JP5472709B2 - Surface mount type nonreciprocal circuit device - Google Patents

Surface mount type nonreciprocal circuit device Download PDF

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JP5472709B2
JP5472709B2 JP2009245276A JP2009245276A JP5472709B2 JP 5472709 B2 JP5472709 B2 JP 5472709B2 JP 2009245276 A JP2009245276 A JP 2009245276A JP 2009245276 A JP2009245276 A JP 2009245276A JP 5472709 B2 JP5472709 B2 JP 5472709B2
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plate
tab terminal
ferrite
lead portion
storage container
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JP2011091730A (en
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行範 有田
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Hitachi Metals Ltd
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本発明は、自動車電話、携帯電話等のマイクロ波帯の高周波部品として採用される非可逆素子、例えばアイソレータ、サーキュレータの構造に関する。   The present invention relates to the structure of non-reciprocal elements such as isolators and circulators that are employed as high-frequency components in the microwave band of automobile phones, mobile phones, and the like.

アイソレータやサーキュレータ等の非可逆回路素子は、高周波信号を伝送方向のみに通過させ、逆方向への伝送を阻止する機能を有している。例えばアイソレータは、電力増幅器などと共にマザーボードに搭載され、マイクロ波回路の不整合などで生じた反射波による電力増幅器の動作不安定の防止や、破壊防止に用いられる重要なマイクロ波回路部品である。   Non-reciprocal circuit elements such as isolators and circulators have a function of passing high-frequency signals only in the transmission direction and preventing transmission in the reverse direction. For example, an isolator is mounted on a motherboard together with a power amplifier and the like, and is an important microwave circuit component used to prevent instability of operation of the power amplifier due to a reflected wave caused by mismatching of the microwave circuit, and to prevent destruction.

非可逆回路素子は、入力端子、出力端子、及びダミー抵抗の接続などに使用されるポート部を有する。マイクロ波回路部品として電力増幅器などと共にマザーボードに搭載される。この場合、非可逆回路素子のマザーボードへの半田付けは、テープアンドリール(tape−and−reel)形式で供給された非可逆回路素子を、マウンターにて機械実装することで、生産性を格段に向上することが行なわれている。   The nonreciprocal circuit element has a port portion used for connection of an input terminal, an output terminal, a dummy resistor, and the like. It is mounted on the motherboard together with a power amplifier as a microwave circuit component. In this case, the soldering of the nonreciprocal circuit element to the motherboard is achieved by significantly mounting productivity by mechanically mounting the nonreciprocal circuit element supplied in a tape-and-reel format with a mounter. Improvements are being made.

前記ポート部は通常0.1〜0.25mmの薄い銅板などで形成されていることが多く、先端を折り曲げて、実装用基板に半田付けされる構成になっている。しかしながら、このような薄い銅板だと外力の作用に対して変形し易く、端子が変形し、マザーボードの配線との間にギャップが生じて半田付け不良が発生し易いという問題があった。   In many cases, the port portion is usually formed of a thin copper plate having a thickness of 0.1 to 0.25 mm. The port portion is bent and soldered to a mounting substrate. However, such a thin copper plate has a problem that it is easily deformed by the action of external force, the terminal is deformed, and a gap is formed between the wiring of the mother board and a soldering failure is likely to occur.

このような問題に対して特許文献1では、剛性を有する端子支持部材と、前記端子支持部材の端部に設けられる端子部材を用いることを提案している。図10はその非可逆回路素子の外観斜視図を示し、図11は下ケース(本発明では収納容器)と端子支持部材との構成を示す分解斜視図である。
上ケース250と下ケース201との間には永久磁石、板状フェライト、中心導体、アース板、端子支持部材501等が重ねられて配置されている。端子支持部材501は3つの腕部202を備え、下ケース201の側面開口部から延出しており、各腕部202の先端側には端子部材502が配置される。図12は端子部材502の構成を示す断面図である。導電材料で形成された円柱状コンタクトリード301とその胴部の周囲を覆う誘電体材料302を備えており、誘電体材料302は下ケース201や端子支持部材501との絶縁を確保している。
中心導体のリード部401は前記側面開口部から端子部材502の円柱状コンタクトリード301の天面側306まで延出して電気的に接続されており、円柱状コンタクトリード301の底面側305は下ケース201の底面24と略同一面となる様に構成される。
In order to solve such a problem, Patent Document 1 proposes to use a rigid terminal support member and a terminal member provided at an end portion of the terminal support member. FIG. 10 is an external perspective view of the non-reciprocal circuit element, and FIG. 11 is an exploded perspective view showing a configuration of a lower case (storage container in the present invention) and a terminal support member.
Between the upper case 250 and the lower case 201, a permanent magnet, a plate-like ferrite, a central conductor, a ground plate, a terminal support member 501 and the like are disposed so as to overlap each other. The terminal support member 501 includes three arm portions 202 and extends from the side opening of the lower case 201, and a terminal member 502 is disposed on the distal end side of each arm portion 202. FIG. 12 is a cross-sectional view showing the configuration of the terminal member 502. A cylindrical contact lead 301 made of a conductive material and a dielectric material 302 covering the periphery of the body portion are provided, and the dielectric material 302 ensures insulation from the lower case 201 and the terminal support member 501.
The lead portion 401 of the central conductor extends from the side opening to the top side 306 of the cylindrical contact lead 301 of the terminal member 502 and is electrically connected. The bottom side 305 of the cylindrical contact lead 301 is the lower case. 201 is configured to be substantially flush with the bottom surface 24 of 201.

また特許文献2では、剛性を有する端子支持部材を絶縁体として構成することが開示されている。図13はその構成を用いてなる非可逆回路素子の一例を示す斜視図であり、図14はその内部構造を示す分解斜視図である。端子支持部材18はガラスエポキシ樹脂や、液晶ポリマーなど曲げ強度に強い材質で作られているので、外力が加わった場合でも、変形がほとんど無い。端子支持部材18の腕の端部には貫通孔19が設けられており、端子部材(タブ端子)5が中心導体40のリード部20の端部に形成された貫通孔22と貫通孔19に挿通してはんだ固定されている。なお、図13、図14においては、後述する本発明の非可逆回路素子と共通する部分には、同じ符号を付与している。
何れの場合も端子支持部材により支持される端子部材を介して、中心導体のリード部をマザーボードの配線と接続することで、端子部材に外力が作用しても容易にその平坦度が崩されること無く、良好な電気的接続を可能としている。
Patent Document 2 discloses that a terminal support member having rigidity is configured as an insulator. FIG. 13 is a perspective view showing an example of a non-reciprocal circuit device using the configuration, and FIG. 14 is an exploded perspective view showing the internal structure. Since the terminal support member 18 is made of a material having high bending strength such as glass epoxy resin or liquid crystal polymer, there is almost no deformation even when an external force is applied. A through hole 19 is provided at the end of the arm of the terminal support member 18, and the terminal member (tab terminal) 5 is formed in the through hole 22 and the through hole 19 formed at the end of the lead portion 20 of the center conductor 40. It is inserted and fixed by soldering. In FIG. 13 and FIG. 14, the same reference numerals are given to the parts common to the non-reciprocal circuit device of the present invention described later.
In any case, by connecting the lead portion of the central conductor to the wiring of the mother board via the terminal member supported by the terminal support member, even if an external force acts on the terminal member, the flatness can be easily broken. And good electrical connection is possible.

特開平10−294606号公報JP-A-10-294606 特開2003−124711号公報JP 2003-124711 A

しかしながら端子支持部材の剛性によって生じる幾つかの問題がある。従来技術の構成によれば、下ケースと端子部材の底面の平坦度は精度良く形成可能であり、形成後の変形も予防されるが、マザーボード自体の撓みや歪みに対しては追従できないと言う問題がある。
非可逆回路素子が実装されるマザーボードはネジや接着などの固着手段によって筐体内に取り付けられるが、その際に撓みや歪みを生じることが有る。また環境温度等の経時変化によって、筐体とマザーボードの線膨張係数の違いからも同様の変形が生じ易い。この様な変形に対して従来の非可逆回路素子では端子部に大きな応力が作用し、接続部において半田や導電性樹脂等が破断し易い。マザーボードの配線との間のギャップによって電気的導通不良が発生するという問題があった。
However, there are some problems caused by the rigidity of the terminal support member. According to the configuration of the prior art, the flatness of the bottom surface of the lower case and the terminal member can be accurately formed, and deformation after the formation is prevented, but it cannot follow the bending and distortion of the motherboard itself. There's a problem.
The motherboard on which the nonreciprocal circuit element is mounted is attached to the housing by a fixing means such as a screw or an adhesive, and may be bent or distorted at that time. In addition, due to a change with time such as the environmental temperature, the same deformation is likely to occur due to a difference in coefficient of linear expansion between the casing and the motherboard. In the conventional non-reciprocal circuit element against such a deformation, a large stress acts on the terminal portion, and solder, conductive resin, and the like are easily broken at the connection portion. There is a problem in that poor electrical continuity occurs due to a gap between the wiring of the motherboard.

またボード自体に撓みや歪みが生じている場合には、非可逆回路素子を実装しても端子部材とマザーボードの配線との間にギャップが生じて、優れた平坦度が逆に電気的導通不良を招くという問題があった。なお非可逆回路素子自体がマザーボードではなく、筐体を含む支持部材に直接取り付けられる場合もあるが、支持部材の変形による影響はマザーボードに実装される場合と同様である。
そこで本発明では、非可逆回路素子が実装される部材の影響を受け難く、配線との電気的接続が容易な面実装型非可逆回路素子を提供することを目的とする。
Also, if the board itself is bent or distorted, even if a non-reciprocal circuit element is mounted, a gap will be created between the terminal member and the wiring of the motherboard, and the excellent flatness will be conversely defective. There was a problem of inviting. Although the nonreciprocal circuit element itself may be directly attached to a support member including a housing instead of the motherboard, the influence of the deformation of the support member is the same as that when mounted on the motherboard.
Therefore, an object of the present invention is to provide a surface-mounting non-reciprocal circuit element that is not easily affected by a member on which the non-reciprocal circuit element is mounted and is easily electrically connected to a wiring.

第1の発明は、収納容器に、板状フェライトと、中心導体と、永久磁石を重ねて配置し、前記収納容器から延出した中心導体のリード部の端部と接続する導電性のタブ端子を備えた非可逆回路素子であって、前記リード部は、板状フェライトと重ねられる中心導体の共通導体部を中心として放射状に所定の角度間隔をもって3方向へ放射状に延びて板状フェライトの外縁側部に現われ、その先が収納容器内において延出方向とは異なる平面方向に屈曲しており、板状フェライト外縁側部側が固定端となり前記タブ端子側を移動端として撓み可能としたことを特徴とする面実装型非可逆回路素子である。   1st invention arrange | positions a plate-shaped ferrite, a center conductor, and a permanent magnet on a storage container, and arrange | positions it, and the conductive tab terminal connected with the edge part of the lead part of the center conductor extended from the said storage container The lead portion extends radially in three directions at predetermined angular intervals centered on a common conductor portion of a central conductor that is overlapped with the plate-like ferrite, and extends outside the plate-like ferrite. Appears on the edge side, the tip is bent in a plane direction different from the extending direction in the storage container, and the plate ferrite outer edge side becomes the fixed end and can be bent with the tab terminal side as the moving end. This is a surface mount type non-reciprocal circuit device.

中心導体はTM110モードで共振する前記共通導体部を中央部をとし、共通導体部から三方向に延長形成されたリード部とからなる。リード部は、その一部を厚み方向に屈曲させても良い
中心導体に高周波電流を流すと、板状フェライトに中心導体を囲む高周波磁界が生じ、永久磁石によって板状フェライトに回転磁界を生じさせることで、入力された高周波磁界は、板状フェライトを通過する際に偏波面が回転し、所定のリード部にのみ出力され、回路として非可逆性を持たせている。
The central conductor includes a lead portion extending in three directions from the common conductor portion with the common conductor portion resonating in the TM110 mode as a central portion. A part of the lead portion may be bent in the thickness direction. When a high-frequency current is passed through the center conductor, a high-frequency magnetic field surrounding the center conductor is generated in the plate-shaped ferrite, and a rotating magnetic field is generated in the plate-shaped ferrite by the permanent magnet. Thus, the input high-frequency magnetic field rotates the plane of polarization when passing through the plate-like ferrite, and is output only to a predetermined lead portion, so that the circuit has irreversibility.

前記リード部の板状フェライトの外縁部側からタブ端子側との間に、延出方向と平行に線状の窪みを形成するのが好ましい。前記窪みにより曲げに対する耐力が向上する。窪みの形状や長さ、あるいは本数は特に限定されるものでは無いが、曲げに対する耐力を向上しつつも、著しくリード部の変形能を阻害しない程度とするのが望ましい。   It is preferable to form a linear depression parallel to the extending direction between the outer edge side of the plate-like ferrite of the lead part and the tab terminal side. The yield strength against bending is improved by the depression. The shape, length, or number of the dents is not particularly limited, but it is desirable that the dent is not significantly disturbed while improving the resistance to bending.

前記中心導体を通常薄銅板とするところを、ばね性を有する金属材料とするのが望ましい。例えばリン青銅からなる厚さ100〜250μmの薄板から形成するのが好ましい。これをエッチングしたり、金型で打ち抜いたりして中心導体が形成される。
リン青銅は、優れた強度とばね特性から電気機器用材料として用いられ、また耐応力腐食割れに優れることにより、信頼性の高いばね材料として広く用いられている。この様なリン青銅を中心導体として用いることで、リード部は強度とばね性を兼ね備えたものとなる。なおリン青銅は、強度とばね性に対して電気抵抗率は相反する傾向にある。使用するばね性を有する金属材料の電気抵抗率が大きさによっては、表面にAu、AgあるいはCuなどの良導電率の金属をめっきするのが望ましい。
Where the central conductor is usually a thin copper plate, it is desirable to use a metal material having spring properties. For example, it is preferably formed from a thin plate made of phosphor bronze and having a thickness of 100 to 250 μm. This is etched or punched out with a mold to form a central conductor.
Phosphor bronze is widely used as a highly reliable spring material because of its excellent strength and spring characteristics, and is excellent in stress corrosion cracking resistance. By using such phosphor bronze as the central conductor, the lead portion has both strength and springiness. Phosphor bronze tends to have a contradictory electrical resistivity with respect to strength and springiness. Depending on the electrical resistivity of the metal material having springiness to be used, it is desirable to plate a metal having a good conductivity such as Au, Ag or Cu on the surface.

本発明における導電性のタブ端子は、平坦な底面を有する略円柱形状、切頭円錐形状、押しピン形状であるのが望ましく、鉄系、銅系、銀系、金系のいずれかの金属、あるいはそれらの何れかの合金を用いるのが好ましい。用いる金属材料の電気抵抗率が大きさによっては、表面にAu、AgあるいはCuなどの良導電率の金属をめっきするのが望ましい。
またマザーボードの配線と接続する底面側の形状については、加工が難しく、また接続面積が減少するなどにより問題が生じない範囲であれば、球状あるいは針状などとすることは許容される。
The conductive tab terminal in the present invention preferably has a substantially cylindrical shape having a flat bottom surface, a truncated cone shape, and a push pin shape, and is an iron-based, copper-based, silver-based, or gold-based metal, Alternatively, any of these alloys is preferably used. Depending on the electric resistivity of the metal material to be used, it is desirable that the surface is plated with a metal having good conductivity such as Au, Ag, or Cu.
Further, the shape of the bottom side connected to the wiring of the mother board is allowed to be spherical or needle-shaped as long as it is difficult to process and does not cause a problem due to a decrease in the connection area.

タブ端子はリード部の端部に形成された貫通孔に挿通されるため、単純な円柱形状の他に、切頭円錐形状であったり、途中に段差が設けられ細軸部と太軸部で構成された押しピン形状であったりするのがより好ましい。どちらの場合もリード部の端部に形成された貫通孔の孔径によって挿通が規制される。このためリード部の貫通孔にタブ端子が必要以上に差し込まれる事が無く、段差、あるいは傾斜によって、一義的にリード部からマザーボード側に現れるタブ端子の高さが決まり、タブ端子とマザーボートとの間隔を、容易にほぼ平行とすることが出来る。タブ端子のマザーボード側を太軸側とすることで、固着面積を増やして強度を増加させるとも出来る。
またマザーボートに変形等がある場合には、その形状に倣ってタブ端子とマザーボートとの間隔を端子毎に異ならせることも容易であるし、タブ端子の底面を収納容器の底面よりも低く形成すれば、実装用部材上への載置によってリード部が撓み、前記収納容器の底面と前記タブ端子の底面とを略同一面とすることが出来る。
Since the tab terminal is inserted through the through hole formed at the end of the lead part, in addition to a simple columnar shape, it has a truncated cone shape, or a step is provided in the middle, with a thin shaft part and a thick shaft part. It is more preferable that the push pin is configured. In either case, insertion is restricted by the diameter of the through hole formed at the end of the lead portion. For this reason, the tab terminal is not inserted more than necessary into the through hole of the lead part, and the height of the tab terminal appearing on the motherboard side from the lead part is uniquely determined by the step or inclination, and the tab terminal and the mother boat Can be made substantially parallel. By setting the motherboard side of the tab terminal to the thick shaft side, the fixing area can be increased to increase the strength.
If the mother boat is deformed, it is easy to change the distance between the tab terminal and the mother boat for each terminal according to its shape, and the bottom surface of the tab terminal is lower than the bottom surface of the storage container. If it forms, a lead part will bend by mounting on the mounting member, and the bottom face of the storage container and the bottom face of the tab terminal can be made into the almost same surface.

本発明の非可逆回路素子では収納容器が板状部材に載置される場合がある。前記板状部材には収納容器を配置する窪み部を有するものもある。板状部材はSPCCやアルミニウム合金、例えばAl−Si−Cu系合金のADC12材を等の金属材料からなる金属板や、ガラスエポキシ樹脂等の樹脂板などである。板状部材には抵抗器が実装されたり、筐体への取り付けネジ孔が設けられたりする。前記リード部は板状部材から延出してその外縁側に前記タブ端子が位置する。前記タブ端子の底面を板状部材の底面よりも低く形成すれば、実装用部材上への載置によってリード部が撓み、前記収納容器の底面と前記タブ端子の底面とを略同一面とすることが出来る。   In the nonreciprocal circuit device of the present invention, the storage container may be placed on the plate member. Some of the plate-like members have a recess for arranging a storage container. The plate-like member is a metal plate made of a metal material such as SPCC or an aluminum alloy, for example, an ADC12 material of an Al—Si—Cu alloy, or a resin plate such as a glass epoxy resin. A resistor is mounted on the plate-like member, or a mounting screw hole to the housing is provided. The lead portion extends from the plate-like member, and the tab terminal is located on the outer edge side. If the bottom surface of the tab terminal is formed lower than the bottom surface of the plate-like member, the lead portion bends by being placed on the mounting member, and the bottom surface of the storage container and the bottom surface of the tab terminal are substantially flush with each other. I can do it.

また実装用部材上に形成された窪み部を形成して、低背化を図ったり、収納容器や板状部材の位置決めを行なったりする場合がある。この様な場合には、前記タブ端子の底面は、収納容器の底面あるいは板状部材の底面よりも高く形成されても良い。   In some cases, a recess formed on the mounting member is formed to reduce the height or position the storage container or the plate-like member. In such a case, the bottom surface of the tab terminal may be formed higher than the bottom surface of the storage container or the bottom surface of the plate member.

本発明によれば、非可逆回路素子が実装される部材の影響を受け難く、配線との電気的接続が容易な面実装型非可逆回路素子を提供することが出来る。   According to the present invention, it is possible to provide a surface-mounting non-reciprocal circuit element that is not easily affected by a member on which the non-reciprocal circuit element is mounted and is easily electrically connected to a wiring.

マザーボードに実装された本発明の一実施例に係る面実装型非可逆回路素子の斜視図である。1 is a perspective view of a surface-mounting non-reciprocal circuit device according to an embodiment of the present invention mounted on a motherboard. 本発明の一実施例に係る面実装型非可逆回路素子の分解斜視図である。1 is an exploded perspective view of a surface-mounted nonreciprocal circuit device according to an embodiment of the present invention. 本発明の一実施例に係る面実装型非可逆回路素子に用いる中心導体の平面図である。It is a top view of the center conductor used for the surface mounting type nonreciprocal circuit device based on one Example of this invention. 本発明の一実施例に係る面実装型非可逆回路素子に用いるタブ端子の斜視図である。It is a perspective view of the tab terminal used for the surface mount type nonreciprocal circuit device concerning one example of the present invention. 本発明の一実施例に係る面実装型非可逆回路素子のマザーボードへの実装状態を示す部分拡大図である。It is the elements on larger scale which show the mounting state to the motherboard of the surface mounting type nonreciprocal circuit device based on one Example of this invention. 本発明の一実施例に係る面実装型非可逆回路素子に用いる中心導体のリード部の撓みを説明する為の図である。It is a figure for demonstrating the bending of the lead part of the center conductor used for the surface mount type nonreciprocal circuit device based on one Example of this invention. 本発明の一実施例に係る面実装型非可逆回路素子に用いる中心導体のリード部の他の態様を示す拡大図と断面図である。It is the enlarged view and sectional drawing which show the other aspect of the lead part of the center conductor used for the surface mount type nonreciprocal circuit device based on one Example of this invention. 本発明の他の実施例に係る面実装型非可逆回路素子の分解斜視図である。It is a disassembled perspective view of the surface mount type nonreciprocal circuit device according to another embodiment of the present invention. 本発明の他の実施例に係る面実装型非可逆回路素子のマザーボードへの実装状態を示す部分拡大図である。It is the elements on larger scale which show the mounting state to the motherboard of the surface mounting type nonreciprocal circuit device based on the other Example of this invention. 従来の面実装型非可逆回路素子の一例を示す斜視図である。It is a perspective view which shows an example of the conventional surface mount type nonreciprocal circuit device. 従来の面実装型非可逆回路素子の構造を示す部分分解斜視図である。It is a partial exploded perspective view which shows the structure of the conventional surface mount type nonreciprocal circuit device. 従来の面実装型非可逆回路素子のマザーボードへの実装状態を示す部分拡大図である。It is the elements on larger scale which show the mounting state to the motherboard of the conventional surface mount type nonreciprocal circuit element. 従来の面実装型非可逆回路素子の他の例を示す斜視図である。It is a perspective view which shows the other example of the conventional surface mount type nonreciprocal circuit device. 従来の面実装型非可逆回路素子の他の例を示す分解斜視図である。It is a disassembled perspective view which shows the other example of the conventional surface mount type nonreciprocal circuit device.

終端抵抗を備えたアイソレータを例として、図面を用いて本発明の一実施例に係る面実装型非可逆回路素子について詳細に説明する。図1は、マザーボードに実装された本発明の一実施例に係る面実装型非可逆回路素子の斜視図であり、図2は、本発明の一実施例に係る面実装型非可逆回路素子の分解斜視図である。
この非可逆回路素子は、3方向に開口13を有し、その内の一箇所には収納容器10の外周から突き出た延長部12が形成されている収納容器(下ケース)10を備え、収納容器10の内側に中心導体40が配置され、そのリード部20の内の一部を前記開口13から外部へ延出させ、前記延長部の端部でタブ端子5と接続している。タブ端子5と接続されないリード部20は延長部12の上に配置された吸収抵抗Rと接続している。収納容器(下ケース)10内には中心導体40を含む複数の収容部材が配置され、内底面側から、下アース板63、板状フェライト30b、中心導体40、板状フェライト30a、シールド板60、下鉄板65、永久磁石3、上鉄板70が順に重ねられて収容される。さらに蓋15が被せられて、収納容器10と蓋15とがはんだ等によるロウ付け、或いは、かしめ、溶接等により固定され、前記固定により生じる押圧力が前記収容部材に作用して、それらも合わせて固定される。
A surface mount type nonreciprocal circuit device according to an embodiment of the present invention will be described in detail with reference to the drawings using an isolator having a termination resistor as an example. FIG. 1 is a perspective view of a surface-mounted nonreciprocal circuit device according to an embodiment of the present invention mounted on a motherboard, and FIG. 2 is a perspective view of the surface-mounted nonreciprocal circuit device according to an embodiment of the present invention. It is a disassembled perspective view.
The nonreciprocal circuit device includes a storage container (lower case) 10 having openings 13 in three directions, and an extension 12 projecting from the outer periphery of the storage container 10 is formed in one of the openings 13. A central conductor 40 is disposed inside the container 10, a part of the lead portion 20 extends outside from the opening 13, and is connected to the tab terminal 5 at the end of the extension portion. The lead portion 20 not connected to the tab terminal 5 is connected to the absorption resistor R disposed on the extension portion 12. A plurality of housing members including the center conductor 40 are disposed in the housing container (lower case) 10. From the inner bottom surface side, the lower ground plate 63, the plate-like ferrite 30 b, the center conductor 40, the plate-like ferrite 30 a, and the shield plate 60. The lower iron plate 65, the permanent magnet 3, and the upper iron plate 70 are stacked and accommodated in this order. Further, the cover 15 is put on, and the storage container 10 and the cover 15 are fixed by brazing with solder or the like, or caulking, welding, etc., and the pressing force generated by the fixing acts on the storage member, and they are also combined. Fixed.

図3は本実施例の面実装型非可逆回路素子で用いた中心導体40の平面図である。中央部の共通導体部45からリード部20がθa、θb、θcの角度をもって三方向に延長形成され、途中でθdの角度で屈曲している。基本的な設計として入出力端のインピーダンスを同じくするのであれば角度θa、θb、θcをそれぞれ120°とするが、アイソレータにおいては、動作周波数において、付加される終端抵抗Rにリアクタンス成分が多く含まれると、インピーダンスのずれが生じて電気的特性の劣化を招く。そこで、これを補償するため終端抵抗Rと接続するリード部20と他のリード部20との角度を100°〜120°とする場合もある。この場合には高周波信号が入出力する他のリード部20間の角度は120°〜160°となる。
中心導体40の厚みは、リード部20にばね性が付与される程度の厚みであれば良く、リン青銅薄板であれば、50μm〜250μmであるのが望ましい。中心導体40の厚みが厚くなるに従って板状フェライト30a,30b間に形成される空間が増加し、非可逆回路素子として動作するのに寄与しない漏洩磁束が増えるため薄く構成するのが望ましい。
またリード部の幅は捻りや横方向からの外力により、容易に変形が生じない程度の幅であれば良く、リン青銅薄板で構成すれば、2mm〜5mmであるのが望ましい。
FIG. 3 is a plan view of the central conductor 40 used in the surface mount type nonreciprocal circuit device of this embodiment. The lead portion 20 extends from the central common conductor portion 45 in three directions at angles θa, θb, and θc, and is bent at an angle θd on the way. If the impedance at the input and output ends is the same as a basic design, the angles θa, θb, and θc are 120 °, respectively. However, in the isolator, the terminal resistor R that is added includes a lot of reactance components at the operating frequency. If this occurs, an impedance shift occurs and the electrical characteristics are degraded. Therefore, in order to compensate for this, the angle between the lead portion 20 connected to the termination resistor R and the other lead portion 20 may be set to 100 ° to 120 °. In this case, the angle between the other lead portions 20 through which high-frequency signals are input and output is 120 ° to 160 °.
The thickness of the center conductor 40 may be a thickness that allows the lead portion 20 to have springiness, and is preferably 50 μm to 250 μm if it is a phosphor bronze thin plate. As the thickness of the central conductor 40 increases, the space formed between the plate-like ferrites 30a and 30b increases, and the leakage magnetic flux that does not contribute to the operation as a nonreciprocal circuit element increases.
Further, the width of the lead portion may be a width that does not easily deform due to twisting or an external force from the lateral direction, and is preferably 2 mm to 5 mm if it is made of a phosphor bronze thin plate.

本発明において、中心導体40のリード部20を、板状フェライト30a,30bからの延出方向と異なる平面方向に屈曲している。
図6はリード部20に作用する外力に対する撓みの状態を示す図である。屈曲部を設けずに延出方向に直線状にリード部20を構成する場合、その端部(移動端)に外力が作用して大きな変位が生じると板状フェライト30a、30bに挟持された部位(固定端)に大きな応力が発生し、リード部20が塑性変形してしまう場合がある。そこで本発明では、途中でθdの角度でリード部20を屈曲させることで、移動端側での上下方向の変位を、板状フェライト側では一部捻るように変化させている。
リード部20は上下方向の変位に対しては容易に変形するが、捻りに対しては変形し難いものであるので、タブ端子側の変位(撓み)を電気的接続に必要な程度に制限しながら、大きな外力に対してもリード部20が塑性変形しないようにすることが出来る。またリード部20の長さを僅かであるが長く確保出来るため、固定端に作用する応力も低減することが出来る。なお本実施例では角度θdについては角度θa〜θcにも依るが、100°〜170°とするのが望ましい。
In the present invention, the lead portion 20 of the central conductor 40 is bent in a plane direction different from the extending direction from the plate-like ferrites 30a and 30b.
FIG. 6 is a diagram showing a state of bending with respect to an external force acting on the lead portion 20. When the lead portion 20 is formed in a linear shape in the extending direction without providing a bent portion, a portion that is sandwiched between the plate-like ferrites 30a and 30b when an external force acts on the end portion (moving end) and a large displacement occurs. A large stress is generated at the (fixed end), and the lead portion 20 may be plastically deformed. Therefore, in the present invention, the lead portion 20 is bent at an angle θd in the middle, so that the vertical displacement on the moving end side is changed to be partially twisted on the plate-like ferrite side.
The lead portion 20 is easily deformed with respect to the vertical displacement, but is difficult to be deformed with respect to the twist. Therefore, the displacement (bending) on the tab terminal side is limited to an extent necessary for electrical connection. However, the lead portion 20 can be prevented from being plastically deformed even by a large external force. Moreover, since the length of the lead part 20 is small but can be secured long, the stress acting on the fixed end can also be reduced. In this embodiment, the angle θd is preferably 100 ° to 170 °, although it depends on the angles θa to θc.

また図7(a)(b)に示す様に、窪みにより曲げに対する耐力を向上させるため、リード部20の固定端からタブ端子5との間に、延出方向と平行に線状の窪み27を形成しても良い。前記窪みは金型により打設するなどして形成することが出来る。断面視でU字状やV字状に形成し、これを複数設けて波状としても良い。   Further, as shown in FIGS. 7A and 7B, in order to improve the bending resistance by the depression, a linear depression 27 is formed between the fixed end of the lead portion 20 and the tab terminal 5 in parallel with the extending direction. May be formed. The indentation can be formed by casting with a mold. A U-shape or a V-shape may be formed in a cross-sectional view, and a plurality of them may be provided to form a wave shape.

図4(a)〜(d)にタブ端子5の形状の一例を示す。円柱状(a)や切頭円錐形状(b)、あるいは押しピン形状(c),(d)に形成される。なお押しピン形状とする場合に、細軸と太軸の中心は同心に無くても良い。中心を異ならせることも当然可能である。加工の容易さからは同心にあるのが好ましく、細軸側を円柱、あるいは切頭円錐形状とし、太軸側を多角形状にて形成しても良い。   An example of the shape of the tab terminal 5 is shown in FIGS. It is formed in a cylindrical shape (a), a truncated cone shape (b), or push pin shapes (c), (d). In the case of a push pin shape, the center of the thin axis and the thick axis may not be concentric. Of course, the center can be different. It is preferable that they are concentric from the viewpoint of ease of processing, and the thin shaft side may be formed into a cylinder or a truncated cone shape, and the thick shaft side may be formed into a polygonal shape.

図5はタブ端子5をリード部20の端部の貫通孔22に挿通し、はんだで固定した後、実装用部材204に配置して配線205と接続した場合の部分拡大断面図である。あわせてタブ端子5の形状が異なる場合のリード部20との接続状態を示す。
タブ端子5の底面6を収納容器10の底面11よりも数十μm〜数百μm程度、低く形成すれば、実装用部材204上への載置によってリード部20が僅かに撓み、前記収納容器10の底面11と前記タブ端子5の底面6とが略同一面となる。また、図5(i)〜(iv)に示す様にタブ端子5が切頭円錐形状や押しピン形状であれば、段差等によって実装用部材204側のタブ端子5の突出長さを容易に規定することが出来る。なお、タブ端子5が挿通されるリード部20端の貫通孔は、円形状や楕円、多形状、或いはその変形であり、その外周側のリード部が抜かれて、例えばC状の貫通孔としても良い。
FIG. 5 is a partially enlarged cross-sectional view when the tab terminal 5 is inserted into the through hole 22 at the end of the lead portion 20 and fixed by soldering, and then placed on the mounting member 204 and connected to the wiring 205. In addition, a connection state with the lead portion 20 when the tab terminal 5 has a different shape is shown.
If the bottom surface 6 of the tab terminal 5 is formed to be lower than the bottom surface 11 of the storage container 10 by several tens of μm to several hundreds of μm, the lead portion 20 slightly bends due to the mounting on the mounting member 204, and the storage container The bottom surface 11 of 10 and the bottom surface 6 of the tab terminal 5 are substantially flush with each other. Further, if the tab terminal 5 is a truncated cone shape or a push pin shape as shown in FIGS. 5 (i) to (iv), the protruding length of the tab terminal 5 on the mounting member 204 side can be easily increased by a step or the like. It can be specified. The through hole at the end of the lead portion 20 through which the tab terminal 5 is inserted is circular, oval, polymorphic, or a modification thereof, and the lead portion on the outer peripheral side is removed, for example, as a C-shaped through hole. good.

(実施例1)
以下本発明に係る非可逆回路素子を詳細に説明する。なお、全体の構成は前項で既に説明した図1及び図2と同様なので、重複する部分については説明を略すこととする。SPCCからなる収納容器10の内側底面に0.1mm厚みの下アース板63を配置した。収納容器10には、下部Cu−中間部Ni−上部Auの順に総厚み10〜30μmのめっき層を形成している。
下アース板63上には板状フェライト30bが配置される。更にその上に中心導体40を配置した。この中心導体40は、厚さ150μmのリン青銅をエッチングして形成されたものである。リード部20は120°の角度をもって延出し、タブ端子5と接続されるリード部20には150°の角度をもって屈曲している。
Example 1
Hereinafter, the nonreciprocal circuit device according to the present invention will be described in detail. Since the entire configuration is the same as that of FIGS. 1 and 2 already described in the previous section, the description of the overlapping parts will be omitted. A lower ground plate 63 having a thickness of 0.1 mm was disposed on the inner bottom surface of the storage container 10 made of SPCC. In the storage container 10, a plating layer having a total thickness of 10 to 30 μm is formed in the order of lower Cu—intermediate part Ni—upper Au.
A plate-like ferrite 30 b is disposed on the lower ground plate 63. Further, a central conductor 40 is disposed thereon. The central conductor 40 is formed by etching phosphor bronze having a thickness of 150 μm. The lead portion 20 extends at an angle of 120 °, and the lead portion 20 connected to the tab terminal 5 is bent at an angle of 150 °.

高周波信号が入出力するリード部20の端部にはφ0.6mmの貫通孔22が形成されている。細軸側がφ0.50mm、太軸側がφ1.0mmの押しピン形状に形成されたタブ端子5が、その細軸側を前記貫通孔22に挿通されて、リード部20と半田にて接続されている。リード部20の下部に現れるタブ端子5の長さは、その低面が収納容器10の低面よりも約0.1m低くなるように形成されている。   A through hole 22 having a diameter of 0.6 mm is formed at the end of the lead portion 20 through which high-frequency signals are input and output. A tab terminal 5 formed in a push pin shape having a thin shaft side of φ0.50 mm and a thick shaft side of φ1.0 mm is inserted into the through hole 22 on the thin shaft side and connected to the lead portion 20 by solder. Yes. The length of the tab terminal 5 appearing at the lower portion of the lead portion 20 is formed such that its lower surface is about 0.1 m lower than the lower surface of the storage container 10.

中心導体40の上には板状フェライト30aが配置される。板状フェライト30a、30bとしてφ17mm、0.5mm厚みで、比誘電率εrが11、飽和磁化4πMsが115mTであり、誘電損失tanδεが2×10−4のガーネットフェライトを用いた。 A plate-like ferrite 30 a is disposed on the center conductor 40. As the plate-like ferrites 30a and 30b, garnet ferrite having a diameter of 17 mm and a thickness of 0.5 mm, a relative dielectric constant εr of 11, a saturation magnetization of 4πMs of 115 mT, and a dielectric loss tan δε of 2 × 10 −4 was used.

板状フェライト30aの上には、0.1mm厚みのシールド板60、厚みが0.8mmのSPCCからなる下鉄板65、φ20mmで厚みが5mmの永久磁石3、厚みが0.8mmの上鉄板70が順に重ねられて収容される。さらにSPCCからなり厚みが0.2mmの蓋15が配置され、収納容器10の上端の折り返し部に、蓋15の端部をかしめて収容部材とともに固定した。
前記永久磁石3はLa−Co置換型フェライト磁石を用いた。磁気特性は、残留磁束密度(Br)が430〜450mTで、固有保磁力(iHc)は382〜414KA/mである。
On the plate-like ferrite 30a, a shield plate 60 having a thickness of 0.1 mm, a lower iron plate 65 made of SPCC having a thickness of 0.8 mm, a permanent magnet 3 having a diameter of 20 mm and a thickness of 5 mm, and an upper iron plate 70 having a thickness of 0.8 mm. Are stacked and accommodated in order. Further, a lid 15 made of SPCC and having a thickness of 0.2 mm was disposed, and the end of the lid 15 was caulked to the folded portion at the upper end of the storage container 10 and fixed together with the housing member.
The permanent magnet 3 was a La-Co substitution type ferrite magnet. As for the magnetic properties, the residual magnetic flux density (Br) is 430 to 450 mT, and the intrinsic coercive force (iHc) is 382 to 414 KA / m.

得られた面実装型非可逆回路素子をマザーボードに載置した。面実装型非可逆回路素子のタブ端子5との接続状態を確認する様に、配線に半田などの接続部材を塗布しないで載置し、この状態で2つのリード部20と接続する配線間の抵抗値を確認した。その結果、面実装型非可逆回路素子のタブ端子間の抵抗値と差がなく良好な実装状態が得られることを確認した。更に配線とタブ端子を半田接続しマザーボードに外力を加えて、繰り返し撓ませる撓み試験を行なったが、配線とタブ端子との接続状態は良好に維持された。   The obtained surface mount type nonreciprocal circuit device was placed on a motherboard. In order to check the connection state with the tab terminal 5 of the surface mount type non-reciprocal circuit element, the wiring is placed without applying a connecting member such as solder, and in this state, between the wirings connected to the two lead portions 20 The resistance value was confirmed. As a result, it was confirmed that there was no difference in resistance value between the tab terminals of the surface mount type nonreciprocal circuit element and a good mounting state was obtained. Furthermore, a bending test was repeated in which the wiring and the tab terminal were soldered and external force was applied to the mother board to bend repeatedly, but the connection state between the wiring and the tab terminal was maintained well.

(実施例2)
面実装型非可逆回路素子の他の態様による構成を示す。図8はその構造を示す分解斜視図である。また図9に実装用部材204に配置した場合の部分拡大断面図を示す。この面実装型非可逆回路素子は収納容器10と終端抵抗80が板状部材6に載置されるものであり、図1及び図2で示したものとは基本的な構成を同じとするものである。
板状部材6はAl−Si−Cu系合金のADC12材からなる金属板で45mm×35mmの矩形で厚みが1.2mmに構成され、その4隅には取り付け用のネジ孔が形成されている。タブ端子5の底面は板状部材の底面よりも約0.05nn低く形成されており、実装用部材205上への載置によってリード部が撓み、前記収納容器の底面と前記タブ端子の底面とを略同一面とすることが出来た。
(Example 2)
The structure by the surface pattern type nonreciprocal circuit device by the other aspect is shown. FIG. 8 is an exploded perspective view showing the structure. FIG. 9 shows a partially enlarged cross-sectional view when arranged on the mounting member 204. In this surface mount type nonreciprocal circuit device, the storage container 10 and the terminating resistor 80 are placed on the plate-like member 6, and the basic configuration is the same as that shown in FIGS. 1 and 2. It is.
The plate-like member 6 is a metal plate made of an Al-Si-Cu-based ADC12 material, is a rectangle of 45 mm x 35 mm and has a thickness of 1.2 mm, and screw holes for attachment are formed at the four corners. . The bottom surface of the tab terminal 5 is formed to be approximately 0.05 nn lower than the bottom surface of the plate-like member, and the lead portion is bent by mounting on the mounting member 205, and the bottom surface of the storage container and the bottom surface of the tab terminal are Can be made substantially the same plane.

5 タブ端子
10 収納容器
20 リード部
30a、30b 板状フェライト
40 中心導体
5 Tab terminal 10 Storage container 20 Lead part 30a, 30b Plate-shaped ferrite 40 Center conductor

Claims (5)

収納容器に、板状フェライトと、中心導体と、永久磁石を重ねて配置し、前記収納容器から延出した中心導体のリード部の端部と接続する導電性のタブ端子を備えた非可逆回路素子であって、
前記リード部は、板状フェライトと重ねられる中心導体の共通導体部を中心とし、放射状に所定の角度間隔をもって3方向へ放射状に延びて板状フェライトの外縁側部に現われ、その先が収納容器内において延出方向とは異なる平面方向に屈曲しており、板状フェライト外縁側部側が固定端となり前記タブ端子側を移動端として撓み可能とし
前記リード部は、板状フェライト外縁側部側からタブ端子側との間に、延出方向と平行に線状の窪みが形成されたことを特徴とする面実装型非可逆回路素子。
A nonreciprocal circuit comprising a conductive tab terminal connected to an end portion of a lead portion of a central conductor extending from the storage container, in which a plate-shaped ferrite, a central conductor, and a permanent magnet are arranged in a storage container. An element,
The lead portion is centered on the common conductor portion of the central conductor that is overlapped with the plate-like ferrite, and radially extends in three directions at predetermined angular intervals and appears on the outer edge side portion of the plate-like ferrite, and the tip of the lead portion It is bent in a plane direction different from the extending direction inside, and the plate-like ferrite outer edge side portion side becomes a fixed end and can be bent with the tab terminal side as a moving end ,
The surface mount type non-reciprocal circuit device , wherein the lead portion is formed with a linear recess in parallel with the extending direction between the plate ferrite outer edge side and the tab terminal side .
収納容器に、板状フェライトと、中心導体と、永久磁石を重ねて配置し、前記収納容器から延出した中心導体のリード部の端部と接続する導電性のタブ端子を備えた非可逆回路素子であって、A nonreciprocal circuit comprising a conductive tab terminal connected to an end portion of a lead portion of a central conductor extending from the storage container, in which a plate-shaped ferrite, a central conductor, and a permanent magnet are arranged in a storage container. An element,
前記リード部は、板状フェライトと重ねられる中心導体の共通導体部を中心とし、放射状に所定の角度間隔をもって3方向へ放射状に延びて板状フェライトの外縁側部に現われ、その先が収納容器内において延出方向とは異なる平面方向に屈曲しており、板状フェライト外縁側部側が固定端となり前記タブ端子側を移動端として撓み可能とし、The lead portion is centered on the common conductor portion of the central conductor that is overlapped with the plate-like ferrite, and radially extends in three directions at predetermined angular intervals and appears on the outer edge side portion of the plate-like ferrite, and the tip of the lead portion It is bent in a plane direction different from the extending direction inside, and the plate-like ferrite outer edge side portion side becomes a fixed end and can be bent with the tab terminal side as a moving end,
前記タブ端子は平坦な底面を有する略円柱形状、切頭円錐形状、押しピン形状であって、The tab terminal has a substantially cylindrical shape having a flat bottom surface, a truncated cone shape, a push pin shape,
前記収納容器が板状部材に載置され、前記リード部は板状部材から延出してその外縁側に前記タブ端子が位置し、前記タブ端子の底面は板状部材の底面よりも低く形成されることを特徴とする面実装型非可逆回路素子。The storage container is placed on a plate-like member, the lead portion extends from the plate-like member, the tab terminal is positioned on the outer edge side thereof, and the bottom surface of the tab terminal is formed lower than the bottom surface of the plate-like member. A surface-mounting non-reciprocal circuit device.
収納容器に、板状フェライトと、中心導体と、永久磁石を重ねて配置し、前記収納容器から延出した中心導体のリード部の端部と接続する導電性のタブ端子を備えた非可逆回路素子であって、A nonreciprocal circuit comprising a conductive tab terminal connected to an end portion of a lead portion of a central conductor extending from the storage container, in which a plate-shaped ferrite, a central conductor, and a permanent magnet are arranged in a storage container. An element,
前記リード部は、板状フェライトと重ねられる中心導体の共通導体部を中心とし、放射状に所定の角度間隔をもって3方向へ放射状に延びて板状フェライトの外縁側部に現われ、その先が収納容器内において延出方向とは異なる平面方向に屈曲しており、板状フェライト外縁側部側が固定端となり前記タブ端子側を移動端として撓み可能とし、The lead portion is centered on the common conductor portion of the central conductor that is overlapped with the plate-like ferrite, and radially extends in three directions at predetermined angular intervals and appears on the outer edge side portion of the plate-like ferrite, and the tip of the lead portion It is bent in a plane direction different from the extending direction inside, and the plate-like ferrite outer edge side portion side becomes a fixed end and can be bent with the tab terminal side as a moving end,
前記タブ端子は平坦な底面を有する略円柱形状、切頭円錐形状、押しピン形状であって、The tab terminal has a substantially cylindrical shape having a flat bottom surface, a truncated cone shape, a push pin shape,
前記収納容器が板状部材に載置され、前記リード部は板状部材から延出してその外縁側に前記タブ端子が位置し、前記板状部材が実装用部材上に形成された窪み部に載置され、前記タブ端子の底面は板状部材の底面よりも高く形成されることを特徴とする面実装型非可逆回路素子。The storage container is placed on a plate-like member, the lead portion extends from the plate-like member, the tab terminal is positioned on the outer edge side thereof, and the plate-like member is formed in a recess formed on the mounting member. A surface-mounting non-reciprocal circuit device that is mounted and has a bottom surface of the tab terminal formed higher than a bottom surface of the plate-like member.
前記中心導体がリン青銅からなる薄板から形成されたことを特徴とする請求項1乃至3のいずれかに記載の面実装型非可逆回路素子。4. The surface-mounting nonreciprocal circuit device according to claim 1, wherein the central conductor is formed of a thin plate made of phosphor bronze. 実装用部材上に非可逆回路素子を載置すると、前記収納容器の底面と前記タブ端子の底面とが略同一面となることを特徴とする請求項2又は3に記載の面実装型非可逆回路素子。 The surface-mounting type nonreciprocal according to claim 2 or 3 , wherein when the nonreciprocal circuit element is placed on the mounting member, the bottom surface of the storage container and the bottom surface of the tab terminal are substantially flush with each other. Circuit element.
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