JP5432008B2 - Compacted wooden board, method for manufacturing the same, and shaping method for deformed wooden board - Google Patents

Description

 The present invention relates to a compacted wooden board, a method for manufacturing the same, and a method for shaping a deformed wooden board, and in particular, a compacted wooden board by flatly compacting a wooden board that is prone to deformation such as warpage during drying, and its manufacture. The present invention relates to a method and a method for shaping a deformed wooden board.

 Conventionally, when press working, the periphery of the wood is sealed, the moisture contained in the wood is confined in the wood, and the heat compression treatment is performed at high temperature and high pressure. It is known not to return. However, when such wood is taken out of the press machine immediately after the heat compression treatment, there has been a problem that the surface of the wood tends to swell and deform due to the action of high-temperature and high-pressure steam contained in the wood. In order to solve this problem, the present inventors have invented the inventions described in Patent Document 1 and Patent Document 2.

 In the technique described in Patent Document 1, wood placed in an internal space between an upper press plate and a lower press plate is heated and compressed to keep the internal space in a sealed state. At this time, the moisture content of the wood is made uniform by allowing high-temperature and high-pressure steam to pass freely through the compression surface and the internal space of the wood through protrusions that bite into the wood formed on the lower press board. Even when the heat-compressed wood is taken out without being cooled, it is possible to prevent swelling and deformation.

 Moreover, in the technique described in Patent Document 2, a plurality of breathing holes are drilled with a multi-axis drilling machine in wood whose moisture content has not been adjusted, and placed in an internal space between the upper press machine and the lower press machine. Then, it is heated and compressed, and the internal space is sealed. At this time, high-temperature and high-pressure water vapor can freely pass through the plurality of breathing holes on the surface and the interior and interior space of the wood, so that the moisture content of the wood can be made uniform. Even if it is taken out without cooling, it is possible to prevent bulge deformation.

JP 2007-008047 A JP 2007-130774 A

 By the way, in recent years, trees such as Itajii and Ryukyu pine have been attracting attention as being suitable for various uses such as flooring, because hard and dense board materials can be obtained and stably supplied. ing. However, in the techniques described in Patent Document 1 and Patent Document 2, when these trees are made of thick wood, it is difficult to make the water content uniform to the inside because the material is dense. The portion with a lot of moisture is destroyed by water vapor. In addition, when the product gets wet with water, the compressed portion may return to the original thickness. On the other hand, when these trees are made of thin wood, there is a problem that deformation such as warpage is likely to occur during drying.

 Accordingly, the present invention has been made to solve such problems, and can obtain a wooden board having a wide variety of uses as a board material and having a high commercial value, and flattening a wooden board that is prone to deformation such as warpage when dried. It is an object of the present invention to provide a compacted wooden board that does not return even when the compressed wooden board gets wet with water, a method for manufacturing the same, and a method for shaping a deformed wooden board.

 The compacted wood board according to claim 1 is a wood board cut into a board thickness within a range of 5 mm to 40 mm, more preferably within a range of 10 mm to 25 mm, and a moisture content of 10% to 30%, more preferably a moisture content. After drying within a range of 15% to 20% and heating to the first heating temperature, pressurization is performed for a first predetermined time at a predetermined pressure, and then to the second heating temperature while maintaining the pressurized state. It is heated, blown with water vapor at the second heating temperature, held for a second predetermined time, cooled to below 120 ° C., and then returned to normal pressure.

The first heating temperature is in the range of 110 ° C. to 160 ° C., more preferably in the range of 120 ° C. to 140 ° C., and the second heating temperature is in the range of 150 ° C. to 210 ° C. Preferably, it is within the range of 160 ° C to 180 ° C.

The predetermined pressure is within a range of 0.1 MPa to 10 MPa, and more preferably within a range of 1 MPa to 5 MPa .

Further, the first predetermined time is within a range of 10 minutes to 40 minutes, more preferably within a range of 20 minutes to 30 minutes, and the second predetermined time is within a range of 10 minutes to 120 minutes, and more Preferably, it is within the range of 30 minutes to 90 minutes.

The method for producing a compacted wood board according to claim 2 includes a cutting process of cutting wood into a board having a thickness within a range of 5 mm to 40 mm, and a drying process of drying the wood board within a range of moisture content of 10% to 30%. A first heating step for heating the dried wooden board to a first heating temperature, a pressing process for pressurizing the heated wooden board for a first predetermined time at a predetermined pressure, and sealing the wooden board, and the wooden board A second heating step for heating to a second heating temperature while maintaining the pressurized hermetically sealed state, and a steam treatment step for blowing the steam at the second heating temperature into the wooden board and holding it for a second predetermined time, It comprises a cooling step of releasing the pressure sealed state after cooling the wooden board to less than 120 ° C.

The first heating temperature is in the range of 110 ° C. to 160 ° C., more preferably in the range of 120 ° C. to 140 ° C., and the second heating temperature is in the range of 150 ° C. to 210 ° C. Preferably, it is within the range of 160 ° C to 180 ° C.

The predetermined pressure is within a range of 0.1 MPa to 10 MPa, and more preferably within a range of 1 MPa to 5 MPa .

Further, the first predetermined time is within a range of 10 minutes to 40 minutes, more preferably within a range of 20 minutes to 30 minutes, and the second predetermined time is within a range of 10 minutes to 120 minutes, and more Preferably, it is within the range of 30 minutes to 90 minutes.

The shaping method of the deformed wood board according to claim 3 includes a first heating step of heating the deformed wood board having a moisture content in a range of 10% to 30% to a first heating temperature, and the heated wood board at a predetermined pressure. And pressurizing for a first predetermined time and making it sealed, a second heating step for heating to a second heating temperature while maintaining the pressurized sealed state of the wooden board, and the second to the wooden board A steam treatment process in which steam at a heating temperature of 2 is blown and held for a second predetermined time, and a cooling process in which the pressure-sealed state is released after the wooden board is cooled to less than 120 ° C.

The first heating temperature is in the range of 110 ° C. to 160 ° C., more preferably in the range of 120 ° C. to 140 ° C., and the second heating temperature is in the range of 150 ° C. to 210 ° C. Preferably, it is within the range of 160 ° C to 180 ° C.

The predetermined pressure is in the range of 0.1 MPa to 10 MPa , more preferably in the range of 1 MPa to 5 MPa.

Further, the first predetermined time is within a range of 10 minutes to 40 minutes, more preferably within a range of 20 minutes to 30 minutes, and the second predetermined time is within a range of 10 minutes to 120 minutes, and more Preferably, it is within the range of 30 minutes to 90 minutes.

 The compacted wooden board according to claim 1 is obtained by drying a wooden board cut to a board thickness within a range of 5 mm to 40 mm within a range of moisture content of 10% to 30% and heating to a first heating temperature. Pressurizing at a pressure for a first predetermined time, and then heating to a second heating temperature while maintaining the pressurized state, blowing in water vapor at the second heating temperature and holding for a second predetermined time, After cooling to below 120 ° C., the pressure is returned to normal pressure.

 In this way, by making the wood board within a range of 5 mm to 40 mm, the inside can be easily and uniformly dried, and by making the moisture content within a range of 10% to 30%, deformation -A compacted wooden board that does not bulge or break can be obtained. When a wooden board having a thickness of less than 5 mm is compacted, the thickness of the pressed wooden board becomes too thin and it is difficult to process it into a uniform wooden board. It takes too much. On the other hand, when a wood board having a thickness of more than 40 mm is dried and compacted, it is not uniformly dried to the inside, and therefore deformation, swelling, destruction, etc. are likely to occur.

 In addition, when a wood board having a moisture content of less than 10% is compacted, the surface is too dry, and when the wood board gets wet with water, the compressed portion returns to its original thickness, so-called improper fixing. On the other hand, when a wood board having a moisture content of more than 30% is compacted, it is not uniformly dried to the inside, so deformation, swelling, destruction, etc. are likely to occur. In addition, it is more preferable that the thickness of the cut wooden board is in the range of 10 mm to 25 mm because deformation, swelling, destruction, and the like are less likely to occur. Moreover, when it dries within the range of moisture content 15%-20%, since immobilization defect becomes difficult to occur more, it is more preferable.

 Further, by applying pressure after heating to the first heating temperature, even if the wooden board is deformed during drying, it can be flattened without breaking, and heated to the second heating temperature while maintaining the pressurized state. By blowing water vapor at the same temperature, it is possible to prevent the surface from drying and to fix the surface uniformly, and to prevent the surface from carbonizing. And after returning to normal pressure after cooling to less than 120 degreeC, excess water vapor | steam can be liquefied and removed and it can fix uniformly.

 In this way, it is possible to obtain a wood plate having a high commercial value with abundant uses as a board material, and it is possible to flatten a wood board that is likely to be warped during drying, and return even if the compressed wood board gets wet. It becomes a compacted wood board without any problems.

Since the first heating temperature is in the range of 110 ° C. to 160 ° C. and the second heating temperature is in the range of 150 ° C. to 210 ° C., the temperature conditions are appropriate and deformation and fixation are insufficient. Therefore, it is possible to more reliably prevent immobilization defects and surface carbonization. If the heating temperature is too low, deformation and fixation may be insufficient, resulting in improper fixation.If the heating temperature is too high, the surface may carbonize and turn black, or the material may become brittle. is there.

 In addition, if the first heating temperature is in the range of 120 ° C. to 140 ° C. and the second heating temperature is in the range of 160 ° C. to 180 ° C., immobilization defects and surface carbonization are more reliably ensured. Since it can prevent, it is more preferable.

Since the predetermined pressure is within the range of 0.1 MPa to 10 MPa, the pressure at the time of pressurization is within an appropriate range, and it is possible to more reliably prevent improper fixing due to insufficient deformation and fixation. can do. In addition, it is more preferable that the predetermined pressure is in the range of 1 MPa to 5 MPa because immobilization defects can be prevented more reliably.

Since the first predetermined time is in the range of 10 minutes to 40 minutes and the second predetermined time is in the range of 10 minutes to 120 minutes, immobilization failure due to the processing time being too short, Carbonization of the surface due to the treatment time being too long can be more reliably prevented. In addition, if the first predetermined time is in the range of 20 minutes to 30 minutes and the second predetermined time is in the range of 30 minutes to 90 minutes, immobilization failure and carbonization of the surface are more reliably prevented. This is more preferable because the compacted wooden board can be manufactured more efficiently.

In the method for producing a compacted wood board according to claim 2 , the wood is cut into a board having a thickness of 5 mm to 40 mm in the cutting process, and the wood board has a moisture content of 10% to 30% in the drying process. Dried inside. In this way, by making the wood board within a range of 5 mm to 40 mm, the inside can be easily and uniformly dried, and by making the moisture content within a range of 10% to 30%, deformation -It is possible to produce a compacted wooden board that does not swell or break.

 When a wood board having a thickness of less than 5 mm is compacted, the thickness of the wood board after pressurization becomes too thin and breakage easily occurs, and it takes too much time to laminate and produce a product. On the other hand, when a wood board having a thickness of more than 40 mm is dried and compacted, it is not uniformly dried to the inside, and therefore deformation, swelling, destruction, etc. are likely to occur. In addition, when a wood board having a moisture content of less than 10% is compacted, the surface is too dry, and when the wood board gets wet with water, the compressed portion returns to its original thickness, so-called improper fixing. On the other hand, when a wood board having a moisture content of more than 30% is compacted, it is not uniformly dried to the inside, so deformation, swelling, destruction, etc. are likely to occur.

 In addition, it is more preferable that the thickness of the cut wooden board is in the range of 10 mm to 25 mm because deformation, swelling, destruction, and the like are less likely to occur. Moreover, when it dries within the range of moisture content 15%-20%, since immobilization defect becomes difficult to occur more, it is more preferable.

 Subsequently, in the first heating step, the dried wood board is heated to a first heating temperature, and in the pressurization process, the heated wood board is pressurized at a predetermined pressure for a first predetermined time and sealed. In the second heating step, the wood board is heated to the second heating temperature while maintaining the pressure sealed state of the wood board, and in the steam treatment process, the steam at the second heating temperature is blown into the wood board. It is held for a predetermined time. And in a cooling process, after cooling a wooden board to less than 120 degreeC, a pressurization sealing state is cancelled | released.

 In this way, by applying pressure after heating to the first heating temperature, even if the wooden board is deformed during drying, it can be flattened without breaking, and up to the second heating temperature while maintaining the pressurized state. By heating and blowing water vapor at the same temperature, it is possible to prevent the surface from drying and to fix it uniformly, and to prevent the surface from carbonizing. And after returning to normal pressure after cooling to less than 120 degreeC, excess water vapor | steam can be liquefied and removed and it can fix uniformly.

 In this way, it is possible to obtain a wood plate having a high commercial value with abundant uses as a board material, and it is possible to flatten a wood board that is likely to be warped during drying, and return even if the compressed wood board gets wet. This is a method for producing a compacted wood board without any problems.

Since the first heating temperature is in the range of 110 ° C. to 160 ° C. and the second heating temperature is in the range of 150 ° C. to 210 ° C., the temperature conditions are appropriate and deformation and fixation are insufficient. Therefore, it is possible to more reliably prevent immobilization defects and surface carbonization. If the heating temperature is too low, deformation and fixation may be insufficient, resulting in improper fixation.If the heating temperature is too high, the surface may carbonize and turn black, or the material may become brittle. is there.

 In addition, if the first heating temperature is in the range of 120 ° C. to 140 ° C. and the second heating temperature is in the range of 160 ° C. to 180 ° C., immobilization defects and surface carbonization are more reliably ensured. Since it can prevent, it is more preferable.

Since the predetermined pressure is within the range of 0.1 MPa to 10 MPa, the pressure at the time of pressurization is within an appropriate range, and it is possible to more reliably prevent improper fixing due to insufficient deformation and fixation. can do. In addition, it is more preferable that the predetermined pressure is in the range of 1 MPa to 5 MPa because immobilization defects can be prevented more reliably.

Since the first predetermined time is in the range of 10 minutes to 40 minutes and the second predetermined time is in the range of 10 minutes to 120 minutes, immobilization failure due to the processing time being too short, Carbonization of the surface due to the treatment time being too long can be more reliably prevented. In addition, if the first predetermined time is in the range of 20 minutes to 30 minutes and the second predetermined time is in the range of 30 minutes to 90 minutes, immobilization failure and carbonization of the surface are more reliably prevented. This is more preferable because the compacted wooden board can be manufactured more efficiently.

In the method for shaping a deformed wood board according to claim 3 , in the first heating step, the deformed wood board having a moisture content in the range of 10% to 30% is heated to the first heating temperature, and in the pressurizing step, heating is performed. The pressed wooden board is pressurized at a predetermined pressure for a first predetermined time and is sealed, and in the second heating step, the wooden board is heated to a second heating temperature while maintaining the pressurized sealed state of the wooden board, In the processing step, steam at the second heating temperature is blown into the wooden board and held for a second predetermined time. In the cooling process, the pressure sealed state is released after the wooden board is cooled to less than 120 ° C.

 In this way, by applying pressure after heating to the first heating temperature, it is possible to flatten without destroying even the deformed wooden board, heating to the second heating temperature while maintaining the pressurized state, By blowing water vapor at the same temperature, it is possible to prevent the surface from drying and to fix the surface uniformly, and to prevent the surface from carbonizing. And after returning to normal pressure after cooling to less than 120 degreeC, excess water vapor | steam can be liquefied and removed and it can fix uniformly.

 In this way, it is possible to obtain a wood plate having a high commercial value with abundant uses as a board material, and it is possible to flatten a wood board that is likely to be warped during drying, and return even if the compressed wood board gets wet. This is a method for shaping a deformed wooden board.

Since the first heating temperature is in the range of 110 ° C. to 160 ° C. and the second heating temperature is in the range of 150 ° C. to 210 ° C., the temperature conditions are appropriate and deformation and fixation are insufficient. Therefore, it is possible to more reliably prevent immobilization defects and surface carbonization. If the heating temperature is too low, deformation and fixation may be insufficient, resulting in improper fixation.If the heating temperature is too high, the surface may carbonize and turn black, or the material may become brittle. is there.

 In addition, if the first heating temperature is in the range of 120 ° C. to 140 ° C. and the second heating temperature is in the range of 160 ° C. to 180 ° C., immobilization defects and surface carbonization are more reliably ensured. Since it can prevent, it is more preferable.

Since the predetermined pressure is within the range of 0.1 MPa to 10 MPa, the pressure at the time of pressurization is within an appropriate range, and it is possible to more reliably prevent improper fixing due to insufficient deformation and fixation. can do. In addition, it is more preferable that the predetermined pressure is in the range of 1 MPa to 5 MPa because immobilization defects can be prevented more reliably.

Since the first predetermined time is in the range of 10 minutes to 40 minutes and the second predetermined time is in the range of 10 minutes to 120 minutes, immobilization failure due to the processing time being too short, Carbonization of the surface due to the treatment time being too long can be more reliably prevented. In addition, if the first predetermined time is in the range of 20 minutes to 30 minutes and the second predetermined time is in the range of 30 minutes to 90 minutes, immobilization failure and carbonization of the surface are more reliably prevented. This is more preferable because the compacted wooden board can be manufactured more efficiently.

FIG. 1 is a schematic diagram showing the configuration of a heating / cooling / pressurizing device for carrying out a method of manufacturing a compacted wooden board and a method of shaping a deformed wooden board according to an embodiment of the present invention. FIG. 2 is a flowchart showing a method of manufacturing a compacted wooden board and a method of shaping a deformed wooden board according to an embodiment of the present invention. FIG. 3 is a schematic diagram for explaining a manufacturing process of a compacted wooden board according to an embodiment of the present invention. 4A is a perspective view showing a deformed wood board, FIG. 4B is a perspective view showing a compacted wood board according to an embodiment of the present invention, and FIG. 4C is a perspective view showing a compacted wood board of a comparative example.

 In carrying out the compacted wooden board and the manufacturing method thereof according to the present invention, it is necessary to cut wood into a wooden board having a thickness of 5 mm to 40 mm and to dry the wooden board to a moisture content of 10% to 30%. is there. As a method for cutting wood into a wooden board having a thickness within a range of 5 mm to 40 mm, a conventionally known lumbering method can be used. Moreover, as a method of drying the cut wood board within the range of moisture content of 10% to 30%, it is possible to use sun drying, and it is also possible to use a dryer such as a steam dryer.

 For domestic broad-leaved trees such as chestnuts and weasels, and Japanese conifers such as cedar, cypress, larch, and ryukyu pine, we cut them into a board with a thickness of 5mm to 40mm and dry them for several days. It is dried within a range of 10% to 30%. Moreover, the moisture content of a wooden board can be made into the more preferable range of 15%-20% by drying at 80 degreeC for 3 days-7 days within a steam dryer. Here, a high frequency moisture meter was used as a method for measuring the moisture content.

 In practicing the present invention, the dried wood board is heated to the first heating temperature, and the heated wood board is pressurized at a predetermined pressure for a first predetermined time and kept in a sealed state, thereby maintaining the pressure sealed state of the wood board. It is necessary to release the pressurized sealed state after heating to the second heating temperature and blowing the steam at the second heating temperature into the wooden board for a second predetermined time and cooling the wooden board to below 120 ° C. There is. In order to carry out these steps efficiently, it is preferable to use a dedicated heating / cooling / pressurizing apparatus.

 As the heating mechanism, an electric heater or a high-frequency heating device can be used. However, since a boiler and a steam pipe are necessary for blowing heated steam, this steam is used for heating, and cooling water is used for cooling. It is more preferable to use piping.

 In addition, a dedicated heating / cooling / pressurizing device requires a press lifting / lowering device. As this pressing lifting / lowering device, various types of devices can be used, but a press lifting / lowering device using a hydraulic mechanism is used. In the case of using a press lifting apparatus using a hydraulic mechanism, it is preferable to provide a plurality of press boards so that a plurality of wood boards can be processed simultaneously.

 Further, when a plurality of press machines are provided, it is preferable to stack the press machines and use both the upper press machine and the lower press machine in order to improve the heating and cooling efficiency. Although about -6 stages are preferable, it is not restricted to this.

 Examples in which the present invention is embodied will be described below with reference to FIGS. 1 to 4, but the present invention is not limited to these examples.

 FIG. 1 is a schematic diagram showing the configuration of a heating / cooling / pressurizing device for carrying out a method of manufacturing a compacted wooden board and a method of shaping a deformed wooden board according to an embodiment of the present invention. FIG. 2 is a flowchart showing a method of manufacturing a compacted wooden board and a method of shaping a deformed wooden board according to an embodiment of the present invention. FIG. 3 is a schematic diagram for explaining a manufacturing process of a compacted wooden board according to an embodiment of the present invention. 4A is a perspective view showing a deformed wood board, FIG. 4B is a perspective view showing a compacted wood board according to an embodiment of the present invention, and FIG. 4C is a perspective view showing a compacted wood board of a comparative example.

 First, a heating / cooling / pressurizing apparatus for carrying out a method of manufacturing a compacted wooden board and a method of shaping a deformed wooden board according to an embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, a heating / cooling / pressurizing apparatus (that is, a compacted wooden board manufacturing apparatus and a deformed wooden board shaping apparatus) 1 according to this embodiment has four press panels, that is, one upper press. A board 10A, two upper and lower press boards 10B and 10C, and one lower press board 10D are mainly configured.

 One compact molded wood board is manufactured between the upper press board 10A and the upper and lower press machines 10B, between the upper and lower press machines 10B and 10C, and between the upper and lower press machines 10C and 10D. A total of three compacted wooden boards can be manufactured simultaneously. Note that a press lifting apparatus including a hydraulic mechanism for lowering and raising the upper press board 10A and the upper and lower press boards 10B and 10C with respect to the lower press board 10D to perform pressurization is not shown. .

 Further, seal members 11A, 11B, and 11C are provided around the lower surfaces of the upper press plate 10A and the upper and lower press plates 10B and 10C, respectively, so that a sealed state can be formed when pressurized. Yes. Further, inside these four press panels 10A, 10B, 10C, and 10D, internal heating and cooling pipes (not shown) are stretched, and these internal heating and cooling pipes, as shown in FIG. Heating / cooling pipes 3A, 3B, 3C, 3D are connected from the inlet header 5 through opening / closing valves V3A, V3B, V3C, V3D.

 As shown in FIG. 1, discharge pipes 6A, 6B, 6C, and 6D are connected to the ends of the internal heating and cooling pipes (not shown) to which these heating and cooling pipes 3A, 3B, 3C, and 3D are connected. The discharge pipes 6A, 6B, 6C, and 6D are connected to the outlet header 7 through three-way valves V5A, V5B, V5C, and V5D, and the drainage collected in the outlet header 7 is connected to the opening / closing valve V6. And discharged from the drain pipe 6 connected to the outlet header 7.

 On the other hand, as shown in FIG. 1, the inlet header 5 is connected to the water vapor supply pipe 2 via the open / close valves V1 and V2, and the cooling water supply pipe 3 via the open / close valve V3. Further, the steam supply pipe 2 branches between the on-off valve V1 and the on-off valve V2, and is connected to the steam header 4 via the on-off valve V4. The steam header 4 includes the on-off valves V4A, V4B, V4C. The steam pipes 2A, 2B, 2C are connected via the. In addition, the boiler which supplies water vapor | steam by the water vapor | steam supply pipe | tube 2 is abbreviate | omitting illustration.

 As shown in FIG. 1, the tips of these water vapor pipes 2A, 2B, 2C pass through the molds of the upper press board 10A and the upper and lower press boards 10B, 10C and open to the inside. Accordingly, the tips of the steam pipes 2A, 2B, 2C are located between the upper press board 10A and the upper and lower press machines 10B, between the upper and lower press machines 10B and 10C, and between the upper and lower press machines 10C and 10D. It communicates with a sealed space formed between them.

 Since the discharge pipes 6A, 6B, 6C, 6D also pass water vapor, a liquefaction device 8 is provided for liquefying the water vapor and returning it to water. That is, as shown in FIG. 1, pipes 7A, 7B, 7C, and 7D branched from the discharge pipes 6A, 6B, 6C, and 6D are connected to the liquefier 8, and the pipe 8A, 8B, 8C, 8D are connected to the discharge pipes 6A, 6B, 6C, 6D via three-way valves V5A, V5B, V5C, V5D.

 Furthermore, the water vapor header 4 and the inlet header 5 are provided with pressure gauges P1 and P2 for measuring the pressure of the supplied water vapor. The water vapor header 4, the inlet header 5 and the outlet header 7 are provided with internal pressure gauges P1 and P2. Emergency valves V7, V8, and V9 are provided to automatically open and release the internal pressure when the pressure exceeds a set value. The heating / cooling / pressurizing apparatus 1 having such a configuration performs heating / pressurizing / steaming / cooling of the wooden board.

 Next, specific procedures of the method for manufacturing a compacted wooden board and the method for shaping a deformed wooden board according to an embodiment of the present invention will be described with reference to FIG. As shown in FIG. 2, first, wood NWs such as domestic hardwoods such as chestnuts, weasels, and Japanese conifers such as cedar, cypress, larch, and ryukyu pine are plate thicknesses within a range of 5 mm to 40 mm in the cutting process. The wood board is cut out (step S10), and the wood board is dried within a range of moisture content of 10% to 30% in the drying process (step S11).

 In the present embodiment, it is cut into a plate thickness of 25 mm using Itajii as the wood NW, and dried in a steam dryer at 80 ° C. for 3 to 7 days, so that the moisture content of the wooden board is within the range of 15% to 18%. Adjusted. As a result, a deformed wood board HW having deformation such as warpage was obtained.

 Subsequently, the deformed wood board HW is set in the heating / cooling / pressurizing apparatus 1 described above, and is heated to a first heating temperature within a range of 110 ° C. to 160 ° C. in the first heating step (step S12). In the pressurizing step, the heated wood board is pressurized and sealed for a first predetermined time within a range of 10 minutes to 40 minutes at a predetermined pressure within a range of 0.1 MPa to 10 MPa. (Step S13).

 In this embodiment, the first heating temperature is set to 120 ° C., the press plate is brought into contact with the deformed wooden board HW at a pressure of 0.1 to 0.5 MPa, and the temperature of the press plate is changed from room temperature to 120 ° C. over 20 minutes. When the temperature of the press board reached 120 ° C., the press board was compressed at a pressure of 3 MPa for 10 minutes to seal the press board. That is, in this embodiment, the predetermined pressure is 3 MPa, and the first predetermined time is 10 minutes.

 Subsequently, in the second heating step, the wood plate is heated to a second heating temperature within a range of 150 ° C. to 210 ° C. while maintaining the pressurized sealed state of the wooden board (step S14). The steam at the second heating temperature is blown into the wooden board placed on the board, and held for a second predetermined time within a range of 10 minutes to 120 minutes (step S15).

 In this example, the second heating temperature was 160 ° C., and the second predetermined time was 50 minutes. That is, the temperature of the press plate was raised from 120 ° C. to 160 ° C. over 5 minutes, and when the temperature of the press plate reached 160 ° C., steam at 160 ° C. was blown and held as it was for 50 minutes.

 Thereafter, in the cooling step, the pressure is maintained at a normal pressure after being cooled to less than 120 ° C. while maintaining the press pressure (step S16). In this example, the press panel was cooled from 160 ° C. to room temperature over 50 minutes, and the press pressure was released. In this way, a compacted wooden board PW according to this example was obtained.

 Next, among the manufacturing method of the compacted wooden board and the shaping method of the deformed wooden board according to the embodiment of the present invention, a specific operation method of the heating / cooling / pressurizing apparatus 1 in steps S12 to S16 will be described with reference to FIG. 3 will be described. In FIG. 3, in the heating / cooling / pressurizing device 1, the vicinity of the press panels 10A and 10B is shown enlarged.

 First, as shown in FIG. 3 (a), wood plates HW1 and HW2 deformed in the drying process between the upper press board 10A and the upper and lower press boards 10B and between the upper and lower press machines 10B and 10C, respectively. Is set. Although not shown, a deformed wood board is set between the upper and lower press machines 10C and 10D, and the same processing is performed thereafter. At this time, the upper press board 10A, the upper and lower press boards 10B, and the upper and lower press boards 10C are all at room temperature. In addition, all the open / close valves V1, V2, V3,... Are closed.

 Subsequently, a press lifting / lowering device (not shown) is activated, and the upper press plate 10A and the upper and lower press plates 10B and 10C are lowered with respect to the lower press plate 10D, and as shown in FIG. The deformed wooden board HW1 is sandwiched between the board 10A and the upper and lower press boards 10B, and the deformed wooden board HW2 is sandwiched between the upper and lower press boards 10B and 10C. The pressure at this time is as small as 0.1 to 0.5 MPa as described above.

 In this state, the on-off valves V1, V2, V3A, V3B, V3C, V3D, and V6 shown in FIG. 1 are opened, and the three-way valves V5A, V5B, V5C, and V5D connect the outlet head 7 and the liquefying device 8. Thus, high-temperature steam is supplied to internal pipes (not shown) of the press machines 10A, 10B, 10C, and 10D, and the press machines 10A, 10B, 10C, and 10D are heated. When the temperature of the press panels 10A, 10B, 10C, 10D reaches 120 ° C., the opening / closing valve V2 is once closed.

 At the same time, a press lifting / lowering device (not shown) is operated, so that the upper press panel 10A and the upper and lower press panels 10B receive a pressure of 3 MPa, and the upper and lower press panel 10B and the upper and lower press panels 10C receive a pressure of 3 MPa. Compressed. As a result, as shown in FIG. 3C, the seal members 11A and 11B on the lower surfaces of the upper press plate 10A and the upper and lower press plates 10B are pressed against the upper surfaces of the upper and lower press plates 10B and 10C, respectively. Between the upper press board 10A and the upper and lower press boards 10B, and between the upper and lower press boards 10B and 10C are sealed.

 After pressurizing at 3 MPa for 10 minutes, the open / close valve V2 is opened again while the pressurized state is maintained, and high-temperature steam is respectively supplied to internal pipes (not shown) of the press panels 10A, 10B, 10C, and 10D. The press machines 10A, 10B, 10C, and 10D are further heated. When the temperature of the press panels 10A, 10B, 10C, 10D reaches 160 ° C., the opening / closing valve V2 is closed again.

 Then, the open / close valves V4, V4A, V4B, and V4C are opened, and 160 ° C. steam is blown into the sealed space from the steam pipes 2A, 2B, and 2C. By holding in this state for 50 minutes, the immobilization process is performed. Thereafter, the on-off valves V1, V4, V4A, V4B, and V4C are closed, then the on-off valve V3 is opened, and cooling water is supplied to internal pipes (not shown) of the press panels 10A, 10B, 10C, and 10D, respectively. The press panels 10A, 10B, 10C, 10D are cooled.

 When the press panels 10A, 10B, 10C, and 10D are cooled to less than 120 ° C., as shown in FIG. 3D, a press lifting / lowering device (not shown) is operated, and the upper press panel 10A and the upper and lower press panels 10B are operated. , 10C rises with respect to the lower press panel 10D, the pressure sealed state is released, and the manufactured compacted wooden board PW1 is taken out.

 Characteristic evaluation was performed on the compacted wooden board PW according to this example manufactured as described above. First, visual evaluation results will be described with reference to FIG.

 As shown in FIG. 4 (a), the wooden boards HW1 and HW2 cut to a thickness of 25 mm and dried in a steam dryer at 80 ° C. for 3 to 7 days were greatly deformed. On the other hand, the compacted wooden boards PW1 and PW2 obtained by the manufacturing method and the deforming wooden board shaping method according to the present embodiment were flat without warping as shown in FIG. 4B. In addition, the plate | board thickness of compacting shaping | molding wooden board PW1, PW2 was 10 mm, and became 40% before a process, and the compression rate was 60%.

 On the other hand, as a comparative example, when the applied pressure was excessively 11 MPa, as shown in FIG. 4 (c), although it became flat as compared with the deformed wooden boards HW1 and HW2, cracking occurred. This resulted in defective wood boards W1, W2. Further, when the second heating temperature was excessively increased to 220 ° C., the surface of the flattened surface was carbonized to become black, the appearance was impaired, and the material became brittle.

 Next, an evaluation test was performed for the presence or absence of immobilization defects, that is, the presence or absence of return (recovery) when the compacted wooden board was wetted with water. Since there is no clear evaluation standard for recovery from compression deformation, in this example, the dimensions of the specimen (consolidated molded wooden board) were measured using a linear gauge sensor, and the following (1) to (3) An underwater immersion / drying test was performed under three conditions, and it was determined as acceptable when recovery amount = (thickness before immersion in water) − (thickness after complete drying) ≦ 0.5 mm.

Condition (1): A compacted wooden board immediately after production is immersed in water at 30 ° C. under reduced pressure for 1 hour and then completely dried in a dryer at 105 ° C. Condition (2): A compacted wooden board immediately after production in water at 60 ° C. After being immersed in a dryer at 105 ° C. for 1 hour, condition (3): Immediately after being immersed in 100 ° C. water for 1 hour, the compacted wooden board was completely dried in a dryer at 105 ° C.

 As a result, the compacted wooden board PW according to the present example passed in all the tests under the three conditions (1) to (3), and was proved to be an extremely excellent immobilization state.

 In the test of the condition (1), a wooden board cut to a thickness within a range of 5 mm to 40 mm is dried to a moisture content within a range of 10% to 30%, heated to a first heating temperature, Pressurize with pressure for a first predetermined time, then heat to the second heating temperature while maintaining the pressurized state, blow in water vapor at the second heating temperature and hold for a second predetermined time, 120 It was found that all of the compacted wooden boards that were returned to normal pressure after cooling to below ° C passed.

 On the other hand, in the test of the condition (2), a wood board cut to a board thickness in the range of 10 mm to 25 mm is dried to a moisture content in the range of 15% to 20%, and the range of 110 ° C. to 160 ° C. After heating in, pressurize only within a range of 10 minutes to 40 minutes at a pressure within a range of 0.1 MPa to 10 MPa, and then heat to 150 ° C. to 210 ° C. while maintaining the pressurized state. All of the compacted wood boards that were blown into water vapor and held only for 10 minutes to 120 minutes, cooled to below 120 ° C. and then returned to normal pressure passed, but those outside these conditions included I found something that did not pass.

 Furthermore, in the test of the condition (3), a wooden board cut to a board thickness within a range of 10 mm to 25 mm is dried to a moisture content of 15% to 20% and heated to a range of 120 ° C. to 140 ° C. After that, the pressure is applied only within a range of 20 minutes to 30 minutes at a pressure within the range of 1 MPa to 5 MPa, and then heated to 160 ° C. to 180 ° C. while maintaining the pressurized state, and steam of the same temperature is blown in to 30 ° C. All of the compacted wooden boards that were held in the range of minutes to 90 minutes and cooled to below 100 ° C. and then returned to normal pressure passed, but those that did not pass these conditions did not pass It was found.

 The compacted wood board that passes the test of the condition (1) is suitable for the usage by the normal usage of wood such as floor boards, wall boards, interior fittings, and exterior materials used by painting, and the test of the condition (2) The compacted wood board that passes is suitable for applications that are used under more severe conditions such as floor heating flooring and bathroom floors.

 In this way, in the compacted wooden board and its manufacturing method and the modified wooden board shaping method according to the present embodiment, it is possible to obtain a wooden board with many uses as a board material and high commercial value, and deformation such as warping when dried. It is possible to obtain a compacted wooden board that can be flattened and that does not return even when the compressed wooden board gets wet.

 Note that the numerical values given in the examples of the present invention are not all critical values, and certain numerical values indicate preferred values suitable for implementation. It does not deny implementation.

HW, HW1, HW2 Deformed wood board PW, PW1, PW2 Compacted wood board

Claims (3)

After drying the wooden board cut out to the board thickness in the range of 5 mm to 40 mm within the range of the moisture content of 10% to 30% and heating it within the range of 110 ° C. to 160 ° C. which is the first heating temperature, 0 .Pressure is applied only within the range of 10 minutes to 40 minutes, which is the first predetermined time, at a pressure within the range of 1 MPa to 10 MPa, and then the second heating temperature is 150 ° C. to 210 ° C. while maintaining the pressurized state . Heat to within the range, blow in steam at the second heating temperature, hold only within the range of 10 minutes to 120 minutes, which is the second predetermined time , cool to below 120 ° C, and then return to normal pressure A compacted wood board characterized by comprising: A cutting step of cutting wood into a wooden board having a thickness within a range of 10 mm to 40 mm;
A drying step of drying the wood board in a moisture content range of 10% to 30%;
A first heating step of heating the dried wood board within a range of 110 ° C. to 160 ° C. which is a first heating temperature;
Pressurizing the heated wooden board with a pressure within a range of 0.1 MPa to 10 MPa only within a range of 10 minutes to 40 minutes, which is a first predetermined time , and bringing the sealed wooden board into a sealed state;
A second heating step of heating to a range of 150 ° C. to 210 ° C., which is the second heating temperature , while maintaining the pressure sealed state of the wooden board;
A steam treatment step in which steam at the second heating temperature is blown into the wooden board and held only within a range of 10 minutes to 120 minutes which is a second predetermined time;
And a cooling step of releasing the pressure sealed state after cooling the wood board to below 120 ° C. A first heating step of heating the deformed wood board having a moisture content in the range of 10% to 30% within a range of 110 ° C. to 160 ° C. that is the first heating temperature;
Pressurizing the heated wooden board with a pressure within a range of 0.1 MPa to 10 MPa only within a range of 10 minutes to 40 minutes, which is a first predetermined time , and bringing the sealed wooden board into a sealed state;
A second heating step of heating to a range of 150 ° C. to 210 ° C., which is the second heating temperature , while maintaining the pressure sealed state of the wooden board;
A steam treatment step in which steam at the second heating temperature is blown into the wooden board and held only within a range of 10 minutes to 120 minutes which is a second predetermined time;
And a cooling step of releasing the pressurized sealed state after cooling the wooden board to less than 120 ° C.

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