JP5601999B2 - Mounted parts separation collection device - Google Patents

Description

  The present invention relates to a mounted component sorting and collecting apparatus for sorting and collecting mounted components mounted on a substrate based on a material constituting the mounted component.

  When recovering material materials such as base metal and rare metal from the circuit board when disposing of used circuit boards with electronic components mounted on them, the powder obtained by crushing the circuit boards is put in a solvent and specified through an ion permeable membrane. There is a method of separating and recovering only useful materials. In such a conventional method, since the circuit board is pulverized with the mounting components attached, the quality of the crushed powder is low. For this reason, when the material material is extracted from the crushed powder by the solvent extraction method. However, there is a problem that requires a lot of time and cost.

  As what solves such a problem, for example, as described in Patent Document 1 and Patent Document 2, a component that is separated and collected using an image processing apparatus is known.

  In the product described in Patent Document 1, when a product (substrate) is collected from the market, the product name is read from a nameplate or the like by visual inspection or an image recognition device, and the result is stored in a separate dismantling database. By searching the necessary data, the shape, material, dismantling work, etc. of the parts of the product are obtained. After that, the automatic disassembly line is operated based on these data, and the product is disassembled and disassembled. Parts are separated individually.

  Moreover, the thing of patent document 2 is equipped with the illuminating device for irradiating a printed wiring board, a photosensor, an image processing apparatus, and the apparatus for extracting and removing components, A device for extracting and removing parts is controlled by detecting the coordinates and model name of the contour.

Japanese Patent Laid-Open No. 9-141242 Japanese National Patent Publication No. 8-505983

  However, in the devices described in Patent Document 1 and Patent Document 2 described above, the mounted components can be separated and collected by image processing, but are not sorted based on the material constituting the mounted components. There has been a problem that specific material materials such as base metal and rare metal cannot be easily recovered from the mounted components recovered from the substrate.

  The present invention has been made in order to solve the above-described conventional problems, and provides a mounting component separation and recovery device that enables a mounting component mounted on a substrate to be collected and recovered based on the material constituting the mounting component. It is intended to do.

In order to solve the above-described problem, a feature of the invention according to claim 1 is that a camera that captures a plurality of types of mounting components mounted on a substrate has a camera, and the type of the mounting component is processed by processing an image captured by the camera. An image processing device that can be classified for each, a mounting component-material configuration correspondence database in which the mounting component and a material constituting the mounting component are associated, and the mounting component based on the mounting component-material configuration correspondence database. e Bei a recovery head for collected separately for recycling station having a plurality of collection boxes holding from the substrate, wherein the recovery head, said mounting component to soak blotting port, a plurality of implementation blotted from the blotter port It is provided with a parts hangar capable of storing parts .

A feature of the invention according to claim 2 is that, in claim 1 , the collection head is composed of a plurality of collection-replaceable heads that hold the mounted parts for each type.

According to a third aspect of the present invention, in the first or second aspect , the image processing apparatus determines a size of the mounted component, and the storage is performed when the mounted component is smaller than a threshold value. When the component is temporarily stored in the component storage of the head and the mounted component is larger than the threshold value, the sucked mounted component is directly collected in the recycling station.

A feature of the invention according to claim 4 is that a code reading device that reads an identification code including types and position information of a plurality of mounting parts given to a board is associated with the mounting parts and materials constituting the mounting parts. Based on the mounted component-material configuration correspondence database, the code reader, and the mounted component-material configuration correspondence database, the mounted components are held from the substrate and separated and collected in a recycling station having a plurality of collection boxes. e Bei a recovery head, the recovery head includes: the mounting soak up part blotting port is that it is provided with a possible part hangar storing a plurality of mounting parts blotted from the blotter port.

  According to the first aspect of the present invention, an image processing apparatus that has a camera that captures a plurality of types of mounting components mounted on a substrate and that can process an image captured by the camera and classify mounting components by type, Recycling station having a plurality of collection boxes that hold mounting components from a substrate based on the mounting component-material configuration correspondence database in which the mounting components and the materials constituting the mounting components are associated, and the mounting component-material configuration correspondence database. And a recovery head for separating and recovering.

  With this configuration, it is possible to classify each mounted component that contains a specific material constituting the mounted component based on the mounted component-material configuration correspondence database, and to separately collect the mounted component. Can be easily separated.

In addition, according to the first aspect of the invention, the recovery head includes the suction port for sucking the mounted component and the component storage for storing the plurality of mounted components sucked from the suction port. There is no need to collect them at the recycling station one by one, and the mounted parts can be collected easily.

According to the second aspect of the invention, the recovery head is composed of a plurality of head-replaceable recovery heads that hold the mounting components for each type, so that the mounting components are removed by the recovery heads corresponding to the mounting components. It can be held securely.

According to the invention of claim 3 , the image processing apparatus determines the size of the mounted component. If the mounted component is smaller than the threshold value, the image processing device temporarily stores it in the component storage of the recovery head, and the mounted component is removed. If it is larger than the threshold value, the sucked-in mounted parts are collected directly to the recycling station, so the collection work according to the size of the mounted parts can be performed without increasing the size of the collection head's parts storage more than necessary. It can be carried out.

According to the invention according to claim 4 , the code reading device that reads the identification code including the types and position information of the plurality of mounting components given to the substrate, and the mounting that associates the mounting components with the materials constituting the mounting components parts - e Bei a recovery head for collected separately and mounted components on the basis of the Composition corresponding database recycling station having a plurality of collection boxes holding from substrate - and Composition corresponding database, code reading device and mounting components The collection head includes a suction port for sucking the mounted components and a component storage for storing a plurality of mounted components sucked from the suction ports .

With this configuration, the type and position information of the mounted components can be acquired in advance based on the identification code given to the board, so there is no need to specify the type by imaging each mounted component with a camera. The mounted components can be collected efficiently, and it is not necessary to collect the mounted components one by one in the recycling station, and the mounted components can be easily collected.

It is a schematic diagram of a mounting component sorting and collecting device showing an embodiment of the present invention. It is a figure which shows the collection | recovery head part which concerns on embodiment. It is a figure which shows the opening part of the collection | recovery nozzle of a collection | recovery head. It is a figure which shows a board | substrate inversion mechanism. It is a figure which shows the control block which controls a mounting components classification | category collection apparatus. It is a figure which shows the mounting component-material structure corresponding | compatible database memorize | stored in the memory | storage device. It is a figure which shows the flowchart which carries out classification collection of the mounting components. It is a figure which shows the flowchart which extracts a specific raw material from mounted components. It is a figure which shows the state which isolate | separates a connector component from a circuit board. It is a figure which shows another embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an outline of a mounted component sorting and collecting apparatus 10 showing an embodiment of the present invention. 11 shows an apparatus main body, and a circuit board S on which a mounted component P is mounted is attached to the apparatus main body 11 on the X axis. A substrate transport device 12 is provided that transports the substrate in the direction and positions and holds it at a predetermined collection position.

  A support base 40 is provided on the apparatus main body 11 so as to be movable in the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The support base 40 includes a recovery nozzle 13 that recovers the mounting component P on the circuit board S. The recovery head 14 is detachably attached. A camera 15 for identifying the type and position of the mounted component P and a heater 16 for warming the circuit board 11 and melting solder are mounted on the collection head 14. A laser device 41 for irradiating a laser beam is attached to the support base 40, and the circuit board S is cut by the laser beam emitted from the laser device 41 so that the connector parts can be separated.

  The apparatus main body 11 includes a recycling station 18 including a plurality (five in the embodiment) of recovery boxes 17 (17a to 17e) for separating and recovering the mounted components P recovered by the recovery head 14. A shredder 19 for crushing the circuit board S after collecting all the mounted components P is installed at a position spaced apart from the collection position by a predetermined distance in the X-axis direction. Further, the apparatus main body 11 is provided with a control device 20 composed of a personal computer or the like for controlling the mounted component sorting and collecting device 10.

  The collection head 14 includes a plurality of collection heads corresponding to the type of the mounted component P to be collected, and one of the collection heads 14 collects a relatively small mounted component P as shown in FIG. And a component storage 22 that can store a plurality of the same type of mounted components P sucked together. The lower end of the component storage 22 is opened and closed by a shutter 23 that can be opened and closed in the horizontal direction, and the mounting component P stored in the component storage 22 is dropped by the opening operation of the shutter 23. Yes. An extruding member 24 is provided in the component storage 22 so as to be movable up and down, and the extruding action by the extruding member 24 ensures that the mounted component P clinging to the inner wall of the component storage 22 can be dropped.

  The tip opening of the recovery nozzle 13 of the recovery head 14 has a double pipe structure as shown in FIG. 3, and the inner pipe 25 is connected to a suction source (not shown) for sucking the mounted parts. Has been. An annular passage 27 is formed between the inner pipe 25 and the outer pipe 26, and the annular passage 27 is connected to an air supply source (not shown) so that air is ejected from the annular passage 27 when sucking the mounted components. I have to. With this configuration, when the mounting component P is sucked by the inner pipe 25 of the recovery nozzle 13, the mounting component existing around the mounting component P to be sucked can be mistakenly sucked by ejecting air around it. I am trying not to.

  As shown in FIG. 4, a substrate reversing mechanism 42 for reversing the circuit board S upside down is provided corresponding to the collection position. The board reversing mechanism 42 reverses the circuit board S so that the mounted parts can be collected from the back surface of the circuit board S when all the mounted parts are collected from the front surface of the circuit board S. The substrate reversing mechanism 42 includes an elevating body 43 that can move up and down, a rotating body 44 that is supported by the elevating body 43 so as to be rotatable about a horizontal axis, and a pair of substrate grips that are supported so as to be able to approach and separate from the rotating body 44. Claws 45 and 46 and a loader 47 that lifts the circuit board S held at the collection position and inserts it between the pair of board gripping claws 45 and 46 are provided.

  As shown in FIG. 5, the control device 20 that controls the mounted component sorting and collecting device 10 includes a CPU 31, a ROM 32, a RAM 33 and a bus 34 for connecting them, and an input / output interface 35 is connected to the bus 34. Connected to the input / output interface 35 are a control circuit 36 that controls the drive unit of the collection head 14 and an image processing device 37 that performs image processing on the image data captured by the camera 15 and identifies the type of the mounting component P. Yes.

  The ROM 32 stores a control program for separately collecting the mounted components P by driving and controlling the collection head 14 in the XY and vertical directions. In addition, the ROM 32 stores a mounting component-configuration material correspondence database DB relating to the type of the mounting component P.

  As shown in FIG. 6, the mounted component-component material correspondence database DB includes component names of the mounted components P, component materials constituting the mounted components P, and collection heads that can be used to collect the respective mounted components P. 14 head no. Are associated with each other. For example, the material constituting the mounting component P made of “ceramic capacitor” is made of “silver (Ag), palladium (Pd), lead (Pb), nickel (Ni)”, and this “ceramic capacitor” is collected. The recovery head 14 that can be used for the head no. Is stored in a database. Similarly, for “tantalum capacitors”, “chip coils”, “chip resistors”, “connectors”, etc., the part names, constituent materials, and head numbers of the recovery heads 14 to be used are also shown. Is databased. Thus, when the type of the mounting component P is specified by the image processing device 37 described above, the material constituting the mounting component P and the usable collection head 14 are searched from the mounting component-configuration material correspondence database DB. It is like that. For items that are collected using the laser device 41 such as “connector”, a circle is marked in the laser processing column.

  Next, the operation of the mounted component sorting and collecting apparatus 10 having the above configuration will be described based on the flowchart shown in FIG. In the following description, a method of extracting a specific constituent material, for example, silver (Ag) from the collected mounting component P will be described.

  First, in step 100, the circuit board S to be processed is carried into the collection position by the board transfer device 12 and positioned at a predetermined position. Next, in step 102, the circuit board S is imaged for each predetermined zone by the camera 15, and the captured image data is processed by the image processing device 37. In step 104, the shape of the mounting component P is identified based on the image processing by the image processing device 37, and the type of the mounting component P mounted on the circuit board S is specified from the shape, and the mounting component is identified. Information on the position where P is mounted is acquired.

  In step 106, based on the information on the type and position of the mounting component P, the collection head 14 collects the mounting component P from the circuit board S and separates and collects it in a predetermined collection box 17 of the recycling station 18. The cycle is executed. Such a separate collection cycle will be described later.

  Next, in step 108, it is determined whether or not all the mounted components P have been collected from the upper surface (front surface) of the circuit board S. If the determination result in step 108 is YES, then in step 110, the circuit board S It is determined whether or not the back surface processing has been completed (or processing unnecessary). If the mounting component P mounted on the back surface of the circuit board S has not been processed, the determination result is NO and the process proceeds to step 112. In step 112, the circuit board S positioned at the collection position is turned upside down by the board turning mechanism 42, and the process returns to step 102 described above. If the determination result in step 108 is NO, the process returns to step 102 and the above operation is repeated.

  The substrate reversing mechanism 42 is operated based on a substrate reversing command. First, the elevating body 43 is moved upward so that the pair of substrate gripping claws 45 and 46 are positioned at positions where the circuit board S can be gripped. The circuit board S that has been moved forward 47 and held at the collection position is lifted, and one end of the circuit board S is inserted between the pair of board gripping claws 45 and 46. In this state, the pair of board gripping claws 45 and 46 are closed to grip one end of the circuit board S, and then the loader 47 is retracted. Subsequently, the rotating body 44 is rotated 180 degrees around the horizontal axis, and the circuit board S held by the board holding claws 45 and 46 is turned upside down. Thereafter, the circuit board S turned upside down is positioned and held at the collection position by an operation reverse to that described above.

  If the determination result in the above-described step 110 is YES, a connector part separation process by the laser device 41 is executed in the subsequent step 114. That is, since the connector part P1 (see FIG. 9) may be fixed to the circuit board S by a method other than soldering such as screwing or fitting, such a part is shown in FIG. The circuit board S is cut along the broken line L by the laser beam emitted from the laser device 41, and the connector component P1 is separated from the circuit board S. Subsequently, in step 116, the separated connector part P <b> 1 is held by the collection head 14, and separated and collected in a predetermined collection box 17 of the recycling station 18.

  Next, in step 118, the circuit board S is unloaded from the collection position by the board transfer device 12, and is transferred to the position where the shredder 19 is installed. The circuit board S conveyed to the position of the shredder 19 is subjected to pulverization by being applied to the shredder 19 after the solder or bonder left on the circuit board S is sucked or wiped off in step 120.

  Next, the separation / collection cycle of the mounted component P executed in step 106 will be described based on the flowchart of FIG. First, in step 200, the mounting component-configuration material correspondence database DB stored in the ROM 32 is referred to, and the material constituting the mounting component P identified in step 104 based on the mounting component-configuration material correspondence database DB, The head No. of the recovery head 14 that can be used. Etc. are calculated.

  Next, in step 202, it is determined whether or not the material constituting the mounting component P contains silver (Ag). For example, when it is specified that the type of the mounted component P is “ceramic capacitor”, it is retrieved from the mounted component-component material correspondence database DB that silver is included in the component material. The determination result in is YES. Similarly, if the type of the mounted component P is specified as “chip resistance” and “connector”, the determination result in step 202 is YES. On the other hand, when the type of the mounting component P is specified as “tantalum capacitor” or “chip coil”, the constituent material does not contain silver, so the determination result in step 202 is NO.

  If the decision result in the step 202 is YES, in the step 204, the mounted parts are classified into the group A, and, for example, the box No. No. 100 collection box 17a is designated, and the process proceeds to Step 208. On the other hand, if the determination result in step 202 is NO, in step 206, the box No. of the collection box 18 to be collected separately for each mounted component. For example, collection boxes 17b, 17c,... 110, 101,.

  In step 208, based on the position information of the mounting component P acquired in step 104 described above, the Head 1 or 2 recovery head 14 retrieved from the mounting component-component material correspondence database DB is moved in the XY direction to mount the mounting component P. The part P is positioned at a position where it can be recovered. At this time, the recovery head 14 is appropriately replaced according to the type of the mounted component P, and after replacement with a predetermined recovery head 14, the recovery head 14 is positioned at a predetermined position.

  Subsequently, in step 210, the heater 16 is activated to heat the mounting component P to be collected, and the solder fixing the mounting component P is melted. In this case, the solder can be efficiently melted by the heater 16 by warming the entire circuit board S to a predetermined temperature before carrying the circuit board S to the collection position. Next, in step 212, the recovery head 14 is lowered, and the mounted component P to be recovered is sucked by the recovery nozzle 13 and stored in the component storage 22. Each time the mounted component P is stored in the component storage 22, a counter (not shown) is incremented.

  In the next step 214, it is determined whether or not the inside of the parts storage 22 of the recovery head 14 is full, that is, whether or not a predetermined number of mounted parts P are stored in the parts storage 22. Is jumped to step 108 described above.

  If the determination result in step 214 is YES (a predetermined number of mounted components are stored in the component storage 22), the process proceeds to step 216, and the collection head 14 is set to the box No. specified in the recycle station 18. In this state, the shutter 23 of the recovery head 14 is opened, and the push-out member 24 is lowered to place the mounted component P stored in the component storage 22 into the predetermined recovery box 17. to recover.

  The mounted parts containing silver separated and collected in the collection box 17 (17a) for the group A of the recycling station 18 are appropriately taken out, processed into pieces, and separated into silver and other metals by a known wet refining method. Is done. In other words, disassembled mounting parts containing silver that has been pulverized into hydrochloric acid solution, and separated from the solution into various metal components using an ion permeable membrane for separating silver and an ion permeable membrane for separating other metals. Collect.

  Some mounted components P cannot be stored in the component storage 22 of the recovery head 14, so such mounted components P are held one by one without being stored in the component storage 22. Each time it is carried, it is carried to the recycling station 18 and directly collected in a predetermined collection box 17. In this case, a large mounted component may be sucked and held at the tip of the collecting nozzle 13 and carried to the recycling station 18, or a collecting head 14 having a suction-dedicated nozzle for sucking and holding the mounted component without having a component storage. Thus, the mounted component may be sucked and held and transported to the recycling station 18.

  In the above-described embodiment, as an example of the specific constituent material, the mounting component P containing silver is collected in the collection box 17 for group A, collected separately, and the silver is separated by the wet refining method. However, it is also possible to extract a plurality of constituent materials in accordance with a predetermined priority order and separate and collect them in each collection box 17 of the recycling station 18 for each constituent material.

  For example, when a mounting component is specified based on an image captured by the camera 15, first, in step 202 of the flowchart shown in FIG. 8, first, the mounting component has the highest priority, for example, gold (Au). Is retrieved by referring to the mounting component-component material correspondence database DB, and if it contains gold, it is classified into group A and collected for collecting the mounting components classified into group A. A box 17 (for example, a collection box 17a) is designated. If it does not contain gold, whether or not silver (Ag) having the next highest priority is contained is searched with reference to the mounting component-constituent material correspondence database. In this way, the collection box 17 (collection box 17b) for collecting mounted components classified into group B is designated. If it does not contain silver, whether or not it contains, for example, copper (Cu) having the next highest priority is searched with reference to the mounting component-constituent material correspondence database DB, and is classified into group C. A collection box 17 (collection box 17c) for collecting mounted parts divided into the above is designated. And about the other mounting components which do not contain gold, silver, and copper, the collection box 17 is designated for every mounting component.

  In this way, the mounted components P collected from the circuit board S are classified into the mounted components including specific materials constituting the mounted components P, and are collected separately at the recycling station 18, and then ionized in the subsequent wet refining. A permeable membrane can be used to separate specific materials and other materials.

  According to the embodiment described above, a plurality of types of mounting components P mounted on the circuit board S are picked up by the camera 15 and the images are processed by the image processing device 37 to identify the type of the mounting component P. Since the component material constituting the identified mounting component is retrieved from the mounting component-material configuration correspondence database DB, the mounting component P is separated and collected based on the material constituting the mounting component P. It is possible to easily separate a specific material included in the mounted component.

  FIG. 10 shows another embodiment of the present invention. The difference from the above-described embodiment is that information on the type and position of the mounted components mounted on the circuit board S is given to the circuit board S. The identification code can be identified based on the identification code.

  In FIG. 10, the circuit board S is provided with an identification code 51 made of a bar code or a nameplate, and the identification code 51 is read by a bar code reader or a code reading device 52 made of a camera and an image processing device. The type of the substrate S is specified. Then, it is ascertained from the board database (not shown) what kind of mounting component is mounted at which position of the circuit board S, and based on the mounting part-configuration material correspondence database DB as described above. Separately collect mounting parts containing specific components.

  According to this embodiment, since the identification code 51 given to the circuit board S is read by the code reading device 52, information on the type and position of the mounted component mounted on the circuit board S can be acquired. All kinds of circuit boards S collected more easily can be collected separately.

  In the above-described embodiment, the unit of the material in the mounting component-constituent material correspondence database DB is the element unit, but it may be set in the compound unit. Examples of the compound include tantalum oxide (Ta2O5) and niobium oxide (Nb2O5).

  Further, in the above-described embodiment, the example in which the same type of mounting components P are stored together in the component storage 22 of the collection head 14 has been described. However, different types of mounting components including the same constituent material are combined. And may be stored in the parts storage 22.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention described in the claims. Of course, it is possible.

  The mounted component sorting and collecting apparatus according to the present invention is suitable for use in sorting and collecting mounted components mounted on a circuit board.

  DESCRIPTION OF SYMBOLS 10 ... Mounting component separation collection apparatus, 12 ... Board conveyance apparatus, 13 ... Collection nozzle, 14 ... Collection head, 15 ... Camera, 16 ... Heater, 17 ... Collection box, 18 ... Recycling station, 19 ... Shredder, 20 ... Control device , 22 ... parts storage, 37 ... image processing apparatus, 51 ... identification code, 52 ... code reading device, P ... mounting parts, S ... circuit board, DB ... mounting parts-constituent material correspondence database.

Claims (4)

An image processing apparatus having a camera for imaging a plurality of types of mounting components mounted on a substrate, processing an image captured by the camera and sorting the mounting components by type, the mounting components and the mounting components A mounting component-material configuration correspondence database in which constituent materials are associated with each other, and based on the mounting component-material configuration correspondence database, the mounting components are retained from the substrate and separated into recycling stations having a plurality of collection boxes. e Bei a recovery head for recovering, the recovery head is mounted component, wherein said mounting soak up part blotting opening, by being provided with a possible part hangar storing a plurality of mounting parts blotted from the blotter port Separation collection device. 2. The mounting component sorting and collecting apparatus according to claim 1 , wherein the collecting head includes a plurality of head-replaceable collecting heads that hold the mounted components for each type. The image processing apparatus according to claim 1 or 2 , wherein the image processing apparatus determines the size of the mounted component, and if the mounted component is smaller than a threshold value, the image processing device temporarily stores the component in the component storage of the storage head, When the mounted component is larger than the threshold value, the mounted component sorting and collecting apparatus is configured to directly collect the sucked mounted component at the recycling station. A code reading device that reads an identification code including types and position information of a plurality of mounting components assigned to a substrate; a mounting component-material configuration correspondence database that associates the mounting components with the materials that constitute the mounting components; the code reading device and the mounting components - e Bei a recovery head for collected separately the mounted components on the basis of the material constituting the corresponding database holds than on the substrate in the recycling station having a plurality of collection box, the recovery head A mounting component sorting and collecting apparatus , comprising: a suction port for sucking up the mounting component; and a component storage for storing a plurality of mounting components sucked from the suction port .

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