JP5471144B2 - Substrate inspection jig and substrate inspection method - Google Patents

Description

  The present invention relates to a substrate inspection jig and a substrate inspection method used in a substrate inspection apparatus for inspecting the quality of electrical connection of a wiring circuit provided on a printed wiring board or the like.

Conventionally, inspection of electrical connection of a printed circuit board (including an electronic component mounting substrate and an electronic component built-in substrate; hereinafter referred to as a substrate) of a wiring circuit, in particular, inspection of an electrical connection of a substrate having a large number of terminals. Then, in order to perform inspection efficiently, substrate inspection is performed using an inspection jig provided with a plurality of electrical measurement probes corresponding to a plurality of terminals .

There are various types of probes used for the substrate inspection, and they are selected in consideration of the distance between the terminals of the substrate and the cost. For example, there are a probe having an integral structure in which a probe pin and a spring are housed in a tube, a probe having a structure in which the probe pin and the spring are separated, and a wire pin made of a conductive material having elasticity. Note that having the above-described spring and elasticity is an indispensable element for the probe in order to reliably bring the probe into contact with the terminal even on a substrate with low surface flatness and unevenness.

  In the conventional board inspection, a concave part called a socket connected to a wire wire is arranged in an inspection jig, and electrical connection is made between the socket and the probe. For the purpose of reducing the weight and cost of jigs, inspection jigs having specifications (socketless) without the sockets have come to be used.

Furthermore, in recent years, the density of terminals such as packages has been increased, and the distance between terminals has become finer. As a result, the probe used does not require a complicated configuration, and many wire pins can be reduced in diameter. It is becoming used.

An example of the configuration of a substrate inspection jig that is frequently used in recent years is shown in FIG. An example of a substrate inspection using a conventional substrate inspection jig is shown in FIG. 7. The conventional substrate inspection jig 1 ′ is, for example, in contact with the terminal 11 of the wiring circuit of the substrate 10 and an electric signal flows. A conductive probe 2, a head structure 3 that arranges and holds the probe 2 so that the probe 2 faces the terminal 11 on a one-to-one basis, and an electric signal that flows through the probe 2 is used as a measurement unit of the substrate inspection apparatus. The electrode terminal 4 for transmitting to the electrode 2 and the electrode part structure 5 on which the electrode terminal 4 is disposed so that the electrode terminal 4 is opposed to the probe 2 on a one-to-one basis. The line 7 is transmitted to the measurement unit of the board inspection apparatus.

As shown in FIG. 7A, the substrate inspection using the substrate inspection jig 1 ′ having the above-described configuration is performed such that the terminal 11 and the probe 2 face each other one-on-one. the use jig 1 ', after placing in a non-contact state, as shown in FIG. 7 (b), the jig 1' substrate inspection pressed against the substrate 10, terminal 11 and the probe 2 and is sufficiently It is performed by pressing so as to come into contact.
Although details are omitted in FIG. 7B, the probe 2 is elastically bent in the space between the upper plate portion 31 and the lower plate portion 32 of the head portion structure 3 by pressing. It is in a state.

In addition, in the above-described substrate inspection jig, as a method for preventing misjudgment due to misalignment between the terminal and the probe, which is likely to occur as the wiring circuit density of the substrate increases, and preventing damage to the terminal , A method of disposing an anisotropic conductive rubber sheet between the probe and the probe has also been proposed (Patent Document 1).

JP 2001-52793 A

  However, the specifications that have been widely used in recent years, with no socket (socketless), have fewer contacts between the probe and electrode terminals than the conventional specifications in which the probe is inserted deeply into the socket. In this case, the number of contact points or the contact area changes due to elastic bending due to the pressure during the inspection and the change in the direction and position of the tip in contact with the electrode terminal, making it difficult to perform a stable inspection. There is a problem of becoming.

  In addition, since the electrode terminals are exposed, there is a problem that an insulator such as a foreign substance or oil is easily attached, and a high resistance state frequently occurs even if the electrical connection does not reach an insulating state.

  As described above, when the number of contact points between the probe and the electrode terminal is small and the electrical connection is unstable, it is necessary to increase the number of inspections (the number of retries) in order to obtain a reliable result. Further, a highly reliable inspection at a low current and a low voltage becomes difficult and cannot be used for inspection of components such as an integrated circuit.

  In addition, the electrode terminal is easily damaged due to the intensive pressing of the thin wire pin at a specific location of the electrode terminal, and it is necessary to frequently perform processing such as cleaning, polishing, and replating of the electrode terminal. Will also occur.

  The present invention has been made in view of the above-described problems. According to the present invention, even in a specification without a socket (socketless), the number of contacts between the probe and the electrode terminal is increased, and electrical contact is made. Can be improved, the inspection can be stabilized, and the reliability of the inspection can be enhanced. As a result, the number of inspections (the number of retries) can be reduced, and parts such as integrated circuits can be inspected.

  In addition, since the electrode terminal can be prevented from being damaged, it is also possible to reduce the number of processes such as cleaning, polishing, and re-plating of the electrode terminal.

To solve the above problems, a substrate inspection jig according to the present invention, between the probe and the electrode terminal, a configuration which is disposed an anisotropic conductive rubber sheet containing conductive particles as a basic configuration, the The anisotropic conductive rubber sheet is configured to be disposed at a desired position.
Further, the substrate inspection method according to the present invention is based on the electrical connection between the probe and the electrode terminal via the anisotropic conductive rubber sheet, and after the predetermined number of inspections, the anisotropic conductive rubber Changing the contact location between the probe and the anisotropic conductive rubber sheet by moving the sheet in parallel between the probe and the electrode terminal and disposing the sheet at a position different from the original disposition position. It is characterized by making it .

That is, the invention according to claim 1 of the present invention is a substrate inspection jig for an apparatus for inspecting an electrical connection of a plurality of wiring circuits provided on a substrate, wherein the substrate inspection jig includes the wiring circuit. A conductive probe that contacts the terminal and through which an electrical signal flows, a head structure that arranges and holds the probe so that the probe faces the terminal on a one-to-one basis, and an electrical signal that flows through the probe An electrode terminal for transmitting to the device; and an electrode part structure having a flat surface structure disposed so that the electrode terminal is in a one-to-one relationship with the probe; and the head part structure, the electrode part structure, An anisotropic conductive rubber sheet containing conductive particles is disposed between them, and the electrode part structure has a guide pin for positioning and arranging the anisotropic conductive rubber sheet. The anisotropic conductive rubber sheet A guide hole through which the guide pin is inserted; the guide pin is detachable from the electrode structure; and the anisotropic conductive rubber is changed by changing a mounting position of the guide pin to a desired position. A substrate inspection jig characterized in that a sheet can be disposed at a desired position .

  In the invention according to claim 2 of the present invention, the anisotropic conductive rubber sheet has a thickness of 20 μm to 2 mm, and the conductive particles contained in the anisotropic conductive rubber sheet are gold, silver, copper 2. The substrate inspection jig according to claim 1, comprising any one of iron, nickel, or cobalt, an alloy thereof, or a metal plated with silver or copper. is there.

  The invention according to claim 3 of the present invention is characterized in that the anisotropic conductive rubber sheet is partially disposed so as to cover at least the surface of the electrode terminal. 2. The substrate inspection jig according to any one of 2 above.

In the invention according to claim 4 of the present invention, the probe is a socketless probe having an integral structure in which a probe pin and a spring are housed in a tube, or both ends of an elastic conductive material and the conductive material. claim 1-3, characterized in that the predetermined a wire pin comprising a tubular covering layer consisting loaded insulating material so as to cover the body portion excluding the length of the It is a jig | tool for a board | substrate inspection as described in one term .

The invention according to claim 5 of the present invention, the tip shape of the probe pin of the socket-less probe or tip shape of at least the electrode terminal side of the conductive material of the wire pin, substantially cylindrical with rounded edges 5. The substrate inspection jig according to claim 4, wherein the substrate inspection jig has any one of a substantially hemispherical shape, a substantially conical shape with rounded vertices, or a shape obtained by processing a substantially hemispherical or substantially conical tip end flatly. It is.

The invention according to claim 6 of the present invention, the tip of the probe pin of the socket-less probe, or the tip of at least the electrode terminal side of the conductive material of the wire pin, a diameter greater than the diameter of the body portion The substrate inspection jig according to claim 5 , wherein the substrate inspection jig is provided.

The invention according to claim 7 of the present invention is characterized in that the probe pin of the socketless probe is made of iron or beryllium copper, and the diameter of the probe pin is 0.01 mm to 1.50 mm. It is a board | substrate test | inspection jig | tool as described in any one of Claims 4-6 .

In the invention according to claim 8 of the present invention, the wire pin includes tungsten or beryllium copper, and has a substantially cylindrical conductive material having elasticity, and predetermined lengths at both ends of the conductive material. A cylindrical coating film made of an insulating material mounted so as to cover the removed barrel portion, and the diameter of the trunk portion of the conductive material is 0.05 mm to 0.15 mm a substrate inspection jig according to any one of claims 4-6, characterized.

In the invention according to claim 9 of the present invention, the substrate inspection jig has a DC current application voltage measurement of 10 nA to 200 mA, a DC voltage application current measurement of 1 mV to 250 V, or an angular frequency of 0.1 kHz to 1 MHz. a substrate inspection jig according to any one of claims 1 to 8, characterized in that used for AC measurement.

According to a tenth aspect of the present invention, in the substrate inspection method for inspecting the electrical connection of a plurality of wiring circuits provided on the substrate, a conductive probe through which an electric signal flows in contact with a terminal of the wiring circuit One end of the electrode terminal is disposed so as to be opposed to the terminal in a one-to-one relationship, and an electrode terminal for transmitting an electric signal flowing through the probe to the substrate inspection apparatus is disposed one-on-one with the opposite end of the probe. An anisotropic conductive rubber sheet containing conductive particles is disposed between the probe and the electrode terminal, and the probe is pressed against the terminal , whereby the probe is By pressing the anisotropic conductive rubber sheet in its thickness direction, and the probe is electrically connected to the opposing electrode terminal via the conductive particles contained in the anisotropic conductive rubber sheet. The pro The electrical signals flowing to convey the measurement portion of the substrate inspection device, a substrate inspection method for inspecting the electrical connection of the wiring circuit, after the inspection of a predetermined number of times, the anisotropic conductive rubber sheet, The contact location between the probe and the anisotropic conductive rubber sheet is changed by moving in parallel between the probe and the electrode terminal and disposing the probe at a position different from the original arrangement position. This is a characteristic substrate inspection method.

Further, in the invention according to claim 11 of the present invention, in the substrate inspection method, the electrode terminals are disposed so as to be opposed to the probe in a one-to-one correspondence with an electrode part structure having a flat surface structure, The electrode part structure has a guide pin for positioning and arranging the anisotropic conductive rubber sheet, and the anisotropic conductive rubber sheet has a guide hole through which the guide pin is inserted, and the guide The substrate inspection method according to claim 10 , wherein the anisotropic conductive rubber sheet is disposed at a desired position by inserting a pin through the guide hole.

Further, in the invention according to claim 12 of the present invention, in the substrate inspection method, the guide pin is detachable from the electrode portion structure, and the mounting position of the guide pin is changed to a desired position. The substrate inspection method according to claim 11 , wherein the anisotropic conductive rubber sheet is disposed at a desired position.

Further, in the invention according to claim 13 of the present invention, the substrate inspection method is a DC current applied voltage measurement of 10 nA to 200 mA, a DC voltage applied current measurement of 1 mV to 250 V, or an alternating current of an angular frequency of 0.1 kHz to 1 MHz. It is used for measurement, It is a board | substrate inspection method as described in any one of Claims 10-12 characterized by the above-mentioned.

  The substrate inspection jig according to the present invention has a basic configuration in which an anisotropic conductive rubber sheet containing conductive particles is disposed between a probe and an electrode terminal, and the substrate inspection method according to the present invention includes: In order to make electrical connection between the probe and the electrode terminal via the anisotropic conductive rubber sheet, even if the tip of the probe is deformed due to wear due to pressing during inspection, or the probe is elastically bent, Since the tip of the probe is in contact with a flexible anisotropic conductive rubber sheet with many contacts or a wide area and can be stably electrically connected, a stable and reliable inspection can be performed. As a result, the number of inspections (the number of retries) can be reduced, and parts such as integrated circuits can be inspected.

  In addition, the anisotropic conductive rubber sheet maintains insulation in the lateral direction where no pressure is applied, so there is no need for fine alignment in the installation, and it is only provided to cover all electrode terminals. Therefore, the phenomenon that the leakage current flows to the adjacent electrode terminals does not occur, and the predetermined length of the electrode terminals arranged in a one-to-one relationship with the vertical electrode terminals in accordance with the vertical pressure received by the probe An electric signal flows through the electrode terminal.

  In addition, since the electrode terminals are covered with an anisotropic conductive rubber sheet and are not exposed as in the conventional case, problems such as adhesion of foreign substances, oils and other insulators are less likely to occur, and a high resistance state is frequent. This also eliminates the problem that occurs.

  Furthermore, since the substrate inspection jig according to the present invention has a configuration in which a flexible anisotropic conductive rubber sheet is provided between the probe and the electrode terminal, the probe is repeatedly pressed according to the number of inspections. However, the probe is not in direct contact with the electrode terminal, and as a result, there is no risk of the electrode terminal being damaged, and it is necessary to frequently perform processing such as cleaning, polishing, and replating of the electrode terminal. There will be no.

  In addition, after a predetermined number of inspections, the anisotropic conductive rubber sheet is moved between the probe and the electrode terminal from the original arrangement position to change the contact location between the probe and the anisotropic conductive rubber sheet. If the substrate inspection method according to the present invention is used, it is possible to reduce damage to the anisotropic conductive rubber sheet due to intensively pressing the thin wire pins at a specific location of the anisotropic conductive rubber sheet. This makes it possible to avoid the effect of making the inspection unstable.

It is explanatory drawing which shows an example of a structure of the jig | tool for board | substrate inspection which concerns on this invention. Is an explanatory view showing an example of a substrate inspection using the substrate inspection jig according to the present invention, (a) shows the state of the terminal and the non-contact, showing a state of contact with (b) the terminal. It is explanatory drawing which shows an example of the front-end | tip shape of the wire pin which concerns on this invention, (a) is substantially cylindrical shape, (b) is substantially hemispherical, (c) shows substantially cone shape. It is explanatory drawing which shows the other example of the front-end | tip shape of the wire pin which concerns on this invention, (a) is the shape which processed the substantially hemispherical front end flatly, (b) is the substantially conical front end processed flatly Show shape. It is explanatory drawing which shows the other example of the front-end | tip shape of the wire pin which concerns on this invention, (a) is substantially cylindrical shape, (b) is substantially hemispherical, (c) is substantially conical shape. It is explanatory drawing which shows an example of a structure of the conventional board | substrate inspection jig | tool. Is an explanatory view showing an example of a substrate inspection using the conventional substrate inspection jig, showing the (a) state the state of the pin and the non-contact, (b) is in contact with the terminals.

Hereinafter, the present invention will be described with reference to the drawings.
[Board inspection jig]
One example of the configuration of the substrate inspection jig according to the present invention is shown in FIG. 1, and one example of the substrate inspection using the substrate inspection jig according to the present invention is shown in FIG. FIG. 6 shows an example of the configuration of a conventional substrate inspection jig, and FIG. 7 shows an example of the substrate inspection using the conventional substrate inspection jig.

A substrate inspection jig 1 according to the present invention is connected to a substrate inspection apparatus main body via a conductive probe 2, a head structure 3 arranged and held at a predetermined position, and a wire 7. The electrode terminal 4 and the electrode part structure 5 in which the electrode terminal 4 is disposed at a predetermined position. An anisotropic conductive rubber sheet is provided between the head part structure 3 and the electrode part structure 5. The basic configuration is that 6 is provided.
On the other hand, the conventional substrate inspection jig shown in FIG. 6 relates to the present invention in that the anisotropic conductive rubber sheet 6 is not disposed between the head portion structure 3 and the electrode portion structure 5. This is very different from the board inspection jig.

The probe 2 is disposed and held in the head structure 3 so as to be opposed to the terminals 11 of a plurality of wiring circuits provided on the substrate 10 on a one-to-one basis, and the electrode terminals 7 are arranged on a one-to-one basis on the probe 2. It arrange | positions at the electrode part structure 5 so that it may oppose.

In the substrate inspection, first, as shown in FIG. 2A, the substrate 10 and the substrate inspection jig 1 are not contacted so that the terminals 11 and the probe 2 face each other one-on-one. Next, as shown in FIG. 2B, the substrate inspection jig 1 is pressed against the substrate 10 and pressed so that the terminal 11 of the substrate and the probe 2 are in sufficient contact.

In addition, in FIG. 2, although the example in which the terminal is provided only on one side of the substrate is shown, the terminal may be provided on both sides of the substrate, and in that case, it corresponds to each surface of the substrate. Substrate inspection can also be performed by preparing a substrate inspection jig, aligning both sides of the substrate, and then pressing the substrate inspection jig against the substrate from both sides.

  Here, in a conventional substrate inspection jig that does not have an anisotropic conductive rubber sheet between the head portion structure 3 and the electrode portion structure 5, the probe is connected to the electrode every time the pressing process is performed during inspection. In particular, when the probe is a wire pin, it is likely to damage both the probe tip and the electrode terminal, especially when the probe is a wire pin. In addition, it is necessary to frequently perform processing such as polishing and re-plating.

  On the other hand, in the substrate inspection jig according to the present invention, since the flexible anisotropic conductive rubber sheet 6 is disposed between the head portion structure 3 and the electrode portion structure 5, the probe Even if 2 is repeatedly pressed, the probe 2 does not come into direct contact with the electrode terminal 4, and as a result, there is no possibility that both the probe 2 and the electrode terminal 4 are damaged. In addition, it is not necessary to perform a process such as polishing and re-plating at a high frequency.

  Further, after a predetermined number of inspections, the anisotropic conductive rubber sheet 6 is moved between the probe 2 and the electrode terminal 4 from the original arrangement position, and the probe 2 and the anisotropic conductive rubber sheet 6 are moved. If the substrate inspection method according to the present invention for changing the contact location is used, damage to the anisotropic conductive rubber sheet caused by pressing the probe 2 intensively at a specific location on the anisotropic conductive rubber sheet 6 will be described. It becomes possible to reduce, and the influence which makes test | inspection unstable can also be avoided.

  Note that the anisotropic conductive rubber sheet 6 maintains insulation in the lateral direction where no pressure is applied. Therefore, there is no need for fine alignment, and the anisotropic conductive rubber sheet 6 is arranged so as to cover all electrode terminals. It does not occur that the leakage current flows to the adjacent electrode terminals simply by providing the electrodes, and is arranged to face the electrode terminals in the vertical direction according to the vertical pressure received by the probe, that is, to face the probe one to one. An electric signal flows through the predetermined electrode terminal.

  Moreover, in the conventional board | substrate test | inspection jig | tool which does not have an anisotropic conductive rubber sheet, there are few contacts of the probe 2 and the electrode terminal 4, and when the probe 2 is a wire pin, it is elastic by the press at the time of a test | inspection. When the direction and position of the tip that is bent and is in contact with the electrode terminal 4 are changed, the number of contact points or the contact area is changed, which makes it difficult to perform a stable inspection.

  On the other hand, in the board inspection jig according to the present invention, the probe 2 and the electrode terminal 4 are electrically connected via the anisotropic conductive rubber sheet 6, so that the probe 2 is elastically bent by the pressing during the inspection. Even so, the tip of the probe 2 is in contact with the flexible anisotropic conductive rubber sheet 6 at a large number of contact points or a wide area, so that stable electrical connection can be obtained. It can be performed. As a result, the number of inspections (the number of retries) can be reduced, and parts such as integrated circuits can be inspected.

  Furthermore, in the conventional board inspection jig that does not have an anisotropic conductive rubber sheet, since the electrode terminals 4 are exposed, insulators such as foreign matters and oils and fats are easily attached, and the electrical connection is in an insulated state. There is also a problem that a high resistance state frequently occurs even if it is not reached.

  On the other hand, in the substrate inspection jig according to the present invention, the electrode terminal 4 is covered with the anisotropic conductive rubber sheet 6 and is not exposed as in the prior art. It becomes difficult to adhere, and the problem that the high resistance state frequently occurs can be solved.

[probe]
Examples of the probe used in the board inspection jig according to the present invention include an integrated probe (socketless probe) in which a probe pin and a spring are housed in a tube, and a probe itself using an elastic conductive material. Although the type (wire pin) etc. which utilize the elasticity which this has as a spring can be used, especially when a wire pin is used, the outstanding effect will be exhibited.

  For example, even if the wire pin elastically bends due to pressing during inspection, the tip of the wire pin is in contact with a flexible anisotropic conductive rubber sheet with a large number of contacts or a wide area, and stable electrical connection is achieved. Therefore, stable and highly reliable inspection can be performed. As a result, the number of inspections (the number of retries) can be reduced, and parts such as integrated circuits can be inspected.

  In addition, in the conventional substrate inspection jig, the electrode terminal is easily damaged due to the intensive press of the thin wire pin at a specific location of the electrode terminal, and the electrode terminal is cleaned, polished, and re-plated. However, in the board inspection jig according to the present invention, even if the wire pin is repeatedly pressed according to the number of inspections, the wire pin is directly applied to the electrode terminal. As a result, there is no possibility that the electrode terminal is damaged, and it is not necessary to frequently perform processing such as cleaning, polishing, and re-plating of the electrode terminal.

  As a material of the probe pin of the socketless probe, various known materials can be used as the probe pin. For example, iron (Fe) or beryllium copper (BeCu) is preferable. Moreover, in order to respond | correspond to various board | substrates, it is preferable that the diameter of a probe pin is 0.01 mm-1.50 mm.

As the conductive material of the wire pin, any conductive material having elasticity for reliably bringing the probe into contact with a plurality of terminals can be used even on an uneven substrate. For example, tungsten (W And those containing beryllium copper (BeCu) are preferred.

Moreover, since the space | interval of a terminal is also becoming fine with the increase in the density of the board | substrate which is a test object, it is preferable that the diameter of the electroconductive material of a wire pin is 0.05 mm-0.15 mm.

  The wire pin is provided with a cylindrical coating film made of an insulating material so as to cover the body portion excluding a predetermined length at both ends of the conductive material. Depending on the thickness of the film (for example, about 0.01 mm), the wire pin does not fall from the insertion hole 33 provided in the head part structure 3.

As long as the tip shape of the wire pin can be connected to the terminal of the substrate and the electrode terminal of the substrate inspection jig, any shape can be used. For example, as shown in FIG. At least the tip shape of the conductive material on the electrode terminal side is any one of a substantially cylindrical shape (a) with a rounded edge, a substantially hemispherical shape (b), or a substantially conical shape with a rounded vertex (c). Is preferable from the viewpoint of reducing damage to the anisotropic conductive rubber sheet.

  Also, for example, as shown in FIG. 4, when the tip shape of the conductive material is substantially hemispherical or substantially conical, further, the shape (a) obtained by processing the substantially hemispherical tip flatly or substantially conical The shape (b) obtained by processing the tip of the shape flat is preferable from the viewpoint of further reducing damage to the anisotropic conductive rubber sheet.

  Further, for example, as shown in FIG. 5, the edge shape of the conductive material at least on the electrode terminal side of the wire pin has a diameter larger than the diameter of the conductive material of the trunk portion on which the coating film is mounted. If the shape is any one of a substantially cylindrical shape (a), a substantially hemispherical shape (b), or a substantially conical shape (c) with a rounded vertex, the effect of reducing damage to the anisotropic conductive rubber sheet In addition, the anisotropic conductive rubber sheet can be in contact with a larger number of contacts or in a wider area, and since stable electrical connection can be obtained, a highly reliable inspection can be performed, which is preferable.

[Head structure]
The head inspection structure 3 of the substrate inspection jig according to the present invention is a housing made of an insulating material, and the tip of the probe 2 faces the terminal 11 of the substrate 10 on a one-to-one basis, and The probe 2 is disposed and held so that the other tip or bottom of the probe 2 faces the electrode terminal 4 on a one-to-one basis. There is no restriction | limiting in particular, The thing of the same kind as what was used for the conventional board | substrate test | inspection jig | tool can be used.
As the material of the head structure 3, for example, an insulating resin material, a glass material, a ceramic material, or the like can be used.

  When the probe 2 is a wire pin, for example, as shown in FIG. 1, the head portion structure 3 is inserted smaller than the diameter of the conductive material 21 of the wire pin and smaller than the outer shape of the coating film 22. A structure having an upper plate portion 31 and a lower plate portion 32 provided with holes 33, and a space between the upper plate portion 31 and the lower plate portion 32 so that a wire pin can be elastically bent by pressing. It has become. The diameter of the insertion hole 33 is, for example, 0.06 mm to 0.16 mm.

[Anisotropic conductive rubber sheet]
A substrate inspection jig 1 according to the present invention has a basic configuration in which an anisotropic conductive rubber sheet 6 containing conductive particles is disposed between a probe 2 and an electrode terminal 4. The substrate inspection method is based on the electrical connection between the probe 2 and the electrode terminal 4 via the anisotropic conductive rubber sheet 6.

  The anisotropic conductive rubber sheet 6 has a configuration in which conductive particles are contained in an insulating elastic polymer material in a state of being aligned in the thickness direction, and the resistance is reduced by being pressed in the thickness direction. That is, electricity flows. In the present invention, a general-purpose anisotropic conductive rubber sheet distributed in the market can be used.

As the insulating elastic polymer material constituting the anisotropic conductive rubber sheet 6, various materials can be used, for example, silicone resin, epoxy resin, and urethane resin can be used.
As the conductive particles, for example, various metal materials such as gold, silver, copper and the like, carbon materials, alloys thereof, or plated materials can be used.
Further, the conductive particles may contain a material exhibiting magnetism. This is because the conductive particles can be easily arranged in the thickness direction of the anisotropic conductive rubber sheet by the action of the magnetic field. As the conductive particles exhibiting such magnetism, for example, a magnetic metal such as iron, nickel, cobalt, or an alloy thereof, or a conductive metal such as gold, silver, copper, palladium, or rhodium is plated on these metals. Or a nonmagnetic metal plated with a magnetic metal as described above can be used.

  If the thickness of the anisotropic conductive rubber sheet 6 is too thin, the durability tends to be hindered, and if it is too thick, there is a problem that the conduction resistance increases. In the present invention, the anisotropic conductive rubber sheet preferably has a thickness of 20 μm to 2 mm.

Since the anisotropic conductive rubber sheet 6 maintains insulation in the lateral direction where no pressure is applied, it is not necessary to perform fine alignment in the installation, and the anisotropic conductive rubber sheet 6 is arranged to cover the electrode terminals 4. The leakage current does not flow to the adjacent electrode terminals 4 alone, and the vertical electrode terminals 4 are arranged in a one-to-one relationship with the probe 2 in accordance with the vertical pressure applied to the probe 2. An electric signal flows through the predetermined electrode terminal 4 provided.
Therefore, the anisotropic conductive rubber sheet 6 only needs to be partially disposed on the flat surface of the electrode structure 5 so as to cover at least the surface of the electrode terminal 4. It does not matter if it is not provided.

  The substrate inspection jig 1 according to the present invention may have a mechanism for disposing the anisotropic conductive rubber sheet 6 at an accurate position. For example, the electrode part structure 5 has a guide pin for positioning and arranging the anisotropic conductive rubber sheet 6, and the anisotropic conductive rubber sheet 6 has a guide hole through which the guide pin is inserted. be able to. This is for improving workability when the anisotropic conductive rubber sheet 6 is disposed, and for bringing the probe 2 into contact with a predetermined position of the anisotropic conductive rubber sheet 6.

  Further, the guide pin is detachable from the electrode part structure 5, and the anisotropic conductive rubber sheet 6 is disposed at a desired position by changing the mounting position of the guide pin to a desired position. It can also be configured.

  Further, in the present invention, after the predetermined number of inspections, the anisotropic conductive rubber sheet 6 is moved in parallel between the probe 2 and the electrode terminal 4 and disposed at a position different from the original disposed position. It is preferable to change the contact location between the probe 2 and the anisotropic conductive rubber sheet 4 by doing so. It is possible to reduce the damage to the anisotropic conductive rubber sheet due to the intensive pressing of the thin wire pins on the specific part of the anisotropic conductive rubber sheet, avoiding the effect of making the inspection unstable. This is because it becomes possible.

In addition, when the terminals of the substrate are arranged at equal intervals, the moving distance at which the anisotropic conductive rubber sheet is arranged at a position different from the original arrangement position is equal to the arrangement interval of the electrode terminals. It is preferable that the distance is an odd multiple of half.
Usually, for the purpose as described above, in order to move and dispose the anisotropic conductive rubber sheet efficiently, the distance between the terminals of the substrate, that is, the distance between the terminals of the electrode terminals, is moved by half. However, in a high-density mounted board, the interval between terminals is narrow (for example, 0.07 mm to 0.3 mm), and it is difficult to move and arrange a distance that is half the arrangement interval.
However, if it is an odd multiple, the moving distance can be increased, and an undamaged portion different from the portion where the probe was in contact with the original arrangement position can be arranged on the electrode terminal. It is.

[Electrode structure]
The electrode portion structure 5 of the substrate inspection jig 1 according to the present invention is a casing made of an insulating material, and is arranged on a flat surface so that the electrode terminals 4 face the probe 2 on a one-to-one basis. It has a structure to be installed and held. The arrangement interval of the electrode terminals 4 is the same as the interval of the terminals 11 of the substrate 10. The electrode terminal 4 transmits the electrical signal that has flowed to the probe 2 to the substrate inspection apparatus main body via the wire wire 7.

  The electrode part structure 5 can be the same type as that used for the conventional substrate inspection jig, similarly to the head part structure 3 described above. However, since the anisotropic conductive rubber sheet 6 is disposed between the probe 2 and the electrode terminal 4, when combined with the head structure 3, the anisotropic conductive rubber sheet 6 is more anisotropic than the conventional substrate inspection jig 1 ′. The board inspection jig 1 according to the present invention is assembled in a state where the thickness corresponding to the thickness of the conductive rubber sheet 6 is added.

  Further, as described above, the electrode part structure 5 may have a mechanism for positioning and arranging the anisotropic conductive rubber sheet 6. For example, the electrode part structure 5 may be provided with the anisotropic conductive rubber. A guide pin for positioning and arranging the sheet 6 may be provided, and the anisotropic conductive rubber sheet 6 may have a guide hole through which the guide pin is inserted.

[Board inspection]
As described above, the substrate inspection jig and the substrate inspection method according to the present invention can perform a stable and reliable inspection, reduce the number of inspections (the number of retries), and thus, like an integrated circuit. In addition, it is possible to inspect various components, and in particular, excellent effects can be exhibited in diode measurement of a substrate with a built-in integrated circuit.
For example, it can be suitably used for DC current application voltage measurement of 10 nA to 200 mA, DC voltage application current measurement of 1 mV to 250 V, or AC measurement of angular frequency 0.1 kHz to 1 MHz.

EXAMPLES Next, although an Example is given and this invention is demonstrated concretely, these Examples do not restrict | limit this invention at all.
Example 1
As the probe, 420 wire pins (90 μm diameter) having a substantially hemispherical tip are used, and disposed at a predetermined position of a conventional substrate inspection jig not provided with an anisotropic conductive rubber sheet. The same pressing process was repeated 200 times.

Using the substrate inspection jig provided with the wire pins that had been pressed 200 times, a continuity test using a conductive plate provided with a conductive material on the entire surface was performed.
In the continuity test, 70 blocks of wire pins were taken as one block, and 6 blocks were evaluated simultaneously in one test.

As a result of five continuity tests (all 30 blocks), continuity failure occurred in 21 blocks, and an accurate inspection could not be performed.
This is because the wire pin and the electrode terminal are worn by the repeated pressing process, the contact point between the wire pin and the electrode terminal changes or decreases, and the electrical connection is in an unstable state. Conceivable.

  Next, as the anisotropic conductive rubber sheet, an anisotropic conductive rubber sheet (JMT Co., Model No. 1810) having a thickness of 20 μm is used. The anisotropic conductive rubber sheet is used as a wire pin and an electrode terminal of the substrate inspection jig. The board inspection jig according to the present invention was prepared, and a continuity test was performed in the same manner as described above.

As a result of the five continuity tests (all 30 blocks), the continuity failure was resolved, and an accurate inspection was possible with all 30 blocks.
This is because the flexible anisotropic conductive rubber sheet deforms following the tip shape of the wire pin and the surface shape of the electrode terminal, increasing the number of contact points or contact surfaces with the wire pin and electrode terminal. This is thought to be due to the stable connection.

(Example 2)
A diode measurement test was performed on a substrate incorporating a five-terminal EEPROM including a GND, a power source, and three types of input / output terminals.
In this diode measurement test, two types of currents of 0.1 mA and 1 mA were applied, and the respective voltage values were measured to determine whether they were within the range of the reference voltage (in the example, 450 mV ± 25, respectively). % And 650 mV ± 25%). The probe used was a wire pin (body diameter 90 μm) having a substantially conical tip shape with rounded vertices.

  First, when a diode measurement test was performed using a conventional substrate inspection jig not provided with an anisotropic conductive rubber sheet, the measurement on the low current (0.1 mA) side was performed as a result of 36 measurements. It was not stable, and 23 times were judged as defective.

  Next, as the anisotropic conductive rubber sheet, an anisotropic conductive rubber sheet (JMT Co., Model No. 1810) having a thickness of 20 μm is used. A substrate inspection jig according to the present invention was prepared, and a diode measurement test was performed in the same manner as described above.

  As a result of 36 measurements, good diode measurement results were obtained with all probes at both currents of 0.1 mA and 1 mA.

(Example 3)
An AC capacitance measurement test was performed on substrates with built-in capacitors of 0.01, 0.1, and 1 μF.
As test conditions, the rated frequency was 1 V and 10 V, the angular frequency was changed from 0.1 to 1 MHz, and each capacitance value was measured. The probe used was a wire pin (body diameter 90 μm) having a substantially conical tip shape with rounded vertices.

  First, when an AC capacity measurement test was performed using a conventional substrate inspection jig without an anisotropic conductive rubber sheet, a value within the rated capacity value (± 20%) was obtained.

  Next, as the anisotropic conductive rubber sheet, an anisotropic conductive rubber sheet (JMT Co., Model No. 1810) having a thickness of 20 μm is used. The anisotropic conductive rubber sheet is used as a wire pin and an electrode terminal of the substrate inspection jig. The board inspection jig according to the present invention was prepared, and an AC capacity measurement test was performed in the same manner as described above.

As a result, a value within the same rated capacity value (± 20%) was obtained regardless of the presence or absence of the anisotropic conductive rubber sheet.
Therefore, the substrate inspection jig according to the present invention has an anisotropic conductive rubber sheet, so that the AC measurement is not affected, and the AC measurement is performed in the same manner as the conventional substrate inspection jig. I confirmed that I was able to.
In addition, it was confirmed that the phase angle of the impedance was maintained at a value near −85 ° as in the case of measurement using a conventional substrate inspection jig.
In general, when there is a large resistance at the connection portion of the substrate inspection jig or when insulation is not sufficiently obtained between adjacent portions, the impedance phase angle changes to approach zero.

As described above, according to the present invention, the tip of the probe is in contact with a flexible anisotropic conductive rubber sheet with a large number of contacts or a wide area, and a stable electrical connection can be obtained. It can be performed. In the above-mentioned embodiment, the result when the wire pin is used as the probe is shown. Similarly, when the socketless probe is used as the probe, the tip of the probe is flexible anisotropic conductive rubber. Since the sheet can be in contact with a large number of contacts or over a wide area and stable electrical connection can be obtained, a highly reliable test can be performed even when using a socketless probe, as in the case of wire pins. It is.
Moreover, it was confirmed that the anisotropic conductive rubber sheet according to the present invention does not affect the AC measurement and can perform the AC measurement in the same manner as a conventional substrate inspection jig.

DESCRIPTION OF SYMBOLS 1 Substrate inspection jig concerning the present invention 1 'Conventional substrate inspection jig 2 Probe 3 Head part structure 4 Electrode terminal 5 Electrode part structure 6 Anisotropic conductive rubber sheet 7 Wire wire 10 Substrate 11 Terminal 21 Conductivity Material 22 Coating film 31 Upper plate portion 32 Lower plate portion 33 Insertion hole

Claims (13)

In the substrate inspection jig of the apparatus for inspecting the electrical connection of a plurality of wiring circuits provided on the substrate,
The substrate inspection jig is
A conductive probe through which an electrical signal flows in contact with a terminal of the wiring circuit;
A head structure that disposes and holds the probe so that the probe faces the terminal on a one-to-one basis;
An electrode terminal for transmitting an electrical signal flowing to the probe to the device;
An electrode portion structure having a flat surface structure disposed so that the electrode terminals face the probe in a one-to-one correspondence;
Between the head part structure and the electrode part structure,
An anisotropic conductive rubber sheet containing conductive particles is disposed ,
The electrode part structure is
Having a guide pin for positioning the anisotropic conductive rubber sheet;
The anisotropic conductive rubber sheet is
A guide hole through which the guide pin is inserted;
The guide pin is detachable from the electrode part structure,
A substrate inspection jig , wherein the anisotropic conductive rubber sheet can be disposed at a desired position by changing the mounting position of the guide pin to a desired position .   The anisotropic conductive rubber sheet has a thickness of 20 μm to 2 mm, and the conductive particles contained in the anisotropic conductive rubber sheet are any one of gold, silver, copper, iron, nickel, or cobalt, The substrate inspection jig according to claim 1, further comprising an alloy thereof, or an alloy of these metals plated with gold, silver, or copper. The anisotropic conductive rubber sheet, so as to cover at least the surface of the electrode terminal, jig board inspection according to claim 1 or claim 2, characterized in that it is partially disposed. The probe covers an integral structure socketless probe that houses a probe pin and a spring in a tube, or an elastic conductive material and a body portion excluding a predetermined length at both ends of the conductive material. The substrate inspection jig according to any one of claims 1 to 3, wherein the jig is a wire pin made of a cylindrical coating film made of an insulating material . The tip shape of the probe pin of the socketless probe, or the tip shape of the conductive material at least on the electrode terminal side of the wire pin is a substantially cylindrical shape with rounded edges, a substantially hemispherical shape, a substantially conical shape with rounded vertices, The substrate inspection jig according to claim 4, wherein the substrate inspection jig has a shape obtained by processing a tip of a substantially hemisphere or a substantially cone into a flat shape . 6. The substrate according to claim 5 , wherein the tip of the probe pin of the socketless probe or the tip of the conductive material at least on the electrode terminal side of the wire pin has a diameter larger than the diameter of the body portion. Inspection jig. The probe pin of the socketless probe is made of iron or beryllium copper,
The diameter of the said probe pin is 0.01 mm-1.50 mm, The board | substrate inspection jig | tool as described in any one of Claims 4-6 characterized by the above-mentioned. The wire pin is
A substantially cylindrical conductive material comprising tungsten or beryllium copper and having elasticity;
It consists of a cylindrical covering film made of an insulating material mounted so as to cover the body part excluding a predetermined length at both ends of the conductive material,
The diameter of the trunk | drum of the said electroconductive material is 0.05 mm-0.15 mm, The board | substrate inspection jig | tool as described in any one of Claims 4-6 characterized by the above-mentioned. The substrate inspection jig is used for DC current application voltage measurement of 10 nA to 200 mA, DC voltage application current measurement of 1 mV to 250 V, or AC measurement of an angular frequency of 0.1 kHz to 1 MHz. The board inspection jig according to any one of 1 to 8 . In a substrate inspection method for inspecting electrical connection of a plurality of wiring circuits provided on a substrate,
One end of a conductive probe through which an electrical signal flows in contact with the terminal of the wiring circuit,
Arranged so as to face the terminal one-on-one,
An electrode terminal for transmitting an electrical signal flowing to the probe to the substrate inspection apparatus;
Arranged so as to face the opposite end of the probe on a one-to-one basis,
Between the probe and the electrode terminal,
An anisotropic conductive rubber sheet containing conductive particles is disposed,
By pressing the probe against the terminal,
The probe presses the anisotropic conductive rubber sheet in its thickness direction,
Through the conductive particles contained in the anisotropic conductive rubber sheet,
When the probe is electrically connected to the opposing electrode terminal,
Tell the measurement part of the substrate inspection apparatus the electrical signal that flows to the probe,
A board inspection method for inspecting electrical connection of the wiring circuit,
After a predetermined number of inspections,
The anisotropic conductive rubber sheet,
Move in parallel between the probe and the electrode terminal,
By disposing at a position different from the original disposition position,
A method for inspecting a substrate, comprising changing a contact portion between the probe and the anisotropic conductive rubber sheet. In the substrate inspection method,
The electrode terminal is
For electrode part structure with flat surface structure
It is arranged so as to face the probe one-on-one,
The electrode part structure is
Having a guide pin for positioning the anisotropic conductive rubber sheet;
The anisotropic conductive rubber sheet is
A guide hole through which the guide pin is inserted;
By inserting the guide pin through the guide hole,
The anisotropic conductive rubber sheet,
The substrate inspection method according to claim 10, wherein the substrate inspection method is arranged at a desired position. In the substrate inspection method,
The guide pin is detachable from the electrode part structure,
By changing the mounting position of the guide pin to a desired position,
The substrate inspection method according to claim 11, wherein the anisotropic conductive rubber sheet is disposed at a desired position . The substrate inspection method, a direct current voltage applied measurement 10NA～200mA DC voltage source current measurement 1MV～250V, or claim characterized in that it is used in the AC measurement of the angular frequency 0.1KHz～1MHz. 10 to The substrate inspection method according to claim 12.

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