JP5614726B2 - Optical module and optical module manufacturing method - Google Patents

Description

  The present invention relates to an optical module and a method for manufacturing the optical module.

For example, in a connection between a server and a switch in a data center or a connection between digital AV (audio / visual) devices, an optical fiber is used as a transmission medium in addition to a metal wire.
When an optical fiber is used, an optical transceiver that converts an electrical signal into an optical signal or an optical signal into an electrical signal is required.

As an optical transceiver, for example, a configuration having an FPC (flexible printed circuit) substrate in a housing is being studied. A polymer optical waveguide is integrally provided on the FPC board, and a mirror, a photoelectric conversion element, and an IC chip are mounted thereon.
When the photoelectric conversion element is a surface light emitting type or a surface light receiving type, the photoelectric conversion element is mounted on the side opposite to the polymer optical waveguide and the mirror. That is, the optical path between the polymer optical waveguide and the photoelectric conversion element is bent by the mirror and extends through the FPC board.
For short-distance transmission, for example, use of a polymer optical waveguide for a mobile phone is being studied. In this case as well, a mirror is required with the same configuration as described above.

  As the mirror, a mirror block can be employed as in the case of the optical waveguide with a mirror disclosed in Patent Document 1, in addition to the one formed by vapor-depositing a metal film on the end face of the polymer optical waveguide. In Patent Document 1, the mirror block is fixed to the FPC board using a clad material as an adhesive. And the fixed position of a mirror block is prescribed | regulated by the guide member.

JP 2007-183467 A

  When assembling the optical waveguide with a mirror disclosed in Patent Document 1 described above, the mirror block is first disposed above the substrate, and then gradually lowered toward the substrate. However, there was no suitable means for aligning the mirror block at the proper position above the substrate. For this reason, it is difficult to perform alignment accurately, and time is required for alignment.

  If alignment is not performed accurately, the reflection mirror collides with the end of the core in the process of lowering the mirror block, and one or both of the end of the core and the reflection mirror are damaged. Sometimes. The mirrored optical waveguide with scratches becomes a defective product, and the yield decreases.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an optical module that can easily and accurately position and fix a mirror member, has a high yield, and is inexpensive, and a method for manufacturing the same. There is.

  In order to achieve the above object, according to one aspect of the present invention, a substrate having translucency and having an underclad layer on a part of at least one surface thereof, a core extending along the underclad layer, An over clad layer surrounding the core in cooperation with the under clad layer, a conductor pattern provided on the substrate, and fixed to the opposite side of the core to the substrate, and a part of the conductor pattern is electrically connected And a mirror member disposed on the same side as the core with respect to the substrate, the photoelectric conversion elements being connected to each other, and a mirror surface disposed on an optical path extending between an end face of the core and the photoelectric conversion element The mirror member has a recess as a marker for alignment with the substrate, and the conductor pattern has a marker pattern for alignment with the mirror member. Including, an optical module is provided.

  According to one embodiment of the present invention, the substrate has translucency and has an underclad layer on a part of at least one surface thereof, a core extending along the underclad layer, and the underclad layer. The over clad layer surrounding the core in cooperation, the conductor pattern provided on the substrate, and fixed to the opposite side of the core with respect to the substrate and electrically connected to a part of the conductor pattern An optical module comprising a photoelectric conversion element and a mirror member disposed on an optical path extending between the end face of the core and the photoelectric conversion element and fixed to the same side of the substrate with respect to the substrate In the manufacturing method, a step of providing a recess as a marker for alignment with the substrate on the mirror member, and a part of the conductor pattern, the mirror member A step of providing a marker pattern for alignment, and in a state where the substrate and the mirror member are separated from each other in the thickness direction of the substrate, the concave portion and the marker pattern are overlapped with each other on the substrate. An alignment step of aligning the relative positions of the substrate and the mirror member in a parallel direction, and after the alignment step, the substrate and the mirror member are relatively approached in the thickness direction. There is provided a method for manufacturing an optical module comprising a step of bonding the substrate and the mirror member.

  ADVANTAGE OF THE INVENTION According to this invention, alignment and fixation of a mirror member are performed easily and exactly, the optical module with a high yield and an inexpensive, and its manufacturing method are provided.

It is a perspective view showing a schematic structure of an optical active cable provided with an optical transceiver of one embodiment. It is a perspective view which expands and shows the optical transceiver vicinity of FIG. FIG. 3 is a schematic perspective view showing the optical transceiver of FIG. 2 in an exploded manner. FIG. 4 is a perspective view schematically showing one side of the photoelectric conversion assembly in FIG. 3. FIG. 5 is a plan view schematically showing an enlarged periphery of an IC chip and a photoelectric conversion element in the photoelectric conversion assembly of FIG. 4. FIG. 4 is a perspective view schematically showing the other side of the photoelectric conversion assembly in FIG. 3. FIG. 7 is a perspective view schematically showing a state where a reinforcing plate is removed from the photoelectric conversion assembly of FIG. 6. FIG. 8 is a perspective view schematically showing one side of the mirror member in FIG. 7. It is a figure which shows schematically the longitudinal cross-section of the mirror member periphery in the photoelectric conversion assembly of FIG. FIG. 7 is a plan view for explaining a relative positional relationship between a marker concave portion of a mirror member and a marker pattern of an FPC board in the photoelectric conversion assembly of FIG. 6. FIG. 5 is a schematic cross-sectional view for explaining a method of aligning a mirror member with respect to an FPC board used in the manufacturing process of the photoelectric conversion assembly of FIG. 4. It is a figure which shows schematically the longitudinal cross-section of the mirror member periphery in the photoelectric conversion assembly which concerns on a modification. It is a figure which shows schematically the longitudinal cross-section of the mirror member periphery in the photoelectric conversion assembly which concerns on a modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view schematically showing a configuration of an optical active cable 12 including an optical transceiver 10 according to an embodiment. The optical active cable 12 includes one optical cable 14 and two optical transceivers 10 attached to both ends of the optical cable 14. The optical active cable 12 is applied to connection between relay devices such as a switching hub, for example.

FIG. 2 is an enlarged perspective view showing the optical transceiver 10 together with a part of the optical cable 14.
The optical transceiver 10 has a housing 16 made of metal, for example, and the housing 16 has a box shape, for example. The optical cable 14 extends from one end of the housing 16 via the seal member 18, while an opening is formed in the other end of the housing 16.
In the opening of the housing 16, for example, the end of one circuit board 20 is located. The end of the circuit board 20 can be inserted into a slot provided in the relay device.

FIG. 3 is an exploded perspective view schematically showing the optical transceiver 10, and the housing 16 includes, for example, a first case 16a and a second case 16b that are separable from each other.
The circuit board 20 is a rigid board made of glass epoxy, for example, and is fixed to the second case 16b. A predetermined conductor pattern made of a metal such as copper is formed on the circuit board 20, and the conductor pattern includes a plurality of electrode terminals 22 arranged at the end of the circuit board 20. The electrode terminal 22 is electrically connected to an electrode terminal provided in the relay device.

Further, a connector 24 electrically connected to the electrode terminal 22 is attached to the circuit board 20, and one end of the photoelectric conversion assembly 26 is connected to the connector 24.
On the other hand, the optical cable 14 includes at least one optical fiber 28, and in the present embodiment, includes four optical fibers 28. The optical fiber 28 extends to the inside of the housing 16 through the seal member 18. The tip of the optical fiber 28 located inside the housing 16 is fixed to the other end of the photoelectric conversion assembly 26.

The photoelectric conversion assembly 26 converts the optical signal received from the optical fiber 28 into an electrical signal and passes it to the relay device through the electrode terminal 22, or converts the electrical signal received from the relay device into an optical signal and passes it to the optical fiber 28. It has a function.
FIG. 4 is a perspective view showing the second case 16 b side of the photoelectric conversion assembly 26. The photoelectric conversion assembly 26 includes an FPC board (flexible printed circuit board) 30. The FPC board 30 is, for example, a polyimide film 32 having flexibility and translucency, and a copper film provided on the film 32, for example. And a conductor pattern made of a metal. The conductor pattern of the FPC board 30 includes a plurality of electrode terminals 34 formed at one end of the film 32.
The conductor pattern can be created, for example, by etching a metal film formed on the film 32.

On one surface of the FPC board 30, an IC chip 36 and a photoelectric conversion element 38 are flip-chip mounted at predetermined positions, for example, and the IC chip 36 and the photoelectric conversion element 38 are electrically connected to a conductor pattern.
In the present embodiment, four photoelectric conversion elements 38 are mounted corresponding to the number of optical fibers 28, and the photoelectric conversion elements 38 are arranged along the vicinity of one side of the IC chip 36. Each photoelectric conversion element 38 is a light emitting element such as an LD (laser diode) or a light receiving element such as PD (photodiode), and the IC chip 36 is a drive circuit for the light emitting element or an amplification for the light receiving element. The circuit is configured.
The photoelectric conversion element 38 is a surface light emitting type or a surface light receiving type, and the photoelectric conversion element 38 is arranged so that its light emission surface or incident surface faces the surface of the FPC board 30.

  FIG. 5 is an enlarged plan view schematically showing the periphery of the IC chip 36 and the photoelectric conversion element 38 in FIG. The IC chip 36 and the photoelectric conversion element 38 are electrically connected by electrodes (first electrodes) 40a and 40b that constitute a part of the conductor pattern. The IC chip 36 is electrically connected to the electrode terminal 34 by a plurality of electrodes (second electrodes) 42 constituting a part of the conductor pattern.

  In the present embodiment, as a preferred mode, one ground electrode 42 a of the second electrodes 42 extends from end to end of the IC chip 36. At the position facing the center of the IC chip 36, for example, a square frame-shaped marker pattern 44 is integrally provided on the ground electrode 42a. The marker pattern 44 constitutes a part of the conductor pattern in the same manner as the first electrodes 40a and 40b and the second electrode 42.

FIG. 6 is a perspective view showing the first case 16a side of the photoelectric conversion assembly 26. On the other surface of the FPC board 30, a sheet-like polymer optical waveguide member is provided at the end opposite to the electrode terminal 34. 46 is provided integrally.
A mirror member 48 is fixed to the other surface of the FPC board 30 using an adhesive. As the adhesive, for example, a thermosetting resin or a UV curable resin can be used. A reinforcing plate 50 made of, for example, metal or glass is fixed on the mirror member 48 and the polymer optical waveguide member 46 using an adhesive.

FIG. 7 is a schematic perspective view showing a state in which the reinforcing plate 50 is removed from the photoelectric conversion assembly 26.
Four grooves are formed in stripes corresponding to the number of optical fibers 28 at the end of the polymer optical waveguide member 46, and the tip of the optical fiber 28 is disposed in each groove.

  FIG. 8 is a perspective view schematically showing the mirror member 48 on the FPC board 30 side. As shown in FIG. 8, the mirror member 48 has a quadrangular frustum shape, and one wall surface (bottom wall) of the mirror member 48 is brought into close contact with the FPC board 30. The length of the mirror member 48 in the length direction and the width direction of the FPC board 30 is preferably equal to or longer than the length of the IC chip 36.

For example, one marker recess 54 is formed on the bottom wall of the mirror member 48, and the marker recess 54 is located near the center of the bottom wall of the mirror member 48. The marker recess 54 is open toward the FPC board 30 and has, for example, a quadrangular shape when viewed in plan. The size of the marker recess 54 when viewed in a plane corresponds to the size of the marker pattern 44 of the conductor pattern. Preferably, the length of one side of the opening of the marker recess 54 is not less than 50 μm and not more than 500 μm. The opening area is 7500 μm ² or more and 250,000 μm ² or less. Preferably, the depth of the marker recess 54 is not less than 30 μm and not more than 300 μm.

  The wall surface (side wall) of the mirror member 48 located on the polymer optical waveguide member 46 side constitutes a mirror surface 56 and is inclined by approximately 45 ° with respect to the bottom wall of the mirror member 48. Therefore, the mirror surface 56 is inclined by about 45 ° with respect to the FPC board 30. The mirror surface 56 is disposed so as to face the end surface of the polymer optical waveguide member 46 opposite to the groove, and the longitudinal direction of the mirror surface 56 is the longitudinal direction of the end surface of the polymer optical waveguide member 46 and the FPC board 30. It is made to correspond to the width direction.

  The mirror member 48 used in the present embodiment is manufactured, for example, by integrally molding a resin and then depositing a metal film such as gold on the resin wall surface that becomes the mirror surface 56. The marker recess 54 can be formed when the resin is integrally formed.

FIG. 9 is a view schematically showing a longitudinal section around the mirror member 48 of the photoelectric conversion assembly 26. In FIG. 9, the reinforcing plate 50 is omitted.
The polymer optical waveguide member 46 includes an under cladding layer 58, a core 60, and an over cladding layer 62. The under-cladding layer 58 is laminated on the FPC substrate 30, and a core 60 having a quadrangular cross-section when viewed from the light transmission direction extends on the under-cladding layer 58.

The number of the cores 60 is four corresponding to the number of the optical fibers 28, and the four cores 60 are spaced apart from each other and arranged in parallel, and are positioned coaxially with the tip of the optical fiber 28. The over clad layer 58 is laminated on the under clad layer 58 and the core 60 so as to surround the core 60 in cooperation with the under clad layer 58.
The material of the under cladding layer 58, the core 60, and the over cladding layer 62 is not particularly limited, and for example, an acrylic resin, an epoxy resin, a polyimide resin, or the like can be used.

  In the present embodiment, as a preferred mode, the under cladding layer 58 covers the entire surface of the film 32 so as to reach the mirror surface 56, and the core 60 and the over cladding layer 62 are end portions of the under cladding layer 58. Are stacked. In this case, the under clad layer 58 can also be regarded as constituting the surface of the FPC substrate 30.

  Both ends of the core 60 are exposed on the end face of the polymer optical waveguide member 46 facing the end face of the groove and the mirror face 56. One end of the core 60 is in contact with the end of the optical fiber 28 and optically coupled, and the other end of the core 60 is optically coupled with the opposing mirror surface 56.

The mirror member 48 is arranged so that the position of the mirror surface 56 corresponds to the emission surface or the incident surface of the photoelectric conversion element 38 in the thickness direction of the FPC board 30. That is, the optical path is bent by 90 ° by the mirror surface 56 between the other end of the core 60 and the photoelectric conversion element 38 and penetrates the FPC board 30.
In this arrangement, the mirror member 48 extends from the vicinity of the end of the IC chip 36 to the photoelectric conversion element 38 in the longitudinal direction of the FPC board 30.

In the present embodiment, as a preferred mode, an optical waveguide member 64 is provided between the core 60 and the mirror surface 56 on the under cladding layer 58. That is, the optical waveguide member 64 is interposed on the optical path between the core 60 and the mirror surface 56.
The optical waveguide member 64 is preferably made of an adhesive used for fixing the mirror member 48, and is in close contact with the end surface of the core 60, the mirror surface 56 and the surface of the under cladding layer 58. The optical waveguide member 64 is made of a material having a higher refractive index than that of the under-cladding layer 58 and the over-cladding layer 62 as well as having a light transmitting property, and is preferably made of a material having the same refractive index as that of the core 60. In other words, the refractive index of the optical waveguide member 64 is closer to the refractive index of the core 60 than the under cladding layer 58 and the over cladding layer 62.
Preferably, the optical waveguide member 64 is made of the same material as that of the core 60.

  FIG. 10 is a plan view for explaining the relative positional relationship between the marker recess 54 and the marker pattern 44 of the conductor pattern of the FPC board 30 in the photoelectric conversion assembly 26. As shown in FIG. 10, the mirror member 48 is aligned with the FPC board 30 so that the marker recess 54 overlaps the marker pattern 44.

  In order to stabilize the photoelectric conversion assembly 26 in the housing 16, for example, a support member made of a glass plate is disposed on the surface of the circuit board 20 on the connector 24 side, and the FPC board 30 is, for example, a mirror member 48. The first case 16a and the circuit board 20 are sandwiched between the reinforcing plate 50 and the support member.

Hereinafter, as a preferred method used for manufacturing the optical transceiver 10 described above, a method of aligning the mirror member 48 with respect to the FPC board 30 when the mirror member 48 is fixed to the FPC board 30 will be described.
FIG. 11 is a view for explaining the alignment method. A mirror member 48 supported by a suitable holder (not shown) is disposed above the FPC board 30 disposed on the stage 66.

A camera 68 is disposed as an imaging device between the FPC board 30 and the mirror member 48. The camera 68 is a two-field camera capable of simultaneously photographing two upper and lower fields of view, and includes a marker recess 54 in one field and a marker pattern 44 in the other field.
Then, on the basis of the image photographed by the camera 68, the stage 66 or the holder is in the horizontal direction, that is, the FPC board so that the relative positional relationship between the marker recess 54 and the marker pattern 44 becomes a predetermined positional relationship. 30 in a direction parallel to 30.

Thus, after the alignment is completed, the camera 68 is moved in the horizontal direction so as to be separated from the FPC board 30 and the mirror member 48, and then an adhesive is applied to predetermined positions of the FPC board 30 and the polymer optical waveguide member 46.
Then, the stage 66 or the holder is moved in the vertical direction, that is, in the thickness direction of the FPC board 30 to bring the mirror member 48 and the FPC board 30 into close contact with each other, and then heat is applied or ultraviolet rays are applied to remove the adhesive. Harden. Thereby, at the same time as the optical waveguide member 64 is formed, the fixing of the mirror member 48 to the FPC board 30 is completed.

According to the optical transceiver 10 of the above-described embodiment, when the mirror member 48 is fixed to the FPC board 30 in the manufacturing process, the marker recess 54 and the marker pattern 44 are used as marks, so that the FPC board 30 can be fixed. The alignment of the mirror member 48 is performed easily and with high accuracy.
For this reason, the manufacturing time of the optical transceiver 10 is shortened, and as a result, the manufacturing cost of the optical transceiver 10 is reduced.

Further, as a result of the alignment being performed with high accuracy, the mirror surface 56 is prevented from colliding with the polymer optical waveguide member 46. Thus, the mirror surface 56 or the end surface of the core 60 of the polymer optical waveguide member 46 is prevented from being damaged by the collision, and the yield of the photoelectric conversion assembly 26 is improved. As a result, the manufacturing cost of the optical transceiver 10 is reduced.
In addition, since the marker pattern 44 is connected to the ground electrode 42a, the potential of the marker pattern 44 does not float, and there is no problem due to the potential floating.

  Furthermore, since the marker recess 54 is formed on the bottom wall of the mirror member 48 facing the FPC board 30, the mirror member 48 is not enlarged by providing the marker recess 54.

  On the other hand, in the optical transceiver 10 described above, the under cladding layer 58 extends below the mirror surface 56, and the optical waveguide member 64 having a higher refractive index than the under cladding layer 58 is provided on the under cladding layer 58. Therefore, the light emitted from the end surface of the core 60 is suppressed from spreading toward the FPC board 30. Therefore, in the optical transceiver 10, the light emitted from the end surface of the core 60 is efficiently guided to the mirror surface 56, and light loss between the core 60 and the photoelectric conversion element 38 is reduced. Further, light scattering at the end face of the core 60 is reduced.

  The present invention is not limited to the above-described embodiment, and includes a form obtained by modifying the embodiment.

For example, in the optical transceiver 10 of the above-described embodiment, the planar shapes of the marker recess 54 and the marker pattern 44 are not limited to a quadrangle, and may be another polygon, a circle, an ellipse, or the like. There is no particular limitation.
Moreover, although the marker recessed part 54 was formed in the bottom wall of the mirror member 48 of the mirror member 48, you may form in the ceiling wall of the mirror member 48 facing a bottom wall.
The number of marker recesses 54 and marker patterns 44 is not limited to one each, and may be two or more.

  In the assembly of the optical transceiver 10 of the above-described embodiment, the alignment is performed by one two-field camera, but two one-field cameras may be used. In this case, one of the two cameras may be arranged above the mirror member 48, not between the mirror member 48 and the FPC board 30, and the mirror member 48 may be photographed from the ceiling wall side. .

In the optical transceiver 10 of the above-described embodiment, the material of the mirror member 48 is not limited to resin, and metal, glass, or the like may be used. According to the metal mirror member 48, the heat generated in the IC chip 36 and the photoelectric conversion element 38 can be efficiently released, and the reliability is further improved.
The metal mirror member 48 can be manufactured, for example, by casting, and in this case, the marker recess 54 can be formed at the time of casting. In the case of the metal mirror member 48, the metal film for the mirror surface 56 may be omitted depending on the material.

  Further, in the optical transceiver 10 of the above-described embodiment, as a preferable aspect, the under cladding layer 58 is provided over the entire surface of the film 32. However, as illustrated in FIG. It may be provided only in the same region as the core 60 and the over clad layer 62, that is, only in the end portion of the film 32.

Further, in the optical transceiver 10 of the above-described embodiment, the FPC board 30 includes the film 32. However, as shown in FIG. 13, the film 32 is omitted and a conductor pattern is directly formed on the undercladding layer 58. May be. In other words, the film 32 may have a function as the under cladding layer 58. That is, the FPC substrate 30 may also serve as a part of the polymer optical waveguide member 46, and the FPC substrate 30 only needs to have an under cladding layer on at least a part of one surface.
Therefore, in the present specification, when the under cladding layer 58 is provided on the film 32, the film 32 and the under cladding layer 58 are collectively referred to as a “substrate”, and the film 32 also serves as the under cladding layer 58. The film 32 is referred to as a “substrate”.

Furthermore, in the optical transceiver 10 of the above-described embodiment, as a preferable aspect, the optical waveguide member 64 and the core 60 that are interposed between the mirror surface 56 and the end surface of the core 60 have the same refractive index. It may be. Further, nothing needs to be interposed between the mirror surface 56 and the end surface of the core 60.
Finally, it goes without saying that the present invention is applicable to optical modules other than optical transceivers.

10 Optical transceiver (optical module)
16 Housing 20 Circuit board 26 Photoelectric conversion assembly 28 Optical fiber 30 FPC board 32 Film (board)
36 IC chip 38 Photoelectric conversion element 44 Marker pattern 46 Polymer optical waveguide member 48 Mirror member 54 Marker recess 56 Mirror surface 58 Under cladding layer (substrate)
60 core 62 over clad layer

Claims (4)

A substrate having translucency and having an underclad layer on a part of at least one surface;
A core extending along the undercladding layer;
An overclad layer surrounding the core in cooperation with the underclad layer;
A conductor pattern provided on the opposite side of the core from the substrate;
A photoelectric conversion element fixed on the opposite side of the core to the substrate and electrically connected to a part of the conductor pattern;
A mirror surface disposed on an optical path extending between the end face of the core and the photoelectric conversion element, and a mirror member fixed on the same side as the core with respect to the substrate,
The mirror member has a recess as a marker for alignment with the substrate,
The conductor pattern includes a marker pattern for alignment with the mirror member,
Optical module. The marker pattern is connected to a ground electrode of the conductor pattern,
The optical module according to claim 1. The under-cladding layer extends to the mirror surface beyond the end face of the core;
Between the end surface of the core and the mirror surface, an optical waveguide member having a refractive index higher than that of the under cladding layer is provided.
The optical module according to claim 1 or 2. A substrate having translucency and having an underclad layer on a part of at least one surface;
A core extending along the undercladding layer;
An overclad layer surrounding the core in cooperation with the underclad layer;
A conductor pattern provided on the opposite side of the core from the substrate;
A photoelectric conversion element fixed on the opposite side of the core to the substrate and electrically connected to a part of the conductor pattern;
In a method for manufacturing an optical module, comprising: a mirror surface disposed in an optical path extending between an end surface of the core and the photoelectric conversion element; and a mirror member fixed to the same side as the core with respect to the substrate.
Providing the mirror member with a recess as a marker for alignment with the substrate;
Providing a marker pattern for alignment with the mirror member as part of the conductor pattern;
In a state where the substrate and the mirror member are separated from each other in the thickness direction of the substrate, the substrate and the mirror member in a direction parallel to the substrate so that the concave portion and the marker pattern overlap each other. An alignment process for aligning the relative positions of
A method of manufacturing an optical module comprising: a step of relatively bringing the substrate and the mirror member closer in the thickness direction and bonding the substrate and the mirror member after the alignment step.

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