JP5477673B2 - Pre-lamination equipment - Google Patents

Description

The present invention relates to a pre-laminate equipment to partially applied resist film on the circuit board. In particular, using a vacuum flat laminating apparatus, the resist film on the circuit board prior to thermocompression bonding, but about the prelaminated equipment to partially applied resist film on the circuit board.

  Conventionally, a resist film laminating apparatus on a circuit board has been laminated by heating and pressing the circuit board and the resist film with a pair of heat rollers in the air. Also, a method of performing this in a vacuum in order to eliminate minute bubbles between the circuit board and the resist film has been proposed (Patent Document 1). However, since sending, laminating, and storing a set in a vacuum chamber are large, a flat plate type vacuum laminating apparatus that performs laminating only in a vacuum is widely used (Patent Document 2).

JP 2005-59486 A JP 2000-15697 A

The problem to be solved is that in a flat plate type vacuum laminating apparatus that performs laminating only in a vacuum, the resist film is temporarily stacked and fixed on the circuit board in the atmosphere, so that the air bubbles in the overlapped internal part are completely removed. Is a point that cannot be eliminated.
The object of the present invention is to limit or eliminate the air bubbles in the inner part as much as possible.

The present invention relates to the following.
1. In a pre-lamination machine that temporarily fixes a resist film on a circuit board before deposition with a vacuum flat plate laminator, it is pressed from the top of the resist film with an elastic pressure roller with irregularities on the surface and dotted projections. A pre-laminating apparatus for partially depositing a resist film on a circuit board in the form of dots.
2. In a pre-lamination machine that temporarily fixes a resist film on a circuit board before being deposited by a vacuum flat plate laminator, when the resist film is stacked on the circuit board, the surface is uneven and the projections are point-like bodies. elastic pressure pressing at pressure roller, the pre-laminating apparatus is partially deposited on the circuit board to resist film in dots is.
3. Item 3. The prelaminating apparatus according to Item 1 or Item 2, wherein the surface unevenness of the elastic pressure roller is a shape in which columnar bodies, cone-shaped bodies, or dome-shaped bodies are scattered in an island shape.
4). Item 4. The pre-laminating apparatus according to any one of Items 1 to 3, wherein the elastic pressure roller having an uneven surface has an elastic body coated or an elastic body or a laminate of an uneven sheet and an elastic body.

Prelaminate equipment of the present invention, before subjecting the plate-type vacuum laminating apparatus, the resist film a prelaminate equipment to temporarily fix superimposed on a circuit board, in order to resist film partially applied to the circuit board In addition, there is an advantage that air bubbles between the circuit board and the resist film are smoothly removed and laminated at the time of vacuum lamination. In particular, when the resist film is deposited on the circuit board in the form of dots, there is an advantage that bubbles are smoothly removed from any direction and laminated.

1 shows a prelaminating apparatus according to the present invention. The figure for demonstrating operation | movement of the pre-laminating apparatus which concerns on this invention is shown. 1 shows a pre-laminating apparatus according to the present invention and a subsequent vacuum laminating apparatus. The partial cross section of the roller of the pre-laminating apparatus which concerns on this invention is shown. The top view of the surface asperity of a roller of the prelaminating device concerning the present invention is shown roughly.

The circuit board described in the present invention is finally a printed wiring board formed by laminating a resin or metal, and an element may be built therein. Moreover, it is applied also to the board | substrate with a rough surface about 10 micrometers-1 mm generally.
The resist film described in the present invention is a general resist film, and in the production of a printed wiring board, a mask of a portion left by etching or a portion not plated, a portion where solder is unnecessary when mounting and soldering a component, etc. Although it is a film material for covering the film, it is also applied to a general film having a small tack force (sticking force) by pressurization, particularly at room temperature or under heating. Further, a protective film is generally stretched on the side to be bonded.
The pre-laminating apparatus described in the present invention refers to a temporary fixing apparatus before a film is bonded to a substrate by a laminating apparatus.
The pressure roller described in the present invention has a substantially cylindrical shape, but has a surface with irregularities, an elastic body, and a roller for the purpose of pressure application.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings. FIG. 1 schematically shows a prelaminating apparatus according to the present invention. FIG. 2 is a diagram for explaining the operation. FIG. 3 schematically shows another example pre-laminating apparatus and a subsequent vacuum laminating apparatus according to the present invention. FIG. 4 shows a partial cross section of the pressure roller of the prelaminating apparatus according to the present invention.

FIG. 1 shows an example of an apparatus in which two sets of the same unit are used, a circuit board is transported horizontally, and a resist film is simultaneously applied to both front and back surfaces.
In the apparatus, a laminated film 3 in which a resist film 1 and a protective film 2 are laminated is fed from a supply roller 4 by a feed roller 5, and the protective film 2 is peeled off from the laminated film 3 by a peeling means 6. The protective film 2 is taken up by the take-up roller 7. The resist film 1 from which the protective film 2 has been peeled off and wound is temporarily held by a suction guide 9 via a slide guide 8, and is cut to a predetermined length similar to the circuit board 11 by a cutting means 10. The circuit board 11 transported by the transport means 12 is partially covered with the resist film 1 by a pair of upper and lower pressure rollers 13 and finally transported by the transport means 14.
At this time, the applied pressure is about 0.2 kg / cm to 5 kg / cm, preferably about 0.5 kg / cm to 2 kg / cm, and the temperature when the pressure roller is pressed is 10 ° C. to 50 ° C. The temperature is about 18 ° C., preferably about 18 ° C. to 30 ° C., and is a temperature at which a slight tack force is generated by pressurization, depending on the physical properties of the resist film. In that sense, the pressure roller is preferably provided with a temperature adjustment mechanism.
Further, the peeling means 6 is formed so that its tip is curved toward the slide guide 8 and sharp. Similarly, the suction guide 9 is formed so that the tip is curved toward the pressure roller 13 and sharply formed. As the cutting means 10, a cutter or the like is used. A roller conveyor or the like is used for the conveying means 12 and the unloading means 14.
In addition, this pre-laminating apparatus can also be used by replacing the heating roller of a normal atmospheric pressure laminating apparatus with an elastic pressure roller having irregularities, and can be diverted from a normal laminating apparatus.

FIG. 2 is a diagram for explaining the operation. The upper half of the upper and lower units is specifically shown.
FIG. 2A shows a state in which the circuit board 11 is transported by the transport means 12 from now on. The position of the peeling means 6 is in the vicinity of the slide guide 8.
FIG. 2B shows a state where the circuit board 11 is conveyed by the conveying means 12 until just before the prelaminating operation. The position of the peeling means 6 extends from the slide guide 8 to the bottom of the suction guide 9 together with the resist film 1 and reaches the tip of the circuit board 11.
FIG. 2C shows a state where the circuit board 11 is pre-laminated. The position of the peeling means 6 returns to the initial state, the cutting means 10 moves, and the rear end portion of the resist film 1 is cut.

FIG. 3 shows a process example in which one set of the unit of FIG. 1 is used, the circuit board is transported horizontally, and the resist film 1 is deposited on the surface thereof. As in FIG. 1, the circuit board on which the resist film is partially deposited by the pre-laminating apparatus according to the present invention is applied to the circuit board by the vacuum plate laminating apparatus in the next continuous process. Finally, it is unloaded by the unloading means.
In the present invention, the vacuum flat plate laminating apparatus is not particularly limited, and an ordinary apparatus is used. For example, the vacuum flat plate laminating apparatus places the circuit board 11 partially coated with a resist film on a heating unit 16 provided with a heater 15 and seals the circuit board 11 with a decompression container 17 and a pressure container 18. The resist film is permanently attached to the circuit board by being pressed by the 18 elastic sheets 19.

  FIG. 4 shows a partial cross section of the pressure roller of the prelaminating apparatus according to the present invention. FIG. 4A shows a case where the cylindrical roller 20 is covered with an elastic body 21 having an uneven surface, and FIG. 4B shows that the cylindrical roller 20 having an uneven surface is thinned by the elastic body 21. FIG. 4 (c) shows a case where the concave and convex sheet 22 is provided on the surface of the cylindrical roller 20, and FIG. 4 (d) shows a case where the cylindrical roller portion having an uneven surface is an elastic body. Shows the case.

As the material of the cylindrical roller 20, it is possible to use iron or an alloy obtained by adding nickel, manganese, molybdenum, silicon or the like to iron, or a hard elastic body obtained by adding an inorganic healer to an elastic body such as stainless steel, silicone rubber, or fluorine rubber.
As the material of the roller shaft, iron, an alloy obtained by adding nickel, manganese, molybdenum, silicon, or the like to iron or stainless steel can be used.

  As the material of the elastic body 21, an elastomer such as silicone rubber, fluorine rubber, ethylene propylene rubber, nitrile butadiene rubber, chloroprene rubber or the like can be used. In the case of the elastic body 21 shown in FIG. 4 (a), a tube-shaped member having irregularities on the outer surface can be used. A sheet having an unevenness on one side having a thickness of about 1 mm to 20 mm, preferably about 3 mm to 10 mm may be cut and affixed to the cylindrical roller 20. In the case of the elastic body 21 shown in FIG. 4 (d), a tube-shaped member having an uneven surface is heated and expanded, passed through the roller shaft, and then cooled and fixed. The irregularities on the outer surface may be processed after the elastic body 21 is provided on the roller or roller shaft.

The concavo-convex sheet 22 has a thickness of about 10 μm to 200 μm, and is formed into a sheet shape such as polyester, polypropylene, polyethylene sulfite, fluororesin, silicone resin, epoxy resin, or metal, so that the concavo-convex shape can be easily formed and the shape is maintained. Easy to use.
FIG. 4C shows a case where the surface of the cylindrical roller 20 is covered with the elastic body 21 and then the uneven sheet 22 is provided on the surface. In this case, the elastic body 21 is not necessarily required, but it is particularly preferable to provide the elastic sheet 22 when the uneven sheet 22 is a hard sheet, when the circuit board has a large area and the unevenness of the circuit is large, or when there is warping. In this case, as the elastic body 21, in addition to elastomers such as silicone rubber, fluorine rubber, ethylene propylene rubber, nitrile butadiene rubber, and chloroprene rubber, elastic foam including olefin resin and urethane resin may be used. it can.

The uneven shape is preferably such that columnar bodies, cones, dome-like bodies, etc. are scattered in an island shape, and the convex portions are discontinuous, with a pitch of about 0.1 mm to 5 mm, preferably from 0.5 mm. The height is about 2 mm and does not necessarily need to be equidistant, but the height is preferably about 10 μm to 1000 μm, preferably about 50 μm to 200 μm, and the same height. In particular, it is preferable that the convex portion for temporarily attaching the resist film to the circuit board in a dot shape is a dot-like body, since bubbles are smoothly removed from any direction and laminated. FIG. 5 schematically shows a top view of the uneven shape. FIG. 5A shows that the convex portions 23 having a trapezoidal longitudinal cross section and a square cross section are arranged at equal intervals. FIG. 5B shows that the circular dome-shaped convex portions 23 are randomly arranged.
In addition to the self-adhesion, an adhesive layer made of an adhesive may be provided between the cylindrical roller 20, the elastic body 21, or the concavo-convex sheet 22.

  DESCRIPTION OF SYMBOLS 1 ... Resist film, 2 ... Protective film, 3 ... Laminated film, 4 ... Supply roller, 5 ... Feed roller, 6 ... Stripping means, 7 ... Winding roller, 8 ... Slide guide, 9 ... Adsorption guide, 10 ... Cutting means DESCRIPTION OF SYMBOLS 11 ... Circuit board, 12 ... Conveyance means, 13 ... Pressure roller, 14 ... Unloading means, 15 ... Heater, 16 ... Heating part, 17 ... Depressurization container, 18 ... Pressure container, 19 ... Elastic sheet, 20 ... Cylindrical roller, 21 ... elastic body, 22 ... uneven sheet, 23 ... convex part.

Claims (4)

An elastic pressure roller in which a resist film is temporarily fixed to a circuit board before being deposited by a vacuum flat plate laminator , and has an irregular surface on its surface and convex portions scattered in an island shape from above the resist film. in pressed, pre-laminate device for partial depositing resist film on the circuit board to the point-like. In a pre-lamination machine that temporarily fixes a resist film on a circuit board before being deposited by a vacuum flat plate laminator, when the resist film is stacked on the circuit board, the surface is uneven and the projections are point-like bodies. elastic pressure pressing at pressure roller, the pre-laminating apparatus is partially deposited on the circuit board to resist film in dots is.   The pre-laminating apparatus according to claim 1 or 2, wherein the surface unevenness of the elastic pressure roller has a shape in which columnar bodies, cone-shaped bodies, or dome-shaped bodies are scattered in an island shape.   The prelaminating apparatus according to any one of claims 1 to 3, wherein the elastic pressure roller having a concavo-convex surface comprises an elastic body or an elastic body or a laminate of an uneven sheet and an elastic body.

Images