JP5646160B2 - Lighting device - Google Patents

Description

  The present invention relates to an illumination device using a light emitting diode (hereinafter referred to as “LED”) as a light source.

  Conventionally, instead of fluorescent lamps and fluorescent tubes, LED lighting devices using low power consumption and long-life LEDs as light sources are known.

  Patent Document 1 includes an LED including a resin-made reflection plate in which a hemispherical depression is formed, an LED provided to face the depression, and a heat dissipation plate installed on the back surface of the reflection plate. An illumination device is disclosed (see FIG. 23). The LED lighting device described in Patent Document 1 has improved heat dissipation characteristics by a heat sink.

JP 2009-99533 A

  However, in the LED lighting device described in Patent Document 1, since the heat sink is arranged behind the LED, for example, when the temperature of the electrical connection portion of the LED becomes too high due to the failure of the LED, the failed LED It is considered that the reflector spreads around the center.

  Then, this invention is made | formed in view of an above-described problem, and it aims at providing the LED illuminating device which can suppress the fire spread of the reflecting plate at the time of a failure.

The present invention provides a lighting device using a light emitting diode as a light source, including a substrate on which a plurality of light emitting diodes are provided, a flat plate portion, and a recess through which each light emitting diode is inserted. A resin-made reflection plate that reflects light to the outside, and a metal film that is provided on the flat plate portion and has a higher thermal conductivity than the reflection plate , the metal film includes an insertion portion through which the concave portion is inserted, and the insertion portion recess is disposed on the rear surface of the flat plate portion in a state of being inserted, characterized in Rukoto.

  According to the present invention, since the flat plate portion of the reflecting plate is provided with the metal film, even when the temperature of the electrical connection portion of the light emitting diode becomes high due to a failure of the light emitting diode or the like and the concave portion starts to melt, Is transmitted through the metal film in the direction of the metal film surface and escapes and is dissipated from the surface of the metal film. This makes it difficult for the temperature of the flat plate portion to reach the ignition point, so even if a fire breaks out from the concave portion at the location of the failed light emitting diode, it does not spread to adjacent concave portions and suppresses the spread of the reflection plate. it can.

(A) is a perspective view of the LED illuminating device which concerns on embodiment of this invention, (B) is a side view of an LED illuminating device. (A) is a longitudinal cross-sectional view of the light-emitting unit of the LED lighting device, and (B) is an exploded perspective view of the light-emitting unit. (A) is a bottom view of the translucent cover of an LED illuminating device, (B) is a longitudinal cross-sectional view of a translucent cover.

  Embodiments of the present invention will be described below with reference to the drawings.

  With reference to FIG. 1, the LED lighting apparatus 100 which uses LED as a light source is demonstrated. 1A shows a perspective view of the LED lighting device 100, and FIG. 1B shows a side view of the LED lighting device 100. FIG.

  The LED lighting device 100 shown in FIGS. 1A and 1B is a lighting fixture installed outdoors or the like, and is configured to be dimmable via a dimming control device.

  The LED lighting device 100 includes a box-shaped casing unit 10 in which a light emitting unit 30 (see FIG. 2A) is accommodated. An opening is formed in the lower part of the casing 10, and a light-transmitting cover 20 is installed in the opening so as to cover the light emitting unit 30.

  With reference to FIG. 2, the structure of the light emission unit 30 of the LED lighting apparatus 100 is demonstrated. FIG. 2A shows a longitudinal sectional view of the light emitting unit 30, and FIG. 2B shows an exploded perspective view of the light emitting unit 30.

  As shown in FIGS. 2A and 2B, the light emitting unit 30 includes an LED substrate 40 on which a plurality of LEDs 41 are installed, a reflecting plate 50 disposed on the front surface of the LED substrate 40, and a reflecting plate 50. And the metal film 60 installed between the LED substrate 40 and the LED substrate 40.

  The LED substrate 40 is a rectangular aluminum substrate, and a plurality of LEDs 41 are mounted on the front surface of the LED substrate 40. The LED 41 is a high-power light emitting diode that emits light when a voltage is applied in the forward direction. The LED 41 is supplied with power from a power source (not shown) via a wiring circuit formed on the LED substrate 40.

  The reflection plate 50 is a member formed by molding a highly reflective acrylic resin or the like. The reflecting plate 50 is a white plate-like member that reflects LED light to the outside, and includes a flat plate portion 51 and a bowl-shaped concave portion 52 that is formed so as to protrude rearward from the flat plate portion 51.

  The recess 52 of the reflecting plate 50 is provided for each LED 41 provided on the LED substrate 40. In the center of the recess 52, an insertion hole 52A for LED insertion is formed. In the state where the light emitting unit 30 is assembled, as shown in FIG. 2A, the LED substrate 40 is disposed on the back surface side of the reflecting plate 50, and the LED 41 passes through the insertion hole 52 </ b> A of the recess 52. Since the reflecting plate 50 and the LED substrate 40 are thus arranged, an air layer 53 corresponding to the protruding amount of the recess 52 is defined between the reflecting plate 50 and the LED substrate 40.

  The metal film 60 is a metal film having a higher thermal conductivity than that of the reflecting plate 50, and is formed of, for example, an aluminum foil. The metal film 60 is provided with the same number of circular insertion portions 61 as the concave portions 52 through which the concave portions 52 of the reflecting plate 50 are inserted. The metal film 60 is bonded and fixed to the back surface of the flat plate portion 51 of the reflection plate 50 with the recess 52 inserted through the insertion portion 61.

  In the present embodiment, the metal film 60 is bonded and fixed to the flat plate portion 51, but the metal film 60 may be deposited on the flat plate portion 51.

  In the light emitting unit 30 configured as described above, part of the LED light emitted from the LED 41 is reflected forward (externally) by the flat plate portion 51 and the concave portion 52 of the reflecting plate 50 and passes through the translucent cover 20. The rest passes directly through the translucent cover 20.

  Here, for example, when the temperature of the electrical connection portion of the LED 41 becomes too high due to a failure of the LED 41 or the like, it is conceivable that the recess 52 at the failed LED position melts. The heat at the time of melting of the recess 52 is transferred to the surface direction of the metal film 60 through the metal film 60 having a high thermal conductivity disposed on the flat plate portion 51 of the reflector 50 and escaped from the surface of the metal film 60. Since heat is radiated to the air layer 53, it is suppressed that the flat plate part 51 adjacent to the melted recess 52 is locally heated. This makes it difficult for the temperature of the flat plate portion 51 to reach the ignition point, and even if a fire breaks out from the concave portion 52 at the failed LED position, it does not spread to the adjacent concave portion 52 and suppresses the spread of the reflection plate 50. can do.

  Next, the translucent cover 20 of the LED lighting device 100 will be described with reference to FIGS. 1 and 3. FIG. 3A is a bottom view of the translucent cover 20, and FIG. 3B is a longitudinal sectional view of the translucent cover 20.

  As shown in FIGS. 1A and 1B, the translucent cover 20 is formed of a translucent resin member, and is provided so as to protrude below the housing portion 10.

  As shown in FIGS. 3A and 3B, a part of the bottom surface (rectangular region) of the translucent cover 20 is formed as a transmissive portion 21 that directly transmits the LED light from the light emitting unit 30. The side surface of the translucent cover 20 and the outer edge of the transmissive portion 21 are formed as a diffusing portion 22 that diffuses the transmitted LED light. In order to diffuse the LED light in the diffusing portion 22, the surface of the light transmitting cover 20 in the diffusing portion 22 is subjected to minute unevenness processing (mat processing).

  Since the diffusing portion 22 is provided in the translucent cover 20 as described above, the lighting of the LED lighting device 100 can be visually recognized even from a position away from the LED lighting device 100, and further glare can be reduced.

  As described above, the LED lighting device 100 of the present embodiment can obtain the following effects.

  Since the LED lighting device 100 includes the metal film 60 on the flat plate portion 51 of the reflector 50, the temperature of the electrical connection portion of the LED 41 becomes too high due to, for example, the failure of the LED 41, and the concave portion 52 at the failed LED position melts. Even if it starts, the heat | fever at the time of the fusion | melting of the recessed part 52 is transmitted to the surface direction of the metal film 60 through the metal film 60, is released, and is radiated from the surface of the metal film 60. Thereby, since the temperature rise of the flat plate part 51 is suppressed and the temperature of the flat plate part 51 becomes difficult to reach the ignition point, even if a fire breaks out from the concave part 52 at the failed LED position, it spreads to the adjacent concave part 52. The fire spread of the reflector 50 can be suppressed.

  Note that the present invention is not limited to the above-described embodiment, and it is obvious that various modifications can be made within the scope of the technical idea.

  In the LED lighting device 100 of the present embodiment, the metal film 60 is provided on the back surface of the flat plate portion 51 of the reflection plate 50, but the metal film 60 may be provided on the back surface of the flat plate portion 51 and the recess 52 of the reflection plate 50. The metal film 60 may be provided on both surfaces of the flat plate portion 51 of the reflection plate 50.

  The illumination device of the present invention can be applied to all illumination devices that use LEDs as light sources.

DESCRIPTION OF SYMBOLS 100 LED illuminating device 10 Housing | casing part 20 Translucent cover 21 Transmission part 22 Diffusion part 40 LED board 41 LED
50 Reflecting plate 51 Flat plate portion 52 Recessed portion 52A Insertion hole 53 Air layer 60 Metal film 61 Insertion portion

Claims (3)

In a lighting device using a light emitting diode as a light source,
A substrate provided with a plurality of light emitting diodes;
A resin plate having a flat plate portion and a recess through which each light emitting diode is inserted, and disposed on the front surface of the substrate to reflect the light of the light emitting diode to the outside;
A metal film provided on the flat plate portion and having a higher thermal conductivity than the reflecting plate ,
The metal film, the lighting apparatus wherein the recess comprises a insertion portion for inserting said recess is disposed on the rear surface of said plate in a state of being inserted into the insertion portion, characterized in Rukoto. A housing portion that houses a light emitting unit composed of the substrate, the reflector, and the metal film;
The illumination device according to claim 1, further comprising a cover provided so as to protrude from the front of the housing part. The illumination device according to claim 2 , wherein a diffusion portion that diffuses the transmitted LED light is formed on at least a side surface of the cover.