JP5611076B2 - Electronics - Google Patents

Description

  The present invention relates to an installation type electronic apparatus in which a heat generating component such as an LSI (Large Scale Integration) or a CPU (Central Processing Unit) is accommodated in a housing.

  In a stationary electronic device in which a heat generating component such as an LSI or a CPU is housed in a housing, the smaller the volume of the small device, the greater the influence of the heat generating component on the surface temperature of the housing. In other words, since the distance between the heat generating component and the housing surface is short, the heat from the heat generating component moves to the surface of the housing above the heat generating component during installation by air convection, and a locally high temperature part (heat spot ) Is formed. In the case of a structure in which no fan or vent is provided, this temperature problem becomes more prominent. Then, when the user touches the surface of the casing that has become high in temperature, a significant discomfort is given.

  As a means for preventing the formation of this heat spot, there is a method of diffusing the heat of the heat-generating component (see, for example, Patent Document 1). In the electronic device disclosed in Patent Document 1, the heat radiating plate is placed in contact with the heat-generating component mounted on the substrate. Thereby, the heat generated in the heating element can be diffused and dissipated by the heat radiating plate.

JP 2010-55642 A

  However, when heat countermeasures are performed using a heat sink as in Patent Document 1, it is necessary to contact the heat sink and the heat-generating component directly or with a substance having a high thermal conductivity. Therefore, when a component having a height higher than the target heat generating component is mounted on the substrate, the shape and area of the heat radiating plate are limited. Or it is necessary to arrange | position and mount another component so that a heat sink may be avoided. Therefore, there is a problem that a position where the heat generating component can be mounted or a surface on which the heat generating component is mounted on the substrate is limited.

  The present invention has been made to solve the above-described problems, and provides an electronic device that can suppress the formation of heat spots on the surface of the housing without affecting the component mounting of the substrate. It is aimed.

An electronic apparatus according to the present invention includes a board on which a heat generating component is mounted, a housing in which the board is stored, and a plurality of spaces that are provided on the inner surface of the housing and are divided at predetermined intervals at positions facing the heat generating component. A heat transfer suppression structure that is a lattice structure having an air layer between the heat generation component and the lattice structure, and the heat transfer suppression structure is caused by the heat generation component generating heat by retaining gas in a plurality of spaces. heat convection generated toward the lattice structure, the air layer moving along the lower surface of the lattice structure, it also of the heat transfer to the casing surface by thermal convection is suppressed.

  According to the present invention, since it is configured as described above, heat can be avoided from being directly applied to the surface of the casing above the heat generating component, and heat radiation from other than the vertical direction can be blocked. Spot formation can be prevented. Moreover, since no heat sink is used, the formation of heat spots can be prevented without affecting the component mounting of the substrate, and the number of components can be reduced.

It is a sectional side view which shows the structure of the subscriber | terminal terminal device which concerns on Embodiment 1 of this invention. It is a top view which shows the structure of the subscriber | terminal terminal device which concerns on Embodiment 1 of this invention. It is a schematic perspective view which shows the lattice structure in Embodiment 1 of this invention. It is a conceptual diagram which shows the flow of the air when there is no lattice structure. It is a conceptual diagram which shows the flow of the air by the lattice structure in Embodiment 1 of this invention. It is the schematic which shows the analysis result of the air flow by the lattice structure in Embodiment 1 of this invention. It is a sectional side view which shows the structure of the vertically installed electronic device which concerns on Embodiment 1 of this invention. It is a schematic perspective view which shows the integration | stacking to the housing | casing of the lattice structure in Embodiment 2 of this invention. It is a sectional side view which shows the structure of the subscriber | terminal terminal device which concerns on Embodiment 3 of this invention. It is a schematic perspective view which shows the grating | lattice structure in Embodiment 3 of this invention. It is a conceptual diagram which shows the flow of the air by the lattice structure in Embodiment 3 of this invention. It is a schematic perspective view which shows the grating | lattice structure in Embodiment 4 of this invention. It is a schematic perspective view which shows another lattice structure in Embodiment 4 of this invention. It is a schematic perspective view which shows another lattice structure in Embodiment 4 of this invention. It is a schematic perspective view which shows the housing | casing structure in Embodiment 5 of this invention. It is a schematic perspective view which shows another housing structure in Embodiment 5 of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Embodiment 1 FIG.
In the following, for ease of explanation, a case where the home terminal device 1 is used as an electronic device will be described.
FIG. 1 is a side sectional view showing a configuration of a home terminal apparatus 1 according to Embodiment 1 of the present invention, and FIG. 2 is a top view thereof.
As shown in FIGS. 1 and 2, the home terminal device 1 contains a printed circuit board 4 (hereinafter simply referred to as a circuit board 4) on which a heat generating component 3 is mounted in a plastic housing 2. The housing 2 can be divided into upper and lower parts, and when the home terminal device 1 is installed, the side that becomes the top surface is the first housing 2a, and the side that becomes the bottom surface is the second housing 2b.

  The heat generating component 3 is a component that generates heat typified by an arithmetic processing device such as an LSI or a CPU. However, in the present invention, any component other than the arithmetic processing device is included in the heat generating component 3 as long as it generates heat.

The substrate 4 is supported by the support portion 5 provided in the second housing 2b, and is sandwiched between the screw boss 6a provided in the first housing 2a and the screw boss 6b provided in the second housing 2b. It is fixed by screws 7.
1 is merely an example, and the method of gripping and fixing the substrate 4 according to the present invention will be described later with the heat generating component 3. Any method may be used as long as the air layer 20 can be formed between the lattice structures 12.

In addition to the heat generating component 3, a power supply terminal 8, an input terminal 9, an output terminal 10, and a power switch 11 are mounted on the substrate 4 and are exposed to the outside from the opening of the housing 2. Although not shown in the drawings, various electronic components other than the heat generating component 3, the power supply terminal 8, the input terminal 9, the output terminal 10, and the power switch 11 are mounted on the substrate 4.
In the present invention, it does not matter whether the power supply terminal 8 is present by using a built-in or removable power supply. The input terminal 9 and the output terminal 10 are not limited to the presence or absence of each, and there is no limitation that each terminal is one. Furthermore, the power switch 11 is not limited to the power source, and refers to all switches that perform other operations, and the number thereof is not limited (including the case where there is no switch).

In addition, a lattice structure (heat transfer suppression structure) 12 facing the heat generating component 3 is provided integrally with the first housing 2a at the central portion of the inner surface of the first housing 2a. This lattice structure 12 has a frame, and the surface of the casing 2 due to heat convection generated by the heat generation component 3 generating heat by retaining gas (the point 30 on the surface of the first casing 2a shown in FIG. 2). Heat transfer to a region in the vicinity thereof is suppressed, and formation of heat spots is prevented. An air layer 20 is formed between the heat generating component 3 and the lattice structure 12.
As shown in FIG. 3, the lattice structure 12 has a surface facing the heat-generating component 3 and has a thin rib 12a and a plurality of spaces 12b separated by the rib 12a. The size of each lattice is about 2 to 3 mm square.

Next, the change in the air flow due to the heat generated by the heat generating component 3 with and without the lattice structure 12 will be described.
FIG. 4 is a diagram illustrating the air flow when the lattice structure 12 is not provided, and FIG. 5 is a diagram illustrating the air flow when the lattice structure 12 is provided.

When the air layer 20 is heated by the heat generated by the heat generating component 3, convection is generated, and the heated air moves upward.
Here, when there is no lattice structure 12, the high-temperature air that has moved upward by convection reaches the first housing 2a as indicated by an arrow 41 in FIG. Then, at the point 30 on the surface of the first housing 2a that is directly above the heat generating component 3 and a region in the vicinity thereof (hereinafter, simply referred to as the point 30), a large amount of heat is received from the heated air. A spot is formed.

  On the other hand, when the lattice structure 12 is provided, the air existing in the finely divided space 12b in the lattice structure 12 remains without being affected by convection. Therefore, the high-temperature air that has moved upward by convection proceeds so as to avoid the lattice structure 12 as indicated by the arrow 51 in FIG.

  An outline of the result of confirming this by flow analysis is as shown in FIG. As described above, the high-temperature air that has moved upward by convection does not enter the inside of the lattice structure 12 but flows outward along the lower surface of the lattice structure 12. And it has shown that the air inside the space 12b of the lattice structure 12 is not moving.

  Therefore, as shown in FIG. 5, the point 31 directly below the heat generating component 3 and the area in the vicinity thereof (hereinafter simply referred to as the point 31) are directly heated by the convection as shown in FIG. That is, heat flows into the point 30 on the surface of the first housing 2 a only from heat transfer by heat conduction from the point 31 on the lower surface of the lattice structure 12 through the lattice structure 12. Here, the thermal conductivity of air near normal temperature is as small as about 0.026 W / m · K, and it can be considered that the lattice structure 12 functions as a heat insulating material. From this, it is possible to avoid the formation of a heat spot at the point 30 on the surface of the first housing 2a.

  Further, not only the installation method as shown in FIG. 1 but also the in-home terminal device 1 may be placed vertically using a stand 13 or the like as shown in FIG. Also in this case, the lattice structure 12 is provided on the inner surface of the housing 2 that becomes the upper surface when installed. Further, in this case, since the heat radiation also affects the surface other than the upper surface, the lattice structure 12 may be provided on a plurality of surfaces.

  As described above, according to the first embodiment, the lattice structure 12 is provided on the inner surface of the housing 2 to suppress heat transfer to the surface of the housing 2 due to heat convection generated by the heat-generating component 3 generating heat. As a result, it is possible to avoid heat from being directly applied to the surface of the casing 2 above the heat generating component 3 and to block heat radiation from other than the vertical direction, thereby preventing the formation of heat spots. it can. Further, since a conventional heat sink is not used, the formation of heat spots can be prevented without affecting the component mounting of the substrate 4, and the number of components can be reduced.

Embodiment 2. FIG.
In the first embodiment, the case where the lattice structure 12 is formed integrally with the first housing 2a has been described. However, in the second embodiment, the lattice structure 12 is manufactured as a separate part from the first housing 2a. The case where the product is assembled in the first housing 2a when assembling the product will be described.
FIG. 8 is a diagram showing the incorporation of the lattice structure 12 into the housing 2 according to the second embodiment of the present invention.
As shown in FIG. 8, notches 12 c are formed on the side walls of the lattice structure 12. An engaging claw 2c that engages with the notch 12c is formed on the inner surface of the first housing 2a. When the product is assembled, the lattice structure 12 is incorporated into the first housing 2a by fitting the engaging claws 2c and the notches 12c.
Note that the method of incorporating the lattice structure 12 into the first housing 2a is not limited to the method shown in FIG. 8, and a different method may be used.

  Here, in the in-home terminal device 1 according to the first embodiment, since the lattice structure 12 is formed as a part of the first housing 2a, the material of the rib 12a is the same as that of the first housing 2a. The thermal conductivity is the same. On the other hand, the lattice structure 12 shown in FIG. 8 can be manufactured from another material having a lower thermal conductivity than the material of the first housing 2a, and the heat insulation effect can be further enhanced.

  As described above, according to the second embodiment, since the lattice structure 12 is formed separately from the first casing 2a, it is made of a material having a lower thermal conductivity than the first casing 2a. By manufacturing the lattice structure 12, the heat insulation effect can be further enhanced.

Embodiment 3 FIG.
FIG. 9 is a side sectional view showing the configuration of the home terminal device 1 according to Embodiment 3 of the present invention.
The in-home terminal device 1 according to Embodiment 3 shown in FIG. 9 is obtained by changing the lattice structure 12 of the in-home terminal device 1 according to Embodiment 1 shown in FIG. Other configurations are the same, and the same reference numerals are given and description thereof is omitted.

The lattice structure 14 is provided in the central portion of the inner surface of the first housing 2a so as to face the heat generating component 3, and prevents the formation of heat spots on the surface of the housing 2. As shown in FIGS. 9 and 10, the lattice structure 14 is formed in a mountain shape and is configured such that the central portion protrudes downward.
The lattice structure 14 may be molded integrally with the first housing 2a, or may be assembled after being molded separately from the first housing 2a.

  By making the lattice structure 14 into a mountain shape in this way, as shown by an arrow 111 in FIG. 11, a point (projecting end of the lattice structure 14) 32 that directly contacts the heat generating component 3 on the lower surface of the lattice structure 14 and its It is possible to make it difficult to stagnate hot convection air in a nearby region (hereinafter simply referred to as a point 32). Moreover, since the distance between the point 32 on the lower surface of the lattice structure 14 and the point 30 on the surface of the first housing 2a can be increased, the heat insulating effect can be further enhanced.

  As described above, according to the third embodiment, the lattice structure 14 is formed in a mountain shape projecting toward the heat generating component 3, so that the heat transfer destination by the convection is set to the projecting end 32 of the lattice structure 14 and its end. It can deviate from the area | region of the vicinity, and can improve the heat insulation effect more.

Embodiment 4 FIG.
In the lattice structures 12 and 14 of the first to third embodiments, the case where the space 12b is configured to be a square is shown. However, the present invention is not limited to this, and if the internal air can remain without being affected by convection, The shape and size are not limited, and for example, shapes such as lattice structures 15 to 17 shown in FIGS. Further, the outer shape of the lattice structure itself does not have to be a quadrangle, and there is no problem even if it has a circular shape as shown in FIG. 12 or an uneven shape as shown in FIG.

Embodiment 5 FIG.
Although Embodiments 1 to 4 show the case where the lattice structures 12 and 14 to 17 are provided as the heat transfer suppression structure, in Embodiment 5, as shown in FIGS. A case where a housing structure 18 having a cavity inside is used will be described. In addition, this housing structure 18 is configured in a shape capable of retaining internal gas.

As shown in FIG. 15, the housing structure 18 having a cavity inside is manufactured as a part different from the first housing 2a, and an engagement recess 18a is formed on the side wall. An engagement claw 2d that engages with the engagement recess 18a is formed on the inner surface of the first housing 2a. When the product is assembled, the housing structure 18 is assembled into the first housing 2a by fitting the engaging claws 2d and the engaging recesses 18a. FIG. 16 shows a case where an engagement hole 18b penetrating to the internal cavity is formed in the housing structure 18 in place of the engagement recess 18a.
Note that the method of incorporating the housing structure 18 into the first housing 2a is not limited to the method shown in FIGS. 15 and 16, and a different method may be used.

As described above, even if the housing structure 18 having a cavity inside is provided on the inner surface of the housing 2, the surface of the housing 2 due to the heat convection generated by the heat generation component 3 generating heat as in the first embodiment. Heat transfer to can be suppressed.
Further, although the case structure 18 has been described as being a separate component from the first case 2a, it may be formed integrally with the first case 2a.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

  DESCRIPTION OF SYMBOLS 1 In-home terminal device, 2 housing | casing, 2a 1st housing | casing, 2b 2nd housing | casing, 2c, 2d engagement nail | claw, 3 heat generating component, 4 printed circuit board, 5 support part, 6a, 6b screw boss, 7 screw, 8 Power terminal, 9 input terminal, 10 output terminal, 11 power switch, 12, 14-17 lattice structure (heat transfer suppression structure), 12a rib, 12b space, 12c notch, 13 stand, 18 housing structure (heat transfer suppression) Structure), 18a engagement recess, 18b engagement hole, 20 air layer.

Claims (5)

A board on which a heat generating component is mounted;
A housing containing the substrate;
A heat transfer suppressing structure that is a lattice structure provided on the inner surface of the housing and having a plurality of spaces divided at predetermined intervals at positions facing the heat generating components;
An air layer is provided between the heat generating component and the lattice structure,
The heat transfer suppression structure causes gas to stay in the plurality of spaces, so that heat convection generated toward the lattice structure due to heat generation by the heat-generating component causes the air layer to move along the lower surface of the lattice structure. moving, electronic apparatus, wherein the heat transfer is suppressed to the casing surface by the thermal convection. The heat transfer suppressing structure, the electronic device according to claim 1, characterized in that it is formed into a projecting mountain-shape facing the heat generating component side. The heat transfer suppressing structure according to claim 1 or claim 2 electronic device, wherein it is a casing structure having a cavity inside. The electronic apparatus according to any one of claims 1 to 3 , wherein the heat transfer suppression structure is formed integrally with the housing. The heat transfer suppressing structure, the electronic device according to any one of claims 1 to 3, wherein the the housing is molded separately.

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