JP5516116B2 - Electronic device module and blind device, curtain device, and lighting device using the electronic device module - Google Patents

Description

  The present invention relates to an electronic device module in which a plurality of panels on which electronic devices relating to light emission or power generation are mounted, and a blind device, a curtain device, and a lighting device on which the electronic device module is mounted.

  In recent years, lighting devices using organic EL (Electro-Luminescence) elements, LEDs (Light Emitting Diodes), solar cells, and the like have been intensively developed in consideration of practical forms under the demand for energy saving (for example, (See Patent Documents 1, 2, and 3).

  The blind device described in Patent Document 1 includes a sheet-shaped surface light emitter including a solar cell, a sheet-shaped polymer secondary battery, or an organic EL element on the blind, and effectively uses the surface of the blind. It is disclosed that

  In the blind device described in Patent Document 2, it is disclosed that a solar cell is disposed on the blind, and the output terminal that is drawn out serves as both an output lead wire and a blind ladder cord.

  In the solar cell described in Patent Document 3, the frame and the terminal electrode of the solar cell are electrically connected, and the module is mechanically connected to each other by forming a recess or a protrusion on the end of the frame and fitting it. It is disclosed that an electrical connection is made.

JP 2001-82058 A JP 2004-27661 A JP-A-7-86627

  However, the blind device described in Patent Document 1 only discloses that three types of sheet-shaped devices of a surface light emitting device, a solar cell, and a secondary battery have a bonded structure. No disclosure is made regarding the means for connecting the wirings necessary for arranging them.

  Moreover, in the solar cell of patent document 2, although the disclosure about the connection method of the solar cell is performed, it is performed only by a lead wire, and when actually assembling, troublesome work is required. Cost.

  And in the solar cell of patent document 3, although electrical connection is performed by the unique wiring by the module with which the frame was attached to the solar cell, the serial connection or parallel which becomes important on installation of a solar cell You cannot select and install both connections.

  The present invention relates to an electronic device module capable of easily selecting both serial connection and parallel connection, which are important in connection / installation of a plurality of electronic devices such as light emission and power generation, and a blind device using the electronic device module, Provided are a curtain device and a lighting device.

  The above object is achieved by the invention described below.

1. A plurality of panels comprising an electronic device, an output end of the anode of the electronic device, and an output end of the cathode of the electronic device;
Each of the plurality of panels can be mounted in two arrangement states,
In the case of one arrangement state, series wiring for wiring the electronic devices mounted on the plurality of panels so as to be connected in series,
In the case of the other arrangement state, parallel wiring for wiring the electronic devices mounted on the plurality of panels so as to be connected in parallel,
A support connection board comprising:
An electronic device module comprising:

  2. 2. The electronic device module according to claim 1, wherein the panel has a convex portion and a concave portion that can be fitted to another adjacent panel in a state where the panel is mounted on the support connection substrate.

  3. 3. The electronic device module according to 1 or 2, wherein the panel includes a film substrate or a glass substrate.

  4). The electronic device module according to any one of 1 to 3, wherein the electronic device is any one of a light emitting device and a photoelectric conversion device.

  5. 5. The electronic device module according to 4 above, wherein the light emitting device is any one of an LED and an organic electroluminescence element.

  6). The photoelectric conversion device is a single crystal silicon solar cell, a polycrystalline silicon solar cell, a thin film silicon solar cell, a HIT solar cell, a multijunction solar cell, a CdTe solar cell, a CIGS solar cell, a dye-sensitized solar cell, or an organic thin film solar cell. 5. The electronic device module according to 4, wherein the electronic device module is any one of a photodiode and a photodiode.

  7). A blind apparatus comprising the electronic device module according to any one of 1 to 6 above.

  8). A curtain apparatus comprising the electronic device module according to any one of 1 to 6 above.

  9. An illumination device comprising the electronic device module according to any one of 1 to 6 above.

  Electronic device module capable of easily selecting both serial connection and parallel connection which are important in connection / installation of a plurality of electronic devices such as light emission and power generation, and blind device, curtain device using the electronic device module, and A lighting device can be provided.

It is an example of the schematic diagram of the electronic device module 1 which concerns on this embodiment. It is another example of the schematic diagram of the electronic device module 1 which concerns on this embodiment. FIGS. 3A and 3B are wiring diagrams of the panel 3 and the support connection board 5. FIG. 3A is a schematic diagram of the support connection board 5, and FIG. It is a schematic diagram of the electronic device module 1 in which every other panel mounted with an electronic device is arranged and connected in parallel connection. It is a schematic diagram of the electronic device module 1 in which every other panel mounted with an electronic device is arranged and connected in series connection. 1 is a schematic diagram showing a cross-sectional structure of an organic EL element 100. FIG. It is a schematic diagram which shows the cross-section of a solar cell. FIG. 2 is a longitudinal sectional view taken along line A-A ′ of FIG. 1. It is a schematic diagram of the electronic device 7 produced on the translucent board | substrate 45. FIG. It is a schematic diagram which shows the state which mounted | wore the support connection board | substrate 5 with the glass substrate 45 (panel) in which the electronic device 7 was built. It is a schematic diagram of the blind apparatus 300 using the electronic device module 1. FIG. 1 is a schematic diagram of a curtain device 400 using an electronic device module 1. FIG.

  Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to the embodiments described below. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted.

  FIG. 1 is an example of a schematic diagram of an electronic device module 1 according to the present embodiment. FIG. 2 is another example of a schematic diagram of the electronic device module 1 according to the present embodiment. The difference between FIG. 1 and FIG. 2 is that the panel 3 is mounted in a different orientation with respect to the support connection substrate 5. That is, in FIG. 1, the panel 3 is mounted on the support connection substrate 5 so as to be connected in parallel using the parallel wiring 13. On the other hand, in FIG. 2, the panel 3 is mounted on the support connection substrate 5 so as to be connected in series using the serial wiring 11.

  The electronic device module 1 includes a plurality of panels 3 on which electronic devices 7 are mounted, and a support connection substrate 5. In addition, the board | substrate of the panel 3 and the support connection board | substrate 5 may be comprised with the board | substrate which consists of a material with high rigidity which is hard to bend like glass and a metal, and is from the material which can be bent like a flexible film. You may be comprised with the board | substrate which becomes.

  FIG. 3 is a wiring diagram of the panel 3 and the support connection substrate 5, FIG. 3A is a schematic diagram of the support connection substrate 5, and FIG. 3B is a schematic diagram of the panel 3.

  The configuration of the panel 3 and the support connection board 5 is set so that the plurality of panels 3 can be attached to and detached from the support connection board 5 and the panel 3 can be mounted in different directions with respect to the support connection board 5. . After the panel 3 is mounted on the support connection base 5, the mounting portion of the support connection base 5 and the panel 3 may be configured so that the panel 3 cannot be removed from the support connection base 5, or may be configured to be removable. Good.

  An electronic device 7 is mounted on the panel 3, and an anode output terminal and a cathode output terminal of the electronic device are formed up to one end of the substrate of the panel 3. Each output end is formed so as to be electrically connected to an external terminal. Although details will be described later, each output end is provided with a protective layer for protecting the electronic device 7 mounted on the panel 3, for example, and this protective layer is a part of the end portion of the substrate, and each output end is provided with a protective layer. It has an exposed structure. In addition to the structure in which the output end is exposed as described above, a connection terminal may be provided at the output end. As shown in FIG. 3B, the panel 3 is formed with, for example, a convex portion 31 and a concave portion 32 so that either the anode or the cathode of the electronic device 7 mounted on the panel 3 can be seen. The mounting of the electronic device 7 refers to making or mounting the electronic device 7 on the substrate of the panel 3. Here, when the electronic device 7 is formed on the substrate of the panel 3, each layer shown in FIGS. 6 and 7 is formed on the substrate of the panel 3 by an appropriate semiconductor process, and the pattern shown in FIG. 9 is formed. It means making by patterning.

  When the substrate of the panel 3 is, for example, a film substrate, an electronic device is directly formed on a PET or PEN film having a thickness of 100 μm, and a metal is further formed thereon as a wiring by a printing technique or the like. Furthermore, a lead line may be formed thereon. A low resistance metal such as Al, Cu, or Ag can be used for the wiring and the lead line. The film substrate on which the electronic device and the wiring are formed is configured to be sealed from both sides with a barrier film in order to obtain electrical insulation and to prevent moisture and oxidation. Thus, the panel 3 having the film substrate has flexibility to be deformed flexibly because it is thin in any case.

  When the panel 3 is attached to the support connection board 5, the wiring position (arrangement) so that the anode terminal and the cathode terminal of the panel 3 can be conducted to the series wiring 11 or the parallel wiring 13 provided on the support connection board 5. Status) is set.

  When the plurality of panels 3 are attached to the support connection substrate 5 so as to be electrically connected to either the series wiring 11 or the parallel wiring 13, all of the plurality of panels 3 are connected in series or in parallel. Become.

  Further, as shown in FIGS. 3C and 3D, if a dummy panel in which no electronic device is mounted or a dummy panel in which only wiring is mounted is used, the panel in which the electronic device shown in FIG. Arrangement and connection can be made at any position without being arranged and connected to the support connection board continuously. For example, FIG. 4 shows a case where every other panel on which an electronic device is mounted is arranged and connected in parallel connection. FIG. 5 shows a case where every other panel on which an electronic device is mounted is arranged and connected in series connection. In any case, the arrangement / connection setting of the panel and the dummy panel is not limited to this example, and can be arbitrarily set.

  As the electronic device 7, for example, an organic EL element or LED can be adopted if it is a light emitting device, and a solar cell or a photodiode can be adopted if it is a photoelectric conversion device, for example.

  As solar cells, single crystal silicon solar cells, polycrystalline silicon solar cells, amorphous silicon, microcrystalline silicon thin films, thin film silicon solar cells in which silicon compound (SiC, SiGe) thin films are laminated alone or in combination, amorphous to single crystal silicon HIT solar cells with thin film stacks of silicon and microcrystalline silicon, multi-junction solar cells in which multiple solar cells with different band gaps are stacked, CdTe solar cells, CIGS solar cells, dye-sensitized solar cells, and organic thin film solar cells are suitably used. it can.

  FIG. 6 is a schematic diagram showing a cross-sectional structure of the organic EL element 100. The organic EL element 100 has a structure in which an ITO 101, an organic layer 102, and an aluminum layer 103 are laminated on a base material 104, and a voltage is applied between the aluminum layer 103 and the ITO 101.

  As a light emission principle of an organic EL element, an organic EL material is obtained by passing a current through a very thin thin film of a transparent conductive film (anode), an organic EL material, and a metal electrode (cathode) on a substrate. Among them, electron-hole recombination is caused to generate light. The organic EL element is lightweight, has surface emission, and can be thinned. Furthermore, if the substrate is a flexible film substrate, it can be bent and can be made difficult to break. Further, by changing the light emitting material of the organic layer, light emission can be changed to various emission colors as well as white.

  In a PN junction manufactured using a semiconductor, an electron and a hole injected from an electrode move in different energy bands (conduction band and valence band) and recombine beyond the forbidden band. In addition, energy equivalent to the forbidden bandwidth is emitted as light.

  FIG. 7A is a schematic cross-sectional view of a crystalline solar cell. Similar to the LED, it is a PN junction diode in which a P-type semiconductor and an N-type semiconductor are joined.

The crystalline solar cell 200 includes, for example, an antireflection film 201, an N-type semiconductor layer 202, a P-type semiconductor layer 203, a P ⁺ type semiconductor layer 204, and a back electrode 205. Semiconductor materials include silicon-based and compound-based materials. Through the reverse process of LED, the light energy is absorbed by the electrons and photoexcited, and the electrons with energy are directly taken out as electric power.

FIG.7 (b) is sectional drawing of a thin film type solar cell, and shows the example of the thin film silicon solar cell using amorphous silicon. A transparent conductive film 251 is formed on the glass substrate 250 by sputtering, the silane gas SiH ₄ is decomposed by plasma CVD to form a photoelectric conversion layer 252, and a back electrode 253 is formed thereon by sputtering. The photoelectric conversion layer has a PIN diode structure, and more specifically, a P layer, an I layer, and an N layer are sequentially formed. For the I layer, only a silane gas is decomposed by plasma CVD to form a hydrogenated amorphous silicon film a-Si: H. The P layer is formed by decomposing a P-type doping gas called diborane B ₂ H ₆ together with silane by plasma CVD. Similarly, the N layer is formed by decomposing an N-type doping gas called phosphine PH ₃ together with silane by plasma CVD.

  Various semiconductor materials for the photoelectric conversion layer have been developed. In addition to amorphous silicon, a CdTe solar cell using a compound of Cd and Te, a CIGS solar cell using a compound of Cu, In, Ga and Se. And organic thin film solar cells using organic semiconductors. In particular, many of these thin film solar cells can form a photoelectric conversion layer at a low temperature and can be produced on a film substrate instead of the glass substrate. Thus, a light and flexible solar cell can be realized, and various applications are considered.

  The electronic device 7 may employ other elements besides a photoelectric conversion element that converts light into electricity and a light-emitting element that converts electricity into light. As a photoelectric conversion element, a thin film photodiode etc. are employable, for example.

  The electronic device 7 may be an assembly of electronic devices in which a plurality of electronic devices are connected in series, in parallel, or in a mixed connection method.

  On the support connection board 5, a serial wiring 11, a parallel wiring 13, and switches 6 and 15 connected to the respective wirings are provided. When the electronic device 7 is a device that converts electricity such as an organic EL element into light, the electronic device 7 has a power source 9 in series with the switches 6 and 15, and the electronic device 7 converts light such as a solar cell into electricity. In the case of the device to be used, the secondary battery 10 is provided in series with the switches 6 and 15.

  The power source 9 and the secondary battery 10 may be provided outside the support connection substrate 5. When the power supply 9 and the secondary battery 10 are provided outside the support connection board 5, the support connection board 5 is provided with wiring for guiding power from the external power supply 9 and the secondary battery 10. Further, the power supply 9 and the secondary battery 10 may be provided on either the front or back surface of the support connection board.

  For example, when the electronic device 7 is a solar cell and it is desired to add up the voltages generated in the solar cells, the panels 3 on which the solar cells are mounted are connected in series. Thus, the electromotive force which improved the voltage value from the solar cell is accumulate | stored in the secondary battery 10 by connecting the panel 3 carrying a solar cell in series.

  For example, when the electronic device 7 is a solar cell and it is desired to add up the currents generated in the solar cells, the panels 3 on which the solar cells are mounted are connected in parallel. Thus, the electromotive force which improved the electric current value from a solar cell is accumulate | stored in the secondary battery 10 by connecting in parallel the panel 3 carrying a solar cell.

  For example, a push switch or a slide switch can be adopted as the switches 6 and 15, but a configuration in which the switches 6 and 15 themselves are not provided may be employed. The switches 6 and 15 may be provided outside the support connection substrate 5.

  The panel 3 has a structure in which the panel 3 is fixedly disposed by being fitted to another adjacent panel 3 while being mounted on the support connection substrate 5. That is, the protrusions 31 and the recesses 32 are fitted to each other to be positioned. Each shape is not limited as long as the convex portion 31 and the concave portion 32 are fitted.

  The panel 3 and the support connection substrate 5 have a structure in which the positions are fixed to each other.

  FIG. 8 is a cross-sectional view taken along the line A-A ′ of FIG. 1 when the electronic device 7 is an LED.

  The support connection board 5 includes a base portion 51, an intermediate layer 52, a series wiring 11, a parallel wiring 13, and a protective layer 53 of the support connection board 5.

  The panel 3 includes insulators 54 and 56, wiring 55, and the electronic device 7.

  The insulator 54 that is the base of the panel 3 has a structure that is fitted between the base portion 51 of the support connection substrate 5 and the protective layer 53.

  The parallel wiring 13 of the support connection substrate 5 and the wiring 55 of the panel 3 are electrically connected.

  Further, if the orientation of the panel 3 is changed, the wiring 55 of the panel 3 and the other series wiring 11 of the support connection substrate 5 are made conductive.

  FIG. 9 is a schematic view of the electronic device 7 manufactured on the light transmitting substrate 45. As the light-transmitting substrate, for example, a light-transmitting glass used for liquid crystal display glass or a flexible substrate having flexibility such as PET and PEN can be used. The column direction in FIG. 9 represents the case where the electronic device is only one element, the case where two elements are in series, and the case where two elements are parallel, respectively. In the row direction, an example of a circuit diagram, a configuration diagram, and an X-X ′ sectional view is shown.

  As shown in the circuit diagram, the number of elements of the electronic device can be arbitrarily set within one substrate. Further, the arrangement in series and parallel can be arbitrarily set in one substrate.

  FIG. 9 shows a case where the electronic device 7 is a light-emitting element such as an organic EL element, an amorphous silicon solar battery, an organic thin-film solar battery using an organic semiconductor as a photoelectric conversion layer, or a photoelectric conversion element such as an optical sensor. . In any case, on the translucent substrate 45, the light emitting layer (or photoelectric conversion layer) 42 is sandwiched between the electrode 40 and the transparent electrode 43, and the protective layer 44 is formed. A lead wire 41 is connected to the electrode 40 and the transparent electrode 43. The protective layer 44 is a layer that protects electronic devices electrically (leakage and antistatic) and environmentally (moisture and oxidation prevention), and is a silicon oxide formed by a vacuum film formation method such as vapor deposition, sputtering, or CVD. A film, a barrier film such as a silicon nitride film, or a glass or barrier film bonded with an adhesive may be used. Moreover, what was adhesively sealed by the metal can for sealing which enclosed the desiccant and dry nitrogen inside may be used.

  As shown in the configuration diagram, the light emitting layer (or the photoelectric conversion layer) 42 is provided in a large area ratio within the plane of the translucent substrate 45. As the transparent electrode, for example, an inorganic transparent conductive film such as ITO or ZnO, or an organic conductive film such as PEDOT-PSS is suitable.

  FIG. 10 is a schematic view showing a state in which the panel 3 in which the electronic device 7 is built on the translucent substrate 45 is mounted on the support connection substrate 5. FIG. 10A is a schematic view of the panel 3 in which the electronic device 7 is formed on the translucent substrate 45, and FIG. 10B shows a state where the panel 3 is mounted on the support connection substrate 5. FIG. 10C shows a state in which the panel 3 is turned upside down and is attached to the support connection substrate 5. Light is incident on or emitted from the panel 3 in which the electronic device 7 is built, from the translucent substrate 45 side, but the base portion 51 of the support connection substrate 5 is translucent. FIG. 10B shows the case where there is a structure in which a window is opened or light enters or exits, and FIG.

  Next, an application using the electronic device module 1 will be described. FIG. 11 is a schematic diagram of a blind apparatus 300 using the electronic device module 1.

  The blind device 300 is a horizontal blind, in which a large number of slats 301 are juxtaposed horizontally and a winding string 302 is coupled to both ends of each slat 301 so that each slat 301 can be rotated back and forth and freely. .

  The blind device 300 is installed so as to be hung near the window side on the indoor side in the same manner as a normal blind used for light shielding.

  In the blind device 300, the electronic device module 1 is used as the slat 301. That is, the electronic device module 1 itself plays the role of the slat 301 by forming a hole through which the winding string passes through the electronic device module 1 itself.

  The electronic device 7 mounted on the panel 3 is, for example, an organic thin film solar cell or an organic EL element.

  When the electronic device 7 is a solar cell, the electronic device module 1 is provided in accordance with the number of slats 301, and wiring for adding up the outputs of the solar cells mounted on the electronic device module 1 for each slat 301 is connected to the winding string 302. The outputs may be provided in parallel and output to the outside of the blind device 300.

  When the electronic device 7 is an organic EL element, similarly, the electronic device module 1 is provided in accordance with the number of slats 301, and wiring for supplying power to the organic EL element mounted on the electronic device module 1 for each slat 301 is provided. May be provided in parallel with the winding string 302 to control the organic EL element from the outside.

  Next, another application using the electronic device module 1 will be described. FIG. 12 is a schematic diagram of a curtain device 400 using the electronic device module 1.

  The curtain device 400 is substantially the same as a horizontal blind in which the slats 301 of the blind device 300 are vertical.

  A large number of slats 401 are juxtaposed vertically, a curtain rail 402 is coupled to the upper end of each slat 401 through a ring 403, and each slat 401 can be freely moved to the left and right. In this case, the slat 401 may be connected to the outside from the upper end of the slat 401 through the ring 403 and the curtain rail 402 to control the organic EL element or take out electric power from the solar cell. Since each function is the same as the function in the above-described blind device 300, description thereof is omitted.

  In addition, as shown in FIG. 12, the electronic device module 1 can also be utilized as the illuminating device 500 provided, for example in an indoor ceiling. In the illumination device 500, a light emitting element such as an organic EL element or an LED is adopted as the electronic device 7, and each of the light emitting elements is arranged in parallel or in series so as to be driven with a specified voltage or current. The user operates the switch.

  As described above, according to the present embodiment, the plurality of panels each including the electronic device, the output end of the anode of the electronic device, and the output end of the cathode of the electronic device, and each of the plurality of panels includes two panels. In the case of one arrangement state, the electronic devices mounted on the plurality of panels are connected in series so that the electronic devices are connected in series, and in the case of the other arrangement state, the plurality of the electronic devices are mounted in the arrangement state. Connecting and installing a plurality of electronic devices such as light emitting and power generating, etc., by having a support connection board provided with parallel wiring for wiring each of the electronic devices mounted on the panel to be connected in parallel. It is possible to provide an electronic device module in which both important series connection and parallel connection can be easily selected.

  In addition, according to the present embodiment, the panel has a convex portion and a concave portion that can be fitted to another adjacent panel in a state where the panel is mounted on the support connection board, thereby positioning the panels. It is possible to provide an electronic device module that can realize accurate wiring with high accuracy.

  Moreover, according to this embodiment, the board | substrate which comprises a panel can employ | adopt both a glass substrate and a film board | substrate, and it can select regardless of whether it is flexible or rigid.

  Moreover, according to this embodiment, any of a light emitting device and a photoelectric conversion device can be adopted as the electronic device.

  Moreover, according to this embodiment, any of LED and an organic electroluminescent element can be employ | adopted for a light emitting device.

  Moreover, according to this embodiment, any of a crystalline silicon solar cell, a thin film silicon solar cell, a CdTe solar cell, a CIGS solar cell, an organic thin film solar cell, or a thin film photodiode can be adopted as the photoelectric conversion device. .

  In addition, according to the present embodiment, by employing the electronic device module described above, it is possible to provide a blind device and a curtain device having a function of converting light into electricity or converting electricity into light.

  In addition, according to the present embodiment, by using the electronic device module described above, it is possible to provide a lighting device that can easily select both serial connection and parallel connection of light emitting elements such as organic EL elements. Can do.

DESCRIPTION OF SYMBOLS 1 Electronic device module 3 Panel 5 Supporting connection board 7 Electronic device 11 Serial wiring 13 Parallel wiring 31 Convex part 32 Concave part 100 Organic EL element 200 Solar cell 300 Blind apparatus 400 Curtain apparatus 500 Illumination apparatus

Claims (9)

A plurality of panels comprising an electronic device, an output end of the anode of the electronic device, and an output end of the cathode of the electronic device;
Each of the plurality of panels can be mounted in two arrangement states,
In the case of one arrangement state, series wiring for wiring the electronic devices mounted on the plurality of panels so as to be connected in series,
In the case of the other arrangement state, parallel wiring for wiring the electronic devices mounted on the plurality of panels so as to be connected in parallel,
A support connection board comprising:
An electronic device module comprising:   The electronic device module according to claim 1, wherein the panel has a convex portion and a concave portion that can be fitted to another adjacent panel in a state where the panel is mounted on the support connection substrate.   The electronic device module according to claim 1, wherein the panel includes a film substrate or a glass substrate.   The electronic device module according to claim 1, wherein the electronic device is any one of a light emitting device and a photoelectric conversion device.   The electronic device module according to claim 4, wherein the light emitting device is either an LED or an organic electroluminescence element.   The photoelectric conversion device is a single crystal silicon solar cell, a polycrystalline silicon solar cell, a thin film silicon solar cell, a HIT solar cell, a multijunction solar cell, a CdTe solar cell, a CIGS solar cell, a dye-sensitized solar cell, or an organic thin film solar cell. The electronic device module according to claim 4, wherein the electronic device module is a photodiode.   A blind device comprising the electronic device module according to claim 1.   A curtain device comprising the electronic device module according to claim 1.   An illumination device comprising the electronic device module according to claim 1.

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