JP5517577B2 - Cutting tool for grooving - Google Patents

Cutting tool for grooving Download PDF

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JP5517577B2
JP5517577B2 JP2009269516A JP2009269516A JP5517577B2 JP 5517577 B2 JP5517577 B2 JP 5517577B2 JP 2009269516 A JP2009269516 A JP 2009269516A JP 2009269516 A JP2009269516 A JP 2009269516A JP 5517577 B2 JP5517577 B2 JP 5517577B2
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cutting edge
coating layer
honing
layer
grooving
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JP2011110654A (en
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佳輝 坂本
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Kyocera Corp
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Description

本発明は、基体の表面に被覆層が形成された溝入れ加工用切削工具に関する。   The present invention relates to a cutting tool for grooving in which a coating layer is formed on the surface of a substrate.

近年、切削工具においては、より効率的な切削加工が求められており、局所的に工具の切刃が摩耗または欠損して工具寿命を迎えることは好ましくない。溝入れ加工用の切削工具では、横切刃の逃げ面側に局所的な異常摩耗が発生してしまい、前切刃はさほど摩耗していないにも関わらず工具寿命となってしまう摩耗形態となることが多々あった。そのため、被覆層を厚く形成すると、被覆層が切刃部で剥離してしまうという問題があった。   In recent years, cutting tools have been demanded for more efficient cutting, and it is not preferable that the cutting edge of the tool is locally worn or chipped to reach the tool life. In a cutting tool for grooving, local abnormal wear occurs on the side of the flank of the side cutting edge, and the front cutting edge is not worn so much, but it has a wear form that becomes the tool life. There were many things that happened. Therefore, when the coating layer is formed thick, there is a problem that the coating layer peels off at the cutting edge portion.

そこで、例えば、特許文献1では、基体の表面に多層膜を形成したチップに対して、切刃稜線における多層膜の数層を除去して、被膜の剥離や刃先のチッピングを防止できたことが開示されている。   Therefore, for example, in Patent Document 1, it is possible to remove several layers of the multilayer film on the edge of the cutting edge from the chip on which the multilayer film is formed on the surface of the substrate, thereby preventing peeling of the film and chipping of the blade edge. It is disclosed.

特開平8−11005号公報JP-A-8-11005

しかしながら、特許文献1のように切刃において被覆層を数層除去する構成を単純に溝入れチップに採用しても、横切刃の逃げ面側のみが境界損傷によって異常に摩耗してしまうという不具合は解消されずに、切削加工面の面状態が悪くなってしまうことから、加工品位が悪くなって工具を交換せざるを得ず、工具寿命は延びないことがわかった。   However, even if the configuration in which several coating layers are removed from the cutting edge as in Patent Document 1 is simply adopted in the grooving chip, only the flank side of the side cutting edge is abnormally worn due to boundary damage. It was found that since the defects were not solved and the surface condition of the cut surface deteriorated, the quality of the work deteriorated and the tool had to be replaced, and the tool life was not extended.

本発明は、被覆層の前切刃および横切刃における被覆層の特性の微調整が可能であり、溝入れ切削性能に求められる前切刃および横切刃の性能の最適化が図れる溝入れチップを提供することを目的とする。   The present invention enables fine adjustment of the characteristics of the coating layer in the front cutting edge and the side cutting edge of the coating layer, and can optimize the performance of the front cutting edge and the side cutting edge required for grooving cutting performance. The purpose is to provide a chip.

本発明の溝入れ加工用切削工具は、基体の表面に被覆層を形成し、前切刃は平均結晶幅の小さい第1被覆層の単層にて構成され、横切刃は一層目が前記第1被覆層で、二層目は前記第1被覆層よりも平均結晶幅が大きい第2被覆層である多層にて構成されるとともに、前記第1被覆層と前記第2被覆層とが同じ組成からなるものである。
The cutting tool for grooving according to the present invention forms a coating layer on the surface of the substrate, the front cutting edge is constituted by a single layer of the first coating layer having a small average crystal width, and the side cutting blade has the first layer described above. In the first coating layer, the second layer is composed of a multilayer that is a second coating layer having a larger average crystal width than the first coating layer, and the first coating layer and the second coating layer are the same. It consists of a composition .

本発明の溝入れ加工用切削工具によれば、前切刃は平均結晶幅の小さい第1被覆層の単層にて構成されるので、切削を始めても切刃がダレて切れ味が悪くなることがない。また、横切刃は第1被覆層の上部に平均結晶幅の大きい第2被覆層が形成されているので、横切刃の表面は比較的早く摩耗して加工面に沿った形状になり、加工面の仕上がり状態が向上するとともに、被覆層全体としての耐摩耗性も高いものである。   According to the cutting tool for grooving of the present invention, the front cutting edge is constituted by a single layer of the first coating layer having a small average crystal width, so that the cutting edge is sagged even when cutting is started and the sharpness is deteriorated. There is no. In addition, since the second cutting layer having a large average crystal width is formed on the upper portion of the first coating layer, the surface of the horizontal cutting blade wears relatively quickly and becomes a shape along the processing surface. The finished state of the processed surface is improved and the wear resistance of the entire coating layer is high.

本発明の溝入れ加工用切削工具の好適例であるスローアウェイチップの一例についての概略斜視図である。It is a schematic perspective view about an example of the throw away tip which is a suitable example of the cutting tool for grooving of this invention. 図1のチップを(a)上方から見た概略図、(b)先端方向から見た概略図である。2A is a schematic view of the chip as viewed from above, and FIG. 2B is a schematic view of the chip as viewed from the tip. 図2(a)のA−A断面図(A)、B−B断面図(B)、C−C断面図(C)である。They are AA sectional drawing (A), BB sectional drawing (B), and CC sectional drawing (C) of Fig.2 (a). 図1のスローアウェイチップを製造するに際して、被覆層を成膜した後のホーニング処理方法を説明するための模式図である。FIG. 2 is a schematic diagram for explaining a honing treatment method after forming a coating layer when manufacturing the throw-away tip of FIG. 1.

本発明の溝入れ加工用切削工具について、その好適例であるスローアウェイチップの概略斜視図である図1、図1のチップを(a)上方から見た概略図、(b)先端方向から見た概略図である図2、図2(a)の(A)A−A断面図、(B)B−B断面図、(C)C−C断面図である図3を基に説明する。   FIG. 1 is a schematic perspective view of a throw-away tip as a preferred example of the cutting tool for grooving according to the present invention, FIG. 1A is a schematic view of the tip as viewed from above, and FIG. 2 and FIG. 2 (a), (A) AA cross-sectional view, (B) BB cross-sectional view, and (C) CC cross-sectional view, FIG.

図1に示すように、スローアウェイチップ(以下、単にチップと称す。)1は、略直方体形状のチップ本体2と、チップ本体2の端部上面に設けられたすくい面3と、すくい面3の先端縁および両端縁にそれぞれ設けられた前切刃4および横切刃5を備えており、前切刃4と横切刃5との交差部分にはノーズ切刃7が形成されている。また、図3に示すように、前切刃4と横切刃5、およびノーズ切刃7にはそれぞれ第1のホーニング11、12、13が設けられており、チップ1は基体6の表面が被覆層10で覆われている。なお、前切刃4に続く側面には前逃げ面8が、横切刃5に続く側面には横逃げ面9が形成されている。また、すくい面3上にはブレーカ突起20が形成されている。   As shown in FIG. 1, a throw-away tip (hereinafter simply referred to as a tip) 1 includes a substantially rectangular parallelepiped tip body 2, a rake face 3 provided on the upper end surface of the chip body 2, and a rake face 3. The front cutting edge 4 and the horizontal cutting edge 5 are provided at the leading edge and the both edges, respectively, and a nose cutting edge 7 is formed at the intersection of the front cutting edge 4 and the horizontal cutting edge 5. As shown in FIG. 3, the front cutting edge 4, the side cutting edge 5, and the nose cutting edge 7 are provided with first honings 11, 12, and 13, respectively. It is covered with a coating layer 10. A front relief surface 8 is formed on the side surface following the front cutting edge 4, and a side relief surface 9 is formed on the side surface following the side cutting edge 5. A breaker protrusion 20 is formed on the rake face 3.

そして、チップ1は、図3(A)の前切刃4を含む断面図に示すように、前切刃4においては基体6の表面に平均結晶幅の小さい第1被覆層10aの単層にて構成されており、図3(C)の横切刃5を含む断面図に示すように、横切刃5においては一層目が第1被覆層10aで、二層目は第1被覆層10aよりも平均結晶幅が大きい第2被覆層10bからなる多層にて構成されている。これによって、前切刃4では切削を始めても前切刃4がダレて切れ味が悪くなることがない。また、横切刃5では第1被覆層10aの上部に平均結晶幅の大きい第2被覆層10bが配置されているので、横切刃5の表面は比較的早く摩耗して加工面に沿った形状になり、加工面の仕上がり状態が向上するが、被覆層10の全体としての耐摩耗性は高い。   As shown in the cross-sectional view including the front cutting edge 4 in FIG. 3A, the chip 1 is formed as a single layer of the first covering layer 10a having a small average crystal width on the surface of the base 6 in the front cutting edge 4. As shown in the sectional view including the horizontal cutting edge 5 of FIG. 3C, the first layer is the first coating layer 10a and the second layer is the first coating layer 10a. It is comprised by the multilayer which consists of the 2nd coating layer 10b with a larger average crystal width. Thereby, even if it starts cutting with the front cutting edge 4, the front cutting edge 4 does not sag and the sharpness does not deteriorate. Further, in the horizontal cutting edge 5, the second coating layer 10b having a large average crystal width is disposed above the first coating layer 10a, so that the surface of the horizontal cutting edge 5 wears relatively quickly and follows the processing surface. The shape and the finished state of the processed surface are improved, but the overall wear resistance of the coating layer 10 is high.

なお、第1被覆層10aを構成する結晶の平均結晶幅の望ましい範囲は0.01〜0.1μmであり、第2被覆層10bを構成する結晶の平均結晶幅の望ましい範囲は0.1〜0.3μmである。これによって、前切刃4および横切刃5における耐摩耗性と耐欠損性のバランスがよい。   The desirable range of the average crystal width of the crystals constituting the first coating layer 10a is 0.01 to 0.1 μm, and the desirable range of the average crystal width of the crystals constituting the second coating layer 10b is 0.1 to 0.1 μm. 0.3 μm. This provides a good balance between wear resistance and chipping resistance in the front cutting edge 4 and the side cutting edge 5.

また、前切刃4における第1被覆層10aの望ましい厚みは0.5〜3.0μmであり、横切刃5における第1被覆層10aの望ましい厚みは0.5〜3.0μm、第2被覆層10bの望ましい厚みは2.0〜5.0μmである。これによって、前切刃4および横切刃5における耐摩耗性と耐欠損性のバランスがよい。なお、前切刃4および横切刃5における被覆層3の厚みは増減していることもあるので、前切刃4および横切刃5のそれぞれ中央の位置にて測定する。   Moreover, the desirable thickness of the 1st coating layer 10a in the front cutting edge 4 is 0.5-3.0 micrometers, The desirable thickness of the 1st coating layer 10a in the horizontal cutting edge 5 is 0.5-3.0 micrometers, 2nd. A desirable thickness of the coating layer 10b is 2.0 to 5.0 μm. This provides a good balance between wear resistance and chipping resistance in the front cutting edge 4 and the side cutting edge 5. In addition, since the thickness of the coating layer 3 in the front cutting edge 4 and the side cutting edge 5 may be increased or decreased, it is measured at the center position of each of the front cutting edge 4 and the side cutting edge 5.

さらに、前切刃4における基体6の表面には第1のホーニング11が形成されるとともに、前切刃4の第1被覆層10aの表面には第2のホーニング14が形成されており、第1のホーニング11および第2のホーニング14のすくい面3側の除去量a、aと逃げ面側の除去量b、bとを比較したとき、第1のホーニング11のa/b比の方が第2のホーニング14のa/b比よりも小さいことが望ましい。これによって、前切刃4においては切れ味を重視して耐摩耗性がさらに高くなり、横切刃5においては耐欠損性を重視してチッピングや層剥離を抑制することができる。 Further, the first honing 11 is formed on the surface of the base 6 in the front cutting edge 4, and the second honing 14 is formed on the surface of the first coating layer 10 a of the front cutting edge 4. When the removal amounts a 1 and a 2 on the rake face 3 side of the first honing 11 and the second honing 14 are compared with the removal amounts b 1 and b 2 on the flank face side, a 1 / it who b 1 ratio is less than a 2 / b 2 ratio of the second honing 14 is desirable. As a result, the cutting edge 4 emphasizes sharpness and the wear resistance is further increased, and the side cutting edge 5 emphasizes chipping resistance and can suppress chipping and delamination.

なお、チップ1は、図3に示すように、前切刃4におけるすくい角αがノーズ切刃7におけるすくい角αおよび横切刃5におけるすくい角αよりも大きくなっている。この構成によって、ノーズ切刃7の耐欠損性を向上させるという効果がある。また、図3中
、β、β、βはそれぞれ前切刃4、ノーズ切刃7および横切刃5における逃げ角である。
In the tip 1, the rake angle α 1 at the front cutting edge 4 is larger than the rake angle α 2 at the nose cutting edge 7 and the rake angle α 3 at the side cutting edge 5 as shown in FIG. This configuration has the effect of improving the fracture resistance of the nose cutting edge 7. In FIG. 3, β 1 , β 2 , and β 3 are clearance angles at the front cutting edge 4, the nose cutting edge 7, and the side cutting edge 5, respectively.

さらに、チップ1を構成する基体6は、例えば超硬合金、サーメット、セラミックス、ダイヤモンド、cBN等の硬質焼結体からなる。   Furthermore, the base 6 constituting the chip 1 is made of a hard sintered body such as cemented carbide, cermet, ceramics, diamond, or cBN.

(製造方法)
上記のチップを製造する方法について、その具体的な一例を挙げて説明する。まず、原料粉末を所定の割合に混合して所定の形状に成形し、焼成する。次に、この焼結体に対して所望によって表面研削加工を施した後、切刃部分にホーニング加工を施す。本発明の望ましい製造方法によれば、このときのホーニング処理条件は切削液を用いたブラスト処理方法を採用する。前切刃4におけるホーニング量は、すくい面3側から見たホーニング(除去)量aと前逃げ面8側から見たホーニング(除去)量bとの比a/bが小さくなる、すなわちすくい面側のホーニング量aが小さくなるように加工することが望ましい。比a/bの望ましい範囲は0.6〜1.2である。
(Production method)
A method for manufacturing the above chip will be described with a specific example. First, raw material powders are mixed at a predetermined ratio, formed into a predetermined shape, and fired. Next, the sintered body is subjected to a surface grinding process as desired, and then a honing process is performed on the cutting edge portion. According to the desirable manufacturing method of the present invention, the honing treatment conditions at this time employ a blasting method using a cutting fluid. The honing amount at the front cutting edge 4 is such that the ratio a 1 / b 1 between the honing (removal) amount a 1 viewed from the rake face 3 side and the honing (removal) amount b 1 viewed from the front flank 8 side becomes smaller. That is, it is desirable to process the honing amount a on the rake face side to be small. A desirable range of the ratio a 1 / b 1 is 0.6 to 1.2.

次に、焼成後の基体6に被覆層10を形成する。被覆層10の成膜方法としてはイオンプレーティング法等の物理蒸着(PVD)法が好適に適応可能である。ターゲットとしては、例えば、金属チタン(Ti)、金属アルミニウム(Al)、金属M(ただし、MはTiを除く周期表第4、5、6族元素、希土類元素およびSiから選ばれる1種以上)をそれぞれ独立に含有する金属ターゲット、これらを複合化した合金ターゲット、これらの化合物粉末または焼結体からなる混合物ターゲットを用いることができる。   Next, the coating layer 10 is formed on the fired substrate 6. A physical vapor deposition (PVD) method such as an ion plating method can be suitably applied as a method for forming the coating layer 10. Examples of the target include metal titanium (Ti), metal aluminum (Al), and metal M (where M is one or more selected from Group 4, 5, 6 elements, rare earth elements and Si in the periodic table excluding Ti). Can be used, a metal target containing these independently, an alloy target obtained by compounding these, and a mixture target composed of these compound powders or sintered bodies.

そして、ターゲットを用いて、アーク放電やグロー放電などにより金属源を蒸発させイオン化すると同時に、窒素源の窒素(N)ガスや炭素源のメタン(CH)/アセチレン(C)ガスと反応させることにより、基体6の表面に被覆層10が堆積する。また、プラズマを発生するためにはアーク放電やグロー放電などを用い、導入ガスとしては窒素源の窒素(N)ガスや炭素源のメタン(CH)/アセチレン(C)ガスを用いることができる。そして、窒素(N)ガスやアルゴン(Ar)ガスを流した状態で成膜する。また、成膜時のバイアス電圧は被覆層10の内部応力を小さくするために30〜125Vに設定することが望ましい。 Then, using a target, the metal source is evaporated and ionized by arc discharge, glow discharge, or the like, and at the same time, nitrogen (N 2 ) gas as a nitrogen source or methane (CH 4 ) / acetylene (C 2 H 2 ) gas as a carbon source. As a result, the coating layer 10 is deposited on the surface of the substrate 6. Further, arc discharge or glow discharge is used to generate plasma, and nitrogen (N 2 ) gas as a nitrogen source or methane (CH 4 ) / acetylene (C 2 H 2 ) gas as a carbon source is used as an introduction gas. Can be used. Then, a film is formed in a state where nitrogen (N 2 ) gas or argon (Ar) gas is supplied. Further, it is desirable that the bias voltage during film formation is set to 30 to 125 V in order to reduce the internal stress of the coating layer 10.

ここで、本実施態様においては、第1被覆層10aと第2被覆層10bとを順に成膜する。その際、同じターゲットを用いて、第1被覆層10aを成膜する際はバイアス電圧を
70〜125Vと高く設定し、第2被覆層10bを成膜する際には30〜70Vと低く設定して成膜することによって、上述した横切刃5における被覆層10の積層構成を形成することができる。
Here, in this embodiment, the 1st coating layer 10a and the 2nd coating layer 10b are formed in order. At that time, using the same target, the bias voltage is set as high as 70 to 125 V when the first cover layer 10 a is formed, and is set as low as 30 to 70 V when the second cover layer 10 b is formed. By forming the film, the laminated structure of the coating layer 10 in the horizontal cutting blade 5 described above can be formed.

そして、本実施態様によれば、成膜終了後、図4に示すように、横切刃5を含む切削工具1の表面をマスキング22に覆った状態で再びホーニング処理する。このときのホーニング処理条件は、ブラシ研磨によってホーニング加工を行うことが望ましい。具体的には、チップのすくい面側がブラシの毛先に対して対向する向きに載置してホーニング加工を行う。そして、上述した基体6の表面に施した第1のホーニング11の形状に対して、すくい面3側から見たホーニング(除去)量aと前逃げ面8側から見たホーニング(除去)量bとの比a/bが大きくなる、すなわちすくい面側のホーニング量aが大きくなるような第2のホーニング14の形状に加工することが望ましい。比a/bの望ましい範囲は、1.2〜2.0である。 Then, according to the present embodiment, after the film formation is finished, as shown in FIG. 4, the surface of the cutting tool 1 including the side cutting edge 5 is covered with the masking 22 and then honing is performed again. As the honing process conditions at this time, honing is preferably performed by brush polishing. Specifically, honing is performed by placing the rake face side of the chip in a direction facing the brush tip. Then, the honing (removal) amount a 2 viewed from the rake face 3 side and the honing (removal) amount viewed from the front flank 8 side with respect to the shape of the first honing 11 applied to the surface of the base 6 described above. the ratio a 2 / b 2 and b 2 is increased, i.e. it is desirable to process the shape of the second honing 14 as honing amount a 2 of the rake face side becomes large. A desirable range of the ratio a 2 / b 2 is 1.2 to 2.0.

WC粉末、Co粉末、Cr粉末およびVC粉末を混合し、溝入加工用スローアウェイチップ(京セラ製スローアウェイチップ型番GMM3020-040MW)のチップ形状にプレス成形し、焼成して研削加工を行い、さらに、メディアとしてMYBLAST MY−40(アルミナ粉末)を用い、ブラスト加工によりホーニング処理を行った。その後、試料を成膜装置内に載置して、窒素(N)ガスをチャンバ内に導入して表1の条件でPVD法によって表1に示す厚みの被覆層を成膜してチップを作製した(試料No.1〜6)。なお、成膜途中でバイアス電圧を表1に示す条件に変えて成膜した。その後、図4に示すように、横切刃を含むチップの前切刃部分を除く中央部分をカーボンテープでマスキングして、前切刃、ノーズ切刃および前逃げ面部分を露出させた状態でブラシ加工を施し、前切刃における第2被覆層を研磨除去した。なお、試料No.6についてはマスキングなしでブラシホーニングを行った。 WC powder, Co powder, Cr 3 C 2 powder and VC powder are mixed, press-molded into a chip shape of a throw-away chip for grooving (Kyocera throw-away chip model number GMM3020-040MW), and fired for grinding Further, honing was performed by blasting using MYBLAST MY-40 (alumina powder) as a medium. Thereafter, the sample is placed in a film forming apparatus, nitrogen (N 2 ) gas is introduced into the chamber, and a coating layer having a thickness shown in Table 1 is formed by the PVD method under the conditions shown in Table 1. It produced (sample No. 1-6). During the film formation, the bias voltage was changed to the conditions shown in Table 1 for film formation. After that, as shown in FIG. 4, the center portion excluding the front cutting edge portion of the tip including the horizontal cutting edge is masked with carbon tape, and the front cutting edge, the nose cutting edge and the front flank portion are exposed. Brush processing was performed, and the second coating layer on the front cutting edge was removed by polishing. Sample No. For No. 6, brush honing was performed without masking.

得られたチップを顕微鏡で観察して、前切刃および横切刃におけるすくい面側から見たときのホーニング量と逃げ面側から見たときのホーニング量を測定した。また、チップの前切刃および横切刃を含むそれぞれの断面について走査型電子顕微鏡観察を行って、断面の基体形状から第1のホーニング量(すくい面側から見たときのホーニング量aと逃げ面側から見たときのホーニング量b)および第2のホーニング量(すくい面側から見たときのホーニング量aと逃げ面側から見たときのホーニング量b)を見積もった。さらに、エネルギー分散型分光分析にて被覆層を構成する成分を分析し、被覆層の組成を算出した。また、上記断面において透過型電子顕微鏡観察を行い、各部位における平均結晶幅(表には結晶幅と記載)、平均厚み(表には厚みと記載)を測定した。結果は表2に示した。 The obtained chip was observed with a microscope, and the amount of honing when viewed from the rake face side of the front cutting edge and the side cutting edge and the amount of honing when viewed from the flank face side were measured. Further, each cross section including the front cutting edge and the side cutting edge of the chip is observed with a scanning electron microscope, and the first honing amount (the honing amount a 1 when viewed from the rake face side) is determined from the cross-sectional substrate shape. The honing amount b 1 ) when viewed from the flank side and the second honing amount (the honing amount a 2 when viewed from the rake side and the honing amount b 2 when viewed from the flank side) were estimated. Furthermore, components constituting the coating layer were analyzed by energy dispersive spectroscopic analysis, and the composition of the coating layer was calculated. Moreover, the transmission electron microscope observation was performed in the said cross section, and the average crystal width (it describes with a crystal width in a table | surface) and average thickness (it describes with thickness in a table | surface) in each site | part were measured. The results are shown in Table 2.

Figure 0005517577
Figure 0005517577

Figure 0005517577
Figure 0005517577

そして、このチップをホルダに装着して以下の切削試験を行い、切削性能評価を行った。
切削方法:溝入れ加工
被削材 :SNCM439
切削速度:200m/分
送り :0.1mm/rev
切込み :2.0mm
切削状態:湿式
評価方法:60分間切削した後で切刃の状態を確認し、逃げ面(先端(前切刃)、横逃げ面(横切刃))摩耗量を測定した。測定後、さらに切削加工を継続してチップが寿命に至るまでの加工可能時間を評価した。結果は表3に示した。
And this chip | tip was mounted | worn to the holder, the following cutting tests were done, and cutting performance evaluation was performed.
Cutting method: Grooving work material: SNCM439
Cutting speed: 200 m / min Feed: 0.1 mm / rev
Cutting depth: 2.0mm
Cutting state: wet evaluation method: After cutting for 60 minutes, the state of the cutting edge was confirmed, and the wear amount of the flank (tip (front cutting edge), side flank (lateral cutting edge)) was measured. After the measurement, the cutting time was further continued to evaluate the workable time until the chip reached the end of its life. The results are shown in Table 3.

Figure 0005517577
Figure 0005517577

表1〜3の結果から明らかなように、前切刃においても横切刃においても第2層を研磨除去しなかった試料No.6では、横逃げ面における摩耗の進行が早くて工具寿命が短いものであった。また、前切刃においても横切刃においても第2層を研磨除去した試料No.5でも、横逃げ面における摩耗の進行が早くて工具寿命が短いものであり、かつ切削加工面が粗いものであった。さらに、被覆層全体を同じ条件で成膜した試料No.7では、横逃げ面における被覆層に剥離が見られて比較的に早く摩耗した。   As apparent from the results of Tables 1 to 3, the sample No. 2 in which the second layer was not polished and removed by the front cutting edge or the side cutting edge was obtained. In No. 6, the progress of wear on the side clearance surface was fast and the tool life was short. In addition, the sample No. 2 in which the second layer was polished and removed in both the front cutting edge and the side cutting edge was used. No. 5, the wear on the side flank was fast, the tool life was short, and the cut surface was rough. Furthermore, sample No. 1 in which the entire coating layer was formed under the same conditions. In No. 7, the coating layer on the lateral flank face was peeled off and was worn relatively quickly.

これに対して、本発明に従い、前切刃は平均結晶幅の小さい第1被覆層の単層にて構成され、横切刃は一層目が第1被覆層で、二層目に第1被覆層よりも平均結晶幅が大きい第2被覆層の多層にて構成した試料No.1〜4では、いずれも摩耗の進行が抑制され、工具寿命も長いものであった。   On the other hand, according to the present invention, the front cutting edge is composed of a single layer of the first coating layer having a small average crystal width, and the horizontal cutting blade has the first coating layer as the first layer and the first coating as the second layer. Sample No. 2 composed of multiple layers of the second coating layer having an average crystal width larger than that of the layer. In each of 1-4, the progress of wear was suppressed, and the tool life was long.

1 スローアウェイチップ(チップ)
2 チップ本体
3 すくい面
4 前切刃
5 横切刃
6 基体
7 ノーズ切刃
8 前逃げ面
9 横逃げ面
10 被覆層
10a 第1被覆層
10b 第2被覆層
11、12、13 第1のホーニング
14 第2のホーニング
20 ブレーカ突起
22 マスキング
1 Throw away tip (chip)
2 Chip body 3 Rake face 4 Front cutting edge 5 Horizontal cutting edge 6 Base body 7 Nose cutting edge 8 Front relief face 9 Lateral relief face 10 Coating layer 10a First coating layer 10b Second coating layers 11, 12, 13 First honing 14 Second honing 20 Breaker protrusion 22 Masking

Claims (1)

基体の表面に被覆層を形成し、前切刃は平均結晶幅の小さい第1被覆層の単層にて構成され、横切刃は一層目が前記第1被覆層で、二層目は前記第1被覆層よりも平均結晶幅が大きい第2被覆層である多層にて構成されるとともに、前記第1被覆層と前記第2被覆層とが同じ組成からなる溝入れ加工用切削工具。 A coating layer is formed on the surface of the substrate, the front cutting edge is constituted by a single layer of the first coating layer having a small average crystal width, the horizontal cutting blade has the first coating layer as the first layer, and the second layer as the above. A cutting tool for grooving , which is composed of a multilayer that is a second coating layer having an average crystal width larger than that of the first coating layer, and in which the first coating layer and the second coating layer have the same composition .
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CN107570772B (en) * 2017-09-07 2020-04-28 株洲钻石切削刀具股份有限公司 Cutting insert having a plurality of different coatings on a surface thereof
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