JP5546528B2 - 半導体モジュールの絶縁欠陥検査装置および検査方法 - Google Patents

半導体モジュールの絶縁欠陥検査装置および検査方法 Download PDF

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JP5546528B2
JP5546528B2 JP2011284694A JP2011284694A JP5546528B2 JP 5546528 B2 JP5546528 B2 JP 5546528B2 JP 2011284694 A JP2011284694 A JP 2011284694A JP 2011284694 A JP2011284694 A JP 2011284694A JP 5546528 B2 JP5546528 B2 JP 5546528B2
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semiconductor module
high voltage
partial discharge
semiconductor
measured
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JP2013134156A (ja
JP2013134156A5 (enExample
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健一 菅
裕基 塩田
正雄 菊池
和郎 舟橋
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Mitsubishi Electric Corp
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  • Testing Electric Properties And Detecting Electric Faults (AREA)
JP2011284694A 2011-12-27 2011-12-27 半導体モジュールの絶縁欠陥検査装置および検査方法 Expired - Fee Related JP5546528B2 (ja)

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JP2013134156A JP2013134156A (ja) 2013-07-08
JP2013134156A5 JP2013134156A5 (enExample) 2013-11-28
JP5546528B2 true JP5546528B2 (ja) 2014-07-09

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CN104635087A (zh) * 2015-02-09 2015-05-20 云南电网有限责任公司电力科学研究院 避雷线绝缘架设时输电线路杆塔接地安全性能的检验方法
KR101787901B1 (ko) * 2016-06-14 2017-11-15 엘에스산전 주식회사 전력설비 진단장치
CN110601376B (zh) * 2019-09-11 2022-05-03 国网陕西省电力公司咸阳供电公司 一种高压隔离开关合闸到位监测装置及方法
JP7820641B2 (ja) * 2022-03-11 2026-02-26 ミネベアパワーデバイス株式会社 パワー半導体モジュールの部分放電要因推定方法、パワー半導体モジュールの部分放電要因推定装置

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JPS61263235A (ja) * 1985-05-17 1986-11-21 Hitachi Ltd 検査装置
JP2003114205A (ja) * 2001-10-05 2003-04-18 Mitsubishi Heavy Ind Ltd 半導体チップの漏洩電流箇所の検出装置
JP2004247618A (ja) * 2003-02-17 2004-09-02 Kyocera Corp 太陽電池素子の検査方法
JP2009141056A (ja) * 2007-12-05 2009-06-25 Sharp Corp 太陽電池モジュールの製造方法および太陽電池モジュールの製造装置
JP5496070B2 (ja) * 2010-03-08 2014-05-21 三菱電機株式会社 半導体装置の絶縁欠陥検出装置

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