JP5539650B2 - マイクロプラズマ装置 - Google Patents
マイクロプラズマ装置 Download PDFInfo
- Publication number
- JP5539650B2 JP5539650B2 JP2008551481A JP2008551481A JP5539650B2 JP 5539650 B2 JP5539650 B2 JP 5539650B2 JP 2008551481 A JP2008551481 A JP 2008551481A JP 2008551481 A JP2008551481 A JP 2008551481A JP 5539650 B2 JP5539650 B2 JP 5539650B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- microcavity
- material layer
- polymeric material
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/70—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/18—AC-PDPs with at least one main electrode being out of contact with the plasma containing a plurality of independent closed structures for containing the gas, e.g. plasma tube array [PTA] display panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
- H01J65/04—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels
- H01J65/042—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field
- H01J65/046—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field the field being produced by using capacitive means around the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/245—Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Micromachines (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
マイクロキャビティプラズマ装置は、また、フォトリトグラフィー技術によりエッチングできるガラスに製造される。例えば非特許文献1参照。珪素による構造物と同じく、アレイのサイズは、基体のサイズおよび表面域(フォトリトグラフィーにより接触してパターン化される)に制限される。アレイのコストは、複数のフォトリトグラフィー工程を行うコストに支配される。
本発明の種々の特徴は、請求の範囲に述べられている。
12 基体
14 底部電極
16 マイクロキャビティ
18 ポリマー層
20 絶縁コーティング
22 ポリマー基体
24 上方の電極
25 絶縁層
26 接着物
27 追加の層
30 型の用意
32 基体の用意
34 圧縮
36 硬化
38 分離
40 予備処理
42 被覆
44 導入
46 シール
50 マイクロチャンネル
50a 流れのチャンネル
50b プラズマチャンネル
51 プラズマリブ
Claims (8)
- 可撓性材料からなる可撓性の底部基体;
該底部基体により支持された連続的な可撓性のポリマー材料層であって、該ポリマー材料層の体積内に画成されており該ポリマー材料層の一の表面にて開口する溝または空隙からなる複数のマイクロチャンネルまたは複数のマイクロキャビティを有するポリマー材料層;
該ポリマー材料層の体積内に画成された該複数のマイクロチャンネルまたは複数のマイクロキャビティに閉じ込められたプラズマ媒体;
該可撓性のポリマー材料層と該可撓性の底部基体との間に配置され、該複数のマイクロチャンネルまたは複数のマイクロキャビティの閉止された底端部を画成する該ポリマー材料層の薄い部分によって該複数のマイクロチャンネルまたは複数のマイクロキャビティから絶縁された、薄いフィルム状の底部電極;
該複数のマイクロチャンネルまたは複数のマイクロキャビティ内でプラズマを含むために該ポリマー材料層と結合する、可撓性材料からなる可撓性の上部基体;
該上部基体に担持され、該底部電極と協働して該プラズマ媒体内でプラズマを励起する、薄いフィルム状で透明な上部電極;
プラズマから該上部電極を保護する、薄い可撓性の絶縁層
からなることを特徴とするマイクロプラズマ装置。 - 該ポリマー材料層が可視域およびUV付近で透明なポリマー材料を備える請求項1の装置。
- 該上部基体が透明である請求項1の装置。
- 該ポリマー材料層がエポキシ樹脂を備える請求項1の装置。
- 該ポリマー材料層がUVにより硬化可能なポリマー材料を備える請求項1の装置。
- 該複数のマイクロチャンネルまたは複数のマイクロキャビティが、複数のマイクロキャビティと接続する少なくとも1つのマイクロチャンネルを含む請求項1の装置。
- 該ポリマー材料層の薄い部分が、該底部電極から、該複数のマイクロチャンネルまたは複数のマイクロキャビティを分けており、
該複数のマイクロチャンネルまたは複数のマイクロキャビティの表面上に付された絶縁コーティングが該プラズマから該ポリマー材料層を保護し、
該上部電極および該上部基体が、該ポリマー材料層に最も近い接着物により保持される請求項1の装置。 - 該接着物が、該複数のマイクロチャンネルまたは複数のマイクロキャビティの間に該プラズマ媒体が流れるような接着物のパターン化層からなる請求項7の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76131606P | 2006-01-23 | 2006-01-23 | |
US60/761,316 | 2006-01-23 | ||
PCT/US2007/001951 WO2007087371A2 (en) | 2006-01-23 | 2007-01-23 | Polymer microcavity and microchannel devices and fabrication method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009524204A JP2009524204A (ja) | 2009-06-25 |
JP5539650B2 true JP5539650B2 (ja) | 2014-07-02 |
Family
ID=38309834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008551481A Expired - Fee Related JP5539650B2 (ja) | 2006-01-23 | 2007-01-23 | マイクロプラズマ装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US8497631B2 (ja) |
EP (1) | EP1977439A4 (ja) |
JP (1) | JP5539650B2 (ja) |
WO (1) | WO2007087371A2 (ja) |
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-
2007
- 2007-01-23 WO PCT/US2007/001951 patent/WO2007087371A2/en active Application Filing
- 2007-01-23 US US11/698,264 patent/US8497631B2/en active Active
- 2007-01-23 JP JP2008551481A patent/JP5539650B2/ja not_active Expired - Fee Related
- 2007-01-23 EP EP07762516A patent/EP1977439A4/en not_active Withdrawn
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US8497631B2 (en) | 2013-07-30 |
EP1977439A4 (en) | 2010-04-28 |
JP2009524204A (ja) | 2009-06-25 |
US20070200499A1 (en) | 2007-08-30 |
WO2007087371A2 (en) | 2007-08-02 |
US8864542B2 (en) | 2014-10-21 |
WO2007087371A3 (en) | 2008-07-17 |
EP1977439A2 (en) | 2008-10-08 |
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