JP5572936B2 - 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 - Google Patents

熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 Download PDF

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Publication number
JP5572936B2
JP5572936B2 JP2008246255A JP2008246255A JP5572936B2 JP 5572936 B2 JP5572936 B2 JP 5572936B2 JP 2008246255 A JP2008246255 A JP 2008246255A JP 2008246255 A JP2008246255 A JP 2008246255A JP 5572936 B2 JP5572936 B2 JP 5572936B2
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Japan
Prior art keywords
optical semiconductor
resin composition
group
semiconductor element
molding
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JP2008246255A
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Japanese (ja)
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JP2009149845A (ja
JP2009149845A5 (https=
Inventor
勇人 小谷
直之 浦崎
真人 水谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008246255A priority Critical patent/JP5572936B2/ja
Publication of JP2009149845A publication Critical patent/JP2009149845A/ja
Publication of JP2009149845A5 publication Critical patent/JP2009149845A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008246255A 2007-11-26 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 Active JP5572936B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008246255A JP5572936B2 (ja) 2007-11-26 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007304255 2007-11-26
JP2007304255 2007-11-26
JP2008246255A JP5572936B2 (ja) 2007-11-26 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Publications (3)

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JP2009149845A JP2009149845A (ja) 2009-07-09
JP2009149845A5 JP2009149845A5 (https=) 2011-12-08
JP5572936B2 true JP5572936B2 (ja) 2014-08-20

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JP2008246255A Active JP5572936B2 (ja) 2007-11-26 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2540776B1 (en) 2007-09-25 2017-08-09 Hitachi Chemical Co., Ltd. Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
JP5262644B2 (ja) * 2007-12-04 2013-08-14 日立化成株式会社 成型体の離型性評価方法及び成型体の製造方法
JP5401905B2 (ja) * 2008-04-25 2014-01-29 日立化成株式会社 熱硬化性樹脂組成物
JP5325560B2 (ja) * 2008-12-18 2013-10-23 スタンレー電気株式会社 発光装置、および、発光装置の製造方法
JP5751260B2 (ja) 2012-01-17 2015-07-22 大日本印刷株式会社 電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法
JP2012162729A (ja) * 2012-04-11 2012-08-30 Hitachi Chemical Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP6149457B2 (ja) * 2013-03-28 2017-06-21 大日本印刷株式会社 光半導体実装用基板、半導体発光装置、及び光半導体実装用基板の製造方法
JP7274245B1 (ja) * 2023-01-31 2023-05-16 国立大学法人 名古屋工業大学 離型条件評価方法、離型条件評価システムおよびプログラム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP3334998B2 (ja) * 1994-03-30 2002-10-15 住友ベークライト株式会社 エポキシ樹脂組成物
JP2000281750A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3870825B2 (ja) * 2002-02-27 2007-01-24 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP5060707B2 (ja) * 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
CN101268559B (zh) * 2005-08-04 2010-11-17 日亚化学工业株式会社 发光装置及其制造方法以及成形体及密封构件
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
KR20090013230A (ko) * 2006-06-02 2009-02-04 히다치 가세고교 가부시끼가이샤 광반도체소자 탑재용 패키지 및 이것을 이용한 광반도체장치
JP5540487B2 (ja) * 2007-09-25 2014-07-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP5239688B2 (ja) * 2007-11-13 2013-07-17 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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