JP5468495B2 - Wiring board manufacturing method and pin array device - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring board and a pin array device.

  When manufacturing a wiring board such as a PGA (pin grid array), a pin stand jig for inserting and connecting a pin to a pin connection portion of the wiring board is used. This pin stand jig has a configuration in which a large number of through holes are formed in a plate-shaped member and pins are inserted into the through holes. The pin is composed of a distal end portion and a proximal end portion. The distal end portion of the pin is inserted into the through hole, and the proximal end portion is exposed to the outside.

  After that, the pin stand jig and the wiring board are aligned, and the base end portion protruding from the pin stand jig is inserted and connected to the connection portion of the wiring board, so that the pin board standing wiring board such as PGA is attached. To manufacture. Note that the tip of the pin inserted into the wiring board protrudes outward and functions as a pin terminal for external input / output.

  When inserting a pin into the through hole of the pin stand jig, chamfer the pin insertion side of the through hole, vibrate and swing the pin stand jig, This was done by aspirating from the opposite side. However, in such a method, there are cases where the tip end portion or the base end portion of the pin is inserted into the through hole of the pin stand jig, and it is not possible to efficiently insert only the tip end portion of the pin into the through hole. It was difficult. For this reason, the manufacturing efficiency of the final pin erected wiring board has also been reduced.

  In view of such a situation, in Patent Document 1, the maximum dimension of the proximal end portion of the pin is made larger than the maximum dimension of the distal end portion of the pin, and the proximal end portion of the pin is placed in the through hole of the pin stand jig. A method is disclosed in which only the tip end portion of the pin is inserted into the through hole with high efficiency so as not to be inserted. However, in such a method, only the tip portion can be selectively inserted into the through hole of the pin stand jig with high efficiency, but the pin tip portion is inserted into all the through holes of the pin stand jig. When inserting, there is a problem that it takes a long time as in the prior art.

  Patent Document 2 discloses a method of inserting a pin into the through hole of the pin stand jig by tilting and swinging the pin stand jig on which the pin is placed and sucking the through hole. ing. In this case, when the base end portion of the pin is inserted into the through hole, the pin standing jig can be easily removed from the through hole as the pin standing jig swings. By repeating the movement, the tip of the pin is finally inserted into all the through holes of the pin stand jig. However, even in this method, there is a problem that it takes a long time as before to insert the tip of the pin into all the through holes of the pin stand jig.

  As a result, in the above-described conventional technology, the manufacturing efficiency of the pin standing wiring board such as PGA cannot be sufficiently improved.

JP 2000-299402 A JP 2000-269400 A

  An object of the present invention is to provide a method capable of manufacturing a pin-standing wiring board such as PGA with high efficiency.

In order to achieve the above object, the present invention provides:
In the thickness direction, from the main surface side toward the back surface side, a plurality of pin insertion holes are formed so as to penetrate, and a main surface side pin insertion port is chamfered to prepare a pin insertion substrate, and
A pin holding step of tilting the pin insertion substrate at a predetermined angle with respect to a horizontal direction and holding a plurality of pins on the main surface by a holding member;
Exhaust operation is performed from the back side of the pin insertion substrate to make negative pressure in the plurality of pin insertion holes, the holding member is moved in a predetermined direction on the main surface, the plurality of pins, An array substrate manufacturing process for inserting into a plurality of pin insertion holes and manufacturing a pin array substrate;
An alignment step of aligning the pin array substrate and a wiring substrate in which a plurality of connection portions are formed on the main surface side or the back surface side;
Base ends of the plurality of pins protruding from the plurality of pin insertion holes of the pin array substrate are respectively connected to the connection portions of the wiring substrate, and the plurality of pins are connected to the plurality of pin array substrates. A pin transfer step of transferring from the pin insertion hole to the plurality of connection portions of the wiring board;
It is related with the manufacturing method of a wiring board characterized by providing.

  According to the present invention, in the thickness direction, a pin insertion substrate having an opening in which a plurality of pin insertion holes are formed penetrating from the main surface side to the back surface side and the pin insertion port on the main surface side is chamfered. A plurality of pins are held on the main surface by a holding member, and an exhaust operation is performed from the back surface side of the pin insertion substrate to make negative pressure in the plurality of pin insertion holes, and the holding member is moved to the main surface. The pins are moved in a predetermined direction on the surface, and the plurality of pins are inserted into the plurality of pin insertion holes to produce a pin array substrate.

  That is, according to the present invention, as in the prior art, in the thickness direction, a plurality of pin insertion holes are formed penetrating from the main surface side to the back surface side, and the pin insertion port on the main surface side is chamfered. A plurality of pins on the main surface, in addition to preparing a pin insertion board to form a part, and performing exhaust operation from the back side of the pin insertion board to make negative pressure in the plurality of pin insertion holes Is held by a holding member, and the holding member is moved in a predetermined direction.

  Accordingly, as the holding member moves, the plurality of pins can be sequentially inserted into the pin insertion holes arranged in the predetermined direction. The plurality of pins can be inserted into the pin insertion hole with extremely high efficiency by only moving once on the main surface. As a result, the pin array substrate can be manufactured with high efficiency.

  In addition, about the pin which was not able to be inserted in the said pin insertion hole only by moving the holding member once on the said main surface, it can be made to insert again by moving on the said main surface again. . Therefore, when inserting the pins into all the pin insertion holes, it may be required to move the holding member a plurality of times on the main surface. However, as compared with a conventional case where a pin is placed on a pin insertion board and swings without using a holding member, the insertion efficiency of the pin is significantly improved by the movement of the holding member.

  Although not clearly indicated in the present invention, as is clear from the prior art, the length of the base end portion of the pin is shorter than the length of the tip end portion of the pin. However, even when the base end portion of the pin is inserted, the pin is pulled out from the pin insertion hole by being swept out when the holding member is moved again. Therefore, the base end portion of the pin is not erroneously inserted into the pin insertion hole. The pin that has fallen out of the pin insertion hole can be inserted into the predetermined pin insertion hole by moving the holding member again as described above.

  Further, as in the past, the (maximum) diameter of the base end portion of the pin is made larger than the (maximum) diameter of the tip end portion of the pin, and the size (diameter) of the pin insertion hole is made only by the tip end portion of the pin. If the size is such that it can be inserted, when the holding member is moved on the main surface of the pin insertion board and the pin is inserted into the pin insertion hole, the base end portion of the pin is not erroneously inserted. Therefore, the pin insertion efficiency into the pin insertion hole accompanying the movement of the holding member is significantly improved.

  As described above, according to the present invention, a pin array substrate in which pins are inserted into insertion holes of a pin insertion substrate can be manufactured with high efficiency. Therefore, after that, the pin array substrate and the wiring substrate in which a plurality of connection portions are formed on the main surface or the back surface side are aligned, and the plurality of the wiring substrates are inserted from the plurality of pin insertion holes of the pin array substrate. The manufacturing efficiency when manufacturing the wiring board with the pins standing up by transferring the pins to the connecting portion is significantly improved.

  In an example of the present invention, the holding members are a pair of holding members facing each other, and in the pin holding step, the pin insertion substrates are alternately inclined so as to be opposite to each other in the length direction or the width direction. In addition, the plurality of pins can be held between the pair of holding members. Even in this case, the same effects as those of the present invention described above can be obtained. Further, in this case, in the array substrate manufacturing step, the pair of holding members are moved on the main surface according to alternate inclinations of the pin insertion substrate, and the plurality of pin insertion holes are arranged with respect to the plurality of pin insertion holes. A pin can be inserted.

  In an example of the present invention, a mask member may be provided on the main surface of the pin insertion substrate, and the plurality of pins described above may be configured to be inserted into the plurality of pin insertion holes via the mask member. it can. In this case, the pins can be selectively inserted only into the pin insertion holes corresponding to the openings of the mask member of the pin insertion substrate.

  Furthermore, in an example of the present invention, a part of the plurality of pin insertion holes may be covered with a closing member such as a thin plate so that the plurality of pins are not inserted into a part of the plurality of pin insertion holes. it can. Therefore, similarly to the above, it becomes possible to selectively insert pins only into predetermined pin insertion holes of the pin insertion substrate.

  In addition, since the said mask member and the said closure member have the same effect, the function of the said closure member can also be provided to the said mask member.

  As described above, according to the present invention, it is possible to provide a method capable of manufacturing a pin erected wiring board such as PGA with high efficiency.

It is a 1 process figure in the manufacturing method of the wiring board in 1st Embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 1st embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 1st embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 1st embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 1st embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 1st embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 1st embodiment. It is a graph which shows the relationship between the inclination angle of a pin insertion board | substrate, and the insertion rate of the pin to a pin insertion hole. It is one process figure in the manufacturing method of the wiring board in a 2nd embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 2nd embodiment. Similarly, it is one process figure in the manufacturing method of the wiring board in a 2nd embodiment. It is process drawing which shows the manufacturing method of the wiring board in 3rd Embodiment. Similarly, it is process drawing which shows the manufacturing method of the wiring board in 3rd Embodiment. Similarly, it is process drawing which shows the manufacturing method of the wiring board in 3rd Embodiment. It is a schematic block diagram of the pin arrangement apparatus in embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
1 to 7 are process diagrams showing a method of manufacturing a wiring board according to the first embodiment. 1-7 has shown the cross section of the length direction of the assembly in each process.

  First, as shown in FIG. 1, a pin insertion substrate 11 is prepared. The pin insertion substrate 11 has a configuration in which a plurality of pin insertion holes 11C are formed penetrating from the main surface 11A side to the back surface 11B side in the thickness direction. The pin insertion opening on the main surface 11A side of the pin insertion hole 11C is chamfered to form an inclined surface 11D that expands outward. The chamfering at the pin insertion opening is performed so that a plurality of pins to be inserted later can be easily inserted into the pin insertion hole 11C.

  The pin 15 includes a distal end portion 151 and a proximal end portion 152, and the diameter (outer diameter) of the proximal end portion 152 is configured to be larger than the diameter (outer diameter) of the distal end portion 151. . Further, the inner diameter of the pin insertion hole 11C is larger than the diameter (outer diameter) of the distal end portion of the pin 15 and smaller than the diameter (outer diameter) of the proximal end portion of the pin 15, In manufacturing, only the tip portion 151 of the pin 15 is inserted into the pin insertion hole 11C.

  Next, as shown in FIG. 2, the mask member 13 having the opening 13A is arranged on the main surface 11A of the pin insertion substrate 11 so that the opening 13A and the pin insertion hole 11C coincide. Thereafter, the pin insertion substrate 11 is inclined from the horizontal direction by an angle θ, and a plurality of pins 15 to be inserted through the mask member 13 are disposed on the main surface 11A of the pin insertion substrate 11. The plurality of pins 15 are held by a brush 17 as a holding member.

  Next, exhaust operation is performed from the back surface 11B side of the pin insertion board 11 by a pump or the like (not shown), the inside of the pin insertion hole 11C is made negative pressure, and the brush 17 is moved downward on the main surface 11A of the pin insertion board 11 Move to. Then, the pins 15 are sequentially inserted into the pin insertion holes 11 </ b> C through the openings 13 </ b> A of the mask member 13 from the upper side to the lower side of the inclined main surface 11 </ b> A according to the moving direction of the brush 17. It becomes like this.

  The brush 17 can be moved as described above, for example, by a brush moving mechanism (not shown).

  As described above, as the brush 17 moves, a plurality of pins 15 can be sequentially inserted into the pin insertion hole 11C. For example, the brush 17 is placed on the main surface 11A of the pin insertion substrate 11. The plurality of pins 15 can be inserted into the pin insertion hole 11C with extremely high efficiency by moving only once.

  Normally, the brush 17 is moved only once on the main surface 11A, and not all of the pins 15 can be inserted into the pin insertion hole 11C. For example, as shown in FIG. The pin 15 can be inserted into the pin insertion hole 11C into which the pin 15 has not yet been inserted by moving the pin 17 again on the main surface 11A of the pin insertion substrate 11 from the lower side to the upper side, for example.

  At this time, as shown in FIG. 3, when a part of the base end portion 152 of the pin 15 is inserted into the pin insertion hole 11C, the pin insertion substrate 11 is inclined and / or Alternatively, the pin 15 is swept out when the brush 17 is moved again, and the pin 15 in the above-described state easily falls out of the pin insertion hole 15C. Therefore, the base end portion 152 of the pin 15 is not erroneously inserted into the pin insertion hole 11C.

  The pin 15 that has fallen out of the pin insertion hole 11C can be inserted into the predetermined pin insertion hole 11C by moving the brush 17 again from the upper side to the lower side, for example, as shown in FIG. .

  By repeating the above operation, the pins 15 can be inserted into all the pin insertion holes 11C selected by the mask member 13, and a pin array substrate can be manufactured.

  In the present embodiment, regarding the insertion of the pin 15 into the pin insertion hole 11C, the brush 17 is moved a plurality of times on the main surface 11A of the pin insertion substrate 11, but a holding member is not used as in the prior art. In addition, the insertion efficiency of the pins is remarkably improved as compared with the case where the pins are placed on the pin insertion board and rocked. Therefore, the pin array substrate can be manufactured with high efficiency.

  The angle θ is preferably set in the range of 20 degrees to 30 degrees. Thereby, the insertion efficiency of the pin 15 into the pin insertion hole 11C every time the brush 17 moves is increased, and a part of the base end portion 152 of the pin 15 is erroneously inserted into the pin insertion hole 11C. The sweeping efficiency by the brush 17 is improved.

  In this embodiment, the mask member 13 is disposed on the main surface 11A of the pin insertion substrate 11 and the pins 15 are selectively inserted into the pin insertion holes 11C. However, the mask member 13 is disposed. Alternatively, the pins 15 can be selectively inserted into all the pin insertion holes 11C of the pin insertion substrate 11.

  When the pins 15 are selectively inserted into the pin insertion holes 11C, the predetermined pin insertion holes 11C are closed by a closing member such as a thin plate instead of or in addition to the mask member 13. It can also be done.

  Next, as shown in FIG. 5, the pin array substrate 19 manufactured as described above and the wiring substrate 21 formed with a plurality of connection portions 21 </ b> A are inserted into the pin insertion holes 11 </ b> C of the pin array substrate 19. The arranged pins 15 and the connecting portions 21A of the wiring board 21 are arranged so as to face each other so as to be aligned with each other.

  Thereafter, as shown in FIG. 6, the pins 15 of the pin array substrate 19 are connected to the connection portions 21 </ b> A of the wiring substrate 21 by bringing the pin insertion substrate 19 and the wiring substrate 21 into contact with each other. Since the connecting portion 21A is formed in a concave shape and the size thereof is slightly narrower than the diameter (outer diameter) of the base end portion 152 of the pin 15, the pin 15 is connected at the base end portion 152. It comes to be fitted with the part 21A.

  Therefore, as described above, after the pins 15 of the pin array board 19 are connected to the connection portion 21A of the wiring board 21, the pin array board 19 is separated from the wiring board 21 as shown in FIG. The pin 15 inserted into the pin array substrate 19 is transferred to the connection portion 21A of the wiring substrate 21, and the tip portion 151 of the pin 15 protrudes from the connection portion 21A, for example, PGA or the like. The pin standing wiring board 21 can be obtained.

  The wiring structure of the wiring substrate 21 is not particularly limited. For example, a so-called resin in which at least one conductor layer and a resin insulating layer are laminated on at least one main surface of the core layer. A wiring board can be obtained.

  FIG. 8 is a graph showing the relationship between the inclination angle θ of the pin insertion substrate 11 and the insertion rate of the pins 15 into the pin insertion holes 11C. The angle θ was changed in the range of 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, and 40 degrees, and an experiment of inserting the pin five times at each angle was performed. The pin insertion substrate 11 is made of aluminum, the inner diameter of the pin insertion hole 11C is (φ0.33 ± 0.03 mm), and the number of the pin insertion holes 11C is 22560. Further, the pin 15 had a diameter of 0.3 ± 0.025 mm and a length of 2.07 ± 0.04 mm. The brush 17 was a horse hair brush, and the number of movements of the brush 17 on the main surface 11A of the pin insertion substrate 11 was 10 times.

  As is clear from FIG. 8, when the inclination angle θ of the pin insertion substrate 11 is in the range of 20 degrees to 30 degrees, the insertion ratio of the pins 15 into the pin insertion holes 11C is increased to nearly 100%. I understand. Therefore, as described above, it can be understood that extremely high insertion efficiency can be realized by setting the inclination angle θ of the pin insertion substrate 11 to 20 degrees to 30 degrees and inserting the pins 15 into the pin insertion holes 11C.

(Second Embodiment)
9 to 11 are process diagrams showing a method for manufacturing a wiring board according to the second embodiment. Moreover, FIGS. 9-11 has shown the cross section of the length direction of the assembly in each process.

  In this embodiment, only the method for manufacturing the pin wiring board is different, and the other steps are the same as those in the first embodiment. Therefore, in this embodiment, the method for manufacturing the pin wiring board will be mainly described. . In addition, similar or identical components are represented using the same reference numerals.

  First, the pin insertion substrate 11 is prepared as in the first embodiment. Next, as shown in FIG. 9, the mask member 13 having the opening 13A is arranged on the main surface 11A of the pin insertion substrate 11 so that the opening 13A and the pin insertion hole 11C coincide. In addition, a pair of brushes 17-1 and 17-2, which are a pair of holding members, are disposed on the main surface 11A of the pin insertion substrate 11, and a plurality of pins are interposed between the pair of brushes 17-1 and 17-2. 15 is arranged.

  In the present embodiment, the pair of brushes 17-1 and 17-2 are fixed by, for example, a jig (not shown). Accordingly, the pair of brushes 17-1 and 17-2 are arranged extending in the vertical direction.

  Next, an exhaust operation is performed from the back surface 11B side of the pin insertion substrate 11 by a pump or the like (not shown), and the inside of the pin insertion hole 11C is set to a negative pressure. Thereafter, the pin insertion board 11 is inclined by an angle θ from the horizontal direction so that the left end of the pin insertion board 11 is lifted. In the present embodiment, such an inclination is defined as a rightward inclination.

  As described above, when the pin insertion board 11 is inclined by the angle θ from the horizontal direction, the pair of brushes 17-1 and 17-2 moves relatively rightward on the main surface 11 </ b> A of the pin insertion board 11. It will be. At this time, the plurality of pins 15 to be inserted through the mask member 13 on the main surface 11A of the pin insertion substrate 11 are held between the pair of brushes 17-1 and 17-2. In the moving direction of the pair of brushes 17-1 and 17-2, the brushes are sequentially inserted into the pin insertion holes 11 </ b> C through the openings 13 </ b> A of the mask member 13.

  Also in the present embodiment, by tilting the pin insertion board 11 in the right direction, the relative movement in one direction (length direction) of the pair of brushes 17-1 and 17-2 is performed with respect to the pin insertion hole 11C. The plurality of pins 15 held between the pair of brushes 17-1 and 17-2 can be sequentially inserted. Therefore, the plurality of pins 15 can be inserted into the pin insertion hole 11 </ b> C with extremely high efficiency only by moving the pair of brushes 17-1 and 17-2 once on the main surface 11 </ b> A of the pin insertion substrate 11. it can.

  As in the first embodiment, normally, the pair of brushes 17-1 and 17-2 is relatively moved once on the main surface 11A, and all the pins 15 are inserted into the pin insertion hole 11C. It is not possible. Therefore, for example, as shown in FIG. 10, after the pin insertion board 11 is once in a horizontal state, as shown in FIG. 11, the pin insertion board 11 is inclined by an angle θ so that the right end is lifted from the horizontal direction. . In the present embodiment, such an inclination is defined as a leftward inclination.

  In this case, the pair of brushes 17-1 and 17-2 moves relatively to the left on the main surface 11 </ b> A of the pin insertion board 11 as the pin insertion board 11 tilts to the left. Therefore, the pin 15 can be inserted into the pin insertion hole 11C into which the pin 15 has not yet been inserted by the relative leftward movement of the pair of brushes 17-1 and 17-2.

  Further, since the diameter (outer diameter) of the base end portion 152 of the pin 15 is larger than the inner diameter of the pin insertion hole 11C, as shown in FIG. 9, the base end portion 152 of the pin 15 with respect to the pin insertion hole 11C. In the case where a part is inserted, the pin insertion board 11 is inclined by tilting the pin insertion board 11 to the left as shown in FIG. 10, and / or the pair of brushes 17-1 and By being swept away by the relative leftward movement of 17-2, the pin 15 in which the base end portion 152 is inserted into the pin insertion hole 11C can easily fall out of the pin insertion hole 11C. Therefore, the base end portion 152 of the pin 15 is not erroneously inserted into the pin insertion hole 11C.

  Thereafter, as shown in FIG. 10 again, the pin insertion board 11 is set in the horizontal direction, and then tilted to the right as shown in FIG. The main surface 11A moves relatively to the right. Therefore, as described above, in this moving direction, the pins 15 to be inserted into the pin insertion holes 11C, including the pins 15 that have fallen out of the pin insertion holes 11C, can be sequentially inserted again into the pin insertion holes 11C. become able to.

  As described above, all of the pin insertion holes 11C selected by the mask member 13 are formed by alternately inclining the pin insertion substrate 11 so as to be opposite to each other, such as rightward inclination and leftward inclination. The pin 15 can be inserted into the pin array substrate, and a pin array substrate can be manufactured.

  In the present embodiment, with respect to inserting the pin 15 into the pin insertion hole 11C, the pair of brushes 17-1 and 17-2 are inclined to the main surface of the pin insertion substrate 11 by inclining the pin insertion substrate 11 in opposite directions. 11A is relatively moved a plurality of times, but the insertion efficiency of the pins is remarkably different from the conventional case where the pins are placed on the pin insertion board and oscillated without using the holding member. To improve. Therefore, the pin array substrate can be manufactured with high efficiency.

  The angle θ is preferably set in the range of 20 degrees to 30 degrees. This increases the insertion efficiency of the pin 15 into the pin insertion hole 11C for each movement of the pair of brushes 17-1 and 17-2, and a part of the base end portion 152 of the pin 15 is erroneously inserted into the pin insertion hole. The sweeping efficiency by the pair of brushes 17-1 and 17-2 when inserted into 11C is improved.

  Further, although specific data regarding the inclination angle θ of the pin insertion substrate 11 and the insertion rate of the pins 15 into the pin insertion holes 11C in the present embodiment is not shown, the same as FIG. 8 in the first embodiment. I was able to get the results.

  In the present embodiment, the pin insertion substrates 11 are alternately inclined so as to be opposite to each other in the length direction, but may be alternately inclined in the width direction.

  In the present embodiment, the pair of brushes 17-1 and 17-2 are fixed by, for example, a jig (not shown). However, as in the first embodiment, the pin insertion substrate 11 is used by using a brush moving mechanism. It is also possible to positively cause relative movement on the main surface 11A.

  Also in this embodiment, the mask member 13 is arranged on the main surface 11A of the pin insertion substrate 11 and the pins 15 are selectively inserted into the pin insertion holes 11C. However, the mask member 13 is arranged. Alternatively, the pins 15 can be selectively inserted into all the pin insertion holes 11C of the pin insertion substrate 11.

  When the pins 15 are selectively inserted into the pin insertion holes 11C, the predetermined pin insertion holes 11C are closed by a closing member such as a thin plate instead of or in addition to the mask member 13. It can also be done.

  After that, as shown in the first embodiment, the joint portion 21A of the wiring board 21 and the pin array board obtained as described above are brought into contact with each other, and the base end portion of the pin 15 into which the pin array board is inserted is brought into contact. 152 is bonded to the bonding portion 21A of the wiring board 21 and the pins 15 are transferred to the wiring board 21 so that the target pin standing wiring board 21 such as PGA can be obtained.

(Third embodiment)
12 to 14 are process diagrams showing a method of manufacturing a wiring board according to the third embodiment. 12 to 14 show cross sections in the length direction of the assembly in the respective steps.

  In this embodiment, the connection method between the pin array board and the wiring board is different, and the manufacturing method of the pin wiring board is the same as in the first embodiment or the second embodiment. The description will focus on the method of connecting the wiring board and the wiring board. In addition, similar or identical components are represented using the same reference numerals.

  After producing the pin array substrate 19 according to the first embodiment or the second embodiment, as shown in FIG. 12, the pin array substrate 19 and the wiring substrate 21 formed with a plurality of connection portions 21A are provided. The pins 15 inserted into the pin insertion holes 11 </ b> C of the pin array substrate 19 and the connection portions 21 </ b> A of the wiring substrate 21 are arranged to face each other so as to be aligned.

  The connection portion 21A of the wiring board 21 is formed in a concave shape, and a solder paste 22 is applied to the bottom surface thereof. Further, unlike the first embodiment, the size of the connecting portion 21A in the wiring board 21 is set larger than the diameter (outer diameter) of the base end portion 152 of the pin 15 of the pin array board 19. Furthermore, in the first embodiment, the end portion of the tip portion 151 of the pin 15 is located in the pin insertion hole 11C. However, in this embodiment, the end portion of the tip portion 151 of the pin 15 is inserted into the pin insertion hole. It protrudes outward from the hole 11C.

  Next, as shown in FIG. 13, the wiring board 21 is installed in the board positioning frame 32, and at least both ends thereof are fixed, thereby fixing the relative position of the wiring board 21 with respect to the pin array board 19. On the other hand, a support plate 32 is arranged below the pin array substrate 19, and the end of the pin 15 protruding from the pin insertion hole 11 </ b> C of the pin array substrate 19 is pushed up by the support plate 32, and its base end 152 is pinned. While pushing out from the insertion hole 11C, it is inserted into the connecting portion 21A of the wiring board 21 and brought into contact with the solder paste 22.

  Thereafter, the solder paste 22 is reflowed to connect the base end portion 152 of the pin 15 into the connection portion 21A of the wiring board 21 so that the pin standing wiring board 21 can be obtained as shown in FIG. become.

  As is clear from the above description, in the first embodiment, the size of the connecting portion 21A is slightly narrower than the diameter (outer diameter) of the base end portion 152 of the pin 15, and the pin 15 has its base The end portion 152 was fitted with the connection portion 21A to produce the target pin-standing wiring board 21, but in this embodiment, the size of the connection portion 21A is set to the diameter of the base end portion 152 of the pin 15. The solder paste 22 formed on the connection portion 21A is reflowed to be larger than (outer diameter), and the pin 15 and the connection portion 21A are connected to obtain the target pin standing wiring board 21.

  In any case, the pin 15 is firmly bonded to the wiring substrate 21. However, in the pin standing wiring substrate 21 of the present embodiment, the connection between the pin 15 and the connecting portion 21A, that is, the wiring substrate 21, is as follows. Since the solder paste 22 is used, the electrical contact of the pins 15 with respect to the wiring board 21 can be reliably ensured as compared with the pin standing wiring board 21 of the first embodiment.

(Fourth embodiment)
Next, the pin array device in the embodiment will be described. In the present embodiment, a pin array device used mainly for the method of manufacturing a pin array substrate described in the second embodiment will be described. Accordingly, similar or identical components are indicated using the same reference numerals.

  The pin array device 40 of this embodiment includes a vacuum vessel 41 that holds the pin insertion substrate 11 on which the mask member 13 is provided on the main surface in an airtight manner, and a negative pressure pipe 42 that is provided below the vacuum vessel 41. And has. The vacuum vessel 41, the negative pressure pipe 42, and a pump (not shown) constitute an exhaust mechanism in the present embodiment.

  Further, the vacuum container 41 is connected to a lower surface constituting a pin sliding surface 45 </ b> A provided at a lower portion of the pin scattering prevention cover 45.

  As described above, the pin scattering prevention cover 45 holds the plurality of pins 15 and inserts the plurality of pins 15 into the pin insertion holes 11 </ b> C of the pin insertion substrate 11 through the mask member 13. A pair of brushes 17-1 and 17-2, which are holding members, are arranged. The brushes 17-1 and 17-2 are attached to a brush reciprocation mechanism 46, and the brush reciprocation mechanism 46 is attached so as to fit into a guide groove (not shown) provided on the upper surface of the pin scattering prevention cover 45. ing. Therefore, when the brush reciprocating mechanism 46 reciprocates in the guide groove, the brushes 17-1 and 17-2 also reciprocate in the pin scattering prevention cover 45, that is, on the pin insertion substrate 11.

  The main surface 13A of the mask member 13 and the pin sliding surface 45A are configured as the same plane level, and when the brushes 17-1 and 17-2 move between them, a step formed therebetween. Can prevent the movement from being hindered or the insertion efficiency of the pin 15 from being lowered due to the splashing up of the brushes 17-1 and 17-2.

  Further, the pin arraying device 40 includes a tilt mechanism (not shown) that tilts the pin insertion substrate 11 (in this embodiment, the entire device) from the horizontal direction at a predetermined angle around the rotation shaft 43.

  Therefore, by using the pin array device 40 of the present embodiment shown in FIG. 15, a method for producing a pin array substrate as shown in the second embodiment can be implemented. A brief description in connection with the second embodiment is as follows.

  In the pin arraying device 40 shown in FIG. 15, an exhaust operation is performed from the back surface 11B side of the pin insertion board 11 airtightly arranged in the vacuum vessel 40 through a negative pressure pipe 42 by a pump (not shown), and the pin insertion hole 11C. The inside of is made negative pressure. Thereafter, the pin insertion board 11 (device 40) is inclined by an angle θ from the horizontal direction by the tilt mechanism described above so that the left end of the pin insertion board 11 is lifted, and the pair of brushes 17-1 and 17-2 are brushes. The reciprocating mechanism 46 moves relative to the main surface 11A of the pin insertion board 11 relatively to the right. At this time, since the plurality of pins 15 to be inserted via the mask member 13 are held between the pair of brushes 17-1 and 17-2 on the main surface 11A of the pin insertion substrate 11, the pins 15 are In the moving direction of the pair of brushes 17-1 and 17-2, the brushes are sequentially inserted into the pin insertion holes 11 </ b> C through the openings 13 </ b> A of the mask member 13.

  Next, after the pin insertion board 11 is once in a horizontal state, the pin insertion board 11 is inclined by an angle θ so that the right end is lifted from the horizontal direction by the same tilting mechanism. In this case, as the pin insertion board 11 is tilted to the left, the pair of brushes 17-1 and 17-2 are moved relatively leftward on the main surface 11 </ b> A of the pin insertion board 11 by the brush reciprocation mechanism 46. Will do. Therefore, the pin 15 can be inserted into the pin insertion hole 11C into which the pin 15 has not yet been inserted by the relative leftward movement of the pair of brushes 17-1 and 17-2.

  As described above, all of the pin insertion holes 11C selected by the mask member 13 are formed by alternately inclining the pin insertion substrate 11 so as to be opposite to each other, such as rightward inclination and leftward inclination. The pin 15 can be inserted into the pin array substrate, and a pin array substrate can be manufactured.

  In the pin array device 40 of the present embodiment, since the pin scattering prevention cover 45 is provided in addition to the pair of brushes 17-1 and 17-2 that are holding members, the above-described pin array substrate is manufactured. In the method, scattering of the pins 15 to be inserted into the pin insertion substrate 11 can be more effectively prevented.

  Note that the detailed conditions in the method of manufacturing the pin array substrate are as described in the second embodiment, and thus description thereof is omitted in this embodiment.

  The present invention has been described in detail with specific examples. However, the present invention is not limited to the above contents, and various modifications and changes can be made without departing from the scope of the present invention.

  For example, in the fourth embodiment, the pin array device related to the method of manufacturing the pin array substrate in the second embodiment has been described. Naturally, the pin related to the method of manufacturing the pin array substrate of the first embodiment is naturally described. An array device can also be realized. Specifically, if any one of the brushes 17-1 and 17-2 is deleted, the method for producing the pin array substrate of the first embodiment can be implemented.

  Furthermore, although the case where the mask member 13 is used has been described in the fourth embodiment, even when the mask member 13 is not used, the main surface of the pin insertion board 11 and the pin sliding surface 45A may be configured on the same plane level. In this case, the effect of preventing pin scattering can be obtained as in the fourth embodiment.

DESCRIPTION OF SYMBOLS 11 Pin insertion board 11A Main surface of pin insertion board 11B Back surface of pin insertion board 11C Pin insertion hole 13 Mask member 15 Pin 151 Pin tip part 152 Pin base end part 17 Brush 17-1, 17-2 A pair of brushes
DESCRIPTION OF SYMBOLS 10 Pin arrangement board 21 Wiring board 21A Connection part 31 Board positioning frame 32 Support plate 40 Pin arrangement device 41 Vacuum container 42 Negative pressure piping 43 Rotating shaft 45 Pin scattering prevention cover 46 Brush reciprocation mechanism

Claims (8)

In the thickness direction, from the main surface side toward the back surface side, a plurality of pin insertion holes are formed so as to penetrate, and the main surface side pin insertion port is chamfered to prepare a pin insertion substrate, and
A pin holding step of tilting the pin insertion substrate at a predetermined angle with respect to a horizontal direction and holding a plurality of pins on the main surface by a holding member;
Exhaust operation is performed from the back side of the pin insertion substrate to make negative pressure in the plurality of pin insertion holes, the holding member is moved in a predetermined direction on the main surface, the plurality of pins, An array substrate manufacturing process for inserting into a plurality of pin insertion holes and manufacturing a pin array substrate;
An alignment step of aligning the pin array substrate and a wiring substrate in which a plurality of connection portions are formed on the main surface side or the back surface side;
Base ends of the plurality of pins protruding from the plurality of pin insertion holes of the pin array substrate are respectively connected to the connection portions of the wiring substrate, and the plurality of pins are connected to the plurality of pin array substrates. A pin transfer step of transferring from the pin insertion hole to the plurality of connection portions of the wiring board;
A method of manufacturing a wiring board, comprising:   2. The method of manufacturing a wiring board according to claim 1, wherein in the pin holding step, the pin insertion board is inclined at an angle of 20 degrees to 30 degrees with respect to a horizontal direction. The holding members are a pair of opposing holding members,
In the pin holding step, the pin insertion substrate is alternately inclined so as to be opposite to each other in the length direction or the width direction, and the plurality of pins are held between the pair of holding members. The method for manufacturing a wiring board according to claim 1, wherein the method is characterized in that:   In the array substrate manufacturing step, the pair of holding members are moved on the main surface according to alternate inclinations of the pin insertion substrate, and the plurality of pins are inserted into the plurality of pin insertion holes. The method for manufacturing a wiring board according to claim 3, wherein:   The method for manufacturing a wiring board according to claim 1, wherein a mask member is provided on the main surface, and the plurality of pins are inserted into the plurality of pin insertion holes through the mask member.   5. The wiring according to claim 1, wherein a part of the plurality of pin insertion holes is covered with a blocking member so that the plurality of pins are not inserted into a part of the plurality of pin insertion holes. A method for manufacturing a substrate. A mask member is provided on the main surface, and the plurality of pins are inserted into the plurality of pin insertion holes through the mask member,
The method for manufacturing a wiring board according to claim 6, wherein the closing member constitutes the mask member. In the thickness direction, a plurality of pin insertion holes are formed through the plurality of pin insertion holes from the main surface side to the back surface side, and the pin insertion holes on the main surface side form a chamfered opening. A pin array device for inserting a plurality of pins into
An exhaust mechanism that performs an exhaust operation from the back surface side of the pin insertion substrate to make negative pressure in the plurality of pin insertion holes;
An inclination mechanism for inclining the pin insertion substrate at a predetermined angle with respect to a horizontal direction;
A holding member that is movable in a predetermined direction on the main surface of the pin insertion substrate, holds the plurality of pins, and inserts the plurality of pins into the plurality of pin insertion holes;
A pin array device comprising:

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