JP5536748B2 - Manufacturing method of package substrate - Google Patents

Description

The present invention relates to a method of manufacturing a package board, and in particular to a manufacturing method of the package board in thickness reduction of the product.

  With the thriving development of the electronics industry, electronic products are progressing in the direction of multifunction and high performance. In order to meet the demand for semiconductor package miniaturization, the company is making progress toward reducing the thickness of package substrates for chip mounting. Currently, package substrates for chip mounting include hard materials and soft materials. Generally, a hard material is selected for a package substrate used in a ball grid array (BGA).

  1A to 1C are schematic cross-sectional views of a conventional method for manufacturing a package substrate 1 of a two-layer circuit.

  First, two core layers 10 as shown in FIG. 1A are prepared. The core layer 10 has a first surface 10a and a second surface 10b facing each other, and the first surface 10a and the second surface 10b are opposed to each other. A first metal layer 11a and a second metal layer 11b are provided on the surface 10b, respectively, and have a plurality of through holes 100 communicating with the first and second surfaces 10a and 10b.

  As shown in FIG. 1B, the first and second circuit layers 13a and 13b are formed on the first and second surfaces 10a and 10b of the core layer 10 by the first and second metal layers 11a and 11b (conductive layer 12). Patterning process to form each of the first and second circuit layers 13a, 13b having a plurality of first and second electrical contact pads 130a, 130b. Conductive vias 14 are formed in the through holes 100 so as to be connected.

  As shown in FIG. 1C, the first and second surfaces 10a of the core layer 10 so that the first and second electrical contact pads 130a, 130b are exposed in the first and second openings 150a, 150b. First and second insulating protective layers 15a and 15b having a plurality of first and second openings 150a and 150b are respectively formed on 10b. Next, first and second surface treatment layers 16a and 16b are formed on the exposed surfaces of the first and second electrical connection pads 130a and 130b, respectively.

  In a subsequent process, a chip is mounted on the second protective layer 15b and a packaging process is performed to complete the manufacture of the package structure. In order to satisfy the requirements for miniaturization and reliability, the thickness S of the package substrate 1 can be reduced to 150 μm in the current manufacturing process technology.

  However, with the increasing demand for miniaturization, the package substrate 1 having a thickness of 150 μm can no longer satisfy the demand for miniaturization of the package. On the other hand, if the thickness S of the package substrate 1 is smaller than 150 μm, the package substrate 1 is likely to be damaged when transported or packaged because the thickness is too thin. .

  Therefore, how to overcome the bottleneck of the technology that the above-described conventional technology cannot simultaneously satisfy the requirements for product miniaturization and reliability is an extremely important issue to be solved at present.

  In order to solve the above-described problems, the present invention provides a package substrate characterized in that it includes a mounting member that is bonded to either side by an adhesive layer.

  Moreover, this invention has two surfaces which oppose, provided the 1st metal layer and the 2nd metal layer in those 2 surfaces, respectively, and has a through-hole which penetrates the said 1st metal layer. A step of preparing two core layers in which the second metal layer is exposed in the through hole, a step of connecting the two core layers by bonding the second metal layer with an adhesive member, Forming a first circuit layer having a first electrical contact pad with a first metal layer and forming a conductive via in the through hole so as to be electrically connected to the first circuit layer; Forming a first insulating protective layer on the first surface and the first circuit layer and exposing the first electrical contact pad, thereby exposing the first electrical contact pad to the exposed surface; Forming a surface treatment layer; and mounting a member on the first insulating protective layer. Forming a second circuit layer having a second electrical contact pad from the second metal layer; and a step of separating the two substrate bodies by removing the adhesive member; And electrically connecting the second circuit layer to the conductive via; forming a second insulating protective layer on the second surface and the second circuit layer; and Forming two package substrates by forming a second surface treatment layer on the exposed surface of the second electrical contact pad by exposing the second electrical contact pad. Also provide.

  According to the manufacturing method described above, before the second circuit layer is formed, the mounting members of the two substrate bodies can be laminated together by the coupling member.

  In the package substrate and the manufacturing method thereof described above, the material of the adhesive layer may be a super glue or a release agent, and the material of the mounting member may be a high temperature resistant material.

  The value obtained by subtracting the thickness of the mounting member from the thickness of the package substrate is preferably smaller than 150 μm.

As described above, according to the manufacturing method of the package board according to the present invention, by binding a mounting member in the first insulating protective layer of the package substrate, due to the thickness is too thin during transportation or during packaging Damage can be avoided. Further, when the mounting member is removed after packaging, the thickness of the package substrate becomes smaller than 150 μm, so that the thickness of the entire package structure can be reduced as compared with the conventional technique. Therefore, the package substrate according to the present invention can simultaneously satisfy the requirements for product miniaturization and reliability.

FIG. 1A is a schematic cross-sectional view showing a first step of a conventional method for manufacturing a package substrate for a two-layer circuit. FIG. 1B is a schematic cross-sectional view showing a step that follows the step of FIG. 1A in the conventional manufacturing method. FIG. 1C is a schematic cross-sectional view showing a step that follows the step of FIG. 1B in the conventional manufacturing method. 2A to 2I are schematic cross-sectional views showing a method for manufacturing a package substrate according to the present invention, and FIG. 2A shows the first step of the manufacturing method according to the present invention. FIG. 2B is a schematic cross-sectional view showing a step that follows the step of FIG. 2A in the manufacturing method of the present invention. FIG. 2C is a schematic cross-sectional view showing a step that follows the step of FIG. 2B of the manufacturing method of the present invention. FIG. 2D is a schematic cross-sectional view showing a step that follows the step of FIG. 2C of the manufacturing method of the present invention. FIG. 2E is a schematic cross-sectional view showing a step that follows the step of FIG. 2D of the manufacturing method of the present invention. FIG. 2F (a) is a schematic cross-sectional view showing a process following the process of FIG. 2E of the manufacturing method of the present invention, and FIG. 2F (b) is a schematic cross-sectional view showing another embodiment. FIG. 2G is a schematic cross-sectional view showing a step that follows the step of FIG. 2F of the manufacturing method of the present invention. FIG. 2H is a schematic cross-sectional view showing a step that follows the step of FIG. 2G of the manufacturing method of the present invention. FIG. 2I is a schematic cross-sectional view showing a step that follows the step of FIG. 2H of the manufacturing method of the present invention. 3A to 3C are cross-sectional schematic views showing another embodiment of the package substrate manufacturing method according to the present invention, and FIG. 3A shows the substrate body separated in the step of FIG. 2E. It is a cross-sectional schematic diagram which shows the process given to the board | substrate main body of FIG. 3A of the other Example of the manufacturing method of this invention. It is a cross-sectional schematic diagram which shows the process following the process of FIG. 3B of the other Example of the manufacturing method of this invention.

  Hereinafter, embodiments of the present invention will be described using specific examples. Those skilled in the art will be able to easily understand other advantages and effects of the present invention according to the contents of this specification.

  Here, the structures, proportions, dimensions, and the like described in the drawings attached to the specification are disclosed in accordance with the contents described in the specification so that those skilled in the art can easily understand. However, any structural modifications, proportionality changes, or dimensional adjustments may be achieved and achieved from the present invention, which are not intended to limit the practice of the present invention and are not substantially technical. If it does not affect the purpose, it is included in the scope of the technical contents described in the present invention. In addition, terms such as “first (no)” and “second (no)” in this specification are used for clarification of the explanation, and limit the scope of the present invention. However, it goes without saying that the change or adjustment of the relative relationship belongs to the range where the present invention can be practiced without substantial change in the technical contents.

  2A to 2I are schematic cross-sectional views of the method for manufacturing the package substrate 2 according to the present invention.

  As shown in FIG. 2A, the first and second surfaces 20a and 20b have a first surface 20a and a second surface 20b opposite to each other (that is, located on both sides of the core layer 20). Each of the metal layer 21a and the second metal layer 21b is provided, and a plurality of through holes 200 penetrating the first metal layer 21a are provided on the first surface 20a, so that the second metal layer 21b penetrates them. Two core layers 20 to be exposed in the holes 200 are prepared.

  Next, the two core layers 20 are laminated by bonding the second metal layers 21 b of these core layers 20 by a plurality of adhesive members 22.

  The core layer 20 may be, for example, an organic polymer material of Bismaleimide-Triazine (BT) or a dielectric material such as prepreg, and the thickness of the core layer 20 may be The first and second metal layers 21a and 21b may be copper, and the adhesive member 22 may be a paste block.

  Although the thickness of the core layer 20 according to the present invention is smaller than 60 μm, the total thickness of the two core layers 20 increases during the manufacturing of the package substrate due to the lamination of the two core layers 20, and is used in the manufacturing process of the package substrate. Since equipment can be used, manufacturing costs can be reduced.

  As shown in FIG. 2B, a patterning process is performed so that the first circuit layer 23a is formed on the first surface 20a of the core layer 20 by the first metal layer 21a, and a plurality of first electric contact pads are formed. The conductive via 24 is formed in the through hole 200 so as to be electrically connected to the first circuit layer 23a having 230a.

  Since the circuit manufacturing process is diverse, it is not particularly limited, and is not a technical feature of the present invention.

  As shown in FIG. 2C, the first surface 20a of the core layer 20 and the first circuit layer 23a have a first opening 250a through which the plurality of first electrical contact pads 230a are exposed. The insulating protective layer 25a is formed. In other embodiments, the surface height of the first insulating protective layer 25a is reduced, and the height of the first electrical contact pad 230a is equal to or higher than the surface height of the first insulating protective layer 25a. The plurality of first electrical contact pads 230a may be exposed by increasing the height.

  Next, a first surface treatment layer 26a is formed on the first electrical contact pads 230a in the plurality of first openings 250a.

  As shown in FIG. 2D, the mounting member 27 is bonded to the first insulating protective layer 25 a by the adhesive layer 270. In this embodiment, the material of the adhesive layer 270 is, for example, a super glue or a release agent, and the material of the mounting member 27 is a high temperature resistant material, for example, a copper clad laminate (CCL).

  As shown in FIG. 2E, the two substrate bodies 2a are separated by removing the plurality of adhesive members 22.

  As shown in FIG. 2F (a) or FIG. 2F (b), the mounting member 27 of the two substrate bodies 2a is stacked on each other by the coupling members 28 and 28 ', thereby exposing the second metal layer 21b. In this embodiment, the coupling members 28, 28 ′ may be adhesive bumps (shown in FIG. 2F (b)) or paste layers (shown in FIG. 2F (a)).

  As shown in FIG. 2G, following the manufacturing process of FIG. 2F, a second circuit layer 23b having a plurality of second electrical contact pads 230b electrically connected to the conductive via 24 by the second metal layer 21b. Form.

  As shown in FIG. 2H, the second surface 20b of the core layer 20 and the second circuit layer 23b have second openings 250b through which the plurality of second electrical contact pads 230b are exposed. By forming the insulating protective layer 25b, two package substrates 2 are formed.

  Next, a second surface treatment layer 26b is formed on the exposed surface of the plurality of second electrical contact pads 230b.

  In other embodiments, the surface height of the second insulating protective layer 25b is reduced, and the height of the second electrical contact pad 230b is equal to or higher than the surface height of the second insulating protective layer 25b. By doing so, the plurality of second electrical contact pads 230b may be exposed.

  As shown in FIG. 2I, the two package substrates 2 are separated by removing the coupling member 28, and the mounting member 27 (the adhesive layer 270 is extremely thin since the thickness L of the package substrate 2 is considered. The thickness h obtained by subtracting the thickness d (which may not be included) is smaller than 150 μm. Further, the thickness d of the mounting member 27 is not particularly limited because it may be changed as necessary.

  3A to 3C are schematic sectional views showing another embodiment of the method for manufacturing the package substrate 2 according to the present invention.

  FIG. 3A shows one of the two substrate bodies 2a separated by removing the plurality of adhesive members 22 in the manufacturing process of FIG. 2E.

  As shown in FIG. 3B, the second substrate main body 2a is not laminated, but the second metal layer 21b is connected to the conductive via 24 and has a plurality of second electrical contact pads 230b. The circuit layer 23b is formed directly.

  As shown in FIG. 3C, the second insulation protection has a plurality of second openings 250b in the second surface 20b of the core layer 20 and the second circuit layer 23b through which the second electrical contact pads 230b are exposed. By forming the layer 25b, the package substrate 2 is formed.

  Next, the second surface treatment layer 26b is formed on the exposed surface of the second electrical contact pad 230b, and the mounting member 27 (the adhesive layer 270 is extremely thin because the thickness L of the package substrate 2 is The thickness h obtained by subtracting the thickness d (which may not be taken into consideration) is smaller than 150 μm.

  In general, when a substrate having a thickness of less than 150 μm is to be manufactured, it is necessary to newly arrange a new manufacturing process facility, which increases the manufacturing cost. In the package substrate 2 according to the present invention, the remaining thickness h excluding the mounting member 27 is smaller than 150 μm. However, when the package substrate 2 is manufactured with the thickness d of the mounting member 27, the total thickness L thereof is Since it becomes equal to or larger than 150 μm, the conventional equipment used for the package substrate manufacturing process can be used, and the manufacturing cost does not increase.

  Further, in the package substrate 2 according to the present invention, in the subsequent manufacturing process, the chip is mounted on the second insulating protective layer 25b (not shown), the packaging member 27 is removed, and then the mounting member 27 is removed. The manufacture of the structure is completed. Accordingly, the remaining thickness h obtained by subtracting the thickness d of the mounting member 27 from the thickness L of the package substrate 2 is smaller than 150 μm, and the thickness of the entire package structure is reduced. Therefore, compared with the prior art, the present invention can satisfy the demand for miniaturization by reducing the thickness of the package substrate 2 to less than 150 μm as necessary.

  Further, since the package substrate 2 has the mounting member 27 before and after the package manufacturing process, the strength of the entire package is improved. Therefore, the package substrate 2 according to the present invention can No damage during packaging.

  Further, for example, by stacking the two core layers 20 or the two substrate bodies 2a, it is possible to manufacture the substrate quantity for two lots at the same time, thereby improving the throughput.

  The package substrate 2 according to the present invention includes a core layer 20 having a first surface 20a and a second surface 20b facing each other, and a first circuit layer 23a provided on the first surface 20a of the core layer 20. A second circuit layer 23b provided on the second surface 20b of the core layer 20, a plurality of conductive vias 24 provided on the core layer 20, the first surface 20a of the core layer 20 and the first surface A first insulation protection layer 25a provided on the circuit layer 23a; a second insulation protection layer 25b provided on the second surface 20b of the core layer 20 and the second circuit layer 23b; and a first insulation protection. A mounting member 27 coupled to the layer 25a.

  The first circuit layer 23a has a plurality of first electrical contact pads 230a, the second circuit layer 23b has a plurality of second electrical contact pads 230b, and the conductive via 24 has first and second electrical contact pads 230b. It is electrically connected to the circuit layers 23a and 23b.

  The first insulating protective layer 25a has a plurality of first openings 250a through which the plurality of first electric contact pads 230a are exposed, and the first electric contact pads 230a in the first openings 250a are formed on the first electric contact pads 230a. The first surface treatment layer 26a is formed.

  The second insulating protective layer 25b has a plurality of second openings 250b through which the plurality of second electric contact pads 230b are exposed, and the second electric contact pads 230b in the second openings 250b are formed on the second electric contact pads 230b. A second surface treatment layer 26b is formed.

  The mounting member 27 is bonded to the plurality of first electrical contact pads 230a and the first insulating protective layer 25a by an adhesive layer 270. In this embodiment, the adhesive layer 270 is made of super glue or a release agent, and the mounting member 27 is made of a high temperature resistant material.

  Further, the remaining thickness h obtained by subtracting the thickness d of the mounting member 27 from the thickness L of the package substrate 2 is smaller than 150 μm.

As described above, the manufacturing method of the package board according to the present invention is mainly to improve the strength of the entire package substrate by coupling the mounting member to the first insulating protective layer of the package substrate, transportation or when packaging Damage due to time can be effectively prevented.

  Further, when the mounting member is removed after packaging, since the thickness of the package substrate is smaller than 150 μm, the thickness of the entire package structure is reduced, and the requirements for downsizing and reliability of the product can be satisfied at the same time.

  As described above, these embodiments are merely illustrative of the principles and effects of the present invention, and the present invention is not limited thereto. The present invention can be variously modified and changed by those skilled in the art without departing from the gist of the present invention, and such modifications and changes fall within the scope of the claims of the present invention. It is.

1, 2 Package substrate 10, 20 Core layer 10a, 20a First surface 10b, 20b Second surface 100, 200 Through-hole 11a, 21a First metal layer 11b, 21b Second metal layer 12 Conductive layer 13a, 23a 1st circuit layer 13b, 23b 2nd circuit layer 130a, 230a 1st electrical contact pad 130b, 230b 2nd electrical contact pad 14, 24 Conductive via 15a, 25a 1st insulation protective layer 15b, 25b 1st Second insulating protective layer 150a, 250a First opening 150b, 250b Second opening 16a, 26a First surface treatment layer 16b, 26b Second surface treatment layer 2a Substrate body 22 Adhesive member 27 Mounting member 270 Adhesive layer 28 Coupling member L, d, S Thickness h Remaining thickness

Claims (5)

The first and second surfaces are opposed to each other, the first metal layer and the second metal layer are provided on the first and second surfaces, respectively, and the first metal is provided on the first surface. Providing two core layers having a through-hole penetrating a layer and exposing the second metal layer to the through-hole;
Connecting the two core layers by bonding the second metal layer with an adhesive member;
A first circuit layer having a first electric contact pad is formed on the first surface of the core layer by the first metal layer, and the first circuit layer is electrically connected to the through hole. Forming conductive vias to be connected;
An exposed surface of the first electrical contact pad is formed by forming a first insulating protective layer on the first surface of the core layer and the first circuit layer and exposing the first electrical contact pad. Forming a first surface treatment layer on
Bonding a mounting member to the first insulating protective layer with an adhesive layer;
Separating the two substrate bodies by removing the adhesive member;
Exposing the second metal layer by laminating the mounting members of the two substrate bodies with a coupling member;
Forming a second circuit layer having a second electrical contact pad from the second metal layer and electrically connecting the second circuit layer to the conductive via;
An exposed surface of the second electrical contact pad is formed by forming a second insulating protective layer on the second surface of the core layer and the second circuit layer and exposing the second electrical contact pad. Forming two package substrates by forming a second surface treatment layer on the substrate;
Separating the two package substrates by removing the coupling member;
A method for manufacturing a package substrate, comprising:   The method of manufacturing a package substrate according to claim 1, wherein the coupling member is an adhesive bump or a paste layer.   The method for manufacturing a package substrate according to claim 1, wherein the material of the adhesive layer is a super glue or a release agent. The first and second surfaces are opposed to each other, the first metal layer and the second metal layer are provided on the first and second surfaces, respectively, and the first metal is provided on the first surface. Providing two core layers having a through-hole penetrating a layer and exposing the second metal layer to the through-hole;
Connecting the two core layers by bonding the second metal layer with an adhesive member;
A first circuit layer having a first electric contact pad is formed on the first surface of the core layer by the first metal layer, and the first circuit layer is electrically connected to the through hole. Forming conductive vias to be connected;
An exposed surface of the first electrical contact pad is formed by forming a first insulating protective layer on the first surface of the core layer and the first circuit layer and exposing the first electrical contact pad. Forming a first surface treatment layer on
Bonding a mounting member to the first insulating protective layer with an adhesive layer;
Separating the two substrate bodies by removing the adhesive member;
Forming a second circuit layer having a second electrical contact pad from the second metal layer and electrically connecting the second circuit layer to the conductive via;
An exposed surface of the second electrical contact pad is formed by forming a second insulating protective layer on the second surface of the core layer and the second circuit layer and exposing the second electrical contact pad. Forming a second surface treatment layer on
A method for manufacturing a package substrate, comprising:   The method for manufacturing a package substrate according to claim 4, wherein the material of the adhesive layer is a super glue or a release agent.

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