JP2002111322A - Microwave element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a microwave element easily manufactured preferably in automated manufacturing processes. SOLUTION: A garnet ferrite magnet 6 having a diameter similar to a valium ferrite magnet 2 is placed on a conductor plate 3, with one leg part 3b folded back on the garnet ferrite magnet 6. Here, between a strip line 4 of the leg part 3b and the garnet magnet 6, a solder resist film 9 is present. One leg part 3c is folded back on the folded-back leg part 3b. Between the strip line 4 of the leg part 3c and the strip line 4 of the leg part 3b, the solder resist film 9 electrostatic-coated on the strip line 4 of the leg part 3c is present. Further, a remaining leg part 3d is folded back on the folded-back leg part 3c. Between the strip line 4 of the leg part 3d and the strip line 4 of the leg part 3c, the solder resist film 9 electrostatic-coated on the strip line 4 of the leg part 3d is present.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave device such as an isolator and a circulator used for a relay station for mobile communication, and more particularly to a microwave device which can be easily manufactured.

[0002]

2. Description of the Related Art A mobile communication device such as a cellular phone and a relay base station thereof are provided with an antenna used for transmitting and receiving a signal. The antenna is provided with a transmission signal transmitted from a transmission circuit at the time of transmission. Is connected to an antenna, and an isolator that transmits a reception signal transmitted from the antenna to a reception circuit at the time of reception is connected. 6A and 6B are diagrams showing a center conductor of a conventional isolator, wherein FIG.
(B) is a schematic sectional view along the BB line of (a). FIG. 7 is a plan view showing the conductor plate 23.

In the center conductor 21 of the conventional isolator, a garnet-based ferrite magnet 26 is mounted on a conductor plate 23. The conductor plate 23 is provided with a disk portion 23a having substantially the same diameter as the garnet-based ferrite magnet 26, and three legs 23b, 23c and 23d extending from the disk portion 23a. The three feet are the discs 23
a extend from the peripheral edge portion a, for example, in directions rotated by 120 ° with respect to each other. Each leg is provided with a strip line 24 extending in a direction away from the disk portion 23a in parallel with each other, and a soldering allowance 25 for connecting the strip lines 24 to each other.

One foot 23b is folded over a garnet-based ferrite magnet 26. Further, a polyimide film 27 having substantially the same diameter as that of the garnet-based ferrite magnet 26 is placed on the folded foot 23b, and one foot 23c is folded on the polyimide film 27. Furthermore, on the folded back leg 23c,
A polyimide film 28 having substantially the same diameter as the garnet-based ferrite magnet 26 is placed, and the remaining feet 23d are folded over the polyimide film 28. The thickness of the garnet-based ferrite magnet 26 is about 0.5 mm, and the thickness of the polyimide films 27 and 28 is 25 mm.
It is about μm.

[0005] The conventional center conductor configured as described above is inserted into a hole formed in the center of a case (not shown) made of a dielectric material. A grounding body (not shown) made of a dielectric is provided on the back surface of the case, and the disk portion 23a is connected to the grounding body. Also, three electrodes are provided on the surface of the case, and each electrode has a soldering allowance of 25 for each foot.
Are soldered. Also, the foot 23d located on the outermost surface
A permanent magnet (not shown) made of barium ferrite or the like is placed on the top, and three feet 23b, 23c and 23
d will be located in the magnetic field formed by these magnets, sandwiched between the two magnets.

[0006]

However, the conventional isolators as described above have a problem that it is difficult to handle the polyimide films 27 and 28 during the manufacturing process. For example, a polyimide film is easily charged with static electricity and is hard to be fixed at a predetermined position. In addition, for example, a polyimide film is packed in a large amount and is taken out one by one from the bag. When trying to take out one, two polyimide films are taken out at the same time and taken out and placed between the feet. . Therefore, it is extremely difficult to automate even mass production.

The present invention has been made in view of the above problems, and has as its object to provide a microwave device that can be easily manufactured, and preferably can automate the manufacturing process.

[0008]

According to the present invention, there is provided a microwave device comprising: a disk-shaped permanent magnet; a plurality of strip lines sequentially laminated on the permanent magnet so as to cross each other; And a disc-shaped conductor portion connected to the plurality of strip lines and arranged on the back side of the microwave device, wherein the plurality of strip lines are formed in at least one of the strip lines. Characterized by being insulated from each other by the insulating film.

In the present invention, a plurality of strip lines are insulated by an insulating film formed thereon. Therefore, the strip lines are insulated from each other without any troublesome handling when a circular polyimide film is used. In addition, since it is not necessary to separate thin films which are easily charged with static electricity one by one, it is possible to automate the film.

In the case where the insulating film is formed from a solder resist film or a photoresist film, the insulating film itself can be processed by photoetching, so that it can be formed particularly easily.

[0011] The insulating film may be formed by electrostatic coating of an insulator;
It can be formed by attaching an insulating sheet, dropping an insulator liquid, immersing the insulator in the liquid, or spin coating the insulator.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an isolator and a circulator according to an embodiment of the present invention will be specifically described with reference to the accompanying drawings. FIG. 1 is a diagram showing an isolator according to a first embodiment of the present invention, wherein (a) is a plan view,
(B) is a sectional view taken along line AA of (a). FIG. 2 is a plan view showing the conductor plate 3.

In the center conductor 1 of the isolator according to the first embodiment, for example, a garnet ferrite magnet 6 is mounted on the conductor plate 3. In the conductor plate 3,
As shown in FIG. 2, a disk portion 3a having substantially the same diameter as the ferrite magnet 6, three legs 3b extending from the disk portion 3a,
3c and 3d are provided. The three legs extend from the peripheral edge of the disk portion 3a, for example, in directions rotated by 120 ° from each other. Each leg is provided with a strip line 4 extending in a direction away from the disk portion 3a in parallel with each other and a soldering allowance 5 for connecting the strip lines 4 to each other. A solder resist film 9 is formed on the upper surface of the strip line 4 by electrostatic coating except for both end portions.
The thickness of the solder resist film 9 is, for example, 25 to 50 μm.
It is. The conductor plate 3 is made of, for example, phosphor bronze plated with silver, but is not limited thereto. Further, as the ferrite magnet 6, not only a garnet-based ferrite magnet but also a nickel-based ferrite magnet or a magnesium-based ferrite magnet may be used. However, it is preferable to use a magnet having excellent high-frequency characteristics as the magnet placed on the conductor plate.

One foot 3b is folded over the garnet ferrite magnet 6. At this time, a solder resist film 9 is interposed between the strip line 4 of the foot 3b and the garnet-based magnet 6. Further, one foot 3c is folded over the folded foot 3b. A solder resist film 9 electrostatically coated on the strip line 4 of the foot 3c is interposed between the strip line 4 of the foot 3c and the strip line 4 of the foot 3b. Further, the remaining foot 3 is placed on the folded foot 3c.
d is folded back. Strip line 4 of foot 3d
And between the strip line 4 of the foot 3c and the foot 3d
The solder resist film 9 electrostatically coated is interposed in the strip line 4 of FIG. The thickness of the garnet-based ferrite magnet 6 is, for example, about 0.5 mm, but is not limited thereto.

In this embodiment, the central conductor 1 thus constructed is inserted into a hole 13a formed in the center of a case 13 made of a dielectric, as shown in FIG. A grounding body 14 made of a dielectric is provided on the back of the case 13.
Is provided. Then, the disk part 3 a is connected to the grounding body 14. On the surface of the case 13, three electrodes 15b, 15c and 15d are provided. Among these, for example, the resistor 16 is connected to the electrode 15c. The solder allowance 5 of the foot 3b is soldered to the electrode 15b, the solder allowance 5 of the foot 3c is soldered to the electrode 15c, and the solder allowance 5 of the foot 3d is soldered to the electrode 15d. Further, a permanent magnet 2 made of barium ferrite or the like is placed on the foot 3d located on the outermost surface, and the three feet 3b, 3c, and 3d are connected to the garnet-based ferrite magnet 6 and the permanent magnet 2. And is located in a magnetic field formed by these magnets. Of the three legs 3b, 3c and 3d, for example, the leg 3c soldered to the electrode 15c is connected to the antenna, and the other leg 3c
b and 3d are connected to either the transmission circuit or the reception circuit, respectively. Further, as the permanent magnet 2, not only a barium ferrite magnet but also, for example, an alnico magnet or a rare earth magnet can be used.

Then, as described above, the transmission signal transmitted from the transmission circuit is transmitted to the antenna without flowing to the reception circuit, and the reception signal transmitted from the antenna is transmitted to the reception circuit without flowing to the transmission circuit. At this time, the foot 3b and the foot 3c are insulated by the solder resist film 9 electrostatically coated on the strip line 4 of the foot 3c, and the foot 3c and the foot 3d are connected to the foot 3d. It is insulated by the electrostatically applied solder resist film 9. Therefore, no short circuit occurs, and the signal transmission is performed reliably.

Although a solder resist film is used instead of a polyimide film for insulation between the feet, the formation of the solder resist film can be performed extremely easily as compared with the handling of the polyimide film. For example, a photosensitive solder resist film is formed on the entire surface of the conductive plate 3 by electrostatic coating, and if the photosensitive solder resist film is a positive type, light is irradiated to an area other than the strip line 9 to be a negative type. For example, the solder resist film 9 may be left only on the strip line 4 by irradiating light to a region corresponding to the strip line 9 and then performing development.

FIG. 3 is a plan view showing a method for processing a conductive plate. For example, metal plate 1 made of phosphor bronze with silver plating
The pattern 12 of the conductive plate 3 is formed by photo-etching or the like in a number of hundreds in each of the vertical and horizontal directions. In FIG. 3,
The line drawing portion inside the metal base plate 11 is a portion removed by photoetching or the like. Each pattern 12 is made of a metal plate 11
Is connected to the remaining portion at two points. Thereafter, for example, a positive photosensitive solder resist film (not shown) is electrostatically coated on the entire surface of the metal base plate 11, and light is applied to regions other than the strip lines. Next, by developing the photosensitive solder resist film, the solder resist film can be left only on the strip line. According to this method, the thickness of the solder resist film can be easily controlled by electrostatic coating, and specifically, can be adjusted to about 2 to 3 μm. This is very convenient for an isolator that may be used. Also,
Since there is no need to handle the polyimide film and the mechanical processing is easy, it is suitable for mass production by automation.

It should be noted that the solder resist film does not need to be formed over a wide area in the strip line, but is formed at least in a region where insulation from other feet can be ensured when folded over the magnet. I just need. In addition, since the garnet-based ferrite magnet is made of an insulator, the foot line that is folded back so as to be in contact with the garnet-based ferrite magnet need not have any solder resist film formed on the strip line. FIG. 4 shows a second embodiment of the present invention.
FIG. 9 is a plan view showing a solder resist film in the isolator according to the example of FIG.

In the second embodiment, no solder resist film is formed at the bottom, that is, on the foot 3b that is folded immediately above the garnet-based ferrite magnet.
On the other hand, in the foot 3c, a solder resist film 9a is formed by electrostatic coating on a portion of the strip line 4 overlapping with the foot 3b due to design, and in the foot 3d, a solder resist film 9a is formed in the strip line 4 due to design. A solder resist film 9a is formed by electrostatic coating on a portion overlapping with the foot 3b or 3c.

Even when the solder resist film 9a is formed as described above, insulation between the feet can be ensured, and the operation required for the isolator, that is, the signal transmitted by the antenna A signal transmitted from the transmission circuit and received by the antenna can be transmitted to the reception circuit. Further, the manufacturing process is not complicated.

In the first and second embodiments, the thickness of the solder resist film is not limited to about 25 to 50 μm. For example, even if the thickness is about 5 μm, insulation can be secured. The thickness may be about the same. Further, the insulating film formed on the strip line is not limited to a solder resist film, and may be any insulating material having heat resistance that does not melt at the time of soldering at about 200 ° C. It may be a tetrafluoroethylene-based resin film or a photoresist film. When a polytetrafluoroethylene-based resin film is used, patterning cannot be performed directly as in the case of a photosensitive solder resist film. Therefore, the resin film may be patterned using a mask. Furthermore, the method of forming these insulating films is not limited to electrostatic coating. For example, an insulating sheet may be attached to the above-described metal base plate, the metal base plate may be immersed in a liquid of an insulator, or the metal base plate may be spin-coated with the insulator.

The element to which the present invention is applied is not limited to an isolator, but can be applied to, for example, a circulator. FIG. 5 is a plan view showing a circulator according to a third embodiment of the present invention.

The center conductor 31 of the circulator according to the third embodiment comprises a conductor plate 33 and a ferrite magnet 36. The conductor plate 33 is provided with a disk portion (not shown) having substantially the same diameter as the ferrite magnet 36 and four legs 33b, 33c, 33d, and 33e extending from the disk portion. Each leg is provided with a strip line 34 and a solder allowance 35 as in the first and second embodiments. On the upper surface of the strip line 34, except for both ends, for example, a solder resist film 39 by electrostatic painting.
Are formed. And the four feet 33b, 33
c, 33d and 33e are sequentially folded on the garnet-based ferrite magnet 36. At this time, the legs are insulated from each other by the solder resist film 39 formed on each strip line 34.

As in the case of the isolator, the center conductor 31 is also provided with a hole 43 of a case 43 made of a dielectric material.
a, and a circulator is constructed by mounting the permanent magnet 32 thereon.

In the circulator according to the third embodiment, the solder resist film 3 is provided between the legs.
9 completely insulated. On the other hand, as described above, the solder resist film is extremely easy to form as compared with the conventional method of sandwiching a polyimide film.

When the present invention is applied to a circulator, the insulating film is not limited to the solder resist film, but may be, for example, a photoresist film. Further, the forming method is not limited to the electrostatic coating. For example, a method of attaching an insulating sheet on a metal base plate constituting a conductor plate may be used.

[0028]

As described in detail above, according to the present invention,
Since multiple strip lines crossing on the ferrite magnet are insulated by the insulating film formed on them,
Insulation between strip lines can be easily secured without causing troublesome handling when a circular polyimide film is used. Also, since it is not necessary to separate thin and easily charged films one by one,
It can also be automated. Further, when the insulating film is formed from a solder resist film or a photoresist film, the insulating film itself can be processed by photoetching, so that the insulating film can be formed particularly easily.

[Brief description of the drawings]

FIG. 1 is a diagram showing an isolator according to a first embodiment of the present invention, wherein (a) is a plan view and (b) is an AA of (a).
FIG. 4 is a schematic cross-sectional view along a line.

FIG. 2 is a plan view showing a conductor plate 3;

FIG. 3 is a plan view showing a method for processing a conductive plate.

FIG. 4 is a plan view showing a solder resist film in an isolator according to a second embodiment of the present invention.

FIG. 5 is a plan view showing a circulator according to a third embodiment of the present invention.

6A and 6B are views showing a conventional isolator, wherein FIG. 6A is a plan view and FIG. 6B is a schematic cross-sectional view taken along line BB of FIG.

FIG. 7 is a plan view showing a conductor plate 23;

[Explanation of symbols]

 1, 31; central conductor part 2, 32; permanent magnet 3, 33; conductor plate 4, 34; strip line 5, 35; soldering allowance 6, 36; ferrite magnet 9; solder resist film 11; 13, 43; Case 13a, 43a; Hole 14, Grounding body 15b, 15c, 15d; Electrode

Claims (3)

[Claims] 1. A disk-shaped permanent magnet, a plurality of strip lines sequentially laminated so as to intersect each other on the permanent magnet, and the plurality of strip lines disposed on the back side of the permanent magnet. A connected disk-shaped conductor,
Wherein the plurality of strip lines are insulated from each other by an insulating film formed on at least one of the strip lines. 2. The microwave device according to claim 1, wherein the insulating film is one kind of film selected from the group consisting of a solder resist film and a photoresist film. 3. The insulating film is selected from the group consisting of electrostatic coating of an insulator, sticking of an insulating sheet, dropping of a liquid of the insulator, immersion of the insulator in the liquid, and spin coating of the insulator. The microwave device according to claim 1, wherein the microwave device is a film formed by one of the above methods.