JP2011157596A5 - - Google Patents

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Publication number
JP2011157596A5
JP2011157596A5 JP2010020657A JP2010020657A JP2011157596A5 JP 2011157596 A5 JP2011157596 A5 JP 2011157596A5 JP 2010020657 A JP2010020657 A JP 2010020657A JP 2010020657 A JP2010020657 A JP 2010020657A JP 2011157596 A5 JP2011157596 A5 JP 2011157596A5
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JP
Japan
Prior art keywords
frame
sacrificial layer
forming
shape
opening corresponding
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JP2010020657A
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English (en)
Japanese (ja)
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JP2011157596A (ja
JP5477711B2 (ja
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Priority claimed from JP2010020657A external-priority patent/JP5477711B2/ja
Publication of JP2011157596A publication Critical patent/JP2011157596A/ja
Publication of JP2011157596A5 publication Critical patent/JP2011157596A5/ja
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JP2010020657A 2010-02-01 2010-02-01 Memsデバイスの製造方法 Active JP5477711B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010020657A JP5477711B2 (ja) 2010-02-01 2010-02-01 Memsデバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010020657A JP5477711B2 (ja) 2010-02-01 2010-02-01 Memsデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2011157596A JP2011157596A (ja) 2011-08-18
JP2011157596A5 true JP2011157596A5 (enExample) 2012-12-13
JP5477711B2 JP5477711B2 (ja) 2014-04-23

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JP2010020657A Active JP5477711B2 (ja) 2010-02-01 2010-02-01 Memsデバイスの製造方法

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JP (1) JP5477711B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5786459B2 (ja) * 2011-05-31 2015-09-30 大日本印刷株式会社 金属粒子の製造方法
JP5824878B2 (ja) * 2011-05-31 2015-12-02 大日本印刷株式会社 偽装防止用粒子の製造方法
JP6068925B2 (ja) * 2012-10-23 2017-01-25 株式会社日本マイクロニクス プローブの製造方法
JP5930091B2 (ja) * 2015-03-16 2016-06-08 大日本印刷株式会社 金属粒子の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3842318B2 (ja) * 1994-10-27 2006-11-08 Tdk株式会社 マイクロマシン部品の取り扱い方法
JP2011140101A (ja) * 2010-01-08 2011-07-21 Japan Electronic Materials Corp Memsデバイスの製造方法

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