CN103066049B - Base plate for packaging and method for making thereof - Google Patents
Base plate for packaging and method for making thereof Download PDFInfo
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- CN103066049B CN103066049B CN201110330017.XA CN201110330017A CN103066049B CN 103066049 B CN103066049 B CN 103066049B CN 201110330017 A CN201110330017 A CN 201110330017A CN 103066049 B CN103066049 B CN 103066049B
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Abstract
A kind of base plate for packaging and method for making thereof, this base plate for packaging comprises: have the sandwich layer on two relative surfaces, be located at two line layers on this sandwich layer two surface, the multiple conductive through holes be located in this sandwich layer, be located at this sandwich layer two surface and two insulating protective layers on two line layers and be incorporated into the bearing part on the insulating protective layer of this sandwich layer wherein on a surface.By on this base plate for packaging side in conjunction with bearing part, with avoid in transport time or encapsulation time break because of too thin.
Description
Technical field
The present invention relates to a kind of base plate for packaging and method for making thereof, espespecially a kind of base plate for packaging and method for making thereof being beneficial to product thinning.
Background technology
Flourish along with electronic industry, electronic product is also marched toward multi-functional, high performance trend gradually.In order to meet the package requirements of semiconductor package part microminiaturization (miniaturization), and develop towards the thickness of the base plate for packaging reducing carries chips.Base plate for packaging at present for carries chips can be divided into hard material and soft material, and the base plate for packaging being generally used for ball grid array packages (Ball Grid Array, BGA) selects hard material.
Refer to Figure 1A to Fig. 1 C, it is the generalized section of the method for making of the base plate for packaging 1 of existing double-deck circuit.
As shown in Figure 1A, first, two sandwich layers 10 are provided, respectively this sandwich layer 10 has relative first surface 10a and second surface 10b, and first and second surperficial 10a of this sandwich layer 10,10b has respectively a first metal layer 11a and one second metal level 11b, this sandwich layer 10 has multiple through holes 100 of connection this first and second surperficial 10a, 10b again.
As shown in Figure 1B, carry out Patternized technique, with by this first and second metal level 11a, 11b (utilizing conductive layer 12 to carry out plated metal), in first and second surperficial 10a of this sandwich layer 10,10b is formed respectively first and second line layer 13a, 13b, and in those through holes 100, form conductive through hole 14 to be electrically connected this first and second line layer 13a, 13b, this first and second line layer 13a, 13b have multiple first and second electric contact mat 130a, 130b respectively again.
As shown in Figure 1 C; in first and second surperficial 10a of this sandwich layer 10; 10b is formed respectively first and second insulating protective layer 15a; 15b, and this first and second insulating protective layer 15a, 15b have multiple first and second perforate 150a respectively; 150b; to make those first and second electric contact mats 130a, 130b correspondence exposes to respectively this first and second perforate 150a, 150b.Then, in those first and second electric contact mats 150a, the exposed surface of 150b is formed respectively first and second surface-treated layer 16a, 16b.
In subsequent technique, its carries chips carry out packaging technology, to make encapsulating structure on this second insulating protective layer 15b.In order to meet the demand of microminiaturization and reliability, in current technology, the thickness S of this base plate for packaging 1 can be contracted to 150 μm.
But, along with the increase in demand of microminiaturization, thickness is that the base plate for packaging 1 of 150 μm cannot meet now to the demand of packaging part microminiaturization, if but make the thickness S of this base plate for packaging 1 be less than 150 μm, then this base plate for packaging 1 in time transporting or encapsulation time easily will break because of too thin, cause using or product bad.
Therefore, how to overcome the technical bottleneck that above-mentioned prior art cannot meet the demand of product microminiaturization and reliability simultaneously, become the problem of desiring most ardently solution at present in fact.
Summary of the invention
In view of the disadvantages of above-mentioned prior art, main purpose of the present invention is to disclose a kind of base plate for packaging, to avoid breaking because of too thin in time transporting or when encapsulating.
Base plate for packaging disclosed by the present invention comprises: sandwich layer, has relative first surface and second surface; First line layer, it is located on the first surface of this sandwich layer, and has the first electric contact mat; Second line layer, it is located on the second surface of this sandwich layer, and has the second electric contact mat; Conductive through hole, it is located in this sandwich layer, to be electrically connected this first and second line layer; First insulating protective layer, on its first surface being located at this sandwich layer and first line layer, and exposes this first electric contact mat; First surface processing layer, is formed on the exposed surface of this first electric contact mat; Second surface processing layer, it is formed on the exposed surface of this second electric contact mat; And bearing part, it is incorporated on this first insulating protective layer by adhesion coating.
The present invention also provides a kind of method for making of base plate for packaging, it comprises: provide two sandwich layers, this sandwich layer has relative first surface and second surface, and first and second of this sandwich layer has the first metal layer and the second metal level on the surface respectively, the first surface of this sandwich layer again has the through hole running through this first metal layer, exposes to this through hole to make this second metal level; By sticker part in conjunction with this second metal level, to connect this two sandwich layer; By this first metal layer, on the first surface of this sandwich layer, form the first line layer with the first electric contact mat, and in this through hole, form conductive through hole to be electrically connected this first line layer; Formation first insulating protective layer on the first surface and first line layer of this sandwich layer, and expose this first electric contact mat, to form first surface processing layer on the exposed surface of this first electric contact mat; On this first insulating protective layer by adhesion coating in conjunction with a bearing part; Remove this sticker part, to isolate two substrates body; The bearing part of this two substrates body is spliced mutually by conjunction, to expose this second metal level; This second metal level is formed second line layer with the second electric contact mat, and this second line layer is electrically connected this conductive through hole; On the second surface and the second line layer of this sandwich layer, form the second insulating protective layer, and expose this second electric contact mat, to form second surface processing layer on the exposed surface of this second electric contact mat, to form two base plate for packaging; And remove this conjunction, to be separated this two base plate for packaging.
According to above-mentioned method for making, before this second line layer of making, first the bearing part of this two substrates body can be spliced mutually by conjunction.
In aforesaid base plate for packaging and method for making thereof, the material of this adhesion coating can be seccotine or mould release, and the material of this bearing part can be high temperature resistant material.
In addition, the thickness that the thickness of aforesaid base plate for packaging deducts this bearing part should be less than 150m.
As from the foregoing, base plate for packaging of the present invention and method for making thereof, by the first insulating protective layer of this base plate for packaging in conjunction with bearing part, with avoid in transport time or encapsulation time break because of too thin.Moreover remove this bearing part again after encapsulation, the thickness of base plate for packaging is now less than 150 μm, so compared to prior art, can reduce the integral thickness of encapsulating structure.Therefore, the demand of product microminiaturization and reliability can be met by base plate for packaging of the present invention simultaneously.
Accompanying drawing explanation
Figure 1A to Fig. 1 C is the cross-sectional schematic of the method for making of the base plate for packaging of existing double-deck circuit;
Fig. 2 A to Fig. 2 I is the cross-sectional schematic of the method for making of base plate for packaging of the present invention; Another embodiment that Fig. 2 F ' is Fig. 2 F; And
Fig. 3 A to Fig. 3 C is the cross-sectional schematic of another embodiment of the method for making of base plate for packaging of the present invention.
Primary clustering symbol description
1,2 base plate for packaging
10,20 sandwich layers
10a, 20a first surface
10b, 20b second surface
100,200 through holes
11a, 21a the first metal layer
11b, 21b second metal level
12 conductive layers
13a, 23a first line layer
13b, 23b second line layer
130a, 230a first electric contact mat
130b, 230b second electric contact mat
14,24 conductive through holes
15a, 25a first insulating protective layer
15b, 25b second insulating protective layer
150a, 250a first perforate
150b, 250b second perforate
16a, 26a first surface processing layer
16b, 26b second surface processing layer
2a substrate body
22 sticker parts
27 bearing parts
270 adhesion coatings
28 conjunctions
L, d, S thickness
The remaining thickness of h.
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, for understanding and the reading of those skilled in the art, and be not used to limit the enforceable qualifications of the present invention, so the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " one ", " two ", " on " etc. term, be also only be convenient to describe understand, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, also when being considered as the enforceable category of the present invention.
Referring to Fig. 2 A to Fig. 2 I, is the cross-sectional schematic of the method for making of base plate for packaging 2 of the present invention.
As shown in Figure 2 A, first, two sandwich layers 20 are provided, this sandwich layer 20 has relative first surface 20a and second surface 20b, and first and second surperficial 20a of this sandwich layer 20,20b has respectively the first metal layer 21a and the second metal level 21b, the first surface 20a of this sandwich layer 20 again has the multiple through holes 200 running through this first metal layer 21a, exposes to those through holes 200 to make this second metal level 21b.
Then, the second metal level 21b of respectively this sandwich layer 20 is combined by multiple sticker part 22, with storehouse two sandwich layer 20.
Described sandwich layer 20 can be such as span and carrys out vinegar imines-triazine (Bismaleimide-Triazine, BT) organic polymer materials, also can be the dielectric material as prepreg (prepreg), and the thickness of this sandwich layer 20 is less than 60 μm, and this first and second metal level 21a, 21b is copper, and this sticker part 22 can be blob of viscose again.
Though the thickness of sandwich layer 20 of the present invention is less than 60 μm, by storehouse two sandwich layer 20, to increase integral thickness in time making this base plate for packaging 2, the equipment that original packaged substrate technology is used can be used, thus can reduce cost of manufacture.
As shown in Figure 2 B, carry out Patternized technique, with by this first metal layer 21a, first line layer 23a is formed on the first surface 20a of this sandwich layer 20, and in this through hole 200, forming conductive through hole 24 to be electrically connected this first line layer 23a, this first line layer 23a has multiple first electric contact mat 230a again.
Relevant circuit technique thereof is of a great variety, and there is no particular restriction, and the technical characteristic of its non-invention, so do not describe in detail, hereby state clearly.
As shown in Figure 2 C, formation first insulating protective layer 25a on the first surface 20a and first line layer 23a of this sandwich layer 20, and this first insulating protective layer 25a has multiple first perforate 250a, exposes those first electric contact mats 230a with correspondence.In other embodiment, also can by the apparent height reducing this first insulating protective layer 25a, make the height of this first electric contact mat 230a higher than or flush the apparent height of this first insulating protective layer 25a, to expose those first electric contact mats 230a.Omit this first insulating protective layer 25a in figure and be formed at structure on this first line layer 23a.
Then, the first electric contact mat 230a in those first perforates 250a is formed first surface processing layer 26a.
As shown in Figure 2 D, on this first insulating protective layer 25a by adhesion coating 270 in conjunction with a bearing part 27.In the present embodiment, the material of this adhesion coating 270 such as: seccotine, mould release etc., and the material of this bearing part 27 is high temperature resistant material, such as copper clad laminate (Copper cladlaminate, CCL).
As shown in Figure 2 E, remove those sticker parts 22, to isolate two substrates body 2a.
As shown in Fig. 2 F or Fig. 2 F ', by the bearing part 27 of this two substrates body 2a by conjunction 28,28 ' splices mutually, to expose this second metal level 21b.In the present embodiment, this conjunction 28,28 ' is adhesion projection (as Suo Shi Fig. 2 F ') or glue-line (as shown in Figure 2 F).
As shown in Figure 2 G, hookup 2F technique, forms the second line layer 23b by this second metal level 21b, and this second line layer 23b is electrically connected this conductive through hole 24, and this second line layer 23b has multiple second electric contact mat 230b again.
As illustrated in figure 2h; formation second insulating protective layer 25b on the second surface 20b and the second line layer 23b of this sandwich layer 20; and this second insulating protective layer 25b has multiple second perforate 250b, expose those second electric contact mats 230b with correspondence, to form two base plate for packaging 2.Omit this second insulating protective layer 25b in figure and be formed at structure on this second line layer 23b.
Then, on the exposed surface of those second electric contact mats 250b, second surface processing layer 26b is formed.
In other embodiment, also can by the apparent height reducing this second insulating protective layer 25b, make the height of this second electric contact mat 250b higher than or flush the apparent height of this second insulating protective layer 25b, to expose those second electric contact mats 250b.
As shown in figure 2i, remove this conjunction 28, to be separated this two base plate for packaging 2, and the remaining thickness h that the thickness L of this base plate for packaging 2 deducts the thickness d of this bearing part 27 (this adhesion coating 270 is very thin, can ignore) is less than 150 μm.In addition, about the thickness d of this bearing part 27 can be done to change on demand, there is no particular restriction.
Refer to Fig. 3 A to Fig. 3 C, it is the cross-sectional schematic of another embodiment of the method for making of base plate for packaging 2 of the present invention.
As shown in Figure 3A, it is the technique of Fig. 2 E, removes those sticker parts 22, to isolate two substrates body 2a.
As shown in Figure 3 B, not storehouse two substrates body 2a, directly forms the second line layer 23b by this second metal level 21b, and this second line layer 23b is electrically connected this conductive through hole 24, and this second line layer 23b has multiple second electric contact mat 230b again.
As shown in Figure 3 C; formation second insulating protective layer 25b on the second surface 20b and the second line layer 23b of this sandwich layer 20; and this second insulating protective layer 25b has multiple second perforate 250b, expose those second electric contact mats 230b with correspondence, to form this base plate for packaging 2.Omit this second insulating protective layer 25b in figure and be formed at structure on this second line layer 23b.
Then, second surface processing layer 26b is formed on the exposed surface of those second electric contact mats 250b, and the remaining thickness h that the thickness L of this base plate for packaging 2 deducts the thickness d of this bearing part 27 (this adhesion coating 270 is very thin, can ignore) is less than 150 μm.
When general wish making thickness is less than the substrate of 150 μm, new technology equipment need be reconfigured, thus increase cost of manufacture.Though the remaining thickness h of base plate for packaging 2 of the present invention is less than 150 μm, but by the thickness d of this bearing part 27, with in time making this base plate for packaging 2, its integral thickness L can be more than or equal to 150 μm, so the equipment that original packaged substrate technology can be used used, thus cost of manufacture can not be increased.
In addition, base plate for packaging 2 of the present invention, in subsequent technique, carries out packaging technology by carries chips on this second insulating protective layer 25b (figure slightly), then removes this bearing part 27, to make encapsulating structure.Therefore, the remaining thickness h that thickness L by this base plate for packaging 2 deducts the thickness d of this bearing part 27 is less than 150 μm, to reduce the integral thickness of encapsulating structure, so compared to prior art, the present invention can make the thickness of this base plate for packaging 2 be less than 150 μm on demand, to meet the demand of microminiaturization.
Moreover after packaging technology, this base plate for packaging 2 has this bearing part 27, to promote the intensity of overall package substrate 2, so compared to prior art, base plate for packaging 2 of the present invention can not break in time transporting or when encapsulating.
In addition, by stacked manner, such as: storehouse two sandwich layer 20 or storehouse two substrates body 2a, can make two batches of plate amounts, to promote production capacity simultaneously.
The present invention also provides a kind of base plate for packaging 2, comprise: one has relative first surface 20a and the sandwich layer 20 of second surface 20b, be located at the first line layer 23a on the first surface 20a of this sandwich layer 20, be located at the second line layer 23b on the second surface 20b of this sandwich layer 20, be located at the multiple conductive through holes 24 in this sandwich layer 20, be located at the first insulating protective layer 25a on the first surface 20a of this sandwich layer 20 and first line layer 23a, be located at the second insulating protective layer 25b on the second surface 20b of this sandwich layer 20 and the second line layer 23b, and the bearing part 27 be incorporated on this first insulating protective layer 25a.
Described first line layer 23a has multiple first electric contact mat 230a, and the second described line layer 23b has multiple second electric contact mat 230b, and described conductive through hole 24 is electrically connected this first and second line layer 23a, 23b.
The first described insulating protective layer 25a has multiple first perforate 250a, exposes those first electric contact mats 230a with correspondence, and the first electric contact mat 230a in those first perforates 250a is formed first surface processing layer 26a.
The second described insulating protective layer 25b has multiple second perforate 250b, exposes those second electric contact mats 230b with correspondence, and the second electric contact mat 230b in those second perforates 250b is formed second surface processing layer 26b.
Described bearing part 27 is incorporated on those the first electric contact mat 230a and this first insulating protective layer 25a by adhesion coating 270.In the present embodiment, the material of this adhesion coating 270 is seccotine or mould release, and the material of this bearing part 27 is high temperature resistant material.
In addition, the remaining thickness h that the thickness L of described base plate for packaging 2 deducts the thickness d of this bearing part 27 is less than 150 μm.
In sum, base plate for packaging of the present invention and method for making thereof, mainly by the first insulating protective layer of this base plate for packaging in conjunction with bearing part, to promote the intensity of overall package substrate, effectively anti-when terminating in transport or encapsulation time the problem of breaking.
In addition, after encapsulation, remove this bearing part again, the thickness of base plate for packaging is now less than 150 μm, so can reduce the integral thickness of encapsulating structure, to meet the demand of product microminiaturization and reliability simultaneously.
Above-described embodiment only in order to illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any those skilled in the art all without prejudice under spirit of the present invention and category, can modify to above-described embodiment.Therefore the scope of the present invention, should listed by claims.
Claims (10)
1. a base plate for packaging, it comprises:
Sandwich layer, has relative first surface and second surface;
First line layer, it is located on the first surface of this sandwich layer, and has the first electric contact mat;
Second line layer, it is located on the second surface of this sandwich layer, and has the second electric contact mat;
Conductive through hole, it is located in this sandwich layer, to be electrically connected this first and second line layer;
First insulating protective layer, on its first surface being located at this sandwich layer and first line layer, and exposes this first electric contact mat;
First surface processing layer, is formed on the exposed surface of this first electric contact mat;
Second insulating protective layer, on its second surface being located at this sandwich layer and the second line layer, and exposes this second electric contact mat;
Second surface processing layer, it is formed on the exposed surface of this second electric contact mat; And
Bearing part, has two relative flat surfaces, and it is incorporated on this first insulating protective layer by adhesion coating.
2. base plate for packaging according to claim 1, is characterized in that, the material of this adhesion coating is seccotine or mould release.
3. base plate for packaging according to claim 1, is characterized in that, the material of this bearing part is high temperature resistant material.
4. a method for making for base plate for packaging, it comprises:
Two sandwich layers are provided, this sandwich layer has relative first surface and second surface, and first and second of this sandwich layer has the first metal layer and the second metal level on the surface respectively, the first surface of this sandwich layer again has the through hole running through this first metal layer, exposes to this through hole to make this second metal level;
By sticker part in conjunction with this second metal level, to connect this two sandwich layer;
By this first metal layer, on the first surface of this sandwich layer, form the first line layer with the first electric contact mat, and in this through hole, form conductive through hole to be electrically connected this first line layer;
Formation first insulating protective layer on the first surface and first line layer of this sandwich layer, and expose this first electric contact mat, to form first surface processing layer on the exposed surface of this first electric contact mat;
On this first insulating protective layer by adhesion coating in conjunction with a bearing part;
Remove this sticker part, to isolate two substrates body;
The bearing part of this two substrates body is spliced mutually by conjunction, to expose this second metal level;
This second metal level is formed second line layer with the second electric contact mat, and this second line layer is electrically connected this conductive through hole;
On the second surface and the second line layer of this sandwich layer, form the second insulating protective layer, and expose this second electric contact mat, to form second surface processing layer on the exposed surface of this second electric contact mat, to form two base plate for packaging; And
Remove this conjunction, to be separated this two base plate for packaging.
5. the method for making of base plate for packaging according to claim 4, is characterized in that, this conjunction is adhesion projection or glue-line.
6. the method for making of base plate for packaging according to claim 4, is characterized in that, the material of this adhesion coating is seccotine or mould release.
7. the method for making of base plate for packaging according to claim 4, is characterized in that, the material of this bearing part is high temperature resistant material.
8. a method for making for base plate for packaging, it comprises:
Two sandwich layers are provided, this sandwich layer has relative first surface and second surface, and first and second of this sandwich layer has the first metal layer and the second metal level on the surface respectively, the first surface of this sandwich layer again has the through hole running through this first metal layer, exposes to this through hole to make this second metal level;
By sticker part in conjunction with this second metal level, to connect this two sandwich layer;
By this first metal layer, on the first surface of this sandwich layer, form the first line layer with the first electric contact mat, and in this through hole, form conductive through hole to be electrically connected this first line layer;
Formation first insulating protective layer on the first surface and first line layer of this sandwich layer, and expose this first electric contact mat, to form first surface processing layer on the exposed surface of this first electric contact mat;
On this first insulating protective layer by adhesion coating in conjunction with a bearing part;
Remove this sticker part, to isolate two substrates body;
This second metal level is formed second line layer with the second electric contact mat, and this second line layer is electrically connected this conductive through hole; And
On the second surface and the second line layer of this sandwich layer, form the second insulating protective layer, and expose this second electric contact mat, to form second surface processing layer on the exposed surface of this second electric contact mat.
9. the method for making of base plate for packaging according to claim 8, is characterized in that, the material of this adhesion coating is seccotine or mould release.
10. the method for making of base plate for packaging according to claim 8, is characterized in that, the material of this bearing part is high temperature resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110330017.XA CN103066049B (en) | 2011-10-24 | 2011-10-24 | Base plate for packaging and method for making thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110330017.XA CN103066049B (en) | 2011-10-24 | 2011-10-24 | Base plate for packaging and method for making thereof |
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| CN103066049A CN103066049A (en) | 2013-04-24 |
| CN103066049B true CN103066049B (en) | 2015-09-02 |
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| CN107680942B (en) * | 2016-08-01 | 2019-10-11 | 欣兴电子股份有限公司 | Line carrier plate and preparation method thereof |
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|---|---|---|---|---|
| CN1491076A (en) * | 2002-09-17 | 2004-04-21 | �¹������ҵ��ʽ���� | Method for preparing wiring placode |
| TW201029130A (en) * | 2009-01-16 | 2010-08-01 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
| TW201101441A (en) * | 2009-06-23 | 2011-01-01 | Phoenix Prec Technology Corp | Package substrate and base therefor and fabrication method thereof |
| CN102194703A (en) * | 2010-03-16 | 2011-09-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4541763B2 (en) * | 2004-01-19 | 2010-09-08 | 新光電気工業株式会社 | Circuit board manufacturing method |
| JP2007335698A (en) * | 2006-06-16 | 2007-12-27 | Fujitsu Ltd | Manufacturing method of wiring board |
| US8017439B2 (en) * | 2010-01-26 | 2011-09-13 | Texas Instruments Incorporated | Dual carrier for joining IC die or wafers to TSV wafers |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1491076A (en) * | 2002-09-17 | 2004-04-21 | �¹������ҵ��ʽ���� | Method for preparing wiring placode |
| TW201029130A (en) * | 2009-01-16 | 2010-08-01 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
| TW201101441A (en) * | 2009-06-23 | 2011-01-01 | Phoenix Prec Technology Corp | Package substrate and base therefor and fabrication method thereof |
| CN102194703A (en) * | 2010-03-16 | 2011-09-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
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