JP5495547B2 - 処理装置、およびデバイス製造方法 - Google Patents

処理装置、およびデバイス製造方法 Download PDF

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Publication number
JP5495547B2
JP5495547B2 JP2008330368A JP2008330368A JP5495547B2 JP 5495547 B2 JP5495547 B2 JP 5495547B2 JP 2008330368 A JP2008330368 A JP 2008330368A JP 2008330368 A JP2008330368 A JP 2008330368A JP 5495547 B2 JP5495547 B2 JP 5495547B2
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JP
Japan
Prior art keywords
heat
exhaust
vacuum
container
vacuum pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008330368A
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English (en)
Japanese (ja)
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JP2010153600A (ja
JP2010153600A5 (https=
Inventor
篤志 梅村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008330368A priority Critical patent/JP5495547B2/ja
Priority to US12/640,095 priority patent/US8497974B2/en
Publication of JP2010153600A publication Critical patent/JP2010153600A/ja
Publication of JP2010153600A5 publication Critical patent/JP2010153600A5/ja
Priority to US13/925,237 priority patent/US20130280659A1/en
Application granted granted Critical
Publication of JP5495547B2 publication Critical patent/JP5495547B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

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  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
JP2008330368A 2008-12-25 2008-12-25 処理装置、およびデバイス製造方法 Expired - Fee Related JP5495547B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008330368A JP5495547B2 (ja) 2008-12-25 2008-12-25 処理装置、およびデバイス製造方法
US12/640,095 US8497974B2 (en) 2008-12-25 2009-12-17 Exhaust apparatus, processing apparatus, and device manufacturing method
US13/925,237 US20130280659A1 (en) 2008-12-25 2013-06-24 Exhaust apparatus, processing apparatus, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008330368A JP5495547B2 (ja) 2008-12-25 2008-12-25 処理装置、およびデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2010153600A JP2010153600A (ja) 2010-07-08
JP2010153600A5 JP2010153600A5 (https=) 2012-02-16
JP5495547B2 true JP5495547B2 (ja) 2014-05-21

Family

ID=42285375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008330368A Expired - Fee Related JP5495547B2 (ja) 2008-12-25 2008-12-25 処理装置、およびデバイス製造方法

Country Status (2)

Country Link
US (2) US8497974B2 (https=)
JP (1) JP5495547B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6041541B2 (ja) * 2012-06-04 2016-12-07 キヤノン株式会社 露光装置及びデバイス製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291054A (en) * 1939-08-31 1942-07-28 Rca Corp Vacuum diffusion pump
JP2538796B2 (ja) * 1989-05-09 1996-10-02 株式会社東芝 真空排気装置および真空排気方法
JPH04326943A (ja) * 1991-04-25 1992-11-16 Hitachi Ltd 真空排気システム及び排気方法
JP3127511B2 (ja) * 1991-09-19 2001-01-29 株式会社日立製作所 露光装置および半導体装置の製造方法
US6031598A (en) * 1998-09-25 2000-02-29 Euv Llc Extreme ultraviolet lithography machine
US6369874B1 (en) * 2000-04-18 2002-04-09 Silicon Valley Group, Inc. Photoresist outgassing mitigation system method and apparatus for in-vacuum lithography
US6630984B2 (en) * 2000-08-03 2003-10-07 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP3467485B2 (ja) * 2001-07-18 2003-11-17 松下電器産業株式会社 軟ｘ線縮小投影露光装置、軟ｘ線縮小投影露光方法及びパターン形成方法
JP2004146492A (ja) * 2002-10-23 2004-05-20 Canon Inc Ｅｕｖ露光装置
US20050099611A1 (en) * 2002-06-20 2005-05-12 Nikon Corporation Minimizing thermal distortion effects on EUV mirror
EP1387054B1 (en) * 2002-07-31 2012-07-25 Canon Kabushiki Kaisha Cooling apparatus for an optical element, exposure apparatus comprising said cooling apparatus, and device fabrication method
JP4235480B2 (ja) * 2002-09-03 2009-03-11 キヤノン株式会社 差動排気システム及び露光装置
JP3703447B2 (ja) * 2002-09-06 2005-10-05 キヤノン株式会社 差動排気システム及び露光装置
JP4065528B2 (ja) * 2003-03-10 2008-03-26 キヤノン株式会社 恒温真空容器及びそれを用いた露光装置
US6992306B2 (en) * 2003-04-15 2006-01-31 Canon Kabushiki Kaisha Temperature adjustment apparatus, exposure apparatus having the same, and device fabricating method
EP1477850A1 (en) * 2003-05-13 2004-11-17 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1491955A1 (en) * 2003-06-27 2004-12-29 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
JP4383911B2 (ja) * 2004-02-03 2009-12-16 キヤノン株式会社 露光装置及び半導体デバイスの製造方法
US20060181689A1 (en) * 2005-02-14 2006-08-17 Nikon Corporation Lithographic-optical systems including isolatable vacuum chambers, and lithography apparatus comprising same
US7502095B2 (en) * 2005-03-29 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP2007142190A (ja) * 2005-11-18 2007-06-07 Canon Inc 露光装置及びデバイス製造方法
JP4718989B2 (ja) * 2005-12-19 2011-07-06 三菱重工業株式会社 真空処理システム及び基板予備加熱方法
JP5350598B2 (ja) * 2007-03-28 2013-11-27 東京エレクトロン株式会社 排気ポンプ、連通管、排気システム及び基板処理装置
JP2008251979A (ja) * 2007-03-30 2008-10-16 Kyocera Corp 電子回路の製造方法、および電子回路製造装置
JP5171482B2 (ja) * 2008-08-27 2013-03-27 キヤノン株式会社 露光装置およびデバイス製造方法
JP2010129687A (ja) * 2008-11-26 2010-06-10 Nikon Corp 真空装置、光源装置、露光装置及びデバイスの製造方法
US8865258B2 (en) * 2010-06-16 2014-10-21 Panasonic Corporation Method of manufacturing thin film which suppresses unnecessary scattering and deposition of a source material

Also Published As

Publication number Publication date
US20130280659A1 (en) 2013-10-24
JP2010153600A (ja) 2010-07-08
US20100167216A1 (en) 2010-07-01
US8497974B2 (en) 2013-07-30

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