected. In addition, as a specific example of the device operated for isolation, for example, a circuit breaker that cuts off an electrical connection between a part that requires inspection and another part where no abnormality has occurred, Fluid shut-off mechanisms such as valves and dampers that shut off the flow of fluid that flows between parts that need to be inspected and other parts where no abnormality has occurred, parts that need to be inspected, and drives that have driven that part There are a driving force transmitting member for transmitting a driving force provided between the mechanism and an environment blocking mechanism for blocking a portion requiring inspection from the external environment. Examples of the driving force transmission member include a coupling provided between the wafer conveyance mechanism and the motor in order to operate the wafer conveyance mechanism. Examples of the environment shut-off mechanism include a shutter provided in a housing. Further, for example, a switch for interrupting the alarm output on the control circuit is also operated for isolation so that the alarm is not generated on the display means 205 when the above circuit breaker is operated. Included in the equipment. As a specific example, a “leak sensor interlock disabling switch” described later corresponds to this. Next, the alarm table 210 will be specifically described.

  As shown in FIG. 5, in the “alarm item” column of the alarm table 210, alarms such as “oven A abnormality”, “heater A disconnection”, “heater A power leakage”, “heater A cooling abnormality” are displayed. The contents are stored. In the “inspection part” field, when the alarm recorded in the “alarm item” field occurs, the name of the part that causes an abnormality, that is, the part that requires inspection is stored. . As shown in FIG. 5, when an alarm of “Oven A Abnormal”, “Heater A Disconnection”, or “Heater A Power Supply Leakage” is generated, the “inspection site” is a heat treatment plate provided in the heat treatment unit 40. However, when the alarm is “heater A cooling abnormality”, there is a possibility that an abnormality has occurred in a cooling water system 230 provided outside the heat treatment unit 40, which will be described later. The cooling water system 230 is also included in the “inspection site”. Further, “A” described at the end of each alarm name described in the “alarm item” column of FIG. 5 is an identification symbol for indicating a part corresponding to the heat treatment unit 40, for example, the heat treatment unit 41, for example. If, in other words, the alarm to be inspected is the heat treatment unit 41, it is stored as “Heater B disconnection” using the symbol “B”, for example. Such an identification method is naturally not limited to the contents of the present embodiment, and can be arbitrarily set.

  Next, in the column of “Isolated equipment”, “power supply circuit breaker A”, “equipment to be operated when isolating the heat treatment plate A that is a site to be inspected from the substrate processing apparatus 1” “Control power circuit breaker A”, “cooling water valve A”, “exhaust duct A”, “shutter A”, “leak sensor interlock invalidation switch A” are stored. For example, as shown in FIG. 6, the “power supply circuit breaker A” is a plurality of circuit breakers 221 a to 221 g provided in the power supply system 220 for supplying power to the heat treatment units 40 to 46. The circuit breaker 221a corresponding to the heat treatment unit 40 is meant. The “control power circuit breaker A” is a circuit breaker (not shown) provided in a control power system (not shown) for supplying control power used to control the heat treatment units 40 to 46. Of these, the circuit breaker corresponding to the heat treatment unit 40 is referred to. Further, the “cooling water valve A” is, for example, as shown in FIG. 7, among the plurality of valves 231 a to 231 g provided in the cooling water system 230 that supplies the cooling water to the respective heat treatment units 40 to 46. 40 represents a valve 231a that isolates the cooling system 40 from the cooling water system 230. Further, “exhaust duct A” means an exhaust duct corresponding to the heat treatment unit 40 among the exhaust ducts (not shown) individually provided in each of the heat treatment units 40 to 46. “Shutter A” is a shutter (not shown) provided in a housing of the heat treatment unit 40 to block the environment between, for example, the wafer transfer region D of the substrate processing apparatus 1 and the heat treatment unit 40. The “leak sensor interlock disable switch A” is used to protect the chiller 232 of the coolant system 230 when the leak sensor 233 provided in the coolant system 230 shown in FIG. This is a switch for invalidating the protective interlock for stopping the chiller 232. Specifically, in the interlock circuit as shown in FIG. 8 configured by a program in the control device 6, even if the water leakage sensor 233 corresponding to the heat treatment unit 40 detects water leakage, the protection interface This is a control signal 250 for preventing the locking operation from being performed, and is operated by, for example, an invalidation switch (not shown) provided in the control device 6. The reason why the interlock is invalidated is, for example, that the leakage sensor 233 is operated by operating the valve 231a and the protective interlock that stops the chiller 232 is prevented from operating.

  In the above description, the case where the device to be inspected is the heat treatment unit has been described. However, the alarm table 210 in FIG. 5 includes, for example, the resist coating unit 32 and the edge exposure device (not shown) in the substrate processing apparatus 1. The information on other processing units such as (No.) is also stored in the same manner. For example, “spin motor power leakage” and “resist liquid supply interruption” are stored as alarms applied to the resist coating unit 32. In the case of “spin motor power supply leakage”, the spin motor indicates “resist liquid supply interruption”. In this case, each of the resist solution supply devices becomes an “inspection site”.

  In addition, when the inspection site is a spin motor, it is not related to the operation of the spin motor other than the “motor power circuit breaker” and “motor control power circuit breaker” related to the operation of the spin motor as the “isolate device”. The “nozzle arm power supply circuit breaker” is included, for example, to prevent the operation of the arm that moves the registration nozzle during the check of the spin motor and to ensure the safety of the worker. In other words, "isolated equipment" includes not only equipment that requires operation to isolate the inspection site, but also other drive mechanisms that can access the inspection site to ensure the safety of workers. Other circuit breakers that cut off the power supply to the arm are also included. As a means for preventing the operation of another drive mechanism accessible to the inspection site, an operation mechanism such as a switch for forcibly stopping the operation of the other drive mechanism is used instead of another circuit breaker. It may be used. In addition, for example, “lamp abnormality”, “spin motor power leakage”, and the like are stored as alarms for the peripheral exposure apparatus. In the case of “Lamp Abnormal”, the lamp main body and the lamp power source are inspection parts, and in the case of “Spin Motor Power Leakage”, the spin motor is the inspection part as in the case of the resist coating unit 32.

  In the “operation procedure” column of the alarm table 210, the order in which each device described in “isolated device” should be operated is stored. In FIG. 5, “2”, “3”, “4”, “5”, “6”, “1” in order from the top, which is “leak sensor interlock disabling switch A”. , “Power source circuit breaker A”, “control power source circuit breaker A”, “cooling water valve A”, “exhaust duct A”, and “shutter A”.

  This order is for avoiding troubles such as “leak sensor interlock disable switch A” and “cooling water valve A” such that the entire substrate processing apparatus 1 stops if the operation order is incorrect. To ensure the safety of workers during isolation work, such as "Power supply circuit breaker A" and "Control power supply circuit breaker A", or to be arbitrarily determined based on each viewpoint Of course, the present embodiment is not limited to the contents. Therefore, for example, in FIG. 5, “power supply circuit breaker A” is described as the second operation device and “control power supply circuit breaker A” is described as the third operation device. Also good. Further, for example, the “operating procedure” of “power source circuit breaker A” and “control power source circuit breaker A” may be set to “2”, and these operations may be set in any order. The specific contents of the position information will be described later.

  The abnormality identification unit 203 detects an abnormality that has occurred in the substrate processing apparatus 1 based on signals from various sensors input to the control device 6, and further, the contents of the abnormality and the alarm table 210 stored in the storage unit 202. Refer to the above to identify the parts that require inspection. For example, when the heater A provided in the heat treatment unit 40 is disconnected, the heat treatment unit 40 is specified as a portion requiring inspection. Further, the abnormality specifying means 203 isolates the heat treatment unit 40 specified as the inspection target from other processing units in which no abnormality has occurred, in other words, from other processing units that continue the wafer processing. Identify devices that require operation. Specifically, "Power circuit breaker A", "Control power circuit breaker A", "Water leakage sensor interlock disable switch A", "Cooling water valve A", "Exhaust duct A", "Shutter A" Identified as an operation target device. Based on the information on the specified parts and devices and the information on the alarm table 210, the parts of the parts that need to be inspected are arranged in the substrate processing apparatus 1 and the devices that need to be operated for isolation. The arrangement is specified, and the specified position information is output to the display unit 205. Note that the abnormality determination itself does not necessarily have to be performed by the abnormality specifying unit 203. For example, the control device 6 determines the presence or absence of abnormality based on signals from various sensors, and the alarm signal is abnormal only when the abnormality is determined. An abnormality may be detected by the abnormality identification unit 230 by inputting to the identification unit 230.

  Next, a method for displaying position information stored in the alarm table and position information on the display unit 205 will be described.

  In the “position information” of the alarm table 210, for example, as the position information of the heat treatment unit 40, a drawing showing the arrangement of each processing unit including the heat treatment unit 40 as shown in FIG. 3 is stored. For example, as the position information of “cooling water valve A”, for example, as shown in FIG. 9, “cooling water valve A”, that is, the arrangement of the entire cooling water system 230 including the valve 231 a in the substrate processing apparatus 1 is shown. The drawings are stored. When the position of the “cooling water valve A” is specified by the abnormality specifying unit 203, this position information is output to the display unit 205.

  In the display unit 205, as information for the operator to specify the position of the “cooling water valve A” on the display unit 205 based on the position information from the abnormality specifying unit 203, for example, a drawing as shown in FIG. Is displayed. In FIG. 10, the corresponding part is indicated by diagonal lines. However, in the actual user interface, for example, the corresponding part is blinked or displayed in a color different from other parts. It can be set arbitrarily. Thereby, the worker can confirm the specific position of the “cooling water valve A” in the substrate processing apparatus 1 based on the display of the display means 205. Note that other devices such as the “power supply circuit breaker”, “control power supply circuit breaker A”, and “exhaust duct A” of the power supply system 220 are also displayed on the display means in the same manner as the “cooling water valve A”. . In addition, position information is also displayed as an inspection site for “heat treatment plate A”. In FIG. 10, for convenience of illustration, a state in which the heat treatment unit 40 is displayed as an inspection site is illustrated, but the “inspection site” is specified and displayed on the display unit 205 instead of the “abnormal unit”. This is because, as described above, the part causing the abnormality of the “abnormal unit” is not necessarily located in the “abnormal unit”. Further, the display unit 205 may display the content of the abnormality identified by the abnormality identifying unit 203, or may display the position information of the “abnormal unit” itself.

  In the operation procedure specifying means 204, based on the information in the alarm table 210 of the storage means 202, “power supply circuit breaker A”, “control power supply breaker A”, “leak sensor interlock disable switch A”, “cooling water” The order in which the “valve A”, “exhaust duct A”, and “shutter A” are operated is specified and output to the display means 205. For example, in FIG. 9, “NEXT” and “BACK” are provided on the display unit 205 and, for example, by selecting “NEXT”, the screen for displaying the operation target device follows the order stored in the “operation procedure”. The screen structure in the case of displaying sequentially is illustrated. In order to prevent the operation order from being wrong, for example, a limit switch may be provided in the valve 231 and the operation of “NEXT” or “BACK” may be invalidated depending on the state of the feedback signal of the limit switch. Alternatively, the position information of the next device to be operated may be displayed without receiving the operation of “NEXT” or “BACK” in response to the feedback signal. By adopting such a configuration, it is possible to prevent information other than the device to be operated next from being displayed, so that a human error such as operating the device to be operated next is erroneously performed. Can be prevented.

  The transfer control unit 201 controls each wafer transfer unit so as to bypass the processing unit in which an abnormality has occurred and process the wafer W. When an abnormality occurs, the wafer W that has not been processed is collected in the cassette C according to the collection route stored in advance in the transfer control unit 201. In addition, when the site | part which abnormality generate | occur | produced is specified, it does not perform control which bypasses the said heat processing unit 40 identified automatically by the conveyance control means 201, For example, it issues a warning of abnormality occurrence and an abnormality occurs. Only the notification may be performed.

  Next, an alarm display method and an inspection method in the substrate processing apparatus 1 configured as described above will be described together with a wafer processing process performed in the entire substrate processing apparatus 1.

  In processing the wafer W, first, the cassette C containing a plurality of wafers W is placed on a predetermined cassette placement plate 13 of the cassette station 10. Thereafter, the wafers W in the cassette C are sequentially taken out by the substrate transfer device 21 and transferred to, for example, the transfer device 53 of the third processing unit group G3 of the processing station 11.

  Next, the wafer W is transferred to the heat treatment unit 40 of the second block G2 by the wafer transfer mechanism 70 and subjected to temperature adjustment processing. Thereafter, the wafer W is transferred to the lower antireflection film forming unit 31 of the first block G1, for example, by the wafer transfer mechanism 71, and a lower antireflection film is formed on the wafer W. Thereafter, the wafer W is transferred to the heat treatment unit 41 of the second block G2 and subjected to heat treatment. Thereafter, the wafer W is returned to the delivery unit 53 of the third block G3.

  Next, the wafer W is transferred by the wafer transfer mechanism 90 to the delivery unit 54 of the same third block G3. Thereafter, the wafer W is transferred to the heat treatment unit 42 of the second block G2 by the wafer transfer mechanism 72 and subjected to temperature adjustment processing. Thereafter, the wafer W is transferred to the resist coating unit 32 of the first block G1 by the wafer transfer mechanism 72, and a resist film is formed on the wafer W. Thereafter, the wafer W is transferred to the heat treatment unit 43 by the wafer transfer mechanism 72 and prebaked. Thereafter, the wafer W is returned to the delivery unit 55 of the third block G3 by the wafer transfer mechanism 72.

  Next, the wafer W is transferred by the wafer transfer mechanism 90 to the delivery unit 54 of the same third block G3. Thereafter, the wafer W is transferred to the heat treatment unit 44 of the second block G2 by the wafer transfer mechanism 73 and subjected to temperature adjustment processing. Thereafter, the wafer W is transferred to the upper antireflection film forming apparatus 33 of the first block G1 by the wafer transfer mechanism 73, and an upper antireflection film is formed on the wafer W. Thereafter, the wafer W is transferred to the heat treatment unit 45 of the second block G2 and subjected to heat treatment. Thereafter, the wafer W is transferred by the wafer transfer mechanism 73 to the delivery unit 56 of the third block G3.

  Next, the wafer W is transferred to the transfer unit 52 by the wafer transfer mechanism 90 and transferred to the transfer unit 62 of the fourth block G4 by the shuttle transfer device 80. Thereafter, the wafer W is transferred to the exposure apparatus 4 by the wafer transfer mechanism 91 of the interface station 7 and subjected to exposure processing.

  Next, the wafer W is transferred by the wafer transfer mechanism 91 to the delivery unit 60 of the fourth block G4. Thereafter, the wafer W is transferred to the heat treatment unit 46 by the wafer transfer mechanism 70 and subjected to post-exposure baking. Next, the wafer W is transferred to the heat treatment unit 45 and subjected to temperature adjustment processing, and then transferred to the development processing unit 30 by the wafer transfer mechanism 70 and developed. After completion of the development, the wafer W is transferred to the heat treatment unit 44 by the wafer transfer mechanism 70 and subjected to a post-bake process. Thereafter, the wafer W is transferred to the heat treatment unit 43 and the temperature is adjusted. Thereby, a series of photolithography processes are completed.

  Thereafter, the wafer W is transferred by the wafer transfer mechanism 70 to the delivery unit 62 of the fourth block G4. Then, the wafer W is transferred to the defect inspection unit 100 by the wafer transfer mechanism 91, and the wafer W is inspected. Thereafter, the wafer W is transferred to the delivery unit 62 by the wafer transfer mechanism 91 and transferred to the cassette C of the predetermined cassette placement plate 13 via the wafer transfer mechanism 70 and the wafer transfer mechanism 21. This series of photolithography steps is repeated in the other heat treatment units 41 to 46.

  Next, in the course of the above-described photolithography process, for example, when an abnormality occurs in the heat treatment unit 40 and an alarm for notifying the display means 205 is issued, the operation of the substrate processing apparatus 1 and a series of inspection operations are performed. This will be described with reference to the flowchart shown in FIG.

  For example, when the heater of the heat treatment unit 40 is disconnected while the wafer W is heat-treated by the heat treatment unit 40, first, an alarm of “heater A disconnection” is displayed on the display means 205 (step S1 in FIG. 11). The processing in the heat treatment unit 40 is stopped (step S2 in FIG. 11). Next, according to a command from the transfer control unit 201, the unprocessed wafer W in the heat treatment unit 40 is unloaded from the heat treatment unit 40 by the transfer mechanism 70 and is collected in the cassette C along the collection route (step S3 in FIG. 11). . In the other heat treatment units 41 to 46, the processing of the wafer W is continued.

  In parallel with the alarm display on the display means 205, the abnormality identification means 203 also detects an abnormality, and the heat treatment unit 40 checks based on the content of the abnormality ("heater A disconnection") and information in the alarm table 210. Identified as a symmetric part. Then, for example, as shown in FIG. 10, the arrangement of the heat treatment unit 40 is displayed on the display means 205 (step S4 in FIG. 11).

  Next, when the thermal processing unit 40 is isolated from the substrate processing apparatus 1 by the abnormality specifying unit 203, a device to be operated is specified, and position information of the specified device is input to the display unit 205 (FIG. 11 step S5). Further, the operation procedure specifying unit 204 specifies the operation procedure of each device specified as the operation target by the abnormality specifying unit 203, and information on this operation procedure is output to the display unit 205 (step S6 in FIG. 11).

  The display unit 205 displays the position information of the “power supply circuit breaker A” that is operated first based on the information output from the abnormality specifying unit 203 and the operation procedure specifying unit 204 (step S7 in FIG. 11). ).

  Thereafter, the worker confirms the position information of the heat treatment unit 40 and the position information of the “power supply circuit breaker A” displayed on the display means 205 and operates the “power supply circuit breaker A” of the substrate processing apparatus 1 to operate the power supply. Is blocked (step S8 in FIG. 11).

  Thereafter, the worker selects “NEXT” on the screen of the display means 205 and displays the position information of “control power circuit breaker A” which is the next operation-symmetric device (step S9 in FIG. 11). Then, the worker confirms the position information of “control power circuit breaker A” displayed on the display means 205 and operates “control power circuit breaker A” to shut off the power (step S10 in FIG. 11).

  Thereafter, position information display of “leak sensor interlock invalidation switch A” (step S11 in FIG. 11), invalidation operation of “leak sensor interlock invalidation switch A” (step S12 in FIG. 11), “cooling water valve” A ”position information display (step S13 in FIG. 11),“ cooling water valve A ”closing operation (step S14 in FIG. 11),“ exhaust duct A ”position information display (step S15 in FIG. 11),“ exhaust gas ” The removal of “duct A” (step S16 in FIG. 11) is sequentially performed. Then, after the “exhaust duct A” is removed, when the closing operation of “shutter A” (step 17 in FIG. 11) is completed, the heat treatment unit 40 can be inspected. An inspection operation such as confirming the state of the above or replacing the heater if necessary is appropriately performed (step S18 in FIG. 11). When the inspection work is completed, a recovery work for returning the heat treatment unit 40 to a usable state is then performed (step S19 in FIG. 11).

  When the heat treatment unit 40 is restored, the alarm displayed on the display means 205 is released, and then the inspection wafer is carried into the substrate processing apparatus 1. The inspection wafer is transferred to the heat treatment unit 40, and then a predetermined heat treatment is performed in the heat treatment unit 40. When it is confirmed that no abnormality occurs in the heat treatment on the inspection wafer, the wafers W in the cassette C are sequentially transferred to the heat treatment unit 40 and the wafers W are processed again.

  According to the above embodiment, the abnormality identification unit 203 detects an abnormality that has occurred in the substrate processing apparatus 1 and identifies a part that needs to be inspected due to the abnormality and a device that is operated for isolation. . Then, since the position information of these specified parts and devices and the operation procedure of these specified devices are specified and output to the display means 205, the position and operation procedure of each device displayed on the display means 205 is confirmed. By doing so, the inspection work can be carried out quickly and without error without being influenced by the experience of the worker.

  Further, for example, the heat treatment unit 40 identified as abnormal by the abnormality specifying unit 203 is detoured by the transfer control unit 201 to transfer the wafer W, so that the processing of the wafer W is performed by another processing unit in which no abnormality has occurred. Can continue.

  In the above embodiment, the procedure for isolating the heat treatment unit 40 in which an abnormality has occurred from the substrate processing apparatus 1 is output and displayed on the display means 205. The procedure of the restoration work after the completion of the process, in other words, the procedure for releasing the isolation of the heat treatment unit 40 may be displayed on the display means 205. In such a case, in the “operation procedure” column of the storage unit 202, in addition to the procedure for isolation, a procedure for releasing the isolation is also stored. Even in the case of releasing the isolation, for example, when the operation procedure of “cooling water valve A” and “leak sensor interlock disable switch A” is wrong, the controller 6 recognizes that an abnormality has occurred and performs substrate processing. Since the apparatus 1 may stop, such a trouble can be avoided by outputting and displaying the procedure for releasing the isolation on the display means 205.

  In the above embodiment, for example, device operation at the time of isolation has been described, for example, a case where an operator manually handles, for example, the specification is such that the device to be operated can be remotely operated at the time of isolation, for example, You may make it operate separately from the display means 205 separately. In such a case, it is preferable that a remotely operated device is provided with a limit switch or the like so that the state of the device can be confirmed by a feedback signal. By doing so, when it is operated from the display means 205, it is not necessary to confirm on the machine side whether or not the device has actually operated, so that the inspection work can be performed more quickly.

  In the above embodiment, if the contents of “inspection site” in the alarm table 210 are the same, the contents of “isolated device” and “operation procedure” are the same regardless of the contents of “alarm item”. However, depending on the content of the abnormality that has occurred, it is not always necessary to operate all “isolated devices”. Therefore, “isolated device” and “operation procedure” may be set individually according to the content of “alarm item”.

  In the above embodiment, the case where the heat treatment unit 40 is inspected when, for example, a failure occurs in the equipment constituting the heat treatment unit 40 has been described. However, other processes such as the resist coating unit 32 and the edge exposure unit are described. Even when an alarm is issued to the unit, various information is output to the display means 205 as in the case of the heat treatment unit 40, and an inspection operation is performed according to the information displayed on the display means 205. Further, the content of the abnormality is not limited to the failure of the device. For example, when the defect W is processed in the specific processing unit as a result of inspecting the wafer W in the defect inspection unit 100, the identification is also performed. It may be determined that an abnormality has occurred in the processing unit, and an alarm may be generated. In such a case, the control device is configured to store in the alarm table 210 the relationship between the alarm due to concentration of defects and the part that needs to be inspected, and to output information necessary for the inspection to the display means 205 when the alarm is generated. 6 is configured.

  In addition, there is a case where inspection of each processing unit is requested in a state where the operation of the substrate processing apparatus 1 is continued regardless of whether there is an abnormality. In order to cope with such a case, for example, a “maintenance mode” switch is provided on the display means, and the processing unit desired to be checked is selected in the state where “maintenance mode” is selected, so that the abnormality specifying means 203 is generated by generating an alarm. The control device 6 may be configured so that the same control as when the inspection target part is specified in step S4, that is, the control after step S4 or step S5 shown in FIG.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  The present invention is useful when processing a substrate such as a semiconductor wafer.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Cassette station 3 Processing station 4 Exposure apparatus 5 Interface station 6 Control apparatus 10 Cassette carrying-in part 11 Wafer conveyance part 12 Cassette mounting base 13 Cassette mounting plate 20 Conveyance path 21 Wafer conveyance mechanism 30 Development processing unit 31 Lower reflection Antireflection film forming unit 32 Resist coating unit 33 Upper antireflection film forming unit 40 to 46 Heat treatment unit 50 to 56 Delivery unit 60 to 62 Delivery unit 70 to 73 Wafer transport mechanism 80 Shuttle transport mechanism 90 Wafer transport mechanism 91 Wafer transport mechanism 100 Defect Inspection unit 200 Transfer control means 201 Wafer processing control means 202 Storage means 203 Abnormality specification means 204 Operation procedure specification means 205 Display means 210 Alarm table 220 Power supply System 221a~g breaker 230 cooling water system 231a~g valve 232 Chiller W wafer F1~F3 cup D wafer transfer region C cassette

Claims (8)

A substrate processing apparatus comprising: a plurality of processing units that process a plurality of substrates in parallel; and a display unit that displays an alarm when an abnormality occurs in each processing unit,
The plurality of processing units include processing units that perform different processes.
Information that correlates the content of the alarm of the occurrence of an abnormality with the part that requires inspection due to the occurrence of the abnormality,
It is set for each part that needs to be inspected, and when performing the inspection work, the part that needs to be inspected is separated from the other part so as not to affect other parts where no abnormality has occurred. Information on the device being operated to isolate, and
Position information of the part that requires the inspection and position information of the device operated for the isolation,
Information on the operating procedure of the device operated for the isolation;
Storage means for storing
An abnormality occurring in each processing unit is detected, and based on the information in the storage unit, a part that needs to be inspected due to the occurrence of the abnormality and a device operated for the isolation are specified, and further, these An abnormality specifying means for specifying the position of the part and device and outputting to the display means;
An operation procedure specifying means for specifying an operation procedure for the device specified by the abnormality specifying means based on the information in the storage means and outputting the operation procedure to the display means. apparatus. The display means is a user interface including any one of a touch panel, a monitor, and a liquid crystal display,
The substrate processing apparatus according to claim 1, wherein the device operated for isolation is remotely operable from the user interface. The substrate processing apparatus according to claim 1, wherein the device operated for the isolation is at least one of the following (1) to (6).
(1) Circuit breaker that cuts off the electrical connection between the part that needs to be inspected and other parts where no abnormality has occurred (2) The part that needs to be inspected and other parts that do not have any abnormality Fluid shut-off mechanism for shutting off the flow of fluid flowing between the parts (3) A switch for shutting off an alarm signal for occurrence of abnormality output to the display means (4) A part requiring inspection and driving the part Driving force transmission member (5) provided between the driving mechanism and the environment mechanism (6) that shuts off the site requiring inspection from the external environment (6) Accessible to the site requiring inspection Another circuit breaker that cuts off power supply to another drive mechanism, or an operation mechanism that stops the operation of the other drive mechanism A substrate transfer mechanism for transferring the substrate;
A conveyance control means for controlling conveyance of the substrate by the substrate conveyance mechanism,
The substrate processing apparatus according to claim 1, wherein the transfer control unit controls the substrate transfer mechanism so as to bypass the processing unit in which an abnormality has occurred and transfer the substrate. An alarm display method in the substrate processing apparatus according to claim 1,
The abnormality detecting means detects an abnormality that has occurred in the processing unit, and then, based on the information in the storage means, the part that needs to be inspected due to the occurrence of the abnormality and the device operated for the isolation, and these Identifying the part and the position of the device and outputting them to the display means,
Further, the operation procedure specifying means specifies an operation procedure of the device operated for the isolation based on the information in the storage means, and outputs it to the display means. A method for inspecting a substrate processing apparatus comprising: a plurality of processing units that process a plurality of substrates in parallel; and a display unit that displays an alarm for occurrence of an abnormality in each processing unit,
The plurality of processing units include processing units that perform different processes.
When an abnormality occurs in at least one of the processing units, an alarm is issued,
Then, based on the content of the alarm of the occurrence of abnormality, identify the part that needs to be inspected due to the occurrence of the abnormality,
The inspection is set for each region to be necessary, when performing inspection work, the site where the inspection is required, from the other portions so as not to affect the other parts no abnormality occurred Identify the device to be operated for isolation and identify the operating procedure for the identified device,
Furthermore, the position of the part that needs to be inspected and the position of the specified device are specified,
Displaying the position of the part requiring inspection and the position of the specified device, and the operation procedure of the specified device on the display means;
The part displayed on the display means that requires the inspection and the position of the specified equipment, and the part that requires the operation of the specified equipment and the inspection according to the operation procedure of the specified equipment. A method for inspecting a substrate processing apparatus, comprising: A program that operates on a computer of a control device that controls the substrate processing apparatus so that the alarm display method according to claim 5 is executed by the substrate processing apparatus. A readable computer storage medium storing the program according to claim 6.

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