JP5443792B2 - Easy adhesive film - Google Patents

Description

  The present invention relates to an easy-adhesion film having an easy-adhesion layer formed on at least one surface of a resin film, and more particularly to an easy-adhesion film used for a material having a functional layer such as a conductive material.

  Resin films are used in a wide range of fields such as magnetic tapes, packaging materials, electrical insulating materials, information recording materials, and various process papers, and are used by applying various functional layers. However, for example, a resin film such as a biaxially oriented polyester film typified by a polyethylene terephthalate film has poor adhesion, and it is often necessary to perform an easy adhesion treatment on the film surface.

  Examples of the method for imparting easy adhesion to the resin film include corona treatment, plasma treatment, flame treatment and the like. In these methods, as described in Japanese Examined Patent Publication No. 58-25331, the time course is increased. There is a drawback that its performance is lowered. There is also a method for imparting easy adhesion by applying a water-based coating liquid containing a resin such as urethane resin or acrylic resin (for example, Patent Document 1). Since the easy-adhesion layer formed by applying these water-based coating liquids has a poor blocking property as it is, the blocking property is usually improved by crosslinking a resin together with some crosslinking agent.

  There are a wide variety of materials to be adhered to the easy-adhesive film, for example, inorganic materials such as metals described in Patent Document 1, and water-soluble polymer layers as described in Patent Document 2. In some cases, an organic substance such as an ultraviolet curable resin as described in Patent Document 3 is used. Here, the crosslinking agent not only greatly affects the adhesion to these adherends, but may also affect various performances of the adherends.

  Recently, a method of using a silver salt photographic light-sensitive material having a silver halide emulsion layer as a conductive material precursor has been proposed. For example, a method using a silver salt diffusion transfer method has been proposed as a method using a silver salt photosensitive material as described in JP-A-2003-77350. Since the conductive material obtained by this method uses the silver salt photography method, it is easy to draw high-definition lines, it is highly stable, the process is simple, and it shows very good characteristics. .

  In such a conductive material, as described in Patent Document 4, the adhesive force between the easy-adhesion layer and the metal pattern must be high, and the conductive material may be another conductive material or a resin film. In order to prevent disconnection due to scratches or the like, it may be used by applying a hard coat agent on a substrate such as an adhesive. Therefore, the easy-adhesion film used for such applications must have high adhesive strength with various materials, but the technique described in Patent Documents 1 to 3 described above does not have high adhesive strength, or Its performance was not sufficient, such as adversely affecting conductivity.

  The cross-linking agent is a very important component as an easy-adhesive layer component, but if an unreacted cross-linking agent remains after the easy-adhesive layer is applied, the reaction of the cross-linking agent gradually proceeds, and after the easy-adhesive layer is applied In some cases, the performance of the easy-adhesion film changes with time, or the crosslinking agent migrates to the functional layer coated on the easy-adhesion layer, which may cause problems that affect the performance.

Japanese Patent Laid-Open No. 6-107832 (pages 2 to 3) JP 2000-229396 A (page 8) Japanese Laid-Open Patent Publication No. 8-332706 (Page 5) JP 2008-235467 A (3rd and 4th pages)

  Accordingly, an object of the present invention is to provide an easy-adhesive film that has high adhesiveness to various materials, does not change adhesiveness over time, and does not adversely affect the function of the functional layer coated on the easy-adhesive layer. It is to provide.

The object of the present invention has been achieved by the following means.
A resin film having an easy-adhesion layer, wherein the easy-adhesion layer contains urethane latex , a water-soluble primary amide low molecule, and a vinyl sulfone compound .

  According to the present invention, there is provided an easy-adhesive film that has high adhesiveness to various materials, does not change adhesiveness over time, and does not adversely affect the function of the functional layer coated on the easy-adhesive layer. Can do.

  Examples of the resin film used in the easily adhesive film of the present invention include polyester resins such as polyethylene terephthalate, diacetate resins, triacetate resins, acrylic resins, polycarbonate resins, polyvinyl chloride, polyimide resins, polyvinylidene fluoride, cellophane, celluloid, and the like. Is mentioned. Further, in the present invention, an antistatic layer or the like can be provided as necessary.

  In the easy-adhesive film of the present invention, an easy-adhesive layer is coated on at least one surface of the resin film. The easy-adhesion layer is preferably formed as an easy-adhesion film by forming a water-based coating liquid by applying and drying from an environmental viewpoint.

  The easy adhesion layer contains a polymer latex as a resin component. As the polymer latex, various known latexes such as homopolymers and copolymers can be used. Homopolymers include polymers such as vinyl acetate, vinyl chloride, styrene, methyl acrylate, butyl acrylate, methacrylonitrile, butadiene, and isoprene. Copolymers include ethylene / butadiene copolymers and styrene / butadiene copolymers. Polymer, styrene / p-methoxystyrene copolymer, styrene / vinyl acetate copolymer, vinyl acetate / vinyl chloride copolymer, vinyl acetate / diethyl maleate copolymer, methyl methacrylate / acrylonitrile copolymer, methyl methacrylate・ Butadiene copolymer, methyl methacrylate / styrene copolymer, methyl methacrylate / vinyl acetate copolymer, methyl methacrylate / vinylidene chloride copolymer, methyl acrylate / acrylonitrile copolymer, methyl acrylate / butadiene Copolymer, methyl acrylate / styrene copolymer, methyl acrylate / vinyl acetate copolymer, acrylic acid / butyl acrylate copolymer, methyl acrylate / vinyl chloride copolymer, butyl acrylate / styrene copolymer, polyester, various There are urethane, etc. Among these, polyester latex, acrylic latex and urethane latex are preferably used from the viewpoint of weather resistance, and urethane latex, particularly non-yellowing urethane polycarbonate latex having high weather resistance is preferable from the viewpoint of adhesion to various materials. The average particle size of the polymer latex is preferably 0.01 to 0.3 μm, more preferably 0.02 to 0.1 μm. These polymer latexes can be used by mixing a plurality of types of latexes. Polyester latex, acrylic latex, and urethane latex contain 30% by mass or more of the resin component in the easy-adhesion layer, preferably 50 It is at least mass%.

  As the resin component used in the easy-adhesion layer of the easy-adhesion film of the present invention, a known water-soluble polymer compound can be used in addition to the polymer latex, and the polymer latex and the water-soluble polymer can be used in combination. preferable. Examples of such water-soluble polymer compounds include polyacrylic acid, polyacrylamide, polyvinyl alcohol, polyvinyl pyrrolidone, copolymers of maleic anhydride and styrene, and proteins such as gelatin, albumin, casein, and polylysine, carrageenan, and hyaluron. Mucopolysaccharides such as acids, “Chemical reactions of macromolecules” (Nobuo Okawara, 1972, Chemical Dojinsha) Chapter 2.6.4, aminated cellulose, polyethyleneimine, polyallylamine, polydiallylamine, allylamine and diallylamine Examples thereof include a copolymer, a copolymer of diallylamine and maleic anhydride, and a copolymer of diallylamine and sulfur dioxide. Among these water-soluble polymer compounds, it is preferable to use a polymer compound having an amino group such as protein, polyethyleneimine, or polyallylamine. A water-soluble high molecular compound is 40 mass% or less of the resin component in an easily bonding layer, Preferably it is 2-30 mass%.

Resin component amount used in the adhesive layer of the easy adhesion film of the present invention is 100 mg / ^{m 2} or more, it is desirable upper limit is 2500 mg / ^{m 2,} preferably 100-2000 mg / ^{m 2,} more preferably 150 to 1000 mg / m ² .

  The easy adhesion layer of the easy adhesion film of this invention contains a vinyl sulfone type crosslinking agent. In the present invention, the vinylsulfone-based crosslinking agent refers to a compound having at least two vinylsulfonyl groups in the molecule, and refers to a compound represented by the following general formula I or general formula II.

In the formula, L ¹ and L ² each represent a divalent linking group that may or may not be present. When present, it preferably represents an alkylene group having 1 to 5 carbon atoms, an arylene group, a carbamoyl group, a sulfamoyl group, oxygen, sulfur, an imino group and the like, and these may be combined. R ³ represents a hydrogen atom, an optionally substituted alkyl group having 1 to 5 carbon atoms, an optionally substituted aryl group such as benzene or naphthalene, and among them, a hydrogen atom is preferable.

  In the formula, L is an m-valent group having at least one hydroxyl group, and m is 2-4. In general formula II, L is a 2- to 4-valent C1-C10 acyclic hydrocarbon group, a 5- or 6-membered heterocyclic group containing a nitrogen atom, an oxygen atom and / or a sulfur atom, 5 or Examples thereof include a 6-membered cyclic hydrocarbon group or a cycloalkylene group having 7 to 10 carbon atoms. The acyclic hydrocarbon group is preferably an alkylene group having 1 to 8 carbon atoms. Each group represented by L may have a substituent, or may be bonded to each other through a hetero atom (for example, a nitrogen atom, an oxygen atom and / or a sulfur atom), a carbonyl group or a carbamide group. Also good. L may be substituted with, for example, one or more alkyloxy groups having 1 to 4 carbon atoms such as a methoxy group or an ethoxy group, a halogen atom such as a chlorine atom or a bromine atom, an acetoxy group, or the like.

  Specific examples of the compound of the general formula I are shown below, but are not limited thereto.

  Specific examples of the compound of the general formula II are shown below, but are not limited thereto.

  1-7 mass% is preferable with respect to the total resin component amount in an easily bonding layer, and, as for the addition amount of the crosslinking agent in the easily bonding layer of the easily bonding film of this invention, More preferably, it is 2-5 mass%.

  The easy adhesion layer of the easy adhesion film of the present invention contains a water-soluble primary amide low molecular weight compound. In the present invention, water-soluble means a compound that can be dissolved in water of 25% by mass or more in water at 25 ° C., and low molecule means a molecule having a molecular weight of 1000 or less. Use small molecules of 200 or less. Examples of water-soluble primary amide small molecules that can be used in the present invention include urea, ethylurea, acetamide, formamide, propionamide, succinamide, oxamide, benzamide, dultine, nicotinamide, and the like. preferable. In the present invention, the content of the water-soluble primary amide low molecule is 10 to 500% by mass, preferably 50 to 300% by mass with respect to the crosslinking agent.

  Furthermore, the easily adhesive layer can contain a matting agent such as silica, a lubricant, a pigment, a dye, a surfactant, an ultraviolet absorber and the like.

  Examples of the present invention are shown below. In order to produce the easy-adhesion film used in the present invention, a polycarbonate film having a thickness of 100 μm (Iupilon sheet manufactured by Mitsubishi Gas Chemical Company) was used as the transparent support.

  Next, according to the following prescription, easy-adhesion layer coating liquids A1 to A3 and comparative easy-adhesion layer coating liquids A4 to A9 were prepared, respectively coated on a polycarbonate film, and dried at 60 ° C. for 5 minutes. An easy-adhesion film was prepared by applying an easy-adhesion layer and drying, followed by heating at 50 ° C. for 24 hours.

<Easily Adhesive Layer Coating Liquid Formulation A1 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg
Urea 18mg

<Easily adhesive layer coating liquid formulation A2 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 12mg
Urea 24mg

<Easily adhesive layer coating formulation A3 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 15mg
Urea 30mg

<Comparative Adhesive Layer Coating Liquid Formulation A4 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg

<Comparative Adhesive Layer Coating Liquid Formulation A5 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 12mg

<Comparative Adhesive Layer Coating Liquid Formulation A6 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 15mg

<Comparative adhesive layer coating solution formulation A7 / 1 m ² per>
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
Denacol EX614 (Sorbitol polyglycidyl ether manufactured by Nagase ChemteX Corporation) 12mg

<Comparative Adhesive Layer Coating Liquid Formulation A8 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
Duranate WB40-80 (Asahi Kasei Corporation self-emulsifying isocyanate)
15 mg (solid content 12 mg)

<Comparative Adhesive Layer Coating Liquid Formulation A9 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
Carbodilite E02 (Nisshinbo's self-emulsifying carbodiimide)
30 mg (12 mg solid content)

  About the obtained easily bonding film, the adhesiveness with an ultraviolet curable adhesive, the electroconductivity of the electroconductive pattern provided on the easily bonding film, and adhesiveness were evaluated as follows.

<Adhesiveness with UV curable adhesive>
Loctite 3105 (a solvent-free visible light polymerization urethane acrylate adhesive manufactured by Henkel) was applied onto the easy-adhesion layer of the obtained easy-adhesion film so that the moisture application amount was 10 g / m ² . Polycarbonate base (Mitsubishi Gas Chemical Co., Ltd. Iupilon sheet) was layered, irradiated with ultraviolet rays using an ultraviolet irradiation device, cured and bonded. T-peel strength of the adhesive cut to a width of 25 mm was measured according to JIS K 6843-3.

<Conductivity of conductive pattern provided on easy-adhesive film>
A palladium sulfide sol solution was prepared as follows, and a physical development nucleus solution was prepared using the obtained sol.

<Preparation of palladium sulfide sol>
Liquid A Palladium chloride 5g
Hydrochloric acid 40ml
1000ml distilled water
B liquid sodium sulfide 8.6g
1000ml distilled water
Liquid A and liquid B were mixed with stirring, and 30 minutes later, the solution was passed through a column filled with an ion exchange resin to obtain palladium sulfide sol.

<Physical development nuclear solution composition / per 1 m ² >
The palladium sulfide sol 0.4mg
Surfactant S-1 30mg

  This physical development nuclei solution was applied onto the above-mentioned polycarbonate base coated with the easy adhesion layer and dried.

Subsequently, a backing layer having the following composition was applied on the side opposite to the side on which the physical development nucleus solution was applied.
<Undercoat layer composition / per 1 m ² >
2g of gelatin
Amorphous silica matting agent (average particle size 5μm) 20mg
Dye 1 200mg
Surfactant S-1 400mg

  Subsequently, an intermediate layer 1, a silver halide emulsion layer 1, and an outermost layer 1 having the following composition are coated on the easy-adhesion layer coated with the above-mentioned physical development nucleating solution in order from the side closer to the support to form a conductive material. A precursor was obtained. The silver halide emulsion was prepared by a general double jet mixing method for photographic silver halide emulsions. This silver halide emulsion was prepared with 95 mol% of silver chloride and 5 mol% of silver bromide, and an average grain size of 0.15 μm. The silver halide emulsion thus obtained was subjected to gold sulfur sensitization using sodium thiosulfate and chloroauric acid according to a conventional method. The silver halide emulsion thus obtained contains 0.5 g of gelatin per gram of silver.

<Middle layer 1 composition / per 1 m ² >
Gelatin 0.5g
Surfactant (S-1) 5mg

<Silver halide emulsion layer 1 composition / 1 m ² >
Gelatin 0.5g
Silver halide emulsion 3.0g Silver equivalent 1-Phenyl-5-mercaptotetrazole 3mg
Surfactant (S-1) 20mg

<Outermost layer 1 composition / per 1 m ² >
1g of gelatin
Amorphous silica matting agent (average particle size 3.5μm) 10mg
Surfactant S-1 10mg

  The conductive material precursor thus obtained was brought into close contact with a transparent original having a fine line width of 20 μm and a lattice pattern of 250 μm through a resin filter that cuts light of 400 nm or less with a contact printer using a mercury lamp as a light source. Exposed.

  Thereafter, the previously exposed conductive material precursor was immersed in the following diffusion transfer developer at 15 ° C. for 90 seconds, and then the silver halide emulsion layer, intermediate layer, outermost layer and backing layer were heated to 40 ° C. with hot water. And washed with water and dried. Thus, a mesh-like metal pattern having a thickness of 0.1 μm was obtained on the easy adhesion layer.

<Diffusion transfer developer composition>
Potassium hydroxide 25g
Hydroquinone 18g
1-phenyl-3-pyrazolidone 2g
Potassium sulfite 80g
N-methylethanolamine 15g
Potassium bromide 1.2g
Total volume 1000ml with water
Adjust to pH = 12.2.

  The surface resistivity of the conductive material on which the mesh-patterned silver thin film obtained as described above was formed was measured according to JIS K 7194 using a Lorester GP / ESP probe manufactured by Dia Instruments.

<Adhesiveness of conductive pattern provided on easy-adhesive film>
Using a conductive material with a conductive pattern provided on an easy-adhesive film, prepared to evaluate the conductivity of the conductive pattern provided on the easy-adhesive film, Used, plated at a current density of 2 A / dm ² per image at 45 ° C. for 10 minutes, washed with water and dried. Nitto Denko Polyester Adhesive Tape No. is applied to the plated mesh pattern silver thin film surface. 31 was affixed to the metal surface so as not to enter bubbles, and then the tape was peeled off vigorously for a peel test. The evaluation of the peel test was made into three stages: ○ is no peel, Δ is a partial peel, and x is a full peel.

<Nickel plating bath composition>
60% nickel sulfamate solution 500ml
Mel Bright NI-2225A (Meltex) 200ml
Mel Bright NI-2225B (Meltex) 20ml
Add ion exchange water to make the total volume 1000 ml.

  The obtained results are shown in Table 1. It can be seen from Table 1 that the easy-adhesion film of the present invention has good adhesion to the UV curable adhesive, and the conductivity and adhesion of the conductive pattern provided on the easy-adhesion film, but it does not contain urea. It can also be seen that the easy-adhesion film coated with the easy-adhesion layer coating solution of the easy-adhesion layer formulation A-6 also has relatively good performance.

  Subsequently, the easy-adhesion film coated with the easy-adhesion layer coating liquid of easy-adhesion formulations A-1 to A-6 was heated at 50 ° C. for 1 week, and after heating, the adhesiveness with the ultraviolet curable adhesive was examined. It was. In addition, the above-mentioned film was heated at 50 ° C. for 1 week after coating a backing layer, a physical development nucleus layer, an intermediate layer, a silver halide emulsion layer, and an outermost layer on an easily adhesive film to prepare a conductive material precursor. The same process was performed, and the conductivity and adhesion of the pattern provided on the easily adhesive film after heating were examined.

  From Table 2, the easily adhesive film containing no urea has deteriorated conductivity or has deteriorated the adhesiveness with the ultraviolet curable adhesive, and the usefulness of the present invention can be seen.

  An easy-adhesion film was prepared in the same manner as in Example 1 except that the easy-adhesion layer coating solution was prepared according to the following easy-adhesion layer formulation. Table 3 shows the results of the evaluation of the produced easy-adhesive film as it is with respect to the adhesiveness to the UV curable adhesive, the conductivity of the conductive pattern provided on the easy-adhesive film, and the adhesiveness. As a result of evaluating the adhesiveness with the ultraviolet curable adhesive after the weekly heating treatment and in the same manner as in Example 1, a conductive material precursor was prepared, and the conductive material precursor was heated at 50 ° C. for one week. Table 4 shows the results of evaluating the conductivity and adhesion of the conductive pattern.

<Easily adhesive layer coating formulation B1 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-3 9mg
Urea 18mg

<Easily adhesive layer coating liquid formulation B2 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-8 9mg
Urea 18mg

<Per easy adhesive layer coating liquid formulation B3 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-12 9mg
Urea 18mg

<Easily adhesive layer coating formulation B4 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg
Ethylurea 18mg

<Per easy adhesive layer coating solution formulation B5 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg
Nicotinamide 18mg

<Comparative adhesive layer coating formulation B6 / 1 m ² per>
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg
WGU gelatin (gelatin with a molecular weight of 5000, manufactured by Nippi Gelatin) 18mg

<Comparative Adhesive Layer Coating Liquid Formulation B7 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg
High micron L-271 (Stearic acid amide aqueous dispersion, manufactured by Chukyo Yushi Co., Ltd.)
(Solid content) 18mg

<Comparative Adhesive Layer Coating Liquid Formulation B8 / 1 m ² >
Hydran WLS210 (polycarbonate urethane latex manufactured by DIC)
770 mg (solid content 270 mg)
Gelatin 30mg
Surfactant (S-1) 1mg
Silicia 450 (Fuji Silysia Chemical Co., Ltd. Silica) 1.25mg
VS-2 9mg
Lauric acid ethanolamide 18mg

  From Tables 3 and 4, it can be seen that good results can be obtained even if the type of the vinyl sulfone crosslinking agent is changed. It can also be seen that good results can be obtained with primary amide compounds, but results such as primary amide compounds cannot be obtained with polymer compounds, water-insoluble amide compounds, and secondary amide compounds.

  As a result of testing the resin film in the same manner as in Example 1 except that Evilon film 3005 (a Taihei Chemicals vinyl chloride film) was used, the same results as in Example 1 were obtained.

  The present invention can be used as a substrate for various coating films such as conductive materials, magnetic tapes, packaging materials, electrical insulating materials, information recording materials, and various process papers.

Claims (1)

A resin film having an easy-adhesion layer, wherein the easy-adhesion layer contains urethane latex , a water-soluble primary amide low molecule, and a vinyl sulfone compound.