JP5477711B2 - Ｍｅｍｓデバイスの製造方法 - Google Patents
Ｍｅｍｓデバイスの製造方法 Download PDFInfo
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- JP5477711B2 JP5477711B2 JP2010020657A JP2010020657A JP5477711B2 JP 5477711 B2 JP5477711 B2 JP 5477711B2 JP 2010020657 A JP2010020657 A JP 2010020657A JP 2010020657 A JP2010020657 A JP 2010020657A JP 5477711 B2 JP5477711 B2 JP 5477711B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 24
- 239000007769 metal material Substances 0.000 claims description 18
- 239000000523 sample Substances 0.000 description 40
- 238000005530 etching Methods 0.000 description 12
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010020657A JP5477711B2 (ja) | 2010-02-01 | 2010-02-01 | Ｍｅｍｓデバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010020657A JP5477711B2 (ja) | 2010-02-01 | 2010-02-01 | Ｍｅｍｓデバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011157596A JP2011157596A (ja) | 2011-08-18 |
| JP2011157596A5 JP2011157596A5 (enExample) | 2012-12-13 |
| JP5477711B2 true JP5477711B2 (ja) | 2014-04-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010020657A Active JP5477711B2 (ja) | 2010-02-01 | 2010-02-01 | Ｍｅｍｓデバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5477711B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5824878B2 (ja) * | 2011-05-31 | 2015-12-02 | 大日本印刷株式会社 | 偽装防止用粒子の製造方法 |
| JP5786459B2 (ja) * | 2011-05-31 | 2015-09-30 | 大日本印刷株式会社 | 金属粒子の製造方法 |
| JP6068925B2 (ja) * | 2012-10-23 | 2017-01-25 | 株式会社日本マイクロニクス | プローブの製造方法 |
| JP5930091B2 (ja) * | 2015-03-16 | 2016-06-08 | 大日本印刷株式会社 | 金属粒子の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3842318B2 (ja) * | 1994-10-27 | 2006-11-08 | Ｔｄｋ株式会社 | マイクロマシン部品の取り扱い方法 |
| JP2011140101A (ja) * | 2010-01-08 | 2011-07-21 | Japan Electronic Materials Corp | Ｍｅｍｓデバイスの製造方法 |
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2010
- 2010-02-01 JP JP2010020657A patent/JP5477711B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011157596A (ja) | 2011-08-18 |
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