JP5424188B2 - Grindability adjustment method of resinoid grinding wheel - Google Patents

Description

  The present invention relates to a method for adjusting the grindability (sharpness) of a resinoid grindstone that is generally commercially available.

  There is known a resinoid grindstone in which abrasive grains are bonded and held by a binder composed of a thermosetting resin such as a phenol resin.

  A user who has purchased a resinoid grindstone having a predetermined grindability from a grindstone manufacturer may want to adjust the grindability of the resinoid grindstone according to the content of the grinding when using the resinoid grindstone. There is also a demand to adjust the grindability of the resinoid grindstone in order to grind multiple types of workpieces with one grindstone.

  As a method for adjusting the grindability of the resinoid grindstone, there is a method of performing an optical treatment on the grinding surface of the grindstone in addition to the adjustment by firing.

  For example, Patent Document 1 discloses a method of adjusting the amount of protrusion of abrasive grains by removing the binder by irradiating a grinding surface of a grindstone with an ultraviolet laser.

Further, as disclosed in Patent Document 2, a method of applying an optical treatment to the grinding surface of the grindstone during grinding has been proposed in order to prevent clogging. According to the method described in Patent Document 2, ultraviolet rays are irradiated and a water-soluble grinding fluid is supplied to a grinding surface of a grindstone formed and fired from a mixture of abrasive grains, a binder and titanium dioxide powder. Is done. As a result, the binder is oxidized by the photocatalytic action of titanium dioxide, and the oxidized binder is gradually peeled off together with the abrasive grains. That is, according to the method, the grindstone is naturally dressed during grinding, and clogging of the grindstone is prevented.
Japanese Patent Laid-Open No. 9-285962 JP 2003-334762 A

However, the method described in Patent Document 1 adjusts the protruding amount of abrasive grains by sublimating and removing the binder on the grinding surface of the grinding wheel with a laser (irradiation energy is generally 1 MW · h / m ² or more). The effect only affects the surface of the grinding surface. Therefore, even if a predetermined grindability is obtained by the method, the grindability cannot be continued for a long time. In addition, since an apparatus for irradiating a laser is generally expensive, it has not been a method that can be easily used by a user.

  Further, according to the method described in Patent Document 2, a resinoid grindstone formed by molding and firing a mixture of abrasive grains, a binder, and titanium dioxide powder, that is, a special resinoid grindstone must be used. It was not a method that could be implemented easily with just the idea. In addition, depending on the material of the workpiece, the workpiece and titanium dioxide may react and adversely affect the grinding process.

  It is also conceivable to perform a firing process on the purchased resinoid grindstone on the user side. However, it is necessary to put a resinoid grindstone into a firing furnace for firing treatment. Therefore, when adjusting the grindability of the resinoid grindstone that has been mounted on the machine, the grindstone is once removed from the grinder, and once the firing process is complete, the grindstone is mounted again. There is a need. Further, when the resinoid grindstone is once fired in the firing furnace, the influence thereof affects the entire grindstone. Therefore, there is a problem in that when grinding a workpiece of a different kind after grinding a certain workpiece, it cannot be restored even if a situation where the grindability of the grindstone is to be restored occurs.

The present invention has been made in view of the above circumstances, and the object of the present invention is to adjust the grindability in the vicinity of the grinding surface of a commercially available resinoid grindstone while being mounted on a grinder. It is an object of the present invention to provide a method for adjusting grindability of a resinoid grindstone that makes it possible to grind a plurality of types of workpieces with one resinoid grindstone.

The present invention in order to solve the above problems, is within 10 minutes irradiation time, the irradiation energy is ^{1kW · h / m 2 ~100kW ·} h / m 2, and the resinoid ultraviolet wavelength is 100nm~400nm by irradiated against the grinding surface of the grinding wheel to cut the molecular chains of the binder in the grinding surface vicinity, along with reducing the abrasive grains coverage by the binder, the degree of coupling binder in the grinding surface near A method for adjusting the grindability of a resinoid grindstone, characterized by grasping the progress of the adjustment based on the wavelength of reflected light from the grinding surface of the ultraviolet rays while adjusting grindability by reducing the grindability. It is.

According to the grinding adjustment method resinoid grinding wheel according to the present invention, since the light of high energy irradiation energy becomes ^{1kW · h / m 2 ~100kW ·} h / m 2 is irradiated with the grinding surface of the resinoid grinding wheel The binder is altered and retracted, and the coverage of the abrasive grains by the binder in the vicinity of the grinding surface of the resinoid grindstone decreases. Thereby, the grindability in the vicinity of the grinding surface of the resinoid grindstone can be adjusted.

Further, according to the present invention, the light irradiation energy becomes ^{1kW · h / m 2 ~100kW ·} h / m 2 for which only irradiates the grinding surface of the resinoid grinding wheel, resinoid grinding wheel on a grinding machine It may remain attached.

  Further, according to the present invention, the grindability in the vicinity of the grinding surface of all commercially available resinoid grindstones can be selected by appropriately selecting the wavelength of irradiation light and irradiation energy (irradiation intensity, irradiation time) within a predetermined range. Can be adjusted.

  Further, according to the present invention, not only the grinding surface of the resinoid grindstone but also the grindability in the vicinity of the grinding surface (from the grinding surface to a predetermined depth) is adjusted, so that the grindability obtained by the adjustment is immediately lost. There is no. Further, according to the present invention, the depth at which the grindability is adjusted can be appropriately adjusted by adjusting the irradiation energy (irradiation, irradiation time) of the light to be irradiated within a predetermined range, and thus is obtained by adjustment. The sustainability of grindability can be adjusted as appropriate.

  Further, according to the present invention, it is possible to adjust not only the grindability of the entire resinoid grindstone but only the grindability in the vicinity of the grinding surface. This means that if the grindability-adjusted portion disappears due to wear or the like, the original grindability is restored. Therefore, according to the present invention, it is possible to grind a plurality of types of workpieces with one resinoid grindstone.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the grinding adjustment device 1 of resinoid grinding wheel according to the present embodiment, the wavelength is 100 nm to 400 nm, and ultraviolet irradiation energy is ^{1kW · h / m 2 ~100kW ·} h / m 2 An ultraviolet irradiation device 2 that can irradiate P is provided.

  Further, the grindability adjusting device 1 of the resinoid grindstone includes an optical element 4 disposed in front of the irradiation port 21 of the ultraviolet irradiation device 2. The optical element 4 converts the ultraviolet light P irradiated by the ultraviolet irradiation device 2 into parallel light.

  The grindability adjusting device 1 for the resinoid grindstone monitors the wavelength of the reflected light P1 from the grinding surface GP of the ultraviolet ray P irradiated by the ultraviolet ray irradiating device 2, and directs the reflected light P1 to the monitoring device 7. And a prism 71. The monitoring device 7 generates a reflected light signal S corresponding to the wavelength of the reflected light P1.

  The grindability adjusting device 1 of the resinoid grindstone further includes a control device 6 that drives and controls the ultraviolet irradiation device 2. The control device 6 adjusts the irradiation energy (irradiation intensity, irradiation time) and wavelength of the ultraviolet light P irradiated from the ultraviolet irradiation device 2 based on the operation of the operator. Further, the control device 6 receives the reflected light signal S from the monitoring device 7, and controls the irradiation of the ultraviolet light P by the ultraviolet light irradiation device 2 according to the value of the signal S (stops in this embodiment).

The grindability adjusting device 1 for a resinoid grindstone configured as described above is used as follows.
First, the grindability adjusting device 1 for a resinoid grindstone is disposed in the vicinity of the resinoid grindstone G to be adjusted, as shown in FIG. At this time, the ultraviolet irradiation device 2 is directed so that the irradiated ultraviolet P hits the grinding surface GP of the resinoid grindstone G. The prism 71 is arranged at a position where the reflected light P1 from the grinding surface GP of the ultraviolet P by the ultraviolet irradiation device 2 can be received. The resinoid grindstone G is attached to a grinding machine (not shown) and is rotatable.

Next, the irradiation energy (irradiation intensity, irradiation time) and wavelength of the irradiated ultraviolet ray P are set by the operator according to the application of the resinoid grindstone G and the type of binder. In this case, the light irradiation time is within 10 minutes, the irradiation energy is set within a range of a ^{1kW · h / m 2 ~100kW ·} h / m 2.

  Then, the ultraviolet irradiation device 2 irradiates the ground surface GP of the resinoid grindstone G rotated at a predetermined number of revolutions with the set irradiation energy (irradiation intensity, irradiation time) and wavelength P. In accordance with the value of the reflected light signal S from the monitoring device 7 received by the control device 6, the irradiation of the ultraviolet light P by the ultraviolet light irradiation device 2 is stopped.

  When the irradiation of the ultraviolet ray P is stopped, the ultraviolet ray irradiation device 2 is moved in the axial direction of the resinoid grindstone G so that the irradiated portions do not overlap. Similarly, the ultraviolet irradiation device 2 irradiates the ultraviolet light P, and finally irradiates the entire grinding surface GP with the ultraviolet light P.

According to resinoid grindstone grinding adjustment device 1, the ultraviolet irradiation device 2, ultraviolet P high energy within a and irradiation energy irradiation time is 10 minutes is ^{1kW · h / m 2 ~100kW ·} h / m 2 is The grinding surface GP of the resinoid grindstone G is irradiated. By the action of the ultraviolet light P, the molecular chain of the binder in the vicinity of the grinding surface GP of the resinoid grindstone G is cut. When the molecular chain of the binder is cut, as shown in FIG. 2, the binder B recedes to generate pores H in the binder B, and the coverage of the abrasive grains A by the binder B decreases. This decrease in coverage means that the protruding amount of the abrasive grains A exposed on the grinding surface GP is increased, and the binding agent is applied to the abrasive grains A buried inside the grinding surface GP. It means that the holding strength by B is lowered. Thereby, the grindability of the vicinity of the grinding surface GP of the resinoid grindstone G is adjusted.

  Further, according to the grindability adjusting device 1 of the resinoid grindstone, the ultraviolet light P is converted into parallel light by the optical element 4. Therefore, even when the distance (irradiation distance) between the grinding surface GP and the ultraviolet irradiation device 2 varies due to the rotational shake of the grindstone G, the ultraviolet light P can be evenly applied to the grinding surface GP. As a result, the grindability can be adjusted equally with respect to the grinding surface GP.

  In addition, as described above, the molecular weight of the binder B in the portion irradiated with the ultraviolet light P is cut and the molecular weight is lowered. Therefore, the wavelength of the light absorbed by the portion irradiated with the ultraviolet light P changes, and the wavelength of the reflected light from the ground surface GP of the ultraviolet light P changes. According to the grindability adjusting device 1 of the resinoid grindstone, since the wavelength of the reflected light is monitored by the monitoring device 7, the irradiation of the ultraviolet P is performed while grasping the progress of the action of the ultraviolet P based on the change in the wavelength. Can be stopped.

Further, according to the grinding adjustment device 1 of resinoid grinding wheel, the grinding surface of the ultraviolet P a resinoid grinding wheel G that time and the irradiation energy is within 10 minutes irradiation is ^{1kW · h / m 2 ~100kW ·} h / m 2 GP Therefore, the resinoid grindstone G may remain attached to the grinder.

  Further, the grindability adjusting device 1 for the resinoid grindstone can appropriately select the wavelength of the ultraviolet light P and the irradiation energy (irradiation intensity, irradiation time) by operating the control device 6. Thereby, grindability in the vicinity of the grinding surface of all resinoid grindstones that are generally marketed can be adjusted.

  Further, according to the grindability adjusting device 1 of the resinoid grindstone, not only the grinding surface GP of the resinoid grindstone G but also the grindability in the vicinity of the grinding surface GP (from the grinding surface to a predetermined depth) is adjusted. Grindability is not lost immediately. Moreover, since the depth at which the grindability is adjusted can be adjusted as appropriate by adjusting the irradiation energy (irradiation intensity, irradiation time) of the ultraviolet light P, the sustainability of the grindability obtained by the adjustment is adjusted accordingly. Can do.

  Further, according to the grindability adjusting device 1 of the resinoid grindstone, it is possible to adjust not only the grindability of the entire resinoid grindstone G but only the grindability near the grinding surface GP. This means that if the grindability-adjusted portion disappears due to wear or the like, the original grindability is restored. Therefore, it is possible to grind a plurality of types of workpieces with one resinoid grindstone.

[Example]
Hereinafter, the present invention will be described more specifically by describing examples with reference to the drawings.

  First, as shown in FIG. 3, an ultraviolet irradiation device 2 including an ultraviolet generation device 2 a and an optical fiber 2 b that guides the ultraviolet rays generated by the ultraviolet generation device 2 a is obliquely below the resinoid grindstone G attached to the grinding machine 10. Arranged. As the resinoid grinding wheel G, a commercially available “GC # 600J11B80W (205.0 × 19.0 × 50.80)” was used.

Next, the resinoid grindstone G is rotated at 3000 rpm, and the irradiation energy is 22.3 kW · h by irradiating the grinding surface GP of the rotating grindstone G with ultraviolet rays P for 1000 seconds (about 12.5 seconds per unit area). Irradiation with ultraviolet light P of / m ² was performed. At this time, the beam diameter of the ultraviolet ray P was 8 mm, and the distance between the irradiation port 21 of the optical fiber 2b and the grinding surface GP was 1 mm.

  Thereafter, the ultraviolet irradiation device 2 was moved so that the irradiated portions were not overlapped, and ultraviolet irradiation was performed in the same manner, so that the entire grinding surface GP was processed.

  Next, in order to confirm various characteristics of the resinoid grindstone G obtained by the above examples, tests 1 to 4 shown below were performed.

[Test 1]
First, the grinding surface GP of the resinoid grindstone G according to the example was investigated. An enlarged photograph of the ground surface GP before and after UV irradiation is shown in FIG. Moreover, the SEM photograph of the grinding surface GP before and after ultraviolet irradiation is shown in FIG. Moreover, the result of having analyzed the grinding surface GP before and behind ultraviolet irradiation with the laser microscope is shown in FIG.

When the grinding surface GP was observed while the ultraviolet light P was being irradiated, the grinding surface GP started to change color about 100 seconds after the start of irradiation. Moreover, it turns out that the protrusion amount of an abrasive grain has increased notably from FIGS. That is, by irradiating the grinding surface GP with the ultraviolet ray P having an irradiation time of 10 minutes or less and an irradiation energy of 22.3 kW · h / m ² , the binder of the grinding surface GP recedes and the coverage of the abrasive grains is reduced. It decreased, and it was confirmed that the protrusion amount of the abrasive grain exposed in the grinding surface GP increases.

[Test 2]
Next, the resinoid grindstone (untreated grindstone) that was not irradiated with the ultraviolet light P, the resinoid grindstone G (ultraviolet-treated grindstone) according to the example, and a baking treatment were held for 1 hour in a 200 ° C. muffle furnace. Three types of resinoid grindstones (fired grindstones) were attached to the main spindle of a surface grinder, and stainless steel plunge grinding was performed under the processing conditions shown in Table 1. The grindstone was not cross-feeded but only longitudinally fed (see FIG. 7), and a 1 μm cut was given at the turning point, and the same part of the workpiece was processed while repeating up-cut and down-cut (see FIG. 8). The relationship between the depth of cut and the back force obtained at this time is shown in FIG.

From FIG. 9, in the case of an untreated grindstone, as the number of passes increased, the grinding resistance rapidly increased and then decreased, and showed a constant value. On the other hand, in the case of the grindstone subjected to the ultraviolet treatment and the firing treatment, a constant grinding resistance was always shown. That is, it was confirmed that the grinding resistance characteristics were adjusted by irradiating the grinding surface GP with the ultraviolet light P having an irradiation time of 10 minutes or less and an irradiation energy of 22.3 kW · h / m ² .

[Test 3]
Next, as in [Test 2], three types of untreated grindstone, ultraviolet-treated grindstone, and fired grindstone were prepared and attached to the spindle of the surface grinder, under the processing conditions shown in Table 2. Plunge grinding was performed. The grindstone gave a 1 μm cut at the turning point, and processed a total of 1000 μm while repeating the up and down cuts on the same part of the workpiece. Here, the wear amount of the grindstone was calculated by ignoring errors such as the secondary amount and the thermal expansion of the workpiece and the grindstone, and subtracting the grinding amount of the workpiece from the grindstone movement amount (see FIG. 10). And the grinding ratio and surface roughness regarding each grindstone obtained at this time are shown in FIG.

FIG. 11 shows that the surface roughness increases in the order of the untreated grindstone, the ultraviolet-treated grindstone, and the fired grindstone. Further, from FIG. 11, the grinding ratio when SUS304 is used for the workpiece does not change much between the untreated grindstone and the ultraviolet-treated grindstone, but the grinding ratio when A1050 is used for the workpiece is compared with the untreated grindstone. It can be seen that the whetstone treated with ultraviolet rays is considerably lowered. That is, it is confirmed that the surface roughness and the grinding ratio of the workpiece are adjusted by irradiating the grinding surface GP with the ultraviolet ray P having an irradiation time within 10 minutes and an irradiation energy of 22.3 kW · h / m ^2. It was.

[Test 4]
Next, as in [Test 2], three types of untreated grindstone, ultraviolet-treated grindstone, and fired grindstone were prepared, and each grindstone grinding surface was gradually dressed and then ground using those grindstones. Went. FIG. 12 shows the relationship between the dress amount and the maximum grinding resistance value (back component force) when the maximum depth of cut becomes 15 μm. In addition, a grindstone having an irradiation time of ultraviolet rays of 500 seconds (irradiation energy: 11.2 kW · h / m ² ) and 200 seconds (irradiation energy: 4.5 kW · h / m ² ) is prepared, and these grindstones are used as they are (dressing). To grind). Similarly, the maximum grinding resistance value (back component force) when the maximum cutting depth is 15 μm is plotted in FIG.

From FIG. 12, it can be seen that when the dress amount is 200 μm, the state of the untreated grindstone is restored. Further, when estimated from FIG. 12, it is estimated that the influence depth is about 100 μm when the ultraviolet irradiation time is 500 seconds, and the influence depth is about 50 μm when the ultraviolet irradiation time is 200 seconds. That is, by irradiating the grinding surface GP with ultraviolet rays P having an irradiation energy of 22.3 kW · h / m ² , the grindability from the grinding surface GP to a predetermined depth is adjusted, and the grindability is adjusted. It was confirmed that the original grindability would be restored if it disappeared due to wear or the like. Furthermore, it was confirmed that the depth at which the grindability is adjusted can be appropriately changed by changing the irradiation energy of ultraviolet rays.

[Modification]
Although the embodiments of the present invention have been specifically described above, the present invention can be implemented with the following modifications.

  In the grindability adjusting apparatus 1 for a resinoid grindstone, an optical element 4 for converting the ultraviolet light P irradiated from the ultraviolet irradiation apparatus 2 into parallel light is provided. In carrying out the grindability adjusting method according to the present invention, an optical element is provided. 4 may be omitted. Further, the monitoring device 7 may be omitted when the grindability adjusting method according to the present invention is carried out.

In the examples, ultraviolet rays having an irradiation energy of 22.3 kW · h / m ² were used, but the present invention is not limited to this. For example, irradiation energy may be in the range of ^{1kW · h / m 2 ~100kW ·} h / m 2. When the irradiation energy is less than 1 kW · h / m ² , the irradiation intensity is too low to cause an effect of reducing the abrasive grain coverage. On the other hand, when the irradiation energy exceeds 100 kW · h / m ² , the irradiation energy is too strong and the binder is sublimated.

  Moreover, since it is difficult to raise irradiation energy if the wavelength of an ultraviolet-ray is too short, the range of 100 nm-400 nm is suitable.

  Moreover, the light to irradiate is not limited to ultraviolet rays, and may be infrared rays or visible rays. When the infrared rays are irradiated, the polymerization of the binder of the portion irradiated with the infrared rays is promoted, whereby the binder of the portion is retreated, thereby reducing the coverage of the abrasive grains, and the same effect as the ultraviolet ray irradiation is obtained. Arise.

[Test 5]
Here, in order to confirm that the polymerization of the binder can be promoted and the coverage of the abrasive grains can be reduced, a test result when a hot air spraying process considered to be equivalent to infrared irradiation is performed will be described.
The hot air spraying treatment is performed by grinding hot air of about 500 ° C. with a spot heater (HIBEC Co., Ltd., SHI-1CHT) and commercially available resinoid grinding wheel “GC # 600J11B80W (205.0 × 19.0 × 50.80)”. This was done by spraying on the surface. At this time, the hot air outlet of the spot heater was separated from the grinding surface of the grindstone by about 5 mm, and the grindstone was slowly rotated at 15 rpm, and hot air was sprayed for 40 minutes. Then, as in [Test 2], four types of untreated grindstone, ultraviolet-treated grindstone, fired grindstone and hot-air sprayed grindstone were attached to the spindle of the surface grinder. Plunge grinding of stainless steel was performed under the indicated processing conditions. Plunge grinding was performed in the same manner as in [Test 2]. The relationship between the depth of cut and the grinding resistance back component force obtained at this time is shown in FIG. 13, and the ratio between the grinding resistance main component and the back component force (hereinafter referred to as the component force ratio) is shown in FIG. .

As can be seen from FIG. 13, in the case of the grindstone subjected to the hot air spraying treatment, a constant grinding resistance was always exhibited as in the case of the grindstone subjected to the ultraviolet treatment and the firing treatment. In particular, the grinding resistance of the grindstone subjected to the hot air spraying process was lowered. That is, it was confirmed that the grinding resistance characteristic was adjusted by spot-heating the grinding surface GP.
Further, FIG. 14 shows that in the case of an untreated grindstone, the component force ratio is large, and the friction during processing is increased. On the other hand, the component ratio became a small value in the order of the grindstone subjected to the ultraviolet treatment, the grindstone subjected to the firing treatment, and the grindstone subjected to the hot air spraying treatment. This is because when the grinding surface GP is heated, the polymerization of the binder is promoted so that the binder is retracted and the abrasive coverage is reduced, and the degree of bonding of the binder is increased and the brittleness becomes hard and brittle. it is conceivable that.

  In the case of irradiation with ultraviolet rays, the molecular chain of the binder in the irradiated part is cut, so that the abrasive grain coverage is reduced and the degree of bonding is lowered. On the other hand, when the infrared ray is irradiated, as described above, the polymerization of the binder in the irradiated portion is promoted, so that the effect of decreasing the abrasive grain coverage and increasing the degree of bonding occurs. That is, both have the effect of reducing the abrasive grain coverage, while the irradiated portion becomes soft when irradiated with ultraviolet rays, and the irradiated portion becomes hard when irradiated with infrared rays. Therefore, when adjusting the grindability of a grindstone that grinds soft workpieces, UV is selected, and when adjusting the grindability of a grindstone that grinds hard workpieces, infrared is selected. Depending on the case, ultraviolet rays or infrared rays can be appropriately selected.

  Also, since ultraviolet irradiation is a hydrophilic treatment and infrared irradiation is a hydrophobic treatment, ultraviolet irradiation is more effective for grindstones that use hydrophobic abrasive grains, and hydrophilic abrasive grains are used. Infrared irradiation is more effective for grindstones. That is, ultraviolet rays or infrared rays can be appropriately selected depending on whether the abrasive grains used for the grindstone to be adjusted for grindability are hydrophobic or hydrophilic.

  When it is desired to select ultraviolet rays or infrared rays as appropriate, as shown in FIG. 15, the ultraviolet irradiation device 2 and the infrared irradiation device 3 are provided, and either one can be selected and used to form a grindability adjusting device 11 for a resinoid grindstone. Is preferred. In this case, the monitoring device for monitoring the wavelength of the reflected light R1 from the grinding surface GP of the infrared ray R and the optical element 4 that makes the infrared ray R emitted from the infrared ray irradiation device 3 parallel light. 7 and a prism 71 for directing the reflected light R1 to the monitoring device 7.

  In the examples, the resinoid grindstone “GC # 600J11B80W (205.0 × 19.0 × 50.80)” was used, but the present invention is not limited to this, and the grindability adjustment of all the resinoid grindstones is performed. Can be adjusted. In the embodiment, the grindability adjustment is performed on the entire grinding surface of the resinoid grindstone. However, the grindability adjustment can be partially performed on the grinding surface.

It is a figure which shows an example of the grindability adjustment apparatus of the resinoid grindstone concerning this invention. It is a figure for demonstrating the effect | action by the grindability adjusting apparatus of FIG. It is a figure which shows the grindability adjustment apparatus in an Example. It is an enlarged photograph of the grindstone grinding surface before and after ultraviolet irradiation. It is a SEM photograph of the grindstone grinding surface before and after ultraviolet irradiation. It is a figure which shows the result of having analyzed the grindstone grinding surface before and behind ultraviolet irradiation with the laser microscope. It is a figure for demonstrating the grinding content in the test 2. FIG. It is a figure for demonstrating the grinding content in the test 2. FIG. It is a figure which shows the relationship between the incision amount obtained in Test 2, and back component force. It is a figure for demonstrating the abrasion amount measuring method in the test 3. FIG. It is a figure which shows the grinding ratio and surface roughness obtained in Test 3. It is a figure which shows the relationship between the dressing amount obtained in Test 4, and the maximum grinding resistance value when the maximum cutting amount becomes 15 μm. It is a figure which shows the relationship between the cutting depth obtained in Test 5, and grinding resistance back component force. FIG. 6 is a diagram showing component force ratios obtained in Test 5. It is a figure which shows the grindability adjustment apparatus of the resinoid grindstone concerning a modification.

Explanation of symbols

G Resinoid grinding wheel GP Grinding surface P Ultraviolet light P1 Reflected light of ultraviolet light 1 Grindability adjusting device 2 of resinoid grinding stone 2 Ultraviolet irradiation device 21 Irradiation port 4 Optical element 6 Control device 7 Monitoring device 71 Prism

Claims (1)

Is within 10 minutes irradiation time, the irradiation energy is ^{1kW · h / m 2 ~100kW ·} h / m 2, and the by irradiating ultraviolet rays having a wavelength of 100nm~400nm against the grinding surface of the resinoid grinding wheel By cutting the molecular chain of the binder in the vicinity of the grinding surface to reduce the coverage of the abrasive grains by the binder, while adjusting the grindability by reducing the binding degree of the binder in the vicinity of the grinding surface , A method for adjusting grindability of a resinoid grindstone, characterized by grasping a progress of the adjustment based on a wavelength of reflected light from the grinding surface of the ultraviolet rays .