JP5591970B2 - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

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Publication number
JP5591970B2
JP5591970B2 JP2013065746A JP2013065746A JP5591970B2 JP 5591970 B2 JP5591970 B2 JP 5591970B2 JP 2013065746 A JP2013065746 A JP 2013065746A JP 2013065746 A JP2013065746 A JP 2013065746A JP 5591970 B2 JP5591970 B2 JP 5591970B2
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circuit board
flexible circuit
conductive holes
substrate
holes
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JP2013214741A (en
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振森 李
敬立 夏
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Description

本発明は、回路基板に関するものであり、特に位置決め孔及び貫通孔を備えたフレキシブル回路基板（ＰＣＢ）に関するものである。   The present invention relates to a circuit board, and more particularly to a flexible circuit board (PCB) having positioning holes and through holes.

図１を参照すると、従来の実施形態において、フレキシブル回路基板１００ａは、基板１０ａを備え、基板１０ａには、少なくとも１つの位置決め孔１１ａが設けられている。位置決め孔１１ａの周囲には、シール１２ａが装着され、また、シール１２ａ及び基板１０ａを貫通した８個の導電孔１３ａが、この位置決め孔１１ａの周囲を等間隔に取り囲むように設けられている。８個の導電孔１３ａは、２個を一対としてシール１２ａの４つの直径Ａ１、Ｂ１、Ｃ１、Ｄ１上に形成される。このように、シール１２ａ及び基板１０ａ上には、複数の導電孔１３ａが設けられているため、基板１０ａ及びシール１２ａの強度は弱く、シール１２ａ及び基板１０ａは外力を受けると、直径Ａ１、Ｂ１、Ｃ１、Ｄ１に沿う方向で断裂し易い。   Referring to FIG. 1, in a conventional embodiment, a flexible circuit board 100a includes a board 10a, and the board 10a is provided with at least one positioning hole 11a. A seal 12a is mounted around the positioning hole 11a, and eight conductive holes 13a penetrating the seal 12a and the substrate 10a are provided so as to surround the positioning hole 11a at equal intervals. The eight conductive holes 13a are formed on the four diameters A1, B1, C1, and D1 of the seal 12a as a pair. Thus, since the plurality of conductive holes 13a are provided on the seal 12a and the substrate 10a, the strength of the substrate 10a and the seal 12a is weak, and when the seal 12a and the substrate 10a are subjected to external force, the diameters A1 and B1 , Easy to tear in the direction along C1, D1.

従来の技術の他の実施形態において、フレキシブル回路基板には、複数の位置決め孔及び導電孔が設けられており、これらが同じ直線上に沿って設けられた場合、フレキシブル回路基板の全体の強度を弱める。例えば、図２を参照すると、フレキシブル回路基板１００ｂは、基板１０ｂを備え、基板１０ｂには、複数の位置決め孔１１ｂが設けられている。各位置決め孔１１ｂの周囲には、シール１２ｂが装着され、また、シール１２ｂ及び基板１０ｂを貫く８個の導電孔１３ｂが、この位置決め孔１１ａの周囲を等間隔に取り囲むように設けられている。フレキシブル回路基板１００ｂは、４つの直線Ｅ１、Ｆ１、Ｇ１、Ｈ１上に、２つの位置決め孔１１ｂ及び４つの導電孔１３ｂがそれぞれ設けられているため、間断部分が多く、強度も弱い。従って、フレキシブル回路基板１００ｂは、外力を受けると、基板１０ｂ及びシール１２ｂが、直径Ｅ１、Ｆ１、Ｇ１、Ｈ１に沿う方向で断裂し易い。   In another embodiment of the prior art, the flexible circuit board is provided with a plurality of positioning holes and conductive holes, and when these are provided along the same straight line, the overall strength of the flexible circuit board is reduced. Weaken. For example, referring to FIG. 2, the flexible circuit board 100b includes a substrate 10b, and the substrate 10b is provided with a plurality of positioning holes 11b. A seal 12b is mounted around each positioning hole 11b, and eight conductive holes 13b penetrating the seal 12b and the substrate 10b are provided so as to surround the positioning hole 11a at equal intervals. The flexible circuit board 100b is provided with two positioning holes 11b and four conductive holes 13b on the four straight lines E1, F1, G1, and H1, respectively. Therefore, when the flexible circuit board 100b receives an external force, the board 10b and the seal 12b are likely to tear in a direction along the diameters E1, F1, G1, and H1.

本発明の目的は、前記課題を解決し、高い強度及び優れた耐衝撃性を有するフレキシブル回路基板を提供することである。   An object of the present invention is to solve the above-mentioned problems and provide a flexible circuit board having high strength and excellent impact resistance.

本発明に係るフレキシブル回路基板は、基板及び硬質部材を備える。前記フレキシブル回路基板と他の部品とを固定するための少なくとも１つの円形の位置決め孔が設けられ、前記硬質部材は、前記基板に前記位置決め孔を囲むように設置され、前記硬質部材及び前記基板を貫いて前記フレキシブル回路基板の内部を電気的に接続させる導電孔が設けられ、前記硬質部材の２つの前記導電孔の中心を結び前記位置決め孔の中心を通過する直線の総数は２つ以下であるように前記導電孔が配置され、前記導電孔が不等間隔に配置される。 The flexible circuit board according to the present invention includes a substrate and a hard member . At least one circular positioning hole for fixing the flexible circuit board and other components is provided, and the hard member is installed in the substrate so as to surround the positioning hole, and the hard member and the substrate are attached to the hard circuit board. Conductive holes are provided to electrically connect the inside of the flexible circuit board, and the total number of straight lines connecting the centers of the two conductive holes of the rigid member and passing through the centers of the positioning holes is two or less. Thus, the conductive holes are arranged, and the conductive holes are arranged at unequal intervals .

従来の技術に比べて、本発明のフレキシブル回路基板は、導電孔の位置を改良した配置方式を採用するため、高い強度及び優れた耐衝撃性を有する。   Compared with the prior art, the flexible circuit board of the present invention employs an arrangement method in which the positions of the conductive holes are improved, and thus has high strength and excellent impact resistance.

従来のフレキシブル回路基板を示す図である。It is a figure which shows the conventional flexible circuit board. 他の従来のフレキシブル回路基板を示す図である。It is a figure which shows another conventional flexible circuit board. 本発明の第一実施形態に係るフレキシブル回路基板を示す図である。It is a figure which shows the flexible circuit board which concerns on 1st embodiment of this invention. 本発明の第二実施形態に係るフレキシブル回路基板を示す図である。It is a figure which shows the flexible circuit board which concerns on 2nd embodiment of this invention. 本発明の第三実施形態に係るフレキシブル回路基板を示す図である。It is a figure which shows the flexible circuit board which concerns on 3rd embodiment of this invention.

以下、図面を参照して、本発明の実施形態について説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図３を参照すると、本発明の第一実施形態に係るフレキシブル回路基板１００は、基板１０を備える。基板１０には、フレキシブル回路基板１００と他の部品とを固定するための少なくとも１つの位置決め孔１１が設けられている。フレキシブル回路基板１００は、位置決め孔１１の大きさ及び形状に対応するシール１２を備える。シール１２は、硬質材料からなり、基板１０上において位置決め孔１１を囲むように設置されている。また、シール１２及び基板１０には、４つの貫通孔（図示せず）が設けられており、金属等の導電材料をこの貫通孔に塗布して、フレキシブル回路基板内部の各層の間を電気的に接続する導電孔１３を形成する。   Referring to FIG. 3, the flexible circuit board 100 according to the first embodiment of the present invention includes a substrate 10. The substrate 10 is provided with at least one positioning hole 11 for fixing the flexible circuit board 100 and other components. The flexible circuit board 100 includes a seal 12 corresponding to the size and shape of the positioning hole 11. The seal 12 is made of a hard material and is installed on the substrate 10 so as to surround the positioning hole 11. The seal 12 and the substrate 10 are provided with four through holes (not shown), and a conductive material such as metal is applied to the through holes to electrically connect the layers inside the flexible circuit board. Conductive holes 13 are formed to be connected to.

フレキシブル回路基板１００において、４つの導電孔１３は等間隔に配置されず、２つが一対として、シール１２の２つの互いに直交しない直径Ａ、Ｂ上にそれぞれ配置される。従来の技術に比べて、フレキシブル回路基板１００の位置決め孔１１を囲むように配置された導電孔１３の数は少ない。また、シール１２の２つの導電孔１３を配置した直径は、２つのみである。これにより、断裂し易い部分が少なくなるため、シール１２及び基板１０の全体の強度を向上させることができる。また、２対の導電孔１３は、シール１２の２つの互いに直交しない直径Ａ、Ｂ上にそれぞれ配置されるため、シール１２には、導電孔１３が配置されていない比較的長い距離の連続部分が形成されている。連続部分に孔は設けられていないため、この部分の強度は、シール１２の他の部分より強い。実際に使用する過程において、この連続部分は、衝撃を受け易い位置に装着され、シール１２の導電孔１３を設けた部分は、比較的衝撃を受けにくい位置に装着される。これにより、フレキシブル回路基板１００は衝撃に強い。   In the flexible circuit board 100, the four conductive holes 13 are not arranged at equal intervals, but two are arranged as a pair on the two non-orthogonal diameters A and B of the seal 12, respectively. Compared to the prior art, the number of conductive holes 13 arranged so as to surround the positioning holes 11 of the flexible circuit board 100 is small. Moreover, the diameter which arrange | positioned the two conductive holes 13 of the seal | sticker 12 is only two. Thereby, since the part which is easy to tear decreases, the intensity | strength of the whole of the seal | sticker 12 and the board | substrate 10 can be improved. Further, since the two pairs of conductive holes 13 are respectively disposed on the two non-orthogonal diameters A and B of the seal 12, the seal 12 has a relatively long continuous portion where the conductive holes 13 are not disposed. Is formed. Since there are no holes in the continuous portion, the strength of this portion is stronger than the other portions of the seal 12. In the process of actual use, the continuous portion is mounted at a position where the impact is easily received, and the portion provided with the conductive hole 13 of the seal 12 is mounted at a position where the impact is relatively difficult. Thereby, the flexible circuit board 100 is resistant to impact.

図４に示したように、本発明の第二実施形態に係るフレキシブル回路基板２００が第一実施形態のフレキシブル回路基板１００と異なる部分は、少なくとも５つの導電孔１３を備え、且つ２つ以下の導電孔１３が、シール１２の直径Ｃ上に配置されることである。直径Ｃ上に配置された２つの導電孔１３のいずれか１つ及び直径Ｃ上に配置されていない導電孔１３のいずれか１つは、シール１２の如何なる１つの直径上にも同時に配置されない。また、直径Ｃ上に配置されない導電孔１３のいずれか２つは、シール１２の如何なる１つの直径上にも同時に配置されない。第一実施形態のフレキシブル回路基板１００に比べて、フレキシブル回路基板２００の導電孔１３の数は多いため、電気的接続性能が向上されるとともに、シール１２の２つの導電孔１３が配置された直径は１つだけであるため、フレキシブル回路基板２００の断裂し易い部分は、フレキシブル回路基板１００より少なく、優れた耐衝撃性を備える。実際に、衝撃試験によって証明され、フレキシブル回路基板１００及びフレキシブル回路基板２００において、シール１２の２つ以上の導電孔１３を配置した直径の総数が２つ以下である場合、フレキシブル回路基板１００及びフレキシブル回路基板２００の耐衝撃性は、従来の技術のフレキシブル回路基板１００ａ、１００ｂより優れる。   As shown in FIG. 4, the portion of the flexible circuit board 200 according to the second embodiment of the present invention that is different from the flexible circuit board 100 of the first embodiment includes at least five conductive holes 13 and two or less. The conductive hole 13 is arranged on the diameter C of the seal 12. Any one of the two conductive holes 13 disposed on the diameter C and any one of the conductive holes 13 not disposed on the diameter C are not simultaneously disposed on any one diameter of the seal 12. Also, any two of the conductive holes 13 that are not disposed on the diameter C are not simultaneously disposed on any one diameter of the seal 12. Compared with the flexible circuit board 100 of the first embodiment, the number of the conductive holes 13 in the flexible circuit board 200 is large, so that the electrical connection performance is improved and the diameter at which the two conductive holes 13 of the seal 12 are arranged. Since the number of the flexible circuit board 200 is less than that of the flexible circuit board 100, the flexible circuit board 200 has excellent impact resistance. Actually, when it is proved by an impact test and the total number of the diameters in which the two or more conductive holes 13 of the seal 12 are arranged in the flexible circuit board 100 and the flexible circuit board 200 is two or less, the flexible circuit board 100 and the flexible circuit board 100 The impact resistance of the circuit board 200 is superior to the conventional flexible circuit boards 100a and 100b.

図５を参照すると、本発明の第三実施形態に係るフレキシブル回路基板３００は、フレキシブル回路基板１００及びフレキシブル回路基板２００と相似する基板１０及びシール１２を備え、且つ、フレキシブル回路基板１００及びフレキシブル回路基板２００と相似する位置決め孔１１及び導電孔１３が設けられている。しかし、フレキシブル回路基板３００の基板１０に設けられた位置決め孔１１の数は複数であり、フレキシブル回路基板３００のシール１２の数も複数である。各シール１２は、対応する位置決め孔１１を囲んで装着される。また、各シール１２及び基板１０のシール１２に対応する部分は、第一実施形態で示した方法に従って複数の導電孔１３を設ける。   Referring to FIG. 5, the flexible circuit board 300 according to the third embodiment of the present invention includes the flexible circuit board 100 and the board 10 similar to the flexible circuit board 200 and the seal 12, and the flexible circuit board 100 and the flexible circuit. A positioning hole 11 and a conductive hole 13 similar to the substrate 200 are provided. However, the number of the positioning holes 11 provided in the substrate 10 of the flexible circuit board 300 is plural, and the number of the seals 12 of the flexible circuit board 300 is plural. Each seal 12 is mounted so as to surround the corresponding positioning hole 11. Moreover, the part corresponding to each seal | sticker 12 and the seal | sticker 12 of the board | substrate 10 provides the some conductive hole 13 according to the method shown in 1st embodiment.

フレキシブル回路基板３００において、各シール１２上に設けられた導電孔１３の配置方式は、フレキシブル回路基板１００又はフレキシブル回路基板２００の導電孔１３と同じであることができる。しかし、フレキシブル回路基板３００において、いずれか１つの直線上に配置された導電孔１３の数は２つ以下である。即ち、フレキシブル回路基板３００のいずれか３つの導電孔１３は、同じ直線上に配置されない。これにより、フレキシブル回路基板３００の複数の間断部分が同じ直線上に配置されることによる断裂し易い問題を回避して、フレキシブル回路基板３００の全体の強度を向上させることができる。   In the flexible circuit board 300, the arrangement method of the conductive holes 13 provided on each seal 12 may be the same as that of the conductive holes 13 of the flexible circuit board 100 or the flexible circuit board 200. However, in the flexible circuit board 300, the number of the conductive holes 13 arranged on any one straight line is two or less. That is, any three conductive holes 13 of the flexible circuit board 300 are not arranged on the same straight line. Thereby, the problem that it is easy to tear due to a plurality of intermittent portions of the flexible circuit board 300 being arranged on the same straight line can be avoided, and the overall strength of the flexible circuit board 300 can be improved.

従来の技術に比べて、本発明のフレキシブル回路基板１００、２００、３００は、導電孔１３の位置を改良した配置方式を採用するため、高い強度及び優れた耐衝撃性を有する。   Compared with the prior art, the flexible circuit boards 100, 200, and 300 of the present invention employ an arrangement method in which the positions of the conductive holes 13 are improved, and thus have high strength and excellent impact resistance.

以上、本発明を実施例に基づいて具体的に説明したが、本発明は、上述の実施例に限定されるものではなく、その要旨を逸脱しない範囲において、種々の変更が可能であることは勿論であって、本発明の技術的範囲は、以下の特許請求の範囲から決まる。   Although the present invention has been specifically described above based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. Of course, the technical scope of the present invention is determined by the following claims.

１０、１０ａ、１０ｂ 基板
１１、１１ａ、１１ｂ 位置決め孔
１２、１２ａ、１２ｂ シール
１３、１３ａ、１３ｂ 導電孔
１００、１００ａ、１００ｂ、２００、３００ フレキシブル回路基板 10, 10a, 10b Substrate 11, 11a, 11b Positioning hole 12, 12a, 12b Seal 13, 13a, 13b Conductive hole 100, 100a, 100b, 200, 300 Flexible circuit board

Claims (7)

基板及び硬質部材を備えるフレキシブル回路基板であって、
前記フレキシブル回路基板と他の部品とを固定するための少なくとも１つの円形の位置決め孔が設けられ、前記硬質部材が、前記基板に前記位置決め孔を囲むように設置され、前記硬質部材及び前記基板を貫いて前記フレキシブル回路基板の内部を電気的に接続させる導電孔が設けられ、前記硬質部材の２つの前記導電孔の中心を結び前記位置決め孔の中心を通過する直線の総数が２つ以下であるように前記導電孔が配置され、
前記導電孔が不等間隔に配置されることを特徴とする、フレキシブル回路基板。 A flexible circuit board comprising a substrate and a rigid member ,
At least one circular positioning hole for fixing the flexible circuit board and other components is provided, and the hard member is installed in the substrate so as to surround the positioning hole, and the hard member and the substrate are mounted. Conductive holes are provided to electrically connect the interior of the flexible circuit board, and the total number of straight lines connecting the centers of the two conductive holes of the rigid member and passing through the centers of the positioning holes is two or less. The conductive holes are arranged so that
A flexible circuit board, wherein the conductive holes are arranged at unequal intervals . 前記フレキシブル回路基板に前記硬質部材及び前記基板を貫いて少なくとも４つの前記導電孔が設けられ、４つの前記導電孔のうち２つの導電孔の中心を結ぶ直線及び４つの前記導電孔のうち他の２つの導電孔の中心を結ぶ直線が前記位置決め孔の中心を通過するように４つの前記導電孔が配置されていることを特徴とする、請求項１に記載のフレキシブル回路基板。 At least four of the conductive holes are provided in the flexible circuit board through the hard member and the substrate, a straight line connecting the centers of two conductive holes of the four conductive holes, and another of the four conductive holes. The flexible circuit board according to claim 1, wherein the four conductive holes are arranged so that a straight line connecting the centers of the two conductive holes passes through the center of the positioning hole . 前記２つの導電孔の中心を結ぶ直線及び前記他の２つの導電孔の中心を結ぶ直線が互いに直交しないように４つの前記導電孔が配置されることを特徴とする、請求項２に記載のフレキシブル回路基板。 The four conductive holes are arranged so that a straight line connecting the centers of the two conductive holes and a straight line connecting the centers of the other two conductive holes are not orthogonal to each other. Flexible circuit board. 前記フレキシブル回路基板に前記硬質部材及び前記基板を貫いて少なくとも５つの前記導電孔が設けられ、且つ２つの前記導電孔の中心を結ぶ直線が前記位置決め孔の中心を通過するように前記導電孔が配置されることを特徴とする、請求項１に記載のフレキシブル回路基板。 The flexible circuit board is provided with at least five conductive holes penetrating the rigid member and the substrate, and the straight line connecting the centers of the two conductive holes passes through the center of the positioning hole. The flexible circuit board according to claim 1, wherein the flexible circuit board is disposed . ２つの前記導電孔の中心を結ぶ直線が前記位置決め孔の中心を通過するように配置された前記導電孔のいずれか１つの中心と残りの前記導電孔のいずれか１つの中心とを結ぶ直線とが、前記位置決め孔の中心を通過しないように前記導電孔が配置され、残りの前記導電孔のいずれか２つを結ぶ直線が前記位置決め孔の中心を通過しないように前記導電孔が配置されることを特徴とする、請求項４に記載のフレキシブル回路基板。 Straight line connecting the centers of two of the electrically Den'ana is connecting the one of the center of one of the center and the rest of the electrically Den'ana of the electrically Den'ana arranged to pass through the center of the positioning hole DOO is, the said conductive holes so as not to pass through the center of the positioning hole is disposed, the remaining of the electrically any two connecting straight lines the positioning hole the conductive hole so as not to pass through the center of the Den'ana disposed characterized in that that the flexible circuit board according to claim 4. 前記フレキシブル回路基板が、複数の前記硬質部材を備え、前記基板に複数の前記位置決め孔が設けられ、各前記硬質部材が、対応する前記位置決め孔を囲んで装着され、各前記硬質部材及び前記基板を貫いて複数の導電孔が設けられていることを特徴とする、請求項１に記載のフレキシブル回路基板。 The flexible circuit board includes a plurality of the hard members , the substrate is provided with a plurality of the positioning holes, and each of the hard members is mounted so as to surround the corresponding positioning hole, and each of the hard members and the substrate The flexible circuit board according to claim 1, wherein a plurality of conductive holes are provided through the substrate. 前記フレキシブル回路基板におけるいずれかの１つの直線上に配置された前記導電孔の数が、２つ以下であることを特徴とする、請求項６に記載のフレキシブル回路基板。   The number of the said conductive holes arrange | positioned on any one straight line in the said flexible circuit board is two or less, The flexible circuit board of Claim 6 characterized by the above-mentioned.
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