CN103066049A - Package substrate and manufacture method thereof - Google Patents
Package substrate and manufacture method thereof Download PDFInfo
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- CN103066049A CN103066049A CN201110330017XA CN201110330017A CN103066049A CN 103066049 A CN103066049 A CN 103066049A CN 201110330017X A CN201110330017X A CN 201110330017XA CN 201110330017 A CN201110330017 A CN 201110330017A CN 103066049 A CN103066049 A CN 103066049A
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- layer
- electric contact
- base plate
- contact mat
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Abstract
The invention discloses a package substrate and a manufacture method of the package substrate. The package substrate comprises a core layer, two line layers, a plurality of conductive through holes, two insulation protection layers and a bearing piece, wherein the core layer is provided with two opposite surfaces, the two line layers are arranged on the two surfaces of the core layer, the plurality of conductive through holes are formed in the core layer, the two insulation protection layers are respectively arranged on the two surfaces of the core layer and the two line layers, and the bearing piece is arranged on the insulation protection layer of one of the surfaces of the core layer in a combined mode. The bearing piece is arranged on one side of the package substrate in the combined mode, and therefore the package substrate is prevented from breaking in a transporting process or in a packaging process due to the fact that the package substrate is too thin.
Description
Technical field
The present invention relates to a kind of base plate for packaging and method for making thereof, espespecially a kind of base plate for packaging and method for making thereof that is beneficial to the product thinning.
Background technology
Flourish along with electronic industry, electronic product multi-functional, the high performance trend of also marching toward gradually.In order to satisfy the package requirements of semiconductor package part microminiaturization (miniaturization), and towards the thickness development of the base plate for packaging that reduces carries chips.The base plate for packaging that is used at present carries chips can be divided into hard material and soft material, and the base plate for packaging that generally is used for ball grid array packages (Ball Grid Array, BGA) is to select the hard material.
See also Figure 1A to Fig. 1 C, it is the generalized section of the method for making of the base plate for packaging 1 of existing double-deck circuit.
Shown in Figure 1A, at first, two sandwich layers 10 are provided, respectively this sandwich layer 10 has relative first surface 10a and second surface 10b, and the surperficial 10a of first and second of this sandwich layer 10, have respectively a first metal layer 11a and one second metal level 11b on the 10b, this sandwich layer 10 has the surperficial 10a of connection this first and second, a plurality of through holes 100 of 10b again.
As shown in Figure 1B, carry out Patternized technique, with by this first and second metal level 11a, 11b (utilizing conductive layer 12 to carry out plated metal), first and second surperficial 10a in this sandwich layer 10, form respectively first and second line layer 13a on the 10b, 13b, and in those through holes 100, form conductive through hole 14 to be electrically connected this first and second line layer 13a, 13b, this first and second line layer 13a again, 13b has respectively a plurality of first and second electric contact mat 130a, 130b.
Shown in Fig. 1 C; first and second surperficial 10a in this sandwich layer 10; form respectively first and second insulating protective layer 15a on the 10b; 15b, and this first and second insulating protective layer 15a, 15b has respectively a plurality of first and second perforate 150a; 150b; to make those first and second electric contact mats 130a, the 130b correspondence exposes to respectively this first and second perforate 150a, 150b.Then, in those first and second electric contact mats 150a, form respectively first and second surface-treated layer 16a on the exposed surface of 150b, 16b.
In subsequent technique, it is in the upper carries chips of this second insulating protective layer 15b and carry out packaging technology, to make encapsulating structure.In order to meet the demand of microminiaturization and reliability, in present technology, the thickness S of this base plate for packaging 1 can be contracted to 150 μ m.
Yet, increase in demand along with microminiaturization, thickness is that the base plate for packaging 1 of 150 μ m can't satisfy now the demand to the packaging part microminiaturization, if but the thickness S that makes this base plate for packaging 1 is less than 150 μ m, then this base plate for packaging 1 when transporting or encapsulation the time will easily break because of too thin, cause using or product bad.
Therefore, how to overcome the technical bottleneck that above-mentioned prior art can't satisfy the demand of product microminiaturization and reliability simultaneously, become in fact the problem of desiring most ardently at present solution.
Summary of the invention
In view of the disadvantages of above-mentioned prior art, main purpose of the present invention is to disclose a kind of base plate for packaging, with avoid when transporting or during encapsulation because of thin breaking too.
The disclosed base plate for packaging of the present invention comprises: sandwich layer has relative first surface and second surface; The first line layer, it is located on the first surface of this sandwich layer, and has the first electric contact mat; The second line layer, it is located on the second surface of this sandwich layer, and has the second electric contact mat; Conductive through hole, it is located in this sandwich layer, to be electrically connected this first and second line layer; The first insulating protective layer, it is located on the first surface and the first line layer of this sandwich layer, and exposes this first electric contact mat; The first surface processing layer is formed on the exposed surface of this first electric contact mat; The second surface processing layer, it is formed on the exposed surface of this second electric contact mat; And bearing part, it is incorporated on this first insulating protective layer by adhesion coating.
The present invention also provides a kind of method for making of base plate for packaging, it comprises: two sandwich layers are provided, this sandwich layer has relative first surface and second surface, and have respectively the first metal layer and the second metal level on first and second surface of this sandwich layer, have the through hole that runs through this first metal layer on the first surface of this sandwich layer again, expose to this through hole to make this second metal level; By sticker part in conjunction with this second metal level, to connect this two sandwich layer; By this first metal layer, on the first surface of this sandwich layer, form the first line layer with first electric contact mat, and in this through hole, form conductive through hole to be electrically connected this first line layer; On the first surface of this sandwich layer and the first line layer, form the first insulating protective layer, and expose this first electric contact mat, on the exposed surface of this first electric contact mat, to form the first surface processing layer; On this first insulating protective layer by adhesion coating in conjunction with a bearing part; Remove this sticker part, to isolate the two substrates body; The bearing part of this two substrates body is spliced mutually by conjunction, to expose this second metal level; This second metal level is formed the second line layer with second electric contact mat, and this second line layer is electrically connected this conductive through hole; On the second surface of this sandwich layer and the second line layer, form the second insulating protective layer, and expose this second electric contact mat, on the exposed surface of this second electric contact mat, to form the second surface processing layer, to form two base plate for packaging; And remove this conjunction, to separate this two base plate for packaging.
According to above-mentioned method for making, can be before making this second line layer, the bearing part with this two substrates body splices mutually by conjunction first.
In aforesaid base plate for packaging and the method for making thereof, the material of this adhesion coating can be seccotine or mould release, and the material of this bearing part can be high temperature resistant material.
In addition, the thickness of aforesaid base plate for packaging deduct the thickness of this bearing part should be less than 150m.
As from the foregoing, base plate for packaging of the present invention and method for making thereof, by on the first insulating protective layer of this base plate for packaging in conjunction with bearing part, with avoid when transporting or during encapsulation because of thin breaking too.Moreover, after encapsulation, removing again this bearing part, the thickness of the base plate for packaging of this moment is less than 150 μ m, so than prior art, can reduce the integral thickness of encapsulating structure.Therefore, can satisfy simultaneously the demand of product microminiaturization and reliability by base plate for packaging of the present invention.
Description of drawings
Figure 1A to Fig. 1 C is the cross-sectional schematic of the method for making of the base plate for packaging of existing double-deck circuit;
Fig. 2 A to Fig. 2 I is the cross-sectional schematic of the method for making of base plate for packaging of the present invention; Fig. 2 F ' is another embodiment of Fig. 2 F; And
Fig. 3 A to Fig. 3 C is the cross-sectional schematic of another embodiment of the method for making of base plate for packaging of the present invention.
The primary clustering symbol description
1,2 base plate for packaging
10,20 sandwich layers
10a, the 20a first surface
10b, the 20b second surface
100,200 through holes
11a, the 21a the first metal layer
11b, 21b the second metal level
12 conductive layers
13a, 23a the first line layer
13b, 23b the second line layer
130a, 230a the first electric contact mat
130b, 230b the second electric contact mat
14,24 conductive through holes
15a, 25a the first insulating protective layer
15b, 25b the second insulating protective layer
150a, 250a the first perforate
150b, 250b the second perforate
16a, 26a first surface processing layer
16b, 26b second surface processing layer
The 2a substrate body
22 sticker parts
27 bearing parts
270 adhesion coatings
28 conjunctions
L, d, S thickness
The last thickness of h.
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, the appended graphic structure that illustrates of this specification, ratio, size etc., equal contents in order to cooperate specification to disclose only, understanding and reading for those skilled in the art, be not to limit the enforceable qualifications of the present invention, so technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under the effect that the present invention can produce and the purpose that can reach, all should still drop on disclosed technology contents and get in the scope that can contain.Simultaneously, quote in this specification as " one ", " two ", " on " etc. term, also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, also ought be considered as the enforceable category of the present invention.
See also Fig. 2 A to Fig. 2 I, be the cross-sectional schematic of the method for making of base plate for packaging 2 of the present invention.
Shown in Fig. 2 A, at first, two sandwich layers 20 are provided, this sandwich layer 20 has relative first surface 20a and second surface 20b, and the surperficial 20a of first and second of this sandwich layer 20, have respectively the first metal layer 21a and the second metal level 21b on the 20b, have a plurality of through holes 200 that run through this first metal layer 21a on the first surface 20a of this sandwich layer 20 again, expose to those through holes 200 to make this second metal level 21b.
Then, by a plurality of sticker parts 22 in conjunction with the second metal level 21b of this sandwich layer 20 respectively, with storehouse two sandwich layers 20.
Described sandwich layer 20 for example can be, and span comes vinegar imines-triazine (Bismaleimide-Triazine, BT) organic polymer materials, also can be the dielectric material such as prepreg (prepreg), and the thickness of this sandwich layer 20 is less than 60 μ m, and this first and second metal level 21a, 21b is copper, and this sticker part 22 can be blob of viscose again.
Though the thickness of sandwich layer 20 of the present invention less than 60 μ m, by storehouse two sandwich layers 20, to increase integral thickness when making this base plate for packaging 2, can use the used equipment of original packaged substrate technology, thereby can reduce cost of manufacture.
Shown in Fig. 2 B, carry out Patternized technique, with by this first metal layer 21a, in the upper first line layer 23a that forms of the first surface 20a of this sandwich layer 20, and form conductive through hole 24 to be electrically connected this first line layer 23a in this through hole 200, this first line layer 23a has a plurality of the first electric contact mat 230a again.
Relevant circuit technique thereof is of a great variety, and there is no particular restriction, and its non-technical characterictic of the present invention, so do not describe in detail, hereby states clearly.
Shown in Fig. 2 C, in the first surface 20a of this sandwich layer 20 and the first line layer 23a is upper forms the first insulating protective layer 25a, and this first insulating protective layer 25a has a plurality of the first perforate 250a, exposes those first electric contact mats 230a with correspondence.In other embodiment, also can be by the apparent height that reduces this first insulating protective layer 25a, make the height of this first electric contact mat 230a be higher than or flush the apparent height of this first insulating protective layer 25a, to expose those first electric contact mats 230a.This first insulating protective layer of omission 25a is formed at the structure on this first line layer 23a among the figure.
Then, the upper first surface processing layer 26a that forms of the first electric contact mat 230a in those first perforates 250a.
Shown in Fig. 2 D, go up by adhesion coating 270 in conjunction with a bearing part 27 in this first insulating protective layer 25a.In the present embodiment, the material of this adhesion coating 270 such as seccotine, mould release etc., and the material of this bearing part 27 is high temperature resistant material, for example copper clad laminate (Copper clad laminate, CCL).
Shown in Fig. 2 E, remove those sticker parts 22, to isolate two substrates body 2a.
Shown in Fig. 2 F or Fig. 2 F ', by conjunction 28,28 ' splices mutually, to expose this second metal level 21b with the bearing part 27 of this two substrates body 2a.In the present embodiment, this conjunction 28,28 ' is adhesion projection (shown in Fig. 2 F ') or glue-line (shown in Fig. 2 F).
Shown in Fig. 2 G, hookup 2F technique forms the second line layer 23b with this second metal level 21b, and this second line layer 23b is electrically connected this conductive through hole 24, and this second line layer 23b has a plurality of the second electric contact mat 230b again.
Shown in Fig. 2 H; second surface 20b and the upper second insulating protective layer 25b that forms of the second line layer 23b in this sandwich layer 20; and this second insulating protective layer 25b has a plurality of the second perforate 250b, exposes those second electric contact mats 230b with correspondence, to form two base plate for packaging 2.This second insulating protective layer of omission 25b is formed at the structure on this second line layer 23b among the figure.
Then, on the exposed surface of those second electric contact mats 250b, form second surface processing layer 26b.
In other embodiment, also can be by the apparent height that reduces this second insulating protective layer 25b, make the height of this second electric contact mat 250b be higher than or flush the apparent height of this second insulating protective layer 25b, to expose those second electric contact mats 250b.
Shown in Fig. 2 I, remove this conjunction 28, separating this two base plate for packaging 2, and the thickness L of this base plate for packaging 2 deducts the last thickness h of thickness d of this bearing part 27 (this adhesion coating 270 can be ignored as thin as a wafer) less than 150 μ m.In addition, the thickness d of relevant this bearing part 27 can change on demand, and there is no particular restriction.
See also Fig. 3 A to Fig. 3 C, it is the cross-sectional schematic of another embodiment of the method for making of base plate for packaging 2 of the present invention.
As shown in Figure 3A, it is the technique of Fig. 2 E, removes those sticker parts 22, to isolate two substrates body 2a.
Shown in Fig. 3 B, storehouse two substrates body 2a does not directly form the second line layer 23b with this second metal level 21b, and this second line layer 23b is electrically connected this conductive through hole 24, and this second line layer 23b has a plurality of the second electric contact mat 230b again.
Shown in Fig. 3 C; second surface 20b and the upper second insulating protective layer 25b that forms of the second line layer 23b in this sandwich layer 20; and this second insulating protective layer 25b has a plurality of the second perforate 250b, exposes those second electric contact mats 230b with correspondence, to form this base plate for packaging 2.This second insulating protective layer of omission 25b is formed at the structure on this second line layer 23b among the figure.
Then, on the exposed surface of those second electric contact mats 250b, form second surface processing layer 26b, and the thickness L of this base plate for packaging 2 deducts the last thickness h of thickness d of this bearing part 27 (this adhesion coating 270 can be ignored as thin as a wafer) less than 150 μ m.
When general wish is made thickness less than the substrate of 150 μ m, need reconfigure new technology equipment, thereby increase cost of manufacture.Though the last thickness h of base plate for packaging 2 of the present invention is less than 150 μ m, but by the thickness d of this bearing part 27, with when making this base plate for packaging 2, its integral thickness L can be more than or equal to 150 μ m, so can use the used equipment of original packaged substrate technology, thereby can not increase cost of manufacture.
In addition, base plate for packaging 2 of the present invention by going up carries chips (figure slightly) in this second insulating protective layer 25b and carrying out packaging technology, removes this bearing part 27, to make encapsulating structure again in subsequent technique.Therefore, deduct the last thickness h of thickness d of this bearing part 27 by the thickness L of this base plate for packaging 2 less than 150 μ m, to reduce the integral thickness of encapsulating structure, so than prior art, the present invention can make the thickness of this base plate for packaging 2 less than 150 μ m, to satisfy the demand of microminiaturization on demand.
Moreover after packaging technology, this base plate for packaging 2 has this bearing part 27, promoting the intensity of overall package substrate 2, so than prior art, base plate for packaging 2 of the present invention can not break when transporting or during encapsulation.
In addition, by the storehouse mode, for example: storehouse two sandwich layers 20 or storehouse two substrates body 2a, can make two batches of plate amounts, simultaneously to promote production capacity.
The present invention also provides a kind of base plate for packaging 2, comprising: one has relative first surface 20a and the sandwich layer 20 of second surface 20b; be located at the first line layer 23a on the first surface 20a of this sandwich layer 20; be located at the second line layer 23b on the second surface 20b of this sandwich layer 20; be located at a plurality of conductive through holes 24 in this sandwich layer 20; be located at the first surface 20a of this sandwich layer 20 and the first insulating protective layer 25a on the first line layer 23a; be located at the second surface 20b of this sandwich layer 20 and the second insulating protective layer 25b on the second line layer 23b; and be incorporated into bearing part 27 on this first insulating protective layer 25a.
Described the first line layer 23a has a plurality of the first electric contact mat 230a, and described the second line layer 23b has a plurality of the second electric contact mat 230b, and described conductive through hole 24 is electrically connected this first and second line layer 23a, 23b.
Described the first insulating protective layer 25a has a plurality of the first perforate 250a, exposes those first electric contact mats 230a with correspondence, and the upper first surface processing layer 26a that forms of the first electric contact mat 230a in those first perforates 250a.
Described the second insulating protective layer 25b has a plurality of the second perforate 250b, exposes those second electric contact mats 230b with correspondence, and the upper second surface processing layer 26b that forms of the second electric contact mat 230b in those second perforates 250b.
Described bearing part 27 is incorporated on those the first electric contact mat 230a and this first insulating protective layer 25a by adhesion coating 270.In the present embodiment, the material of this adhesion coating 270 is seccotine or mould release, and the material of this bearing part 27 is high temperature resistant material.
In addition, the thickness L of described base plate for packaging 2 deducts the last thickness h of thickness d of this bearing part 27 less than 150 μ m.
In sum, base plate for packaging of the present invention and method for making thereof, mainly by on the first insulating protective layer of this base plate for packaging in conjunction with bearing part, promoting the intensity of overall package substrate, the effectively anti-problem that terminates in when transporting or break during encapsulation.
In addition, remove this bearing part after encapsulation, the thickness of base plate for packaging of this moment is less than 150 μ m again, thus can reduce the integral thickness of encapsulating structure, to satisfy simultaneously the demand of product microminiaturization and reliability.
Above-described embodiment is only in order to illustrative principle of the present invention and effect thereof, but not is used for restriction the present invention.Any those skilled in the art all can under spirit of the present invention and category, make amendment to above-described embodiment.So the scope of the present invention, should be listed such as claims.
Claims (10)
1. base plate for packaging, it comprises:
Sandwich layer has relative first surface and second surface;
The first line layer, it is located on the first surface of this sandwich layer, and has the first electric contact mat;
The second line layer, it is located on the second surface of this sandwich layer, and has the second electric contact mat;
Conductive through hole, it is located in this sandwich layer, to be electrically connected this first and second line layer;
The first insulating protective layer, it is located on the first surface and the first line layer of this sandwich layer, and exposes this first electric contact mat;
The first surface processing layer is formed on the exposed surface of this first electric contact mat;
The second insulating protective layer, it is located on the second surface and the second line layer of this sandwich layer, and exposes this second electric contact mat;
The second surface processing layer, it is formed on the exposed surface of this second electric contact mat; And
Bearing part, it is incorporated on this first insulating protective layer by adhesion coating.
2. base plate for packaging according to claim 1 is characterized in that, the material of this adhesion coating is seccotine or mould release.
3. base plate for packaging according to claim 1 is characterized in that, the material of this bearing part is high temperature resistant material.
4. the method for making of a base plate for packaging, it comprises:
Two sandwich layers are provided, this sandwich layer has relative first surface and second surface, and have respectively the first metal layer and the second metal level on first and second surface of this sandwich layer, have the through hole that runs through this first metal layer on the first surface of this sandwich layer again, expose to this through hole to make this second metal level;
By sticker part in conjunction with this second metal level, to connect this two sandwich layer;
By this first metal layer, on the first surface of this sandwich layer, form the first line layer with first electric contact mat, and in this through hole, form conductive through hole to be electrically connected this first line layer;
On the first surface of this sandwich layer and the first line layer, form the first insulating protective layer, and expose this first electric contact mat, on the exposed surface of this first electric contact mat, to form the first surface processing layer;
On this first insulating protective layer by adhesion coating in conjunction with a bearing part;
Remove this sticker part, to isolate the two substrates body;
The bearing part of this two substrates body is spliced mutually by conjunction, to expose this second metal level;
This second metal level is formed the second line layer with second electric contact mat, and this second line layer is electrically connected this conductive through hole;
On the second surface of this sandwich layer and the second line layer, form the second insulating protective layer, and expose this second electric contact mat, on the exposed surface of this second electric contact mat, to form the second surface processing layer, to form two base plate for packaging; And
Remove this conjunction, to separate this two base plate for packaging.
5. the method for making of base plate for packaging according to claim 4 is characterized in that, this conjunction is adhesion projection or glue-line.
6. the method for making of base plate for packaging according to claim 4 is characterized in that, the material of this adhesion coating is seccotine or mould release.
7. the method for making of base plate for packaging according to claim 4 is characterized in that, the material of this bearing part is high temperature resistant material.
8. the method for making of a base plate for packaging, it comprises:
Two sandwich layers are provided, this sandwich layer has relative first surface and second surface, and have respectively the first metal layer and the second metal level on first and second surface of this sandwich layer, have the through hole that runs through this first metal layer on the first surface of this sandwich layer again, expose to this through hole to make this second metal level;
By sticker part in conjunction with this second metal level, to connect this two sandwich layer;
By this first metal layer, on the first surface of this sandwich layer, form the first line layer with first electric contact mat, and in this through hole, form conductive through hole to be electrically connected this first line layer;
On the first surface of this sandwich layer and the first line layer, form the first insulating protective layer, and expose this first electric contact mat, on the exposed surface of this first electric contact mat, to form the first surface processing layer;
On this first insulating protective layer by adhesion coating in conjunction with a bearing part;
Remove this sticker part, to isolate the two substrates body;
This second metal level is formed the second line layer with second electric contact mat, and this second line layer is electrically connected this conductive through hole; And
On the second surface of this sandwich layer and the second line layer, form the second insulating protective layer, and expose this second electric contact mat, on the exposed surface of this second electric contact mat, to form the second surface processing layer.
9. the method for making of base plate for packaging according to claim 8 is characterized in that, the material of this adhesion coating is seccotine or mould release.
10. the method for making of base plate for packaging according to claim 8 is characterized in that, the material of this bearing part is high temperature resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110330017.XA CN103066049B (en) | 2011-10-24 | 2011-10-24 | Base plate for packaging and method for making thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110330017.XA CN103066049B (en) | 2011-10-24 | 2011-10-24 | Base plate for packaging and method for making thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN103066049A true CN103066049A (en) | 2013-04-24 |
| CN103066049B CN103066049B (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110330017.XA Expired - Fee Related CN103066049B (en) | 2011-10-24 | 2011-10-24 | Base plate for packaging and method for making thereof |
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| CN (1) | CN103066049B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107680942A (en) * | 2016-08-01 | 2018-02-09 | 欣兴电子股份有限公司 | Line carrier plate and preparation method thereof |
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| TW201029130A (en) * | 2009-01-16 | 2010-08-01 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
| TW201101441A (en) * | 2009-06-23 | 2011-01-01 | Phoenix Prec Technology Corp | Package substrate and base therefor and fabrication method thereof |
| US20110183464A1 (en) * | 2010-01-26 | 2011-07-28 | Texas Instruments Incorporated | Dual carrier for joining ic die or wafers to tsv wafers |
| CN102194703A (en) * | 2010-03-16 | 2011-09-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
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| CN1491076A (en) * | 2002-09-17 | 2004-04-21 | �¹������ҵ��ʽ���� | Method for preparing wiring placode |
| US20050155222A1 (en) * | 2004-01-19 | 2005-07-21 | Shinko Electric Industries Co., Ltd. | Circuit substrate manufacturing method |
| US20070289128A1 (en) * | 2006-06-16 | 2007-12-20 | Fujitsu Limited | Process for producing circuit board |
| TW201029130A (en) * | 2009-01-16 | 2010-08-01 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
| TW201101441A (en) * | 2009-06-23 | 2011-01-01 | Phoenix Prec Technology Corp | Package substrate and base therefor and fabrication method thereof |
| US20110183464A1 (en) * | 2010-01-26 | 2011-07-28 | Texas Instruments Incorporated | Dual carrier for joining ic die or wafers to tsv wafers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107680942A (en) * | 2016-08-01 | 2018-02-09 | 欣兴电子股份有限公司 | Line carrier plate and preparation method thereof |
| CN107680942B (en) * | 2016-08-01 | 2019-10-11 | 欣兴电子股份有限公司 | Line carrier plate and preparation method thereof |
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| Publication number | Publication date |
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| CN103066049B (en) | 2015-09-02 |
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