TW201729915A - Automatic component segregator - Google Patents

Abstract

The present invention relates to an apparatus and a method for automatic segregation of working and non-working parts from waste printed circuit boards or electronic waste with minimal or no manual efforts. The apparatus comprises a component segregation section and a chip separation section, contiguous to segregation section to segregate the components in various stages depending upon their functionality, nature and reusability. The apparatus takes in the bulk waste product as feed; the entry of the same is sensed by the sensors provided on the conveyor belt and that initiates the segregation process. The components from the waste product then undergo a number of stages wherein all necessary steps are taken like, size sorting, metallic parts sorting, reusable parts sorting. The automatic segregation according to the present invention is based upon the principles of size sorting, metals sorting and chip sorting.

Description

Automatic component separator

The present invention relates to an apparatus and method for automatically separating recyclable and reusable components from electronic waste. More specifically, the present invention relates to an apparatus and method for automatically separating working and non-working components of a waste printed circuit board.

E-waste management is an important requirement for ecological sustainability in many countries. The efficient classification of waste is a major issue in today's society, and for the waste management industry, ensuring effective and sustainable management of waste is an urgent problem to be solved. The economic value of waste is best achieved when it is separated.

The trend to automate things that are manually controlled has become a common practice in recent times. Automate things to reduce the burden on humans. In addition, the cost and effort used in manually operated products is much higher than in automated systems.

The main problem with manually operated waste management systems is the inspection and separation of components based on their potential for recovery and reuse. The usual method involves manual mode where one person must travel to a different location, check where the waste is collected, or require a team to identify and separate components. This is a somewhat complicated and time consuming process. Therefore, considering the advances in technology that have emerged in recent years, today's waste management systems are not as efficient. Therefore, it is impossible to ensure the effective use of electronic waste by properly identifying, separating, and applying waste management methods to the basic components of electronic waste.

In addition, there is another problem in which the recycler needs to identify the value of the basic components of the electronic waste or the possibility of reuse to determine or plan an appropriate waste management strategy. PCB is an important component of electrical equipment, which has precious components of metal, non-metal, components (such as capacitors, semiconductors, inductors, detachable board ports, etc.). Therefore, recycling becomes a more complex task. The complexity of the recycling process is not only due to differences in valuable components; more precisely, due to the presence of such detachable components, which have a tendency to be reused, recycled, or recycled depending on the functional state of the components.

Reusing functional components (such as capacitors, inductors, semiconductors, etc.) can be a better choice and a cost effective way in an effective waste management program.

CN101444784A discloses a method and apparatus for efficiently recycling waste circuit boards in a vacuum. According to the disclosed method, the waste circuit boards are arranged in a vacuum vessel and heated for pyrolysis, wherein most of the pyrolyzed volatile materials are cooled and liquefied into liquid oil, while the rest are brought into the gas. The collector; the centrifuge device separates the solder from the circuit board during pyrolysis; the substrate and electronic components of the pyrolyzed circuit board are sorted and collected for further separation and recovery. The main disadvantage of this method is that even if pyrolysis is carried out under vacuum conditions, the heating involved in the pyrolysis process may affect the function of the working element.

No. 6,234,317 discloses a device for classifying unprocessed, pretreated or recycled bulk materials. The device has less utility for recycling purposes because the primary function of removing components from the PCB must be performed separately.

In order to overcome the limitations of the prior art, one method proposes a way to ensure an effective waste management procedure regardless of the nature, functional state and abundance of valuable materials (eg, metals, non-metals, etc.). This approach should focus on ease of operation, low dependence on manpower, and a tendency to simultaneously implement more than one waste management technique without interrupting parallel ongoing processing.

Therefore, there is a need for a method that automatically separates components and determines the functional state of the components, helping the recycler to set the process and objectives of the waste management process, which can be the reuse, recycling, and recycling of components.

It is a primary object of the present invention to provide an apparatus and method for automatically separating working and non-working components of a waste printed circuit board or electronic waste with minimal or no manual intervention.

Yet another object of the present invention is to provide a programmable logic controller (PLC) controlled device that operates the separation process in an automatic mode by a series of input/output modules, sensor modules, and communication processors.

Yet another object of the present invention is to provide a method of reusing functional elements present in a waste printed circuit board or electronic waste.

Still another object of the present invention is to provide an element separator comprising a main element separation region and an adjacently connected wafer separation region to separate them at various stages depending on the function, properties and recyclability of the element.

Yet another object of the present invention is to provide a sensor that allows a device to sense the presence of waste on a conveyor belt and initiate movement of the conveyor belt.

Yet another object of the present invention is to provide an automatic separation device having an infrared (IR) proximity sensor or camera module for automatically classifying wafers present in a waste printed circuit board or electronic waste.

Yet another object of the present invention is to provide an apparatus in which specific parameters such as temperature, speed and time can be customized according to the needs of the separation process.

Yet another object of the present invention is to provide a separation method using automated unit operations such as size classification, metal classification, and reusable components such as wafer/capacitor/inductors from printed circuit boards or electronic waste. /Diode) separation.

Yet another embodiment of the present invention provides a device having a safety mechanism to protect embedded components present in electronic waste from damage.

Accordingly, the present invention is directed to an apparatus and method for automatically separating working and non-working components from waste printed circuit boards or electronic waste in a minimal or no manual manner. The apparatus includes a component separation region and a wafer separation region adjacent to the component separation region to separate the phases in various stages depending on the function, properties and recyclability of the component.

The device receives bulk waste as a feed; the inlet of the device is sensed by a sensor disposed on the conveyor belt, and the sensor initiates the separation process. The components from the waste then go through several stages in which all necessary steps are performed, such as: sizing, classification of metal parts, classification of reusable parts (ie wafers, capacitors, inductors and diodes, etc.), and comminution.

The automatic separation according to the present invention is based on the following principles: 1. Size classification; 2. Metal classification; and 3. Wafer classification.

In another embodiment, the device has a security device in which the functional element is protected from crushing, damage, or any type of damage during the separation process.

The invention will now be described with reference to the drawings, in which some but not all embodiments of the invention are shown. In fact, the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy the applicable legal requirements.

Numerous modifications and other embodiments of the inventions set forth herein will be apparent to those skilled in the <RTIgt; Therefore, the invention is to be understood as not limited to the specific embodiments disclosed, and such modifications and other embodiments are intended to be included within the scope of the accompanying drawings. Although specific terms are used herein, they are used in a generic and descriptive sense only and not for the purpose of limitation.

Figure 1 is an isometric view of a component separator depicting a complete system for performing a separation process. In a first step, the e-waste components from the component removal machine 400 are received by the primary screening unit 110 for sorting. The component remover provides two types of fractions, thin and thick, outside of the blank. The primary screening unit 110 performs screening of pellets including solder balls, dust, multilayer ceramic capacitors (platinum group metals), high value small capacitors, pins, and particulates, and is further provided to an independent sorting system 300. Thereafter, the components are selectively transmitted toward the component separator 100 and the wafer separation region 200 for automatic separation of the components and the wafer. Element separator 100 and wafer separator 200 are connected adjacently to provide a continuous separation process.

In yet another embodiment, the embedded components of the printed circuit board are separated in three different stages, with all of the connectors and ports being removed first in stage one. The removed connectors and ports are then sent to mechanical recycling. The remaining material is moved forward for further separation steps.

Figure 2a is a process flow diagram illustrating the component removal procedure in which waste material is fed into the component removal machine/device. The component removal machine (CRM) performs preparatory steps such as the initial classification of electronic waste (especially waste printed circuit boards) and the removal of components of electronic waste. After the component is removed, the blank board is sent for comminution and further recovery procedures. On the other hand, the removed components are sent for the separation process of the present invention. Specifically, the component remover connected before the separator device removes all working and non-working components from the printed circuit board and transports the components for various inspections to ensure properness according to the type and state of each component. Waste management methods. For example, if the printed circuit board is used as a feed input, the device will remove all of the embedded components of the printed circuit board and deliver all of these components for various sensing modules and smart test suites in the device. Perform a functional check with the help of it. If the component is found to be in good working condition, it is transmitted for reuse. Similarly, if the component is found to be defective, other waste management methods can be selected based on the recycling and recycling possibilities of such defective components. The blank plate after the component removal is sent to the metal recycling process.

Referring to Figure 2b, a schematic flow diagram for processing the remaining materials obtained is explained. The removed components are sent for size sorting, screening, metal sorting, and wafer sorting. The size classification of the removed elements is carried out by roll separation. Among them, the metal present in the removed component is classified by a magnetic classifier. The wafers are classified by the aid of an infrared proximity sensor.

Referring to Figure 3, process flows depicting various stages, such as size classification, metal classification, and wafer classification, are shown in accordance with an embodiment of the present invention. The size classification is further carried out in stages by passing the components through a roller and separating the connector/port, the processor socket/iron, the capacitor/transistor, wherein the capacitor/electro-crystal system is sent to the test bench, and the capacitor is again checked at the test bench. / Whether the transistor needs to be guided to mechanical recycling or reuse.

Referring to Figure 4, a perspective view of the component separator is provided. In this embodiment, the separator includes a frame 145 to support the delivery system 120 and other subassemblies. In addition to the blank plate, there are two types of PCB material grain sizes received from CRM processing, namely fine and coarse. The primary screening unit 110 performs screening of fine-grained grades including solder balls, dust, multilayer ceramic capacitors (platinum group metals), high value small capacitors, pins, and particles, and is further provided to an independent classification system. The preliminary screening unit 110 is formed by a screen and a cam mechanism to vibrate back and forth. It is the same as the vibration feeder. The primary screening unit 110 receives components from a component removal machine (CRM) in which the coarse and thin components are separated. The thick components include components such as heat sinks, sockets, connectors, copper coils, electrolytic capacitors, coils, connector pedestals, transistors, inductors, wafers, and the like. The coarse elements are then passed to a feeder 115 which receives the mixing elements of all sizes/coarse grades. It uses the cam mechanism to vibrate back and forth. It is the same as the vibration feeder. Feeder 115 is contiguously coupled to delivery system 120. The conveyor system 120 includes a motor driven conveyor belt that drives the conveyor belt to move longitudinally along the main frame 145 and to convey the coarse-grained mixing elements through various stages of separation. The delivery system further includes a camera and a proximity sensor to sense the components on the conveyor belt and trigger the motor, thereby moving the conveyor belt in a desired direction. The plurality of roller separators 125, 130 and 135 are arranged at appropriate positions above the conveyor belt at an adjustable height such that the conveyor belt moves directly below the separator. Each roller separator unit is provided with at least one funnel 155 for receiving and collecting components from the roller separator unit. Each roll separator unit separates it according to the size of the element and transfers the remaining elements towards the other roll separator unit, wherein the elements are separated based on the same principle (ie size). As discussed above, separate components are collected within each funnel 155. The funnel acts as a guide for directing the separated material to the collection bin. The magnetic separator/classifier 160 is provided for the separation of the magnetic elements. The magnetic separator/classifier is then attached next to the roller separator to initiate a magnetic separation process for the components left after the roller separation process and direct the separated iron material to the collection bin.

Referring to Figure 5, a side view of the separator unit is provided.

Referring to Figure 6, a perspective view of the wafer separation unit is provided. In this embodiment, the auxiliary screening assembly 245 receives components from a magnetic sorter (not shown). The contents are transferred to a delivery system for automated separation of the wafer. The conveyor system includes a motorized conveyor belt that drives the conveyor belt to extend longitudinally to receive and move the processed batch from the primary component separator. The imaging module 210 is disposed on the transport system for capturing images to detect the shape, size, and color of the components (wafers). The configuration of the proximity sensor 220 detects the load on the conveyor belt and determines the distance between the components for an uninterrupted and accurate separation procedure. At least one reflector 240 is placed on the conveyor system to reflect and manage the light emitted from the proximity sensor. A plurality of gas nozzles 225 at appropriate locations on the conveyor belt collect the separated wafers that are activated to separate the components according to the size, shape, color, and distance of the components when receiving responses from the imaging module and the sensor. . An array of funnels 230 collects components from each air nozzle.

7 & 8 are top and side views of a wafer separation unit in accordance with an embodiment of the present invention.

Referring to Figure 9, the layout of the PLC control system is shown, which controls various component removal machines equipped in the apparatus. The PLC system operates all machines, rolls, and screening motors in automatic mode. The status of the operation is displayed on the LCD/TFT screen, which is set to monitor the normal function of the device. In a preferred embodiment of the invention, system operation ceases if any of the components to be separated are stuck anywhere in the separation process (e.g., under the rollers). The splitter will not restart unless the jammed component is removed. The device may have a safety device in which the functional element is protected from crushing, damage, or any type of damage during the separation process.

Figure 10 is a block diagram showing the process of wafer sorting or detection. The wafer separation assembly includes a conveyor belt, a plurality of infrared (IR) proximity sensors or camera modules, a pneumatic pump, and a collection funnel. The IR proximity sensor or camera module is located on both sides of the conveyor belt, wherein the IR proximity sensor or camera module senses the entrance and detects the type of wafer. Wafer detection is controlled by a PLC system, where the detection is based on the color of the wafer. The air pump further includes a plurality of air valves or vents. The presence of a particular color wafer on the conveyor belt is detected by a camera module that allows a particular air valve or vent to open, and the detected wafer is a funnel that is propelled from the conveyor belt by airflow. The different types of wafers that are separated are classified into three types of three funnels, namely: a noble metal content wafer, a medium precious metal content wafer, and a low precious metal content wafer. Functionally, a wafer includes an electronic wafer (such as a microchip), a processor, an integrated circuit wafer, and a microprocessor.

Accordingly, a preferred embodiment of the present invention provides an automatic component separator for separating an electronic waste component, comprising: a) a frame; b) at least one feeder to receive the component to be separated; c) at least one a transport system for moving the components away from the feeder, the transport system comprising at least one motor driven conveyor belt and at least one proximity sensor; d) a plurality of roller separator units for separating the components according to respective dimensions of the components, Each of the equal roller separator units includes at least one roller separator and at least one funnel; e) at least one magnetic sorter adjacent to the roller separator units to separate the magnetic elements; and f) at least one wafer separator adjacent The magnetic sorter; wherein the conveyor system triggers once the conveyor belt receives the components from the feeder; the roller separator units are disposed at an adjustable height above the conveyor belt such that the conveyor belt In the roller separators are positive Move below; and the automatic component splitter is controlled by a programmable logic controller.

In still another preferred embodiment of the present invention, an automatic component separator for separating an electronic waste component is provided, comprising: a) a frame; b) at least one feeder to receive the component to be separated c) at least one primary conveyor system for moving the components away from the feeder, the primary conveyor system comprising a motor driven conveyor belt and at least one proximity sensor; d) at least one roller separator unit for each component Dimensions separate the elements, the roll separator unit comprising at least one roll separator and at least one funnel; e) at least one magnetic sorter adjacent the roll separator unit to separate the magnetic elements; f) at least one size separation unit to The magnetic sorter receives the non-magnetic element; g) at least one auxiliary transport system adjacent the size separation unit to move the component away from the size separation unit, the auxiliary transport system comprising a motor driven conveyor belt and having both ends h) an imaging module disposed at at least one end of the auxiliary transport system to capture an image of the non-magnetic component to detect its shape, size and color; i) at least one end of the auxiliary transport system a plurality of proximity sensors configured to sense a load on the auxiliary conveyor system and determine a distance between the components; and j) a plurality of air nozzles disposed on the auxiliary conveyor system, each of which is provided with at least one funnel Collecting the separate components; wherein the imaging module and the proximity sensors are located at a suitable location to capture images and sense the presence of components on the auxiliary delivery system; the plurality of nozzles are attached An appropriate position on the auxiliary delivery system is provided, the nozzles being activated to separate the components from the size, shape, color and distance of the components when receiving responses from the imaging module and the sensors And the components are collected in their respective funnels; and the automatic component separator is made up of programmable logic The controller controls it.

100‧‧‧Component separator
110‧‧‧Primary screening unit
115‧‧‧ Feeder
120‧‧‧Conveying system
125‧‧‧ Roller separator
130‧‧‧ Roller separator
135‧‧‧ Roller separator
145‧‧‧Frame
155‧‧‧ funnel
160‧‧‧Magnetic separator/classifier
200‧‧‧ wafer separation area
210‧‧‧ imaging module
220‧‧‧ proximity sensor
225‧‧‧ gas nozzle
230‧‧‧ funnel
240‧‧‧reflector
245‧‧‧Auxiliary screening components
300‧‧‧Classification system
400‧‧‧Component removal machine

The various features, advantages and other uses of the method and apparatus for recycling the electronic waste of the present invention will become more apparent from the following detailed description and drawings.

Figure 1 is an isometric view of a component separator apparatus that illustrates various stages of separation during the separation process.

Figure 2a is a flow diagram of the basic process for explaining a general separation procedure in accordance with the present invention.

Figure 2b is a schematic flow diagram illustrating the processing of the remaining components obtained after the component removal process.

Figure 3 depicts the process flow for the various stages involved in the separation process.

4 is a perspective view of a main component separator in accordance with an embodiment of the present invention.

Figure 5 is a side elevational view of a primary component separator in accordance with an embodiment of the present invention.

Figure 6 shows a wafer separation unit in accordance with an embodiment of the present invention.

7 & 8 are top and side views of a wafer separation unit in accordance with an embodiment of the present invention.

Figure 9 shows the layout of the PLC control system.

Figure 10 is a block diagram illustrating a wafer separation or detection process in accordance with an embodiment of the present invention.

110‧‧‧Primary screening unit

115‧‧‧ Feeder

120‧‧‧Conveying system

125‧‧‧ Roller separator

130‧‧‧ Roller separator

135‧‧‧ Roller separator

145‧‧‧Frame

155‧‧‧ funnel

160‧‧‧Magnetic separator/classifier

Claims (10)

An automatic component separator for separating electronic waste components, comprising: (a) a frame; (b) at least one feeder to receive components to be separated; (c) at least one delivery system to such components Moving away from the feeder, the delivery system comprising at least one motor driven conveyor belt and at least one proximity sensor; (d) a plurality of roller separator units for separating the elements according to respective dimensions of the elements, the roller separator units Each of the at least one roller separator and at least one funnel; (e) at least one magnetic sorter adjacent the plurality of roller separator units to separate the magnetic elements; and (f) at least one wafer separator adjacent to the magnetic classification Wherein, once the conveyor belt receives the components from the feeder, the conveyor system is triggered to transmit the components toward the roller separator units; the roller separator units are disposed in the conveyor An adjustable height above the belt, such that the conveyor belt moves directly under the roller separators; and the automatic component System is controlled by programmable logic controller. An automatic component separator for separating an electronic waste component according to claim 1, wherein the delivery system further comprises an imaging module to detect the presence of components on the conveyor belt. An automatic component separator for separating an electronic waste component according to claim 1, wherein the plurality of roller separator units comprise rollers of different sizes. An automatic component separator for separating an electronic waste component according to claim 1, wherein the component to be separated comprises a connector, a port, a processor socket, a magnetic and non-magnetic component, a capacitor, a transistor, a microchip. , processor, integrated circuit chip, and microprocessor. An automatic component separator for separating electronic waste components, comprising: (a) a frame; (b) at least one feeder to receive components to be separated; (c) at least one delivery system to such components Moving away from the feeder, the delivery system comprising a motor driven conveyor belt and at least one proximity sensor; (d) at least one roller separator unit for separating the elements according to their respective dimensions, the roller separator unit comprising at least a roll separator and at least one funnel; (e) at least one magnetic sorter adjacent to the roll separator unit to separate the magnetic element; and (f) at least one wafer separator adjacent to the magnetic sorter, once the transfer belt Receiving the components from the feeder, the conveyor system is triggered to transmit the components toward the roller separator unit; the roller separator unit is disposed at an adjustable height above the conveyor belt such that a conveyor belt moving directly below the roller separator unit; and the automatic component separator is controlled by a programmable logic It is controlled. An automatic component separator for separating an electronic waste component according to claim 5, wherein the delivery system further comprises an imaging module to detect the presence of components on the conveyor belt. An automatic component separator for separating an electronic waste component according to claim 5, wherein the component to be separated comprises a connector, a port, a processor socket, a magnetic and non-magnetic component, a capacitor, a transistor, a microchip. , processor, integrated circuit chip, and microprocessor. An automatic component separator for separating an electronic waste component, comprising: (a) a frame; (b) at least one feeder to receive the component to be separated; (c) at least one primary transport system to move the component Leaving the feeder, the primary delivery system includes a motor driven conveyor belt and at least one proximity sensor; (d) at least one roller separator unit to separate the elements according to their respective dimensions, the roller separator unit comprising at least a roll separator and at least one funnel; (e) at least one magnetic sorter adjacent to the roll separator unit to separate the magnetic element; and (f) at least one size separating unit receiving the non-magnetic element from the magnetic sorter; g) at least one auxiliary conveying system adjacent to the size separating unit for moving the component away from the size separating unit, the auxiliary conveying system comprising a motor driven conveyor belt having both ends; (h) an imaging module in which the auxiliary At least one of the two ends of the delivery system is configured to capture the non-magnetic element An image to detect its shape, size, and color; (i) a configuration of a plurality of proximity sensors at at least one end of the auxiliary delivery system to sense the load on the auxiliary delivery system and determine between the components And (j) a plurality of gas nozzles disposed on the auxiliary conveyor system, each of which is provided with at least one funnel to collect the separated components; wherein, once the conveyor belt receives the components from the feeder, the distance The conveyor system is triggered to transfer the components toward the roller separator unit; the roller separator unit is disposed at an adjustable height above the conveyor belt such that the conveyor belt is directly below the roller separator unit Moving; the imaging module and the proximity sensors are located at a suitable location to capture images and sense the presence of components on the auxiliary delivery system; the plurality of air nozzles are attached to the auxiliary delivery system Positioned in position, the nozzles are activated to receive the response from the imaging module and the sensors in accordance with the size, shape, and color of the components The color and distance separate it; and the components are collected in their respective funnels; and the automatic component separator is controlled by a programmable logic controller. An automatic component separator for separating an electronic waste component according to claim 8 wherein the primary delivery system further comprises an imaging module to detect the presence of components on the conveyor belt. An automatic component separator for separating an electronic waste component according to claim 8 wherein the separated non-magnetic component comprises a microchip, a processor, an integrated circuit chip, and an electronic chip of a microprocessor.