JP2009224416A - Heat radiation structure in control panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure in a control panel excelling in heat radiation efficiency with a simple structure without adding a special component. <P>SOLUTION: In this heat radiation structure in the control panel, two or more electronic apparatuses are housed in a sealed housing forming a part of the control panel by being vertically arranged in the installation state of the control panel. A shelf plate 20 for mounting the electronic apparatus is arranged in the sealed housing 10 for each electronic apparatus 30, and the shelf plate 20 has, at least on one side, a cutout 21 nearly coincident with the width of the electronic apparatus 30 and having a depth reaching the electronic apparatus from an edge of the side, whereby the heat radiation structure in a control panel excelling in heat radiation efficiency can be provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat dissipating structure in a control panel in which at least two or more electronic devices are arranged side by side in an installed state of a control panel in a sealed casing forming a part of the control panel.

  In the case where a plurality of electronic devices are housed inside the sealed casing, a structure for radiating heat by circulating and cooling the heat from the electronic device serving as a heating element is required. For this reason, as disclosed in Patent Document 1, conventionally, a plate-like heat radiating member having a thermal conductivity higher than that of air is placed on the surface of the electronic device and on the inner surface of the housing at a position higher than the surface of the electronic device. Inclined so that it touches. And this heat radiating member has the structure which provided the air hole located between an electronic device and a housing | casing. With this configuration, the heat generated from the electronic device can be efficiently transmitted to the housing and radiated from the housing to the outside, thereby improving the cooling efficiency.

Further, as shown in FIG. 5, a punching plate (plate material) 102 provided with a large number of punching holes 101 is used as a shelf plate on which an electronic device is placed, and air inside the housing is led to the outside by a fan provided at the upper part of the housing. Circulating cooling of the air inside the control panel is also performed.
JP 2002-353669 A

  According to the configuration disclosed in Patent Document 1 described above, since it is necessary to provide a heat dissipation member so as to be in contact with the inner side surface of each electronic device housed in the hermetically sealed casing, the number of components is increased, and the configuration is increased. It is complicated. Moreover, although the heat radiating member is applied to the part where the temperature is locally high, the inside of the narrow sealed casing is partitioned up and down, which hinders air from being circulated by the fan provided at the top of the sealed casing. The electronic device housed in the sealed casing cannot be efficiently cooled.

  Further, in the configuration using the punching plate 102 provided with a lot of punching holes 101 as a shelf plate on which the electronic device is placed, the air heated by the heat from the lower electronic device rises through the punching hole 101, so A certain electronic device is exposed to heat from the heat dissipated from the lower electronic device, and the temperature rises.

  In addition, air convects to the top electronic device through the air outlet provided in the upper part of the sealed casing, but the lower part, especially the periphery of the bottom electronic device, cannot convect and the heat circulation is sufficient. There was a problem that it could not be obtained.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat dissipating structure in a hermetically sealed casing having excellent heat dissipating efficiency with a simple configuration without adding special parts.

  The heat dissipating structure in the hermetic casing according to the present invention is a hermetically sealed control panel that houses at least two or more electronic devices side by side in an installed state of the control panel inside the hermetic casing forming a part of the control panel. A shelf plate for mounting the electronic device inside the sealed casing is provided for each electronic device, and the shelf plate is at least cut to a depth that substantially matches the width of the electronic device and reaches the electronic device from the edge of the side. It is characterized by having a chip.

  Preferably, in the heat dissipating structure in the control panel according to the present invention, the plurality of shelf boards may be arranged with their notches aligned vertically.

  Preferably, in the heat dissipating structure in the control panel according to the present invention, the heated air is transmitted to the upper part of the hermetic casing through the notch in the installed state of the control panel, and the heated air is transmitted to the hermetic casing. It is preferable to provide a heat radiating means for radiating heat from the upper heat radiating port.

  Preferably, in the heat dissipating structure in the control panel according to the present invention, the heat dissipating means is a fan.

  Preferably, the heat dissipating structure in the control panel according to the present invention is provided with an outside air introduction port for introducing outside air to the lower part of the sealed casing.

  According to the heat dissipating structure in the sealed casing according to the present invention, the shelf board for placing the electronic device inside the sealed casing is provided for each electronic apparatus, and the shelf board substantially coincides with the width of the electronic apparatus on at least one side. Since it has a notch with a depth reaching the electronic device from the edge of the inside, there is no need to add special parts, and the air inside the sealed housing is circulated with a simple configuration. The electronic device housed in the can be efficiently cooled.

  More specifically, a chimney-like heat dissipation space in which air flows vertically is formed by the notches of each shelf and the inner wall surface of the sealed housing, and the air heated by the heat generated from each electronic device Will rise through space. For this reason, the air heated by the lower electronic device is less likely to act on the upper electronic device, and the dust phenomenon that the upper electronic device receives due to the heated air is reduced, and the chimney-like heat dissipation space is reduced. The upward flow of air that rises through increases the temperature as it goes to the top, and the flow becomes faster, generating heat from the electronic equipment in the height direction of the air and the chimney-like heat dissipation space including heat from the lower electronic equipment. This flow actively sucks in the air that contains it, eliminating the accumulation of heated air around the electronic equipment in the lower part of the control panel and in the middle of the chimney-like heat radiation space in the height direction. And since the raised air flow is radiated from the heat radiating port provided on the upper side plate or the top plate of the sealed casing through the radiating means, the inside of the sealed casing is efficiently cooled from the lower part to the upper part.

  According to the present invention, it is possible to provide a heat dissipating structure in a control panel with excellent heat dissipating efficiency with a simple configuration without adding special parts.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of an overall configuration showing a heat dissipation structure in a sealed casing of the present invention, and FIG. 2 is a longitudinal side view taken along line II-II in FIG. FIG. 3 is a plan view of the shelf board, and FIG. 4 is a front view of the shelf board. FIG. 5 is a perspective view of a punching plate used as a conventional shelf plate.

  As shown in FIG. 1 and FIG. 2, a plurality of shelf boards 20 are provided in the hermetic casing 10 with a space at which an electronic device 30 can be placed vertically. An outside air introduction port 11 is provided at the lower part of the hermetic casing 10, and a heat radiation port 12 is provided at the upper part, and a heat radiation fan 40 as a heat radiation unit is provided opposite to the heat radiation port 12. The radiating port 12 and the radiating fan 40 may be provided on the front plate 10a provided with the door of the hermetically sealed housing 10 as opposed to being provided on the rear plate 10b as in the illustrated example. Moreover, you may provide in both the front board 10a and the rear board 10b.

  As shown in FIGS. 3 and 4, the shelf plate 20 is obtained by bending both sides of a flat metal plate at a right angle, that is, bending it into a U-shape, and the electronic device 30 of the shelf plate 20. A cutout portion 21 is provided on one side of the surface on which is mounted.

  The width W of the cutout portion 21 substantially matches the width W ′ of the electronic device 30, and the depth X of the cutout portion 21 is formed to a depth reaching the electronic device 30.

  The notch 21 may be formed by punching at the same time when the metal plate is bent into a U shape, and no special processing step is required. In addition, the shelf board 20 is arrange | positioned at intervals like the example of illustration to the support pillar (it abbreviate | omitted illustration) standingly arranged in the airtight housing | casing 10, and the notch part 21 of each shelf board 20 is made to correspond vertically. .

  The electronic device 30 accommodates heat generating electrical components such as power transistors and power supply circuits and circuit boards on which the heat generating electronic components are mounted, and is mounted and fixed on the shelf plate 20 in the sealed casing 10. In this case, the electronic device 30 may be placed directly on the shelf board 20, but in order to improve the convection and enhance the cooling effect, for example, support bases 60 are provided at the four corners on the lower surface of the electronic device 30, It is preferable to form a gap 70 between the rack plate 20 and the shelf board 20. In this case, the support base 60 may be integrally formed on the lower surface of the electronic device 30 or may be directly formed on the shelf board 20 by punching and bending. In the latter case, the number of parts does not increase and the processing becomes simple.

  Next, the heat radiation operation in the sealed casing will be described. When the electronic devices 30 respectively placed and fixed on the shelf plate 20 in the sealed casing 10 are operated, the electronic devices 30 are heated by heat generated from the electronic circuit inside the electronic device 30. For this reason, the air around each electronic device 30 is heated and rises. At this time, the notch portions 21 of the respective shelf boards 20 on which the electronic devices are placed and fixed coincide with each other, and the chimney-like heat radiation space is formed between the notch portions 21 and the inner wall surface of the sealed housing as shown in FIGS. Since 50 is formed, the heated air rises through the chimney-like heat radiation space 50.

  By securing the air flow path in this way, the upward flow of the air rising through the chimney-like heat radiation space 50 increases in temperature as it goes upward, and the flow becomes faster. For this reason, the air containing heat from the electronic equipment located in the lower part and the air containing heat generated from the electronic equipment 10 located in the middle of the chimney-like heat radiation space in the height direction are drawn into this flow. Eliminate air traps around the middle electronics. Then, the raised air flow is discharged to the outside of the sealed casing 10 by the heat radiating fan 40 from the heat radiating port 12 provided on the front plate 10a, the rear plate 10b or the top plate 10c of the sealed casing 10.

  On the other hand, outside air flows into the inside of the sealed casing from the outside air introduction port 11 provided in the lower part, so that convection is efficiently performed from the lower part to the upper part inside the sealed casing. As a result, even if electronic devices are installed at high density in the sealed casing, the flow of air around the electronic device can be promoted, and the accumulation of heated air around the lower electronic device is eliminated.

  As described above, according to the present invention, a shelf board on which the electronic device is placed is provided for each electronic device inside the sealed casing, and the shelf board substantially coincides with the width of the electronic device at least on one side and Since it has a configuration with a notch with a depth reaching the electronic device from the edge, there is no need to add special parts, and the air inside the sealed housing is circulated with a simple configuration. The electronic device housed inside can be efficiently cooled.

  And the chimney-like heat radiation space in which air flows in the vertical direction is formed by the notch portion of each shelf board and the inner wall surface of the sealed casing, and the air heated by the heat generated from each electronic device passes through the chimney-like heat radiation space. Will rise. For this reason, the upper electronic device is less affected by the air heated by the lower electronic device, and the upward flow of the air rising through the virtual chimney space increases in temperature as it goes upward. The air containing heat from the electronic equipment located in the lower part and the air containing heat generated from the electronic equipment located in the middle of the chimney-shaped heat radiation space in the height direction are drawn in. Eliminates air traps around lower and middle electronic devices. And since the raised air flow is dissipated by the fan from the heat radiating port provided on the front plate, the rear plate or the top plate of the sealed casing, the inside of the sealed casing is efficiently convected from the bottom to the top. .

  In the above-described embodiment, the outside air inlet is provided below the front surface of the sealed casing, but is not necessarily limited to this location, and may be provided at any position below the sealed casing. .

  Further, in the above-described embodiment, the heat radiating port is provided in the upper part of the back surface of the sealed casing, but it is not necessarily limited to this place. It only has to be provided in that place.

It is a perspective view of the whole structure which shows the heat dissipation structure in the airtight housing | casing of this invention. It is a vertical side view along the II-II line of FIG. It is a top view of a shelf board. It is a front view of a shelf board. It is a slope view of the punching board currently used as a shelf board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sealing housing | casing 10a Front plate 10b Rear surface plate 10c Top surface plate 11 Outside air introduction port 12 Heat radiation port 20 Shelf plate 21 Notch 30 Electronic device 40 Heat radiation fan 50 Chimney-shaped heat radiation space 60 Support stand 70 Gap 101 Punch hole 102 Punch plate W Width W 'Width X Depth

Claims (5)

In the heat dissipating structure in the control panel in which at least two or more electronic devices are housed side by side in the installed state of the control panel in a sealed casing that forms a part of the control panel,
A shelf plate on which the electronic device is placed inside the sealed casing is provided for each electronic device, and the shelf plate is substantially equal to the width of the electronic device on at least one side and a depth reaching the electronic device from the edge of the side. A heat dissipating structure in the control panel characterized by having a notch.   The heat dissipating structure in the control panel according to claim 1, wherein the plurality of shelves are arranged with their notches aligned vertically.   In the installed state of the control panel, it is provided with heat radiating means for radiating the heated air that is transmitted to the upper part of the sealed casing through the notch and heated from the heat radiating port of the upper part of the sealed casing. The heat dissipation structure in the control panel according to claim 1 or 2.   The heat dissipation structure in a control panel according to any one of claims 1 to 3, wherein the heat dissipation means is a fan.   The heat dissipation structure in the control panel according to any one of claims 1 to 4, wherein an outside air introduction port for introducing outside air is provided in a lower portion of the sealed casing.

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