JP5538330B2 - Heat generating member, manufacturing method thereof, and thermocompression bonding apparatus - Google Patents

Description

  Embodiments described herein relate generally to a heat generating member, a manufacturing method thereof, and a thermocompression bonding apparatus.

  When manufacturing an inkjet head, a plurality of terminals provided on a tape carrier package (TCP) are soldered to a target substrate. Conventionally, a thermocompression bonding apparatus using a heat generating member made of titanium has been used for this soldering.

  Titanium has a characteristic that it does not get wet with solder and has a relatively high resistance value. Therefore, the heat generating member made of titanium is used in a thermocompression bonding apparatus for pulse heat in combination with an electrode.

  In soldering an array of a plurality of terminals and a target substrate in TCP, first, cream solder is applied to the target substrate, and then other components other than TCP are placed on the target substrate and passed through the furnace. Let me. The place where the cream solder is applied is on a pattern corresponding to a place where a lead of another component and a plurality of terminals in the TCP are placed. Other parts are soldered on the substrate by melting cream solder in the furnace, and the surface of the place where a plurality of terminals in the TCP are to be placed is also soldered.

  Next, a plurality of terminals in TCP are placed. A tip portion of the heat generating member is formed on the target substrate on which the soldered terminals are placed, and a heating portion having a crimping surface is pressed against the heat generating member by causing a pulse current to flow from the electrode to the heat generating member. The heating part of the heat generating member has a length corresponding to the length (array length) from the outside to the outside of the two terminals at both ends of the array in the arrangement direction of the plurality of terminals in the TCP. The solder on the soldered target substrate is melted again by the heat generated by the heating unit, and a plurality of terminals in the TCP are collectively soldered to the target substrate.

JP-A-8-227918 JP 2000-21930 A JP 2007-123647 A Special table 2011-509349 gazette

  However, the plurality of terminals in the TCP are not necessarily soldered uniformly, and partial solder defects have occurred. The cause of the solder failure is that heat from the heat generating member is not uniformly transmitted to the solder. For example, the contact between the heating part of the heat generating member and the target substrate is defective.

  The problem to be solved by the present invention is to provide a heat generating member capable of uniformly soldering a plurality of terminals in a TCP to a target substrate.

Heat generating member embodiment includes a current receiving surface along the longitudinal direction in contact with the electrodes, and a heating portion having a crimping surface along the longitudinal direction is provided integrally with the lower portion of said current receiving surface, wherein The current receiving surface has a plurality of taps on which screws for connecting to the electrodes are arranged, and is connected to the electrodes by the screws and comes into contact with the electrodes, so that the current receiving surface is elongated from the electrodes. A heat generating member that generates heat by a pulse current that flows in a direction orthogonal to the direction, and has a member that reduces contact resistance with the electrode on the current receiving surface.

The perspective view of a heat generating member. Schematic explaining the structure of a thermocompression bonding apparatus. The figure explaining the direction through which the electric current flows in the head of a thermocompression bonding apparatus. The figure explaining the direction through which the electric current flows in the cross section of the head of a thermocompression bonding apparatus. The figure which shows the terminal and target board | substrate of TCP which were soldered. The perspective enlarged view of the terminal soldered. The figure which shows the temperature distribution of a heat generating member. The perspective view of the head of a thermocompression bonding apparatus. The figure which shows the screw | thread with which the lead wire was welded. Sectional drawing of the head of a thermocompression bonding apparatus. The perspective view explaining a measurement part. The graph which shows the relationship between an applied electric current and an electric potential. The graph which shows the relationship between an applied electric current and an electric potential. The graph which shows the relationship between an applied electric current and an electric potential. The graph which shows the relationship between an applied electric current and an electric potential. The graph which shows the relationship between an applied electric current and an electric potential. The graph which shows a voltage drop. The graph which shows a voltage drop. Sectional drawing of the head in the thermocompression bonding apparatus concerning one Embodiment.

  Hereinafter, embodiments will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a basic structure of a heat generating member 10 according to an embodiment. As shown in FIG. 1, the heating members 10 are arranged symmetrically apart from each other, and include a first wall portion 111 and a second wall portion including a first cuboid portion 111a and a second cuboid portion 112a, respectively. 112. As for the 1st wall part 111 and the 2nd wall part 112, the lower part forms the taper parts 111b and 112b, respectively. The first wall portion 111 and the second wall portion 112 are integrally connected by a heating portion 113 at their bottom portions (lower portions of the tapered portions 111b and 112b). The heating unit 113 extends along the longitudinal direction of the rectangular parallelepiped portions 111 and 112, and a lower end surface thereof constitutes a pressure-bonding surface 113a for pressure-bonding to a heated object (target substrate).

  A plurality of taps 12 are provided on the rectangular parallelepiped portion 111 of the heat generating member 10. The surface provided with the tap 12 is a current receiving surface 13 that contacts the current supply surface of the electrode. When a current is supplied from the electrode to the current receiving surface 13, the current flows in the direction of arrow a in the figure. Each tap 12 is provided with a screw for connecting the heat generating member 10 to an electrode, which will be described later.

  A thermocouple 11 is welded to the heating portion 113 of the heat generating member 10. The thermocouple 11 detects the temperature of the heat generating member 10, controls the phase angle of the supplied current with a controller (not shown), and maintains it at a predetermined temperature (for example, about 350 ° C.).

  The length L in the longitudinal direction of the heating unit 113 in the heat generating member 10 corresponds to the array length of the terminals in the TCP, and is about 55 mm, for example. As indicated by an arrow a in FIG. 1, the direction of current flow in the heating member 10 is orthogonal to the longitudinal directions of the rectangular parallelepiped portions 111 and 112 and the heating unit 113.

  FIG. 2 is a schematic diagram showing a configuration of a pulse heat type thermocompression bonding apparatus using the heat generating member 10 of the embodiment. In the thermocompression bonding apparatus 20, the heat generating member 10 is pressed into contact with the positive shank 14P and the negative shank 14N by bolts 16. The positive electrode side shank 14P and the negative electrode side shank 14N are made of brass and function as electrodes. The positive electrode side shank 14P, the heat generating member 10, and the negative electrode side shank 14N constitute a head 43 of the thermocompression bonding apparatus 20.

  The positive side shank 14P and the negative side shank 14N are fixed to the conductive plate 45 by bolts 44, respectively. Current is supplied to the conductive plate 45 from a power supply 46 that supplies a pulsed heating current. An insulating block 48 is fixed to the positive-side shank 14P and the negative-side shank 14N by bolts 47, and the insulating block 48 is fixed to the spindle 49. The spindle 49 moves up and down by an elevating mechanism (not shown).

  The surface of the copper foil pattern 35 of the substrate 34 is preliminarily soldered. That is, the board | substrate 34 which apply | coated the cream solder to the part of the copper foil pattern 35 is passed through a furnace, and the solder is melted. When passing through the furnace, another electronic component (not shown) may be placed on another copper foil pattern coated with cream solder on the substrate 34, and the other electronic component may be soldered on the substrate 34. .

  When the terminal 32 in the TCP 30 including the film 31 and the terminal 32 is thermocompression bonded to the copper foil pattern 35 of the target substrate 34, after the positions of the terminal 32 and the copper foil pattern 35 are aligned, the spindle 49 is lowered. The heating unit 10 a of the heat generating member 10 is pressed against the bonding position of the film 31. Next, the heating member 10 is heated by supplying a pulsed heating current from the power source 46. Thus, the joining position is pressurized and heated, and the terminal 32 and the copper foil pattern 35 are thermocompression bonded by the solder 36. The pulsed current is supplied only during thermocompression, and the heat generating member 10 is cooled after thermocompression. After waiting for the solder 36 to harden, the heating member 10 is separated from the film 31 by raising the spindle 49.

  Here, the direction of current flow in the head 43 is shown in FIG. The positive side shank 14 </ b> P contacts the current receiving surface of the heat generating member 10 at a current supply surface (not shown) and supplies current to the heat generating member 10. In the direction indicated by the arrow a in the figure, for example, a pulsed current flows for 10 to 15 seconds. Since the resistance value of the heating member 10 is less than milliohms, the required pulse heat current usually reaches several hundreds of A.

  FIG. 4 is a cross-sectional view of the head in a direction orthogonal to the longitudinal direction L of the heat generating member 10. The heat generating member 10 is in contact with the positive electrode side shank 14P and the negative electrode side shank 14N at the current receiving surfaces 13 and 20. Gold plating 15 is provided on the surfaces of the negative electrode side shank 14N and the positive electrode side shank 14P as shown in FIG. The current flows in the direction indicated by arrow a in the figure.

  Using a thermocompression bonding apparatus including such a head, a plurality of terminals in TCP and a target substrate are soldered by the method as described above. FIG. 5 schematically shows an example of the TCP to which the terminals are soldered and the target substrate. The film 31 and the terminal 32 constitute a TCP 30. As the solder 36 melts, the terminals 32 are soldered to the copper foil pattern 35 on the target substrate 34.

  However, solder does not necessarily melt sufficiently uniformly, and it may melt unevenly and cause partial defects. FIG. 6 is an enlarged perspective view showing an example of a solder defect. Since the solder 37 is not sufficiently melted, the solder 37 and the terminal 32 are not in electrical contact. It is so-called potato solder.

  Conventionally, it has been thought that the solder failure is caused by heat from the heat generating member not being uniformly transmitted to the solder. In some cases, heat does not escape uniformly from the solder, which is also related to solder failure.

  FIG. 7 shows the temperature distribution of the heat generating member 10 when a solder failure occurs. As shown in FIG. 7A, the temperature of the heat generating member 10 is not uniform and has a distribution. The temperature of the heat generating member 10 in FIG. 7A corresponds to the display in FIG. In FIG. 7B, the left side represents a low temperature (100 ° C.) and the right side represents a high temperature (320 ° C.). It can be seen that the temperature of the heating member 10 itself is low. When such a temperature distribution was present in the heating member 10, a solder failure occurred on the left side of the plurality of terminals.

  When the same operation was performed several times under the same conditions, it was confirmed that the temperature distribution generated in the heat generating member was not constant. In some cases, the temperature of the heat generating member was uniform, and the result of soldering at a plurality of terminals was also good. In some cases, as in the case described above, the temperature on the left side of the heater did not rise, and a solder failure occurred on the left side of the plurality of terminals. On the other hand, the temperature of the right half of the heater did not rise, contrary to the case described above. At that time, solder defects occurred in the right half of the plurality of terminals. It was confirmed that the temperature distribution abnormality in the heat generating member and the occurrence of solder failure in the plurality of terminals always correlated.

  These facts mean the following: That is, the cause of the solder failure is not the non-uniform heat transfer from the heat generating member to the solder, as conventionally considered. The heat generation member itself generates heat in a non-uniform manner, resulting in defective solder.

  The amount of heat generated by the heat generating member is determined by the electrical resistance of the heat generating member itself and the flowing current. It is normally not considered that the electrical resistance of the heating part in the heat generating member fluctuates in an unstable manner. Therefore, it can be presumed that the amount of generated heat fluctuates and becomes non-uniform due to unstable and non-uniform current flowing through the heat generating member. The inventors paid attention to the contact resistance between the heating member 10 and the shank 14.

  Since the heat generating member is made of titanium, its surface is easily oxidized and titanium oxide is easily formed. When a titanium oxide film is formed on the current receiving surface of the heat generating member that contacts the shank, the resistance value due to surface contact between the heat generating member and the shank becomes unstable. The contact resistance varies during the soldering operation. Since the temperature of the heat generating member is feedback-controlled, even if the contact resistance between the heat generating member and the shank changes, feedback acts to keep the temperature of the heat generating member constant.

  However, the temperature of the heat generating member is detected by the welded thermocouple in very limited places. The controllable current value is a scalar, and the current distribution in the heat generating member cannot be controlled. For this reason, the current distribution is non-uniform for the entire heat generating member, and as a result, the temperature of the heat generating member, that is, the soldering temperature is non-uniform. Unstable contact resistance between the heat generating member and the shank is a cause of fluctuation or nonuniformity in the amount of generated heat. These findings have been found by the present inventors.

  Here, a method for measuring the contact resistance between the heat generating member and the shank will be described. As described above, the heat generating member is used with a current of several hundreds of A flowing in actual use. It is actually difficult to evaluate the contact resistance with a current value close to actual use. One reason for this is that the resistance changes due to the generated heat. Further, the reason is that it is necessary to process the generated heat and it is difficult to stably supply a direct current of several hundreds of amps.

  Since the resistance value of the heat generating member is inherently a very low value, the contact resistance cannot be measured with a required accuracy with a small current. Therefore, the present inventors have established a method of setting the measurement current to 20 A and measuring the potential distribution of each part in a state where 20 A is flowing.

  Even when a current of about 20 A is passed, the heat generating member hardly generates heat. The voltage drop of each part in the heat generating member is about several hundred μV to several mV, and the voltage can be secured to such an extent that it can be measured with necessary accuracy.

  FIG. 8 shows a head for measuring the potential distribution. As shown in the figure, the heat generating member 10 is connected to the negative electrode side shank 14N and the positive electrode side shank 14P by screws 16. The screw 16 is usually made of stainless steel. The DMM negative electrode 17 in the negative electrode side shank 14N is used as a measurement reference, and the positive electrode 18 is provided in the positive electrode side shank 14P. A current of 20 A flows in the direction of arrow b in the figure.

  A lead wire 19 is electrically welded to the bottom end of the screw 16 as shown in FIG. By measuring the potential at the tip 19A of the lead wire 19, the potential at the bottom end 16B of the screw can be known. Since the screw 16 connects the heat generating member 10 and the shank 14, the contact resistance between the heat generating member and the shank is determined from the potential difference between the top end 16T and the bottom end 16B of the screw.

  Locations at which the potential of the head is measured will be described with reference to FIGS. FIG. 10 is a schematic view of a cross section of the head in a direction orthogonal to the longitudinal direction of the heat generating member 10, and FIG. 11 schematically shows the head as a perspective view. In FIG. 11, the negative electrode side shank 14N and the positive electrode side shank 14P are connected to a constant current source.

  As shown in FIG. 10, the heat generating member 10 is sandwiched between the negative electrode-side shank 14N and the positive electrode-side shank 14P and connected by screws. A gap of about 0.5 to 1 mm is generated between the negative electrode side shank 14N and the positive electrode side shank 14P. The diameter of the lead wire welded to the bottom end of the screw is about 0.3 mm, and this lead wire is drawn out from the gap between the positive electrode side shank 14P and the negative electrode side shank 14N. The negative side screw top potential T, the negative side screw bottom potential B, the heating portion tip potential K, and the positive electrode screw top potential R are set.

  As shown in FIG. 11, the screw top potential (2T to 7T) on the negative electrode side and the screw bottom potential (2B to 7B) on the negative electrode side are measured for all the screws connecting the negative electrode side shank 14N and the heating member 10. To do. Further, the potentials (2R to 7R) of the positive electrode screw top are measured for all the screws connecting the positive electrode side shank 14P and the heat generating member 10 respectively. Furthermore, the heating portion tip potential (2K to 7K) along the current flow is also measured corresponding to each screw. Measurement was omitted for the positive electrode screw bottom potential (2RB to 7RB), and it was estimated from the heating portion tip potential (2K to 7K) and the negative electrode side screw bottom potential (2B to 7B) by calculation using the following formula.

nRB = 2 × nK−nB
The electric current flowing at the time of measurement was changed at 10 to 30 A, and the potential of each screw was measured. The results are shown in FIGS. 12 to 15 show the results for the negative side screw top potential T, the negative side screw bottom potential B, the heating portion tip potential K, and the positive electrode screw top potential R, respectively. FIG. 16 shows the measurement results for the positive electrode potential 18.

  As shown in these graphs, the current dependence of the potential in each part is linear. Therefore, it was confirmed that the measurement of the potential distribution is appropriate as a method for measuring the contact resistance between the heat generating member and the shank.

The electric current (mV) in each screw was measured by supplying a current of 20 A, and the results are summarized in Table 1 below. Here, the heat generating member and the shank were tightened with a screw tightening torque of 1.5 Nm.

For each screw, the contact potential difference (mV) on the T side and R side is calculated and summarized in Table 2 below.

Based on the above, the average value of resistance of the heat generating member itself (average heat generating member resistance) and the average value of contact resistance (average contact resistance) were obtained. The results are shown in Table 3 below.

  As shown in Table 3 above, the average heating member resistance is 235.1 μΩ, while the average contact resistance is 122 μΩ. It can be seen that the average contact resistance reaches 51.9% of the average heat generating member resistance. When the screw tightening is 1.5 Nm, the heat generation of as much as 50% of the heat generation of the heat generation member is generated on the contact surface between the heat generation member and the shank.

Since the contact potential difference in each screw also changes depending on the screw tightening torque for screwing the heat generating member and the shank, the contact resistance also changes depending on the screw tightening torque. The potential at each screw was measured in the same manner as described above except that the screw tightening torque between the heat generating member and the shank was changed to 2.8 Nm. 2.8 Nm is considered the limit of stainless steel screws. The potential (mV) at each screw is summarized in Table 4 below.

For each screw, the contact potential difference (mV) on the T side and R side is calculated and summarized in Table 5 below.

Based on the above, the average value of resistance of the heat generating member itself (average heat generating member resistance) and the average value of contact resistance (average contact resistance) were obtained. The results are shown in Table 6 below.

  As shown in Table 6, the average heating member resistance is 237 μΩ, while the average contact resistance is 91.88 μΩ. When the screw tightening is 2.8 Nm, the average contact resistance is equivalent to 38.8% of the average heating member resistance. By tightening the screw strongly, the ratio of the average contact resistance can be reduced. Nevertheless, contact resistance corresponding to about 39% of the resistance of the heat generating member still occurs.

  The results in the case of the screw tightening torque of 1.5 Nm and the results in the case of the screw tightening torque of 2.8 Nm are plotted together in the graph of FIG.

  Since a heat cycle is applied to the heat generating member, the screw connecting the heat generating member and the shank is loosened by repeated use. If the screw is slightly loosened, the contact resistance between the heat generating member and the shank increases. At locations where the contact resistance has increased, the current decreases and the temperature of the heat generating member becomes non-uniform. If the contact state between the heat generating member and the shank changes even slightly with the screw loosened, the temperature of the heat generating member becomes unstable.

  The reason why the contact resistance varies greatly depending on the tightening force of the screw is related to the fact that the heat generating member is made of titanium. As already described, a titanium oxide film is formed on the surface of titanium. The titanium oxide film is formed in a short time. The resulting titanium oxide film has a thickness of about 0.1 μm and is very strong. Even when the heat generating member having the titanium oxide film formed on the current receiving surface is brought into contact with the current supply surface of the shank, only the portion where the titanium oxide film is broken is conducted.

  The region where conduction is hindered by the titanium oxide film has a large resistance, and thus heat generation becomes large. As already explained, the shank is made of brass and the screw is made of stainless steel. Since the heat generating members connected to the shank by screws are made of titanium, they have different coefficients of thermal expansion. Due to the difference in coefficient of thermal expansion, the interval between the heat generating member and the shank is increased and the resistance is increased every cycle of pulse heat. As the resistance increases, the amount of heat generation also increases. Moreover, since it is exposed to air, the oxidation of titanium is further promoted. This creates a vicious circle.

  In order to confirm the influence of oxidation of titanium, a thermocompression bonding apparatus was constructed using heat generating members made of different materials, and the potential of a predetermined screw was measured in the same manner as described above. The Invar heating member having the same shape as the titanium heating member is used for comparison.

  Invar cannot be used as a heat-generating member for soldering because it becomes wet with solder. In general, invar is used as a heat tool for thermosetting an anisotropic conductive film (ACF). Although this invar has a slightly higher electrical resistance than titanium, a strong oxide film unlike titanium is not easily formed on the surface.

  In this experiment, an Invar heat tool having the same size as that used in the experiments of Tables 1 to 6 and FIGS. 8 to 17 could not be obtained. Therefore, a titanium heat tool having the same size as the Invar heat tool was used. Was obtained. First, after measuring the potential with this titanium heat tool, the potential was measured with an Invar heat tool of the same size and compared. Since this heat tool is smaller than those used in the experiments of Tables 1 to 6 and FIGS. 8 to 17, only three screws each for fixing the heat tool positive electrode and the negative electrode to the shank were measured.

First, a current of 20 A was passed through a thermocompression bonding apparatus using a titanium heating member, and the potential (mV) at a predetermined screw was measured. The results are summarized in Table 7 below. The screw tightening torque between the heat generating member and the shank was 1.5 Nm and 2.8 Nm.

For each screw, the contact potential difference (mV) on the T side and R side is calculated and summarized in Table 8 below.

Based on the above, the average value of resistance of the heat generating member itself (average heat generating member resistance) and the average value of contact resistance (average contact resistance) were obtained. The results are shown in Table 9 below.

  Based on the results of Table 9 above, the average contact resistance of the titanium heating member is equivalent to 60.2% of the average heating member resistance when screw tightening is 1.5 Nm, and when screw tightening is 2.8 Nm. Is equivalent to 57.3% of the average heating member resistance.

For the thermocompression bonding apparatus using the Invar heat generating member, a current (20 A) was passed in the same manner as described above, and the potential (mV) at a predetermined screw was measured. The results are summarized in Table 10 below. The screw tightening torque between the heat generating member and the shank was 1.5 Nm and 2.8 Nm as in the case of titanium.

For each screw, the contact potential difference (mV) on the T side and R side is calculated and summarized in Table 11 below.

Based on the above, the average value of resistance of the heat generating member itself (average heat generating member resistance) and the average value of contact resistance (average contact resistance) were obtained. The results are shown in Table 12 below.

  Based on the results of Table 12 above, the average contact resistance in the thermocompression bonding apparatus using the Invar heat generating member is equivalent to 16.7% of the average heat generating member resistance when screw tightening is 1.5 Nm. When the tightening is 2.8 Nm, it corresponds to 12.3% of the average heat generating member resistance.

  The results in the case of using the titanium heating member and the results in the case of using the Invar heating member are collectively plotted in the graph of FIG.

  Comparing the average heat generating member resistance, the Invar heat generating member is larger than the titanium heat generating member. On the other hand, regarding the average contact resistance, the thermocompression bonding apparatus using the Invar heat generating member is extremely smaller than the thermocompression bonding apparatus using the titanium heat generating member. It has been confirmed that the Invar heat generating member has an extremely small contact resistance compared to titanium even though the electrical resistance of the material itself is large. Due to the small contact resistance between the heat generating member and the shank, the current flowing through the heat generating member is uniformly stabilized, and fluctuation or nonuniformity in the amount of generated heat is avoided.

  Based on these measurement results, the present inventors have found that it is effective to lower the contact resistance with the electrode that is the current supply terminal in order to stabilize the temperature distribution in the heat-generating member made of titanium.

  FIG. 19 is a cross-sectional view of a head using a heat generating member according to one embodiment. The basic structure is as described with reference to FIG. As shown in FIG. 19, a member 41 that reduces contact resistance with the shank is provided on the surface (current receiving surface) of the heat generating member 10 that contacts the current supply surface of the shank 14. The contact resistance reducing member 41 can be a noble metal thin film, for example. Examples of the noble metal include gold, platinum, and rhodium. Such noble metals can be referred to as highly conductive and corrosion resistant materials.

  The noble metal thin film can be formed on the current receiving surface of the heating member 10 by, for example, plating or sputtering. Alternatively, a noble metal thin film may be formed by cladding a gold foil. The thickness of the noble metal thin film is not particularly limited, and the effect can be obtained if it exists on the current receiving surface of the heat generating member 10.

  The material provided on the current receiving surface of the heat generating member 10 is a splat of a plurality of highly conductive and corrosion-resistant materials covering a part of the current receiving surface of the heat generating member 10 as disclosed in, for example, JP-T-2011-509349. It can also be produced using thermal spray techniques.

  In addition, as a material provided on the current receiving surface, a highly conductive and corrosion-resistant material other than a noble metal can be used. Specific examples include metal nitride, carbon, and conductive ceramics.

  As described above in detail, since the member for reducing the contact resistance is provided on the current receiving surface in contact with the electrode, a heating member capable of uniformly soldering a plurality of terminals is obtained according to this embodiment.

  The material of the heat generating member is not limited to titanium, and a metal having the same characteristics as titanium can be used. Examples of metals that can be used include molybdenum and tungsten.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 10 ... Heat generating member; 111 ... 1st wall part; 112 ... 2nd wall part 111a ... 1st rectangular parallelepiped part; 112a ... 2nd rectangular parallelepiped part 111b, 112b ... Tapered part; 113 ... Heating part; 12 ... Tap; 13 ... Current receiving surface; 14 ... Shank 14N ... Negative electrode shank; 14P ... Positive electrode shank; 15 ... Gold plating 16 ... Screw; 16T ... Screw top end; 16B ... Screw bottom end; DESCRIPTION OF SYMBOLS ... DMM negative electrode 18 ... Positive electrode; 19 ... Lead wire; 20 ... Thermocompression bonding apparatus 30 ... Tape carrier package (TCP); 31 ... Film; 32 ... Terminal 34 ... Target board | substrate; 35 ... Copper foil pattern; ... Solder that is insufficiently melted; 40 ... Thermocompression bonding equipment; 41 ... Contact resistance reducing member 43 ... Head; 44 ... Bolt; ; 46 ... power supply; 47 ... bolt 48 ... insulating block; 49 ... spindle.

Claims (22)

A current receiving surface along a longitudinal direction in contact with the electrode; and a heating unit integrally provided at a lower portion of the current receiving surface and having a pressure-bonding surface along the longitudinal direction, the current receiving surface including the electrode A plurality of taps in which screws for connecting to the electrodes are arranged, and are connected to the electrodes by the screws and are brought into contact with the electrodes, thereby causing the electrodes to flow in a direction perpendicular to the longitudinal direction of the current receiving surface. A heating member that generates heat by a pulsed current, and has a member that reduces contact resistance with the electrode on the current receiving surface. The heating member according to claim 1 , wherein the member for reducing the contact resistance is a noble metal thin film. The heating member according to claim 2 , wherein the noble metal is selected from the group consisting of gold, platinum, and rhodium. The heat generating member according to claim 1 or 2 , wherein the heat generating member is made of titanium. 2. The method for manufacturing a heating member according to claim 1 , wherein the current receiving surface is subjected to a treatment for reducing contact resistance with the electrode. 6. The method according to claim 5 , wherein the treatment for reducing the contact resistance is performed by spraying a highly conductive and corrosion-resistant material. The method of claim 6 , wherein the highly conductive and corrosion resistant material is a noble metal. The method according to claim 6 , wherein the highly conductive and corrosion-resistant material is metal nitride, carbon, or conductive ceramics. The method according to claim 5 , wherein the treatment for reducing the contact resistance is performed by forming a thin film of noble metal. The method according to claim 9 , wherein the formation of the noble metal thin film is performed by plating. The method according to claim 9 , wherein the formation of the noble metal thin film is performed by sputtering. 10. The method of claim 9 , wherein the noble metal thin film is formed by cladding the noble metal foil. 13. A method according to any one of claims 9 to 12 , wherein the noble metal is selected from the group consisting of gold, platinum and rhodium. The method according to any one of claims 5 to 12 wherein the heat-generating member is characterized in that is made of titanium. An electrode having a current supply surface; and
The heating member according to claim 1 is provided,
The thermocompression bonding apparatus, wherein the heat generating member has a member that reduces contact resistance with the electrode on the current receiving surface. The thermocompression bonding apparatus according to claim 15 , wherein the current flows in a direction orthogonal to a longitudinal direction of the current receiving surface. The thermocompression bonding apparatus according to claim 15 or 16 , wherein the current is a pulse current. The thermocompression bonding apparatus according to any one of claims 15 to 17 , wherein the member for reducing the contact resistance is a noble metal thin film. The thermocompression bonding apparatus according to claim 18 , wherein the noble metal is selected from the group consisting of gold, platinum, and rhodium. The thermocompression bonding apparatus according to any one of claims 15 to 17 , wherein the member for reducing the contact resistance is metal nitride, carbon, or conductive ceramics. The heating member is thermocompression bonding apparatus according to any one of claims 15 to 20, characterized in that it is made of titanium. The thermocompression bonding apparatus according to any one of claims 15 to 21 , wherein the thermocompression bonding apparatus is a soldering apparatus.

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