JP5657319B2 - LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE LIGHT EMITTING DEVICE - Google Patents

LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE LIGHT EMITTING DEVICE Download PDF

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JP5657319B2
JP5657319B2 JP2010215857A JP2010215857A JP5657319B2 JP 5657319 B2 JP5657319 B2 JP 5657319B2 JP 2010215857 A JP2010215857 A JP 2010215857A JP 2010215857 A JP2010215857 A JP 2010215857A JP 5657319 B2 JP5657319 B2 JP 5657319B2
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emitting device
circuit board
light emitting
heat sink
holding member
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JP2012074134A (en
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高明 片岡
高明 片岡
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Panasonic Intellectual Property Management Co Ltd
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Description

本発明は、光源として固体発光素子を用いた発光装置及びこの発光装置を備えた照明器具に関する。   The present invention relates to a light-emitting device using a solid-state light-emitting element as a light source and a lighting fixture including the light-emitting device.

従来から、照明器具には、光源から出射される光の拡散、配光制御又は光源の保護等のため、器具本体の開口近傍に光を透過する透過パネルが設置されている。また、光源として蛍光灯を用いた照明器具では、蛍光灯が空気流で冷却されて発光効率が低下することを抑制するため、器具本体の開口が透過パネルで塞がれる。一方、光源として発光ダイオード(LED)を用いた照明器具では、一般的に、LED基板が光透過部材でハウジングされたLED基板ユニットによって器具本体の開口が塞がれている。   2. Description of the Related Art Conventionally, in a lighting fixture, a transmissive panel that transmits light is installed in the vicinity of the opening of the fixture body in order to diffuse light emitted from the light source, control light distribution, or protect the light source. In addition, in a lighting fixture using a fluorescent lamp as a light source, the opening of the fixture main body is closed with a transmissive panel in order to prevent the fluorescent lamp from being cooled by an air flow and reducing the luminous efficiency. On the other hand, in a lighting fixture using a light emitting diode (LED) as a light source, the opening of the fixture body is generally closed by an LED board unit in which the LED board is housed by a light transmitting member.

しかし、LEDは、蛍光灯とは異なり、温度上昇によって発光効率が顕著に低下するため、LED基板ユニットに放熱部材を密着させて熱伝導による放熱が一般的に行われている。この発光装置において、基板上の発光素子の設置箇所に貫通孔を設け、基板を挟んで貫通孔を介して熱伝導部材であるヒートシンクと発光素子であるLEDパッケージとを直接かつ密接に接触させたものが知られている(例えば、特許文献1参照)。   However, unlike fluorescent lamps, the light emission efficiency of LEDs is remarkably lowered due to a rise in temperature. Therefore, heat radiation is generally performed by bringing a heat radiation member into close contact with the LED substrate unit. In this light emitting device, a through hole is provided at a place where the light emitting element is provided on the substrate, and the heat sink as the heat conducting member and the LED package as the light emitting element are brought into direct and intimate contact via the through hole with the substrate interposed therebetween. Those are known (for example, see Patent Document 1).

特開2006−147744号公報JP 2006-147744 A

しかしながら、上記特許文献1に記載された光源装置において、ヒートシンクとLEDパッケージとは、夫々が個別に成形されたものであるため、それらを隙間無く正確に密着させることは容易でない。また、特許文献1には、貫通孔に充填材を設けた形態が記載されているが、この場合でも、充填材とヒートシンクとの間に若干の隙間が形成されることがある。このような隙間が存在すると、LEDパッケージからヒートシンクへの熱流量が低下し、放熱性が悪くなる。また、充填材は軟性があるので、LEDパッケージとヒートシンクとの間に充填材を均一に設けることは容易でなく、器具組立の作業性が良くない。   However, in the light source device described in Patent Document 1, since the heat sink and the LED package are individually molded, it is not easy to accurately adhere them without any gap. Moreover, although the form which provided the filler in the through-hole is described in patent document 1, a some clearance gap may be formed between a filler and a heat sink also in this case. If such a gap exists, the heat flow from the LED package to the heat sink decreases, resulting in poor heat dissipation. In addition, since the filler is soft, it is not easy to provide the filler uniformly between the LED package and the heat sink, and the workability of assembling the appliance is not good.

本発明は、上記問題を解決するものであり、光源として用いられる固体発光素子からの熱を効率的に放熱することができ、しかも器具組立の作業性の良い発光装置及びこの発光装置を備えた照明器具を提供することを目的とする。   The present invention solves the above-described problem, and can efficiently dissipate heat from a solid-state light-emitting element used as a light source, and further includes a light-emitting device that has good workability in assembling an instrument, and the light-emitting device. It aims at providing a lighting fixture.

上記課題を解決するため、本発明の発光装置は、固体発光素子が実装される回路基板と、前記固体発光素子から生じた熱を放熱するためのヒートシンク部材と、前記回路基板と前記ヒートシンク部材との間に設けられる回路基板保持部材と、を備え、前記ヒートシンク部材に前記回路基板保持部材がインサート成形されており、前記ヒートシンク部材は、前記回路基板保持部材が設けられる面に形成されて前記回路基板に接続されるリード線を挿通させるための挿通孔を有し、前記挿通孔の端部エッジに前記回路保持部材が一部被覆していることを特徴とする。 In order to solve the above problems, a light emitting device of the present invention includes a circuit board on which a solid light emitting element is mounted, a heat sink member for radiating heat generated from the solid light emitting element, the circuit board, and the heat sink member. A circuit board holding member provided between the circuit board, the circuit board holding member being insert-molded on the heat sink member, and the heat sink member formed on a surface on which the circuit board holding member is provided. An insertion hole for inserting a lead wire connected to the board is provided, and the circuit holding member partially covers the edge of the insertion hole .

上記発光装置において、前記回路基板保持部材は、絶縁性を有する樹脂材料から形成されていることが好ましい。   In the light emitting device, the circuit board holding member is preferably formed of an insulating resin material.

また、上記発光装置において、前記回路基板保持部材は、前記ヒートシンク部材と接する面に複数の凸状部が形成されていることが好ましい。   In the light emitting device, it is preferable that the circuit board holding member has a plurality of convex portions on a surface in contact with the heat sink member.

また、上記発光装置において、前記樹脂材料は、フィラーを含有することが好ましい。   In the light emitting device, the resin material preferably contains a filler.

上記発光装置は、照明装置に備えられることが好ましい。。   The light emitting device is preferably provided in a lighting device. .

本発明によれば、インサート成形によって回路基板保持部材とヒートシンク部材とが実質的に一体的に形成されているので、固体発光素子からの熱を回路基板保持部材を介してヒートシンク部材に効率的に放熱することができ、しかも器具組立の作業性が良い。   According to the present invention, since the circuit board holding member and the heat sink member are formed substantially integrally by insert molding, the heat from the solid light emitting element is efficiently transferred to the heat sink member via the circuit board holding member. Heat can be dissipated, and the assembly workability is good.

本発明の一実施形態に係る発光装置を用いた照明器具の斜視図。The perspective view of the lighting fixture using the light-emitting device which concerns on one Embodiment of this invention. 同発光装置の分解斜視図。The disassembled perspective view of the light-emitting device. 同発光装置の側断面図。The sectional side view of the light-emitting device. (a)乃至(c)は、同発光装置において、ヒートシンク部材に回路基板保持部材をインサート成形する手順を示す側断面図。(A) thru | or (c) is a sectional side view which shows the procedure which insert-molds a circuit board holding member in a heat sink member in the light-emitting device.

本発明の一実施形態に係る発光装置について、図1乃至図4(a)(b)を参照して説明する。図1に示すように、本実施形態の発光装置1は、天井、壁面等に埋め込まれる埋込型の照明器具10に組み込まれている。照明器具10は、発光装置1を保持すると共に、発光装置1を点灯させる電源ユニット(不図示)を収容する本体部11と、天井等に形成された開口部に嵌め込まれ、光源等を保持する枠体部12と、商用電源から電源供給を受けるための電源線が接続される端子台13と、枠体部12を天井等に固定するための取付バネ14と、を備える。   A light emitting device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4A and 4B. As shown in FIG. 1, the light emitting device 1 of this embodiment is incorporated in an embedded lighting fixture 10 embedded in a ceiling, a wall surface, or the like. The lighting fixture 10 holds the light emitting device 1 and is fitted into a main body 11 that houses a power supply unit (not shown) that lights the light emitting device 1 and an opening formed in a ceiling or the like, and holds a light source and the like. A frame body portion 12, a terminal block 13 to which a power supply line for receiving power supply from a commercial power source is connected, and an attachment spring 14 for fixing the frame body portion 12 to a ceiling or the like are provided.

図2に示すように、発光装置1は、固体発光素子(以下、LED2)が実装される回路基板3と、LED2の熱を放熱するためのヒートシンク部材4と、回路基板3とLEヒートシンク部材4との間に設けられる回路基板保持部材(以下、保持部材5)と、を備える。これらヒートシンク部材4及び保持部材5は、一方が他方に対してインサート成形される。本実施形態においては、保持部材5が、絶縁性を有する樹脂材料から形成され、同保持部材5の一方の面は回路基板3と密着し、他方の面はヒートシンク部材4とインサート成形されている構成例に基いて説明する。この構成例では、ヒートシンク部材4が放熱性の高いアルミニウム合金等の金属材料から形成され、このヒートシンク部材4に対して、樹脂材料から構成される保持部材5がインサート成形される。   As shown in FIG. 2, the light emitting device 1 includes a circuit board 3 on which a solid light emitting element (hereinafter, LED 2) is mounted, a heat sink member 4 for radiating heat of the LED 2, a circuit board 3, and an LE heat sink member 4. Circuit board holding member (hereinafter, holding member 5) provided between the two. One of the heat sink member 4 and the holding member 5 is insert-molded with respect to the other. In the present embodiment, the holding member 5 is formed of an insulating resin material, one surface of the holding member 5 is in close contact with the circuit board 3, and the other surface is insert-molded with the heat sink member 4. This will be described based on a configuration example. In this configuration example, the heat sink member 4 is formed of a metal material such as an aluminum alloy having high heat dissipation, and the holding member 5 made of a resin material is insert-molded with respect to the heat sink member 4.

発光装置1は、LED2を保護する保護カバー6を備える。保護カバー6の裏面側にはネジホルダ(不図示)が設けられており、ヒートシンク部材4(本体部11)内側から挿通されたネジ(不図示)によって保護カバー6とヒートシンク部材4とが固定される。回路基板3は、保護カバー6と、インサート成形によって保持部材5と実質的に一体となっているヒートシンク部材4とによって挟持される。   The light emitting device 1 includes a protective cover 6 that protects the LED 2. A screw holder (not shown) is provided on the back side of the protective cover 6, and the protective cover 6 and the heat sink member 4 are fixed by screws (not shown) inserted from the inside of the heat sink member 4 (main body 11). . The circuit board 3 is sandwiched between a protective cover 6 and a heat sink member 4 that is substantially integrated with the holding member 5 by insert molding.

LED2には、例えば、青色LED素子と、LED素子の発光面を囲むように配置された蛍光体部材から成る白色LEDを用いたLEDパッケージが用いられる。青色LED素子は、LED2の発熱を放熱するための金属板から成る放熱板上に絶縁基板を介して実装されることが好ましい。また、例えば、発光効率の高い汎用の1W(ワット)クラスのものが好適に用いられる。   For example, an LED package using a white LED composed of a blue LED element and a phosphor member disposed so as to surround the light emitting surface of the LED element is used as the LED 2. The blue LED element is preferably mounted on a heat radiating plate made of a metal plate for radiating heat generated by the LED 2 via an insulating substrate. Further, for example, a general-purpose 1 W (watt) class having high luminous efficiency is preferably used.

回路基板3は、ガラスエポキシ等から形成された基板31に複数のLED2が設けられたものである。回路基板3の平面外形は、本体部11の内部形状に合わせた形状、例えば略円形であり、ヒートシンク部材4に取り付けるための切欠き穴32が周囲に形成されている。LED2は、基板31の裏面から接合され、基板31に形成された開口部から発光面側に露出している。基板31の裏面には、導電パターン(図示せず)が形成されており、各LED2がこの導電パターンに接続される。導電パターンは、リード線33により本体部11に収容された電源ユニットに接続される。このリード線33は、基板31に設けられたスルーホール(不図示)に挿通されて、導電パターンに電気的に接続される。   The circuit board 3 is obtained by providing a plurality of LEDs 2 on a substrate 31 made of glass epoxy or the like. The planar outer shape of the circuit board 3 is a shape matched to the internal shape of the main body 11, for example, a substantially circular shape, and a cutout hole 32 for attaching to the heat sink member 4 is formed around the circuit board 3. The LED 2 is bonded from the back surface of the substrate 31 and is exposed to the light emitting surface side from an opening formed in the substrate 31. A conductive pattern (not shown) is formed on the back surface of the substrate 31, and each LED 2 is connected to this conductive pattern. The conductive pattern is connected to the power supply unit accommodated in the main body 11 by the lead wire 33. The lead wire 33 is inserted into a through hole (not shown) provided in the substrate 31 and is electrically connected to the conductive pattern.

ヒートシンク部材4は、上述したように、本体部11と一体的に又は本体部11の一部として、例えば、上述したようなアルミニウム合金等から形成されており、好ましくは、汎用のアルミダイキャストが用いられる。保持部材5がインサート成形される面には、回路基板3を固定するためのネジ等の固定部材を挿通させるための固定孔(不図示)や、リード線33を本体部11内に挿通させるための挿通孔(不図示)が形成されている。また、外気に触れる表面積を大きくして放熱性を高めるため、複数の突条41が形成されている。   As described above, the heat sink member 4 is formed of, for example, the above-described aluminum alloy integrally with the main body portion 11 or as a part of the main body portion 11. Preferably, a general-purpose aluminum die cast is used. Used. A fixing hole (not shown) for inserting a fixing member such as a screw for fixing the circuit board 3 and a lead wire 33 are inserted into the main body 11 on the surface on which the holding member 5 is insert-molded. Insertion holes (not shown) are formed. Further, a plurality of protrusions 41 are formed in order to increase the surface area in contact with the outside air and improve the heat dissipation.

保持部材5は、絶縁性を有すると共に、高い熱伝導性を有する樹脂材料から形成される。好ましくは、絶縁性が4kV程度、熱伝導性が5〜10W/mkである樹脂材料が用いられる。この樹脂材料には、適宜にフィラーを含有させる。フィラーの種類、添加量等を調整することにより、保持部材5の絶縁性と熱伝導性を任意に制御することができる。このものとしては、例えば、セラミック微粒子等をフィラーとして混入したABS樹脂又はPBT樹脂等が挙げられる。また、フィラーとして、絶縁性を有し、且つ熱伝導性が高い、例えば、酸化アルミニウム(Al)、窒化アルミニウム(AlN)又は酸化チタン(TiO)等の金属酸化物の粒子が用いられてもよい。また、保持部材5に用いられる樹脂材料は、低硬度でクッション性が良く、表面にゲル特有のタック性(粘着性)を有するものが望ましい。また、保持部材5には、回路基板3をヒートシンク部材4に固定するためのネジ等の固定部材を挿通させるための固定孔51や、リード線33を本体部11内に挿通させるための挿通孔52が、夫々ヒートシンク部材4の固定孔及び挿通孔と対応する位置に形成されている。 The holding member 5 is formed of a resin material having an insulating property and a high thermal conductivity. Preferably, a resin material having an insulating property of about 4 kV and a thermal conductivity of 5 to 10 W / mk is used. This resin material appropriately contains a filler. By adjusting the kind of filler, the amount added, and the like, the insulation and thermal conductivity of the holding member 5 can be arbitrarily controlled. As this thing, ABS resin or PBT resin etc. which mixed ceramic fine particles etc. as a filler are mentioned, for example. Further, as the filler, particles of metal oxide such as aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), or titanium oxide (TiO 2 ) having insulating properties and high thermal conductivity are used. May be. In addition, the resin material used for the holding member 5 is desirably a low hardness, good cushioning property, and a surface having gel-specific tackiness (adhesiveness). The holding member 5 has a fixing hole 51 for inserting a fixing member such as a screw for fixing the circuit board 3 to the heat sink member 4, and an insertion hole for inserting the lead wire 33 into the main body 11. 52 are formed at positions corresponding to the fixing hole and the insertion hole of the heat sink member 4, respectively.

保護カバー6は、例えば、透明アクリル等の光透過材料を有底円筒形状に射出成型したものである。保護カバー6は、LED2の設置位置に対応するように複数の出射口61が設けられており、この出射口61には、LED2からの光を配光制御するためのレンズ62が嵌め込まれる。レンズ62は、保護カバー6と一体的に成形されていてもよい。出射口61の内周面は、反射面として形成されていてもよい。また、好ましくは、保護カバー6の底部表面、すなわち、回路基板3と対向する面には、シボ加工が施される。こうすれば、回路基板3等の発光装置1の内部構造を外部から見え難くすることができる。   The protective cover 6 is obtained by injection-molding a light-transmitting material such as transparent acrylic into a bottomed cylindrical shape. The protective cover 6 is provided with a plurality of emission ports 61 so as to correspond to the installation positions of the LEDs 2, and lenses 62 for controlling the light distribution of the light from the LEDs 2 are fitted into the emission ports 61. The lens 62 may be formed integrally with the protective cover 6. The inner peripheral surface of the emission port 61 may be formed as a reflective surface. Preferably, the bottom surface of the protective cover 6, that is, the surface facing the circuit board 3 is subjected to a graining process. By doing so, it is possible to make the internal structure of the light emitting device 1 such as the circuit board 3 difficult to see from the outside.

図3に示すように、ヒートシンク部材4における保持部材5が成形される面には、複数の凹状部材42が設けれている。そのため、インサート成形される保持部材5は、そのインサート成形される面に複数の凸状部53が形成される。また、保持部材5の回路基板3が密着される面は、回路基板3の裏面に対応する形状に形成される。このように、保持部材5に、複数の凸状部53が形成され、これらがヒートシンク部材4の凹状部材42と嵌まり込むことにより、ヒートシンク部材4と保持部材5とが接する面積が大きくなり、保持部材5からヒートシンク部材4への熱流量が大きくなる。その結果、発光装置1は、光源として用いられるLED2からの熱を保持部材5を介して効率的に放熱することができる。   As shown in FIG. 3, a plurality of concave members 42 are provided on the surface of the heat sink member 4 on which the holding member 5 is molded. Therefore, the holding member 5 to be insert-molded has a plurality of convex portions 53 formed on the surface to be insert-molded. The surface of the holding member 5 to which the circuit board 3 is closely attached is formed in a shape corresponding to the back surface of the circuit board 3. Thus, a plurality of convex portions 53 are formed on the holding member 5, and by fitting these into the concave member 42 of the heat sink member 4, an area where the heat sink member 4 and the holding member 5 are in contact with each other increases. The heat flow from the holding member 5 to the heat sink member 4 increases. As a result, the light emitting device 1 can efficiently dissipate heat from the LED 2 used as the light source via the holding member 5.

次に、ヒートシンク部材4に保持部材5をインサート成形する手順を図4(a)乃至(c)を参照して説明する。まず、図4(a)に示すように、保持部材5の形状に対応するように成形加工された所定形状の金型7が、ヒートシンク部材4に取り付けられる。次に、図4(b)に示すように、ヒートシンク部材4に保持部材5を構成する樹脂材料Rが充填される。樹脂材料Rが硬化した後、図4(c)に示すように、金型7が取り外され、ヒートシンク部材4に保持部材5がインサート成形される。なお、発光装置1の形状が直線型である場合には、ヒートシンク部材4と保持部材5とを同時押し出し製法で製造することもできる。また、ヒートシンク部材4は、高い放熱性と、筐体としての十分な剛性とを有するものであれば、樹脂材料から形成されていてもよく、この場合も、ヒートシンク部材4と保持部材5とを同時押し出し製法で製造することができる。   Next, a procedure for insert-molding the holding member 5 on the heat sink member 4 will be described with reference to FIGS. First, as shown in FIG. 4A, a mold 7 having a predetermined shape that is molded so as to correspond to the shape of the holding member 5 is attached to the heat sink member 4. Next, as shown in FIG. 4B, the heat sink member 4 is filled with the resin material R constituting the holding member 5. After the resin material R is cured, the mold 7 is removed and the holding member 5 is insert-molded on the heat sink member 4 as shown in FIG. In addition, when the shape of the light-emitting device 1 is a linear type, the heat sink member 4 and the holding member 5 can also be manufactured by a simultaneous extrusion manufacturing method. The heat sink member 4 may be made of a resin material as long as it has high heat dissipation and sufficient rigidity as a housing. In this case, the heat sink member 4 and the holding member 5 are It can be manufactured by the simultaneous extrusion method.

このように、ヒートシンク部材4に保持部材5をインサート成形することにより、保持部材5とヒートシンク部材4とが実質的に一体化され、それらが隙間なく密着するので、保持部材5からヒートシンク部材4へ熱が効率的に伝わる。その結果、発光装置1は、光源として用いられるLED2からの熱を保持部材5を介してより効率的に放熱することができる。また、従来のような、ヒートシンク部材4との回路基板3との間に充填材等を設ける作業が不要であるため、発光装置1を照明器具10として組み立てる際の作業性が良い。更に、リード線33を挿通させるためにヒートシンク部材4に形成された挿通孔の端部エッジに、保持部材5を構成する樹脂材料が一部被覆される。そのため、この端面エッジにリード線33が直接的には接触し難くなり、リード線33の被覆損傷を抑制することがきる。   In this manner, by insert-molding the holding member 5 on the heat sink member 4, the holding member 5 and the heat sink member 4 are substantially integrated, and they are in close contact with each other, so that the holding member 5 is transferred to the heat sink member 4. Heat is transmitted efficiently. As a result, the light emitting device 1 can more efficiently dissipate heat from the LED 2 used as the light source via the holding member 5. Moreover, since the operation | work which provides a filler etc. between the heat sink member 4 and the circuit board 3 like the past is unnecessary, the workability | operativity at the time of assembling the light-emitting device 1 as the lighting fixture 10 is good. Further, the end edge of the insertion hole formed in the heat sink member 4 for inserting the lead wire 33 is partially covered with the resin material constituting the holding member 5. Therefore, it is difficult for the lead wire 33 to come into direct contact with the edge of the end face, and the covering damage of the lead wire 33 can be suppressed.

なお、本発明は、上記実施形態の構成に限られず、発明の要旨を変更しない範囲で種々の変形が可能である。例えば、保持部材5が放熱性の高いアルミニウム合金等の金属材料から形成され、この保持部材5に対して、樹脂材料から構成されるヒートシンク部材4がインサート成形されていてもよい。すなわち、LED2又は電源ユニット等といった発熱部に近い部材に、熱伝導性の高い材料を適宜に用いることにより、より放熱性を向上させた発光装置1が得られる。この場合、例えば、回路基板3表面に絶縁性を確保するための絶縁層等が形成されていてもよく、また、保持部材5自体が絶縁性を有する金属酸化物等から形成されていてもよい。なお、ヒートシンク部材4は、保持部材5がインサート成形される箇所が少なくとも一部材あれば、複数の部材から形成されたものであってもよく、本体部11とは別の構成部材であってもよい。   In addition, this invention is not restricted to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not change the summary of invention. For example, the holding member 5 may be formed of a metal material such as an aluminum alloy having high heat dissipation, and the heat sink member 4 made of a resin material may be insert-molded with respect to the holding member 5. That is, the light emitting device 1 with improved heat dissipation can be obtained by appropriately using a material having high thermal conductivity for a member close to the heat generating portion such as the LED 2 or the power supply unit. In this case, for example, an insulating layer or the like for ensuring insulation may be formed on the surface of the circuit board 3, and the holding member 5 itself may be formed of a metal oxide or the like having insulation. . The heat sink member 4 may be formed of a plurality of members as long as the holding member 5 is at least one part where the insert molding is performed, or may be a constituent member different from the main body 11. Good.

1 発光装置
10 照明器具
2 LED(固体発光素子)
3 回路基板
4 ヒートシンク部材
5 回路基板保持部材
53 凸状部
DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 Lighting fixture 2 LED (solid state light emitting element)
3 Circuit board 4 Heat sink member 5 Circuit board holding member 53 Convex part

Claims (5)

固体発光素子が実装される回路基板と、
前記固体発光素子から生じた熱を放熱するためのヒートシンク部材と、
前記回路基板と前記ヒートシンク部材との間に設けられる回路基板保持部材と、を備え、
前記ヒートシンク部材に前記回路基板保持部材がインサート成形されており、
前記ヒートシンク部材は、前記回路基板保持部材が設けられる面に形成されて前記回路基板に接続されるリード線を挿通させるための挿通孔を有し、前記挿通孔の端部エッジに前記回路基板保持部材が一部被覆していることを特徴とする発光装置。
A circuit board on which a solid state light emitting device is mounted;
A heat sink member for radiating heat generated from the solid state light emitting device;
A circuit board holding member provided between the circuit board and the heat sink member,
The circuit board holding member is insert-molded in the heat sink member,
The heat sink member has an insertion hole for inserting a lead wire in which the circuit board holding member is connected to the circuit board is formed on a surface provided, the circuit board held by the end edge of the insertion hole A light emitting device characterized in that a member is partially covered.
前記回路基板保持部材は、絶縁性を有する樹脂材料から形成されていることを特徴とする請求項1に記載の発光装置。   The light emitting device according to claim 1, wherein the circuit board holding member is formed of an insulating resin material. 前記回路基板保持部材は、前記ヒートシンク部材と接する面に複数の凸状部が形成されていることを特徴とする請求項1又は請求項2に記載の発光装置。   The light emitting device according to claim 1, wherein the circuit board holding member has a plurality of convex portions formed on a surface in contact with the heat sink member. 前記樹脂材料は、フィラーを含有することを特徴とする請求項2又は請求項2を引用する請求項3に記載の発光装置。 The light emitting device according to claim 2, wherein the resin material contains a filler. 請求項1乃至請求項4のいずれか一項に記載の発光装置を備えた照明器具。   The lighting fixture provided with the light-emitting device as described in any one of Claims 1 thru | or 4.
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KR20190128366A (en) * 2018-05-08 2019-11-18 이호창 Street light fixture with heat sink with improved thermal conductivity
KR102063612B1 (en) 2018-05-08 2020-02-11 이호창 Street light fixture with heat sink with improved thermal conductivity

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