JP5567865B2 - Addition-curing silicone resin composition for light-emitting diode and light-emitting diode - Google Patents

Description

  The present invention relates to an addition-curable silicone resin composition for light-emitting diodes (LEDs), and in particular, the cured product is transparent, suitable for protecting light-emitting diode elements, changing / adjusting wavelengths, or constituting materials for lenses, and for high / low temperature cycles. The present invention relates to an addition-curable silicone resin material that can provide a cured product having good crack resistance even under conditions.

  It is known that when an LED is energized / lighted, a rapid temperature rise occurs and the LED element receives a thermal shock. Therefore, the LED element is subjected to a severe temperature cycle by repeatedly turning on and off the LED element.

Epoxy resin is generally used as a sealing material for LED elements. Since the elastic modulus of the epoxy resin is high, the bonding wire may be broken due to stress due to the temperature cycle, or the epoxy resin may be cracked. Moreover, due to the stress that the epoxy resin gives to the LED chip, there is a concern that the light emission efficiency is lowered due to the collapse of the crystal structure of the semiconductor material.
As a countermeasure, a method of using room temperature curable silicone rubber as a buffer material and sealing the outside with an epoxy resin has been established as a standard method. However, in this method, since the epoxy resin does not adhere to the silicone resin, it is known that peeling occurs at the interface between the epoxy resin and the silicone rubber due to the temperature cycle, and the light extraction efficiency is extremely lowered with time. Yes.

It has been proposed to use a silicone resin as a material to replace the epoxy resin (see, for example, Patent Documents 1, 2, and 3). Silicone resins are superior in heat resistance, weather resistance, and discoloration resistance compared to epoxy resins, and in recent years, examples of being used mainly for blue LEDs and white LEDs are increasing.
However, although these silicone resins have a lower elastic modulus than epoxy resins, their mechanical properties such as bending strength are also low, so the problem is that cracks are likely to occur due to the thermal shock that occurs when the LED is energized and lit. Have.

  Patent Document 4 proposes a photoelectric conversion device sealed with a liquid silicone resin comprising an organopolysiloxane containing a vinyl group and hydrogen, an organopolysiloxane containing a vinyl group, and a platinum catalyst. This is because the organopolysiloxane containing a vinyl group and hydrogen has a branched structure and is used in a large amount, so that it becomes brittle and inferior in crack resistance, and inferior in durable weather resistance and discoloration resistance. It was.

Japanese Patent Laid-Open No. 11-1619 JP 2002-265787 A JP 2004-186168 A JP 2004-140220 A

  The present invention has been made in view of the above circumstances, and is an addition-curable silicone for LED that has high transparency, has high resistance to thermal shock, hardly cracks even under severe temperature cycles, and does not cause peeling. It aims at providing a resin composition.

In order to solve the above problems, the present invention provides at least
(A) 100 parts by mass of an organopolysiloxane represented by the following average composition formula (1) having no hydrogen atom bonded to a silicon atom in one molecule and having at least two alkenyl groups in one molecule;
R _a SiO _{(4-a) / 2} (1)
(In the formula, R represents a monovalent organic group, at least 5 mol% of which is a phenyl group. A is a number of 1.5 to 3.0.)
(B) an organohydrogenpolysiloxane represented by the following average composition formula (2) having at least two hydrogen atoms bonded to silicon atoms and at least one alkenyl group bonded to silicon atoms in one molecule;
R ¹ _b H _c SiO _{(4-b-c) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group, and b and c are numbers satisfying 0 <b <3, 0 <c ≦ 2, and 0 <b + c <4)
(C) addition reaction catalyst catalyst amount,
An organopolysiloxane composition comprising:
In the organohydrogenpolysiloxane (B), the number of hydrogen atoms bonded to silicon atoms is 0.4 to 10 per total number of alkenyl groups bonded to silicon atoms in the components (A) and (B). Provided is an addition-curable silicone resin composition for light-emitting diodes, characterized in that it is blended at a ratio of individual.

  Such an addition-curable silicone resin composition of the present invention has high transparency because of its excellent resistance to discoloration, and has high resistance to thermal shock. However, cracks and peeling are unlikely to occur.

In this case, it is preferable that the organohydrogenpolysiloxane of the component (B) is a straight chain having no branched structure.
Thus, if the said (B) component is linear form which does not have a branched structure, the said composition will become the thing excellent in crack resistance.

The present invention also provides a light emitting diode sealed with a cured product of the composition.
The addition-curable silicone resin composition of the present invention is excellent in high transparency and has high resistance to thermal shock, so that it does not easily crack or peel even when subjected to severe temperature cycles. As a result, the light emitting diode sealed with the cured product of the present invention is also useful.

  As described above, the addition-curable silicone resin composition of the present invention has high thermal shock resistance of the cured product, so that it is difficult for cracks and peeling to occur and is excellent in high transparency. Therefore, it is useful as a material for a light emitting diode element.

It is sectional drawing which shows typically an example of the light-emitting semiconductor device with which the addition-curable silicone resin composition of this invention is used suitably.

Hereinafter, the present invention will be described in more detail.
As described above, the conventionally used sealing materials for LED elements have the problem that cracks are likely to occur due to thermal shocks that occur particularly during energization / lighting of the LED, and severe temperature cycling is required. There has been a demand for a sealing material that does not easily crack or peel off.

  Therefore, as a result of intensive studies to solve the above problems, the present inventor has found that the above problems can be achieved by introducing at least one alkenyl group into the crosslinking agent. A suitable addition-curable silicone resin composition has been completed.

That is, the addition-curable silicone resin composition for light-emitting diodes of the present invention is at least
(A) 100 parts by mass of an organopolysiloxane represented by the following average composition formula (1) having no hydrogen atom bonded to a silicon atom in one molecule and having at least two alkenyl groups in one molecule;
R _a SiO _{(4-a) / 2} (1)
(In the formula, R represents a monovalent organic group, at least 5 mol% of which is a phenyl group. A is a number of 1.5 to 3.0.)
(B) an organohydrogenpolysiloxane represented by the following average composition formula (2) having at least two hydrogen atoms bonded to silicon atoms and at least one alkenyl group bonded to silicon atoms in one molecule;
R ¹ _b H _c SiO _{(4-b-c) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group, and b and c are numbers satisfying 0 <b <3, 0 <c ≦ 2, and 0 <b + c <4)
(C) addition reaction catalyst catalyst amount,
An organopolysiloxane composition comprising:
In the organohydrogenpolysiloxane (B), the number of hydrogen atoms bonded to silicon atoms is 0.4 to 10 per total number of alkenyl groups bonded to silicon atoms in the components (A) and (B). It is characterized by being blended at a ratio of individual.

Hereinafter, each component of the present invention will be described in detail.
<(A) component>
The component (A) is an organopolysiloxane represented by the following average composition formula (1) having no hydrogen atom bonded to a silicon atom in one molecule and having at least two alkenyl groups in one molecule.
R _a SiO _{(4-a) / 2} (1)
(In the formula, R represents a monovalent organic group, at least 5 mol% of which is a phenyl group. A is a number of 1.5 to 3.0.)

  As the alkenyl group bonded to the silicon atom in the component (A), for example, a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group or the like, usually 2 to 8 carbon atoms, preferably 2 to 2 carbon atoms. Examples thereof include about 4, and a vinyl group is particularly preferable.

  Examples of the position of the silicon atom to which the alkenyl group in the polysiloxane skeleton of the component (A) is bonded include the molecular chain terminal and / or the molecular chain halfway (non-terminal molecular chain). As the component (A), The organopolysiloxane preferably contains an alkenyl group bonded to silicon atoms at both ends of the molecular chain.

  In addition, the content of the alkenyl group in the component (A) is a monovalent organic group bonded to a silicon atom (that is, an unsubstituted or substituted monovalent hydrocarbon represented by R in the average composition formula (1)). Group) is preferably from 0.01 to 20 mol%, particularly from about 0.1 to 10 mol%, based on the whole.

  Examples of the monovalent organic group bonded to the silicon atom other than the alkenyl group of the component (A) include alkyl such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, cyclohexyl group, and heptyl group. Groups; aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group; aralkyl groups such as benzyl group and phenethyl group; chloromethyl group, 3-chloropropyl group, 3,3,3-trifluoropropyl group, etc. Examples thereof include an unsubstituted or halogen-substituted monovalent hydrocarbon group usually having 1 to 12 carbon atoms, preferably about 1 to 10 carbon atoms, such as a halogenated alkyl group.

  In addition, when the phenyl group is less than 5 mol% in all R, the heat resistance of the cured coating protective material is deteriorated or the low-temperature characteristics are deteriorated, and the reliability is lowered by the thermal shock test. It is necessary that the mol% is a phenyl group, preferably 10 mol% or more, particularly preferably 20 mol% or more. The upper limit is not particularly specified, but is preferably 80 mol% or less, particularly preferably 60 mol% or less, from the viewpoint of ease of synthesis.

  a is a positive number of 1.5 to 3.0, and the molecular structure of this component may be, for example, linear or branched, or a mixture thereof.

  The viscosity when the organopolysiloxane as the component (A) is linear is preferably in the range of about 0.1 to 20 Pas, particularly about 0.5 to 10 Pas at 23 ° C. from the viewpoint of workability. If it is 0.1 Pas or more, the fluidity is moderate, so that molding burrs and the like can be greatly reduced, and if it is 20 Pas or less, air bubbles mixed during mixing of necessary components can be easily removed. In the case of a branched chain, it may become a solid depending on the degree of branching or molecular weight, but in that case, it may be used by dissolving it in a meltable solvent.

<(B) component>
The organohydrogenpolysiloxane of component (B) is represented by the following average composition formula (2).
R ¹ _b H _c SiO _{(4-b-c) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group, and b and c are numbers satisfying 0 <b <3, 0 <c ≦ 2, and 0 <b + c <4)

  The organohydrogenpolysiloxane of component (B) used in the present invention acts as a crosslinking agent, and forms a cured product by addition reaction with the alkenyl group in component (A). Therefore, in this organohydrogenpolysiloxane, at least two hydrogen atoms bonded to a silicon atom are required in one molecule, and such a hydrogen atom may be any silicon atom at the molecular end or in the middle of the molecule. It can be combined with

Further, the organohydrogenpolysiloxane of component (B) needs to have at least one alkenyl group in the molecule as a substituted or unsubstituted monovalent hydrocarbon group for R ¹ . By having such an alkenyl group in the molecule, such an organohydrogenpolysiloxane can itself form a partially crosslinked structure, and as a result, formed from the composition of the present invention. By localizing the crosslink density in the cured product, crack growth is avoided even under severe temperature cycles with high resistance to thermal shock.

  Examples of the alkenyl group include the same vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, styryl group and the like as R in the component (A), usually 2 to 8 carbon atoms, preferably 2 to 2 carbon atoms. Examples thereof include about 4, and a vinyl group is particularly preferable. These alkenyl groups may exist at the terminal of the molecular chain or may exist in the middle thereof. In order to prevent the cured product obtained by the presence of a large number of such alkenyl groups in the molecule from becoming brittle, it is preferably 10 or less, more preferably 3 or less, and in particular, One is preferably present in one molecule of the organohydrogenpolysiloxane.

In addition, as R ¹ , the group other than the alkenyl group is the same as R in the component (A), for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group, etc. Alkyl groups; phenyl groups, tolyl groups, xylyl groups, naphthyl groups and other aryl groups; benzyl groups, phenethyl groups and other aralkyl groups; chloromethyl groups, 3-chloropropyl groups, 3,3,3-trifluoropropyl groups In general, an unsubstituted or halogen-substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably about 1 to 10 carbon atoms, such as a halogenated alkyl group such as From the viewpoint of compatibility with the component (A), the group other than the alkenyl group is preferably a methyl group or a phenyl group. With such a (B) R ¹ is a methyl group components, cured product excellent a heat resistance can not be obtained, if high refractive index is required, use of the phenyl group are effective.
In order to obtain a transparent composition, it is preferable that the refractive indexes of the component (A) and the component (B) are made comparable.

  The above-mentioned organohydrogenpolysiloxane skeleton may be linear, cyclic, branched or highly branched resinous, but has no branched structure that makes the crack resistance better. It is preferable that The viscosity is not particularly limited, but is preferably 1000 mPas or less, more preferably 5 to 200 mPas.

  The compounding amount of the organohydrogenpolysiloxane (B) is such that the number of hydrogen atoms bonded to silicon atoms is 0.00 per total number of alkenyl groups bonded to silicon atoms in the components (A) and (B). It is blended at a rate of 4-10. If it is less than 0.4, the curing becomes sweet, and if it exceeds 10, the cured product becomes too brittle. Preferably it is 0.6-5 pieces.

<(C) component>
The addition reaction catalyst for component (C) is a catalyst for crosslinking by addition reaction between component (A) and component (B). Examples thereof include chloroplatinic acid, chloroplatinic acid and monohydric alcohol. Examples include reactants, olefin complexes of chloroplatinic acid, coordination compounds of chloroplatinic acid and vinylsiloxane, platinum-based catalysts such as platinum black, palladium-based catalysts, rhodium-based catalysts, etc. Usually a platinum catalyst is used. Particularly in this application, low chlorine catalysts that do not corrode metals are preferable because they are used for the production of sealed LEDs in the electronics field. Among them, divinyltetramethyldisiloxane and divinyldiphenyl that do not contain chlorine components are preferred. Those modified with dimethyldisiloxane or the like are preferable. These addition reaction catalysts may be used alone or in combination of two or more.

  The addition amount of the addition reaction catalyst is an effective amount (catalyst amount) that acts as a catalyst, and is preferably 1 to 1000 ppm with respect to the total amount of the components (A) and (B). If it is 1 ppm or more, curing proceeds at an appropriate speed, and if it is 1000 ppm or less, the workable time does not become too short, and the cured product is not easily yellowed, which is economical. Most preferably, it is 5-100 ppm.

<Optional component>
In the composition of the present invention, as the optional components other than the above components (A) to (C), for example, all conventionally known control agent compounds which are compounds having a curing inhibitory effect on the addition reaction catalyst are used. Can be used. Such compounds include phosphorus-containing compounds such as triphenylphosphine, nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole, sulfur-containing compounds, acetylenic compounds, compounds containing two or more alkenyl groups, hydroper Examples include oxy compounds and maleic acid derivatives. Since the degree of the curing delay effect by the control agent compound varies greatly depending on the chemical structure of the control agent compound, it is preferable to adjust the addition amount of the control agent compound to an optimum amount for each of the control agent compounds to be used. An amount in a range where long-term storage stability at room temperature is obtained and curing is not inhibited, usually 0.5 parts by mass or less, preferably 0.01 to 0.3 parts by mass with respect to 100 parts by mass of component (A). Used in part quantities.

  Moreover, you may contain the adhesion imparting agent for improving the adhesiveness in this composition. Examples of the adhesion-imparting agent include silane coupling agents and hydrolysis condensates thereof. As silane coupling agents, epoxy group-containing silane coupling agents, (meth) acrylic group-containing silane coupling agents, isocyanate group-containing silane coupling agents, isocyanurate group-containing silane coupling agents, amino group-containing silane coupling agents , And known ones such as a mercapto group-containing silane coupling agent are exemplified, and preferably 0.1 to 20 parts by mass, preferably 0.3 to 100 parts by mass with respect to the total of 100 parts by mass of component (A) and component (B). 10 parts by mass.

  Such a cured product of the composition of the present invention is excellent in high transparency and does not generate cracks or peeling even under severe temperature cycles, and is therefore useful as a sealing material for light-emitting diodes. Such a light emitting diode is useful in various fields such as a switching element, illumination, and backlight of a liquid crystal display.

EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example etc.
[Example 1]
Average unit formula: (PhSiO _3/2 ) _0.55 [(CH ₂ ═CH) MeSiO _2/2 ] _0.2 (Me ₂ SiO) _0.25 Branched organopolysiloxane [property = solid (25 ° C.), silicon atom-bonded vinyl group content in silicon atom-bonded all organic groups = 14 mol%, silicon atom-bonded phenyl group content in silicon atom-bonded all organic groups = 38 mol%, standard styrene conversion Weight average molecular weight = 3000] 90 parts by mass, 18 parts by mass of a vinyl group-containing organohydrogenpolysiloxane having a viscosity represented by the following formula (I) of 20 mPas, chloroplatinic acid / 1,3-divinyltetramethyldisiloxane 0.06 parts by mass of a toluene solution containing 1% by mass of platinum as a platinum atom content, 0.05 parts by mass of ethynylcyclohexanol, and γ-glycidoxyp Were uniformly mixed pills trimethoxysilane 3 parts by weight, the silicone composition (A) was prepared. When the silicone composition (A) was cured by heating at 150 ° C. for 4 hours, the hardness was 67 in Shore D.

HMe ₂ SiO (Me ₂ SiO) ₁ (HMeSiO) ₆ (Ph ₂ SiO) ₁ SiMe ₂ CH═CH ₂ (I)

[Example 2]
80 parts by mass of a methyl phenylvinylsiloxy group-blocked diphenylsiloxane copolymer having a main chain composed only of diphenylsiloxane units and a viscosity of 0.4 Pas, (PhSiO _3/2 ) _0.75 [(CH ₂ ═CH) Me ₂ SiO _1/2 ] Branched organopolysiloxane represented by _0.25 [Property = solid (25 ° C.), silicon atom-bonded vinyl group content = 20 mol%, silicon in silicon atom-bonded all organic groups Content ratio of atomic bond phenyl group = 50 mol%, weight average molecular weight in terms of standard styrene = 1600] 20 parts by mass, vinyl group-containing organohydrogenpolysiloxane having a viscosity represented by the following formula (II) of 20 mPas 32 parts by mass , Toru containing 1% by mass of chloroplatinic acid / 1,3-divinyltetramethyldisiloxane complex as platinum atom content Solution 0.5 parts by weight 0.05 part by weight of ethynyl cyclohexanol, and γ- glycidoxypropyltrimethoxysilane 3 parts by weight were uniformly mixed to prepare a silicone composition (B). When the silicone composition (B) was cured by heating at 150 ° C. for 4 hours, the hardness was 58 in Shore D.

HMe ₂ SiO (HMeSiO) ₃ (Ph ₂ SiO) ₂ SiMe ₂ CH═CH ₂ (II)

[Example 3]
Average unit formula: (PhSiO _3/2 ) _0.55 [(CH ₂ ═CH) MeSiO _2/2 ] _0.2 (Me ₂ SiO) _0.25 Branched organopolysiloxane [property = solid (25 ° C.), silicon atom-bonded vinyl group content in silicon atom-bonded all organic groups = 14 mol%, silicon atom-bonded phenyl group content in silicon atom-bonded all organic groups = 38 mol%, standard styrene conversion Weight average molecular weight = 3000] 90 parts by mass, 17 parts by mass of a vinyl group-containing organohydrogenpolysiloxane having a viscosity of 20 mPas represented by the following formula (III), chloroplatinic acid / 1,3-divinyltetramethyldisiloxane 0.06 parts by mass of a toluene solution containing 1% by mass of platinum as a platinum atom content, 0.05 parts by mass of ethynylcyclohexanol, and γ-glycidoxy Were uniformly mixed to 3 parts by weight of trimethoxysilane, silicone composition (C) was prepared. When the silicone composition (C) was cured by heating at 150 ° C. for 4 hours, the hardness was 65 in Shore D.

Me ₃ SiO (Me ₂ SiO) ₁ (HMeSiO) ₇ [Ph (CH ₂ ═CHC ₆ H ₄ ) SiO] ₁ SiMe ₃ (III)

[Comparative Example 1]
The composition according to Example 1 except that 18 parts by mass of HMe ₂ SiO (Me ₂ SiO) ₁ (HMeSiO) ₆ (Ph ₂ SiO) ₁ SiMe ₂ H having no alkenyl group is used instead of the above formula (I). A product (D) was prepared. When the silicone composition (D) was cured by heating at 150 ° C. for 4 hours, the hardness was 69 in Shore D.

[Comparative Example 2]
A composition (E) was prepared according to Example 2 except that 32 parts by mass of HMe ₂ SiO (HMeSiO) ₃ (Ph ₂ SiO) ₂ SiMe ₂ H having no alkenyl group was used instead of the above formula (II). did. When the silicone composition (E) was cured by heating at 150 ° C. for 4 hours, the hardness was 60 in Shore D.

[Comparative Example 3]
The composition according to Example 3, except that 17 parts by mass of Me ₃ SiO (Me ₂ SiO) ₁ (HMeSiO) ₇ (Ph ₂ SiO) ₁ SiMe ₃ having no alkenyl group was used instead of the above formula (III). (F) was prepared. When the silicone composition (F) was cured by heating at 150 ° C. for 4 hours, the hardness was 66 in Shore D.

The evaluation methods in the silicone compositions (A) to (F) prepared in the above examples and comparative examples were performed as follows.
[Evaluation method]
As the light emitting semiconductor package light emitting element, a light emitting semiconductor device as shown in FIG. 1 having a light emitting layer made of InGaN and mounting an LED chip having a main light emission peak of 470 nm was used. Here, 1 is a housing, 2 is a light emitting element, 3 and 4 are lead electrodes, 5 is a die bond material, 6 is a gold wire, and 7 is a sealing resin. The curing conditions for the sealing resin 7 are 150 ° C. and 4 hours.

Moisture resistance and infrared reflow test method 10 light-emitting semiconductor devices were placed in a constant temperature and humidity chamber at 85 ° C and 85% for 24 hours, and then passed through an infrared reflow device (260 ° C) three times to observe changes in appearance. did. The results are shown in Table 1. In addition, the thing by which the crack of resin and the peeling from an LED package were confirmed was counted as NG.

As shown in Table 1, in Examples 1 to 3, the NG number is 0, the crack resistance is good even under high temperature / low temperature cycle conditions, no peeling occurs, and the light extraction efficiency is high. I understand. Moreover, such a silicone resin was also excellent in high transparency.
On the other hand, in Comparative Examples 1 to 3, cracks of the resin and peeling from the LED package occurred in more than half. Thereby, when a conventional thing is used as a sealing material, it turns out that productivity of LED will worsen.

  From the above, since the addition-curable silicone resin composition of the present invention has high resistance to thermal shock, it is difficult to generate cracks and has high light extraction efficiency, and is subjected to severe temperature cycles. It proved to be useful for LEDs.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1 ... Housing | casing 2 ... Light emitting element 3, 4 ... Lead electrode 5 ... Die-bonding material,
6 ... gold wire, 7 ... sealing resin.

Claims (2)

at least,
(A) 100 parts by mass of an organopolysiloxane represented by the following average composition formula (1) having no hydrogen atom bonded to a silicon atom in one molecule and having at least two alkenyl groups in one molecule;
R _a SiO _{(4-a) / 2} (1)
(In the formula, R represents a monovalent organic group, at least 5 mol% of which is a phenyl group. A is a number of 1.5 to 3.0.)
(B) It is a straight chain having at least two hydrogen atoms bonded to silicon atoms and at least one alkenyl group bonded to silicon atoms in one molecule, having no branched structure, and having the following average composition formula ( 2) organohydrogenpolysiloxane represented by
R ¹ _b H _c SiO _{(4-b-c) / 2} (2)
( Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group, and b and c are numbers satisfying 0 <b <3, 0 <c ≦ 2, and 2 <b + c ≦ 3 )
(C) addition reaction catalyst catalyst amount,
An organopolysiloxane composition comprising:
In the organohydrogenpolysiloxane (B), the number of hydrogen atoms bonded to silicon atoms is 0.4 to 10 per total number of alkenyl groups bonded to silicon atoms in the components (A) and (B). An addition-curable silicone resin composition for light-emitting diodes, wherein the addition-curable silicone resin composition is blended in a ratio of individual.   A light emitting diode encapsulated with a cured product of the silicone resin composition according to claim 1.

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