JP5436869B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

Info

Publication number
JP5436869B2
JP5436869B2 JP2009006461A JP2009006461A JP5436869B2 JP 5436869 B2 JP5436869 B2 JP 5436869B2 JP 2009006461 A JP2009006461 A JP 2009006461A JP 2009006461 A JP2009006461 A JP 2009006461A JP 5436869 B2 JP5436869 B2 JP 5436869B2
Authority
JP
Japan
Prior art keywords
substrate
liquid
microbubbles
gas
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009006461A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010165825A (ja
JP2010165825A5 (enExample
Inventor
治道 廣瀬
正泰 安部
幸伸 西部
勉 菊池
佳大 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2009006461A priority Critical patent/JP5436869B2/ja
Publication of JP2010165825A publication Critical patent/JP2010165825A/ja
Publication of JP2010165825A5 publication Critical patent/JP2010165825A5/ja
Application granted granted Critical
Publication of JP5436869B2 publication Critical patent/JP5436869B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2009006461A 2009-01-15 2009-01-15 基板処理装置および基板処理方法 Active JP5436869B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009006461A JP5436869B2 (ja) 2009-01-15 2009-01-15 基板処理装置および基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009006461A JP5436869B2 (ja) 2009-01-15 2009-01-15 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2010165825A JP2010165825A (ja) 2010-07-29
JP2010165825A5 JP2010165825A5 (enExample) 2012-03-01
JP5436869B2 true JP5436869B2 (ja) 2014-03-05

Family

ID=42581780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009006461A Active JP5436869B2 (ja) 2009-01-15 2009-01-15 基板処理装置および基板処理方法

Country Status (1)

Country Link
JP (1) JP5436869B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5954984B2 (ja) * 2011-12-22 2016-07-20 芝浦メカトロニクス株式会社 洗浄処理装置及び洗浄処理方法
JP5996329B2 (ja) * 2012-08-20 2016-09-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および基板処理方法
TWI576938B (zh) 2012-08-17 2017-04-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6498910B2 (ja) * 2014-10-30 2019-04-10 原嶋 文子 Ｐｃｂを内包する機器の処理方法
JP2019094426A (ja) * 2017-11-22 2019-06-20 大同メタル工業株式会社 洗浄液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006181426A (ja) * 2004-12-27 2006-07-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008080230A (ja) * 2006-09-27 2008-04-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008085231A (ja) * 2006-09-28 2008-04-10 Sharp Manufacturing System Corp 基板上の残留有機物除去方法

Also Published As

Publication number Publication date
JP2010165825A (ja) 2010-07-29

Similar Documents

Publication Publication Date Title
JP5436869B2 (ja) 基板処理装置および基板処理方法
US20190329520A1 (en) Cleaning device using micro/nano-bubbles
JP5243849B2 (ja) 基板処理装置および基板処理方法
CN1949086B (zh) 基板处理方法以及基板处理装置
CN103579053B (zh) 清洗液生成装置及方法、基板清洗装置及方法
JP2011218308A (ja) 気体溶解液生成装置及び生成方法
KR20150111818A (ko) 기판 세정 방법 및 기판 세정 장치
KR20080028804A (ko) 기판 처리 장치 및 기판 처리 방법
JP2006223995A (ja) 洗浄方法及び洗浄装置
JP5399678B2 (ja) レジスト剥離装置
JP2006310456A (ja) パーティクル除去方法および基板処理装置
JP2010165825A5 (enExample)
JP4994279B2 (ja) 微小気泡生成装置
JP5448385B2 (ja) 基板処理装置および基板処理方法
JP5412131B2 (ja) 基板処理装置および基板処理方法
JP5053115B2 (ja) 基板の処理装置及び処理方法
JP2006179765A (ja) 基板処理装置およびパーティクル除去方法
JP2009032710A (ja) 基板処理装置
JP2011072950A (ja) 処理装置
JP2008021672A (ja) ガス過飽和溶液を用いた超音波洗浄方法及び洗浄装置
JP5717241B2 (ja) 処理装置及び処理方法
JP2012000580A (ja) バブル含有液生成装置及び処理装置
JP2009291681A (ja) 微小気泡生成装置、微小気泡生成方法および基板処理装置
JP5435688B2 (ja) 基板処理装置および基板処理方法
JP5130127B2 (ja) 基板の処理装置及び処理方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120113

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120113

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130319

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130326

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130520

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131203

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131211

R150 Certificate of patent or registration of utility model

Ref document number: 5436869

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150