JP5417725B2 - Pattern coating apparatus and pattern coating method using the same - Google Patents

Pattern coating apparatus and pattern coating method using the same Download PDF

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JP5417725B2
JP5417725B2 JP2008079897A JP2008079897A JP5417725B2 JP 5417725 B2 JP5417725 B2 JP 5417725B2 JP 2008079897 A JP2008079897 A JP 2008079897A JP 2008079897 A JP2008079897 A JP 2008079897A JP 5417725 B2 JP5417725 B2 JP 5417725B2
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coating
coating liquid
slit die
linear actuator
base material
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JP2009233506A (en
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尚樹 大野
秀樹 森
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Toppan Inc
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Description

本発明は、連続送りにて搬送される紙、プラスチックフィルム、布、金属箔及び、これらの積層体からなるウェブシ−ト(以下基材と称する)の表面に、塗布液をスリットダイを用いて間欠的に塗布するパターン塗布装置およびパターン塗布方法に関する。更に詳しくは、液晶表示ディスプレイや光学フィルター製造用のプラスチックシートなどの基材の表面に、ダイ・コーティング法によって、各種の塗布液を塗布して導電膜、絶縁膜、フォトレジスト膜等の機能性膜を形成するために用いられるパターン塗布装置およびパターン塗布方法に関する。   The present invention uses a slit die to apply a coating solution on the surface of a sheet of paper, plastic film, cloth, metal foil, and a web sheet (hereinafter referred to as a base material) comprising these laminates conveyed by continuous feeding. The present invention relates to a pattern coating apparatus and a pattern coating method for intermittent application. More specifically, various coating liquids are applied to the surface of a substrate such as a liquid crystal display or a plastic sheet for manufacturing an optical filter by a die coating method, and the functionalities such as a conductive film, an insulating film, and a photoresist film are applied. The present invention relates to a pattern coating apparatus and a pattern coating method used for forming a film.

従来、基材へスリットダイを用いて塗布液を所定の間隔でパターン塗布する技術がある。例えば、特許文献1では、バックアップロールの周面とスリットダイとの間に一定のギャップを設けて、その間に基材を走行させながら、定量ポンプを回転・停止してスリットダイから塗布液を間欠的に吐出させて、基材にパターン塗布する塗布装置が開示されている。   2. Description of the Related Art Conventionally, there is a technique for applying a coating solution to a substrate at a predetermined interval using a slit die. For example, in Patent Document 1, a constant gap is provided between the peripheral surface of the backup roll and the slit die, and the metering pump is rotated and stopped while the substrate is running between them, and the coating liquid is intermittently supplied from the slit die. A coating apparatus is disclosed in which a pattern is applied to a substrate by ejecting the substrate.

また、特許文献2では、間欠塗布の場合の塗布区間の始端及び終端を直線的にし、塗布始端部の厚塗りを防止するために、塗布停止時にはスリットダイの塗布液供給口への塗料の流れを遮断して塗布液供給口以外に導くと同時に、塗布液供給口内部及びスリット出口部の塗料を塗布液供給口内部に設けた所定の場所に吸引する、いわゆるサックバック機構を用いた間欠塗布装置が開示されている。しかしながら、塗布終端部でサックバックを行っても、基材と塗布液との密着力により、不要な塗布液を充分に取りきれず、その結果、塗布終端部において厚みムラを生じる問題が残った。   Further, in Patent Document 2, in order to make the start and end of the application section in the case of intermittent application straight and prevent thick application at the start of application, the flow of paint to the application liquid supply port of the slit die when application is stopped Intermittent application using a so-called suck-back mechanism that shuts off the liquid and guides it to other than the coating liquid supply port, and at the same time sucks the paint inside the coating liquid supply port and the slit outlet to a predetermined place provided inside the coating liquid supply port An apparatus is disclosed. However, even if the sucking back is performed at the coating terminal portion, the unnecessary coating liquid cannot be sufficiently removed due to the adhesive force between the base material and the coating liquid, and as a result, there remains a problem of causing uneven thickness at the coating terminal portion. .

そこで、特許文献3には、基材はウェブシートではないが、枚葉基板の表面のほぼ全範囲に均一な塗布膜を形成する技術として、塗布開始部では基板表面とスリットダイの先端との間隔を定常間隔より狭い間隔として、このスリットと塗布開始部との間に初期ビードを形成し、直ちに、ダイのスリットから塗布液を吐出しながらダイを若干上昇させて定常ビードへと移行させ、ついで、スリットへの塗布液供給速度とダイの走行速度とを同期させて定常ビードを保持したままダイを基板表面に沿って走行させ、続いて、基板の塗布終端部で、基板表面とダイのスリットの先端との間隔を定常間隔ないしそれ以下の間隔に調節しながら、定常ビードのサックバックを行う、枚葉基板の製造方法が開示されている。
特許第2997637号公報 特許第2842347号公報 特開2002−153795号公報
Therefore, in Patent Document 3, although the base material is not a web sheet, as a technique for forming a uniform coating film on almost the entire surface of the single-wafer substrate, the coating start portion includes a substrate surface and a slit die tip. With an interval narrower than the regular interval, an initial bead is formed between this slit and the coating start portion, and immediately, the die is slightly raised while discharging the coating solution from the slit of the die to shift to a regular bead, Next, the die is run along the substrate surface while maintaining the steady bead by synchronizing the coating liquid supply speed to the slit and the running speed of the die, and then the substrate surface and the die A method for manufacturing a single-wafer substrate is disclosed, in which a steady bead is sucked back while adjusting the distance from the tip of the slit to a regular interval or less.
Japanese Patent No. 2997637 Japanese Patent No. 2842347 Japanese Patent Application Laid-Open No. 2002-153795

しかしながら、従来のサックバック方式を用いる塗布方法において、ウェブ状で搬送される基材に対して、はやい速度での生産が可能で、かつ、各種の塗布材料を均一に精度良く基材に塗布できる装置はなかった。そこで、本発明は上記従来の問題点に鑑み、塗布終端部及び塗布始端部の塗布量を制御することで、厚みムラが改善可能な、ウェブ基材のパターン塗布装置およびパターン塗布方法を提供することを目的とする。 However, in the coating method using the conventional suck-back method, it is possible to produce at a high speed with respect to the substrate conveyed in a web shape, and various coating materials can be uniformly and accurately applied to the substrate. There was no equipment. Therefore, in view of the above-described conventional problems, the present invention provides a web substrate pattern coating apparatus and a pattern coating method capable of improving thickness unevenness by controlling the coating amount at the coating end portion and the coating start end portion. For the purpose.

本発明の請求項1に係る発明は、少なくとも、基材を所定の速度で搬送するバックアップロールと案内用ロールとからなる搬送機構と、前記バックアップロールの周面に保持された前記基材上に塗布液を塗布するスリットダイと、前記スリットダイのノズルに前記塗布液を間欠的に供給する塗布液供給機構と、前記塗布液供給機構に接続する前記塗布液を循環する循環配管と前記塗布液を排出する排出配管と前記塗布液を吸引するサックバック機構とを有するパターン塗布装置において、前記スリットダイは、塗布液の塗出方向を固定保持することが可能となるように回転軸に連結した容体に枢支され、前進・後退動作をさせるリニアアクチュエータを有し、かつ、前記スリットダイは前記回転軸に連結固定された棒状部材を介したシリンダで前記リニアアクチュエータに押し付けられた状態で配置され、前記リニアアクチュエータの前進・後退動作により前記回転軸を中心とした円弧運動で、前記スリットダイの吐出口が前記バックアップロールの周面に接近・離間することで、前記スリットダイと前記バックアップロールの間隔が調整されることを特徴とするパターン塗布装置である。 The invention according to claim 1 of the present invention includes at least a transport mechanism composed of a backup roll and a guide roll for transporting the base material at a predetermined speed, and the base material held on the peripheral surface of the backup roll. A slit die for applying the coating liquid, a coating liquid supply mechanism for intermittently supplying the coating liquid to the nozzle of the slit die, a circulation pipe for circulating the coating liquid connected to the coating liquid supply mechanism, and the coating liquid In the pattern coating apparatus having a discharge pipe for discharging the liquid and a suck back mechanism for sucking the coating liquid, the slit die is connected to a rotating shaft so as to be able to fix and hold the coating direction of the coating liquid . A cylinder having a linear actuator that is pivotally supported by the container and moves forward and backward, and the slit die is connected to and fixed to the rotating shaft via a rod-shaped member It is arranged in a state of being pressed against the linear actuator, and the discharge port of the slit die approaches and separates from the peripheral surface of the backup roll by an arc motion around the rotation axis by the forward / backward movement of the linear actuator. Thus, the distance between the slit die and the backup roll is adjusted.

次に、本発明の請求項2に係る発明は、請求項1に記載するパターン塗布装置を用いて、以下の動作を繰り返し制御することを特徴とするパターン塗布方法であって、(1)まず、塗布始端部においてリニアアクチュエータを作動させてスリットダイを基材に接近させて塗布液を吐出し、前記基材への塗布量を連続塗布時の塗布量に調整する動作、(2)ついで、前記リニアアクチュエータを作動させて前記スリットダイと前記基材との間隔を拡げ、その間隔及び塗布液の吐出量を保持して、塗布量を連続塗布時の塗布量に調整する動作、(3)続いて、塗布終端部において、前記リニアアクチュエータを作動させて、前記スリットダイを前記基材に定常間隔より近づけてサックバックを行う動作、(4)さらに、前記リニアアクチュエータを作動させて、前記スリットダイと前記基材との間隔を定常間隔より拡げることより、塗布液を切る動作である。   Next, an invention according to claim 2 of the present invention is a pattern coating method characterized by repeatedly controlling the following operations using the pattern coating apparatus according to claim 1, wherein (1) The operation of adjusting the coating amount on the base material to the coating amount at the time of continuous application by operating the linear actuator at the coating start end to discharge the coating liquid by bringing the slit die close to the base material, (2) (3) an operation of adjusting the coating amount to a coating amount at the time of continuous coating by operating the linear actuator to widen the gap between the slit die and the base material, and maintaining the spacing and the discharge amount of the coating liquid; Subsequently, in the application terminal portion, the linear actuator is operated to perform a suck back by bringing the slit die closer to the base material than a regular interval. (4) Further, the linear actuator Is operated, than to spread than the steady interval distance between the slit die and the substrate, is an operation to cut the coating liquid.

本発明のパターン塗布装置によれば、リニアアクチュエータの動作がスリットダイの円弧運動に変換され、スリットダイ吐出口とバックアップロールの間隔の変化が増幅される形になるため、応答性が速くなり、高速で搬送されるウェブ状基材に対しても塗布始端部及び塗布終端部の塗布量制御が容易となる。また、回転軸に連結固定された棒状部材を介したシリンダでスリットダイがリニアアクチュエータに押し付けられた状態で保持されるため、パターン塗布部の厚みムラが生じるのを防止することが可能となる。   According to the pattern coating apparatus of the present invention, the operation of the linear actuator is converted into the arc motion of the slit die, and the change in the interval between the slit die discharge port and the backup roll is amplified. The application amount control of the application start end portion and the application end portion can be easily performed even on the web-like substrate conveyed at high speed. Further, since the slit die is held in a state of being pressed against the linear actuator by a cylinder via a rod-like member connected and fixed to the rotating shaft, it is possible to prevent the thickness unevenness of the pattern application portion from occurring.

更に、本発明のパターン塗布方法によれば、スリットダイとバックアップロールの間隔を素早く変更して塗布液の吐出およびサックバックができるため、粘度が低いものから高いものや、カーボン等を多量に含有した流動性の低い塗布液であっても、厚みムラが少なく、かつ、終端での切れが良いため、安定したパターン塗布性が得られる。   Furthermore, according to the pattern coating method of the present invention, the gap between the slit die and the backup roll can be quickly changed to discharge and suck back the coating liquid. Even a coating solution with low fluidity has little thickness unevenness and good cutting at the end, so that a stable pattern coating property can be obtained.

以下本発明のパターン塗布装置およびそれを用いたパターン塗布方法を、一実施形態に基づいて、図面を参照しながら説明する。図1は、本発明のパターン塗布装置のスリットダイ近傍の構成の概略図である。また、図2(a),(b),(c)は、本発明のパターン塗布方法の一実施形態での一連の動作の説明図であり、図3(a),(b),(c),(d)は、図2に引き続く動作の説明図である。
本発明のパターン塗布装置は、例えば図1に示すように、基材1が図示しない巻き出し部から巻き出され、案内用ロールからバックアップロール2に搬送されて、スリットダイから塗布液10を間欠的に吐出することで、基材上に塗布液10を間欠的に塗布する装置として用いることが出来る。ここで、スリットダイは、回転軸6に連結した容体7に枢支され、前進・後退動作をさせるリニアアクチュエータを有し、かつ、回転軸6に連結固定された棒状部材を介したシリンダ9でリニアアクチュエータに常に押し付けられた状態で配置され、リニアアクチュエータの前進・後退動作(図1では上下動となる)により回転軸6を中心とした仮想の線60で示す円弧運動で、スリットダイの吐出口がバックアップロール2の周面に接近・離間することで、スリットダイとバックアップロール2の間隔が調整され、基材1とスリットダイの先端部との間隔を変化させることが出来る。なお、ここでリニアアクチュエータに関しては、自己保持力が十分あり分解能が1μm以下のリニアアクチュエータを使用することが高い精度を保持するために好ましい。
Hereinafter, a pattern coating apparatus and a pattern coating method using the same according to the present invention will be described based on an embodiment with reference to the drawings. FIG. 1 is a schematic diagram of a configuration in the vicinity of a slit die of a pattern coating apparatus of the present invention. 2 (a), 2 (b), and 2 (c) are explanatory diagrams of a series of operations in one embodiment of the pattern coating method of the present invention, and FIGS. ), (D) are explanatory diagrams of the operation following FIG.
In the pattern coating apparatus of the present invention, for example, as shown in FIG. 1, the substrate 1 is unwound from an unillustrated unillustrated portion, conveyed from the guide roll 8 to the backup roll 2, and applied from the slit die 3 to the coating liquid 10. Can be used as a device for intermittently applying the coating liquid 10 onto the substrate. Here, the slit die 3 is pivotally supported by a container 7 connected to the rotary shaft 6, has a linear actuator 4 that moves forward and backward, and is connected via a rod-like member 5 that is connected and fixed to the rotary shaft 6. are arranged at all times pressed against the state in the linear actuator 4 in the cylinder 9, the forward-backward movement of the linear actuator 4 (a vertical movement in FIG. 1) by an arc movement indicated by the line 60 of the virtual about the rotation axis 6 The distance between the slit die 3 and the backup roll 2 is adjusted as the discharge port of the slit die 3 approaches and separates from the peripheral surface of the backup roll 2, and the distance between the substrate 1 and the tip of the slit die 3 is changed. It can be made. As for the linear actuator, it is preferable to use a linear actuator having sufficient self-holding force and resolution of 1 μm or less in order to maintain high accuracy.

また、図示しないが、スリットダイのノズルには、塗布液を間欠的に供給する塗布液供給機構と、塗布液供給機構に接続する塗布液を循環する循環配管と、塗布液を排出する排出配管とが接続されている。塗布停止時には塗布液供給口への塗布液の流れを遮断し、循環配管に導くと同時に、塗布液供給口内部及びスリットダイ吐出口部の塗布液を、サックバック機構により所定の場所に吸引する。なお、サックバック機構は、塗布終端部での余剰塗布液を吸引し、パターンの切れを良くし、塗布液の引きずりやカスレを防止するもので、この機能を果たすものであれば構造は問わない。塗布実施時には塗布液供給口への塗布液の流れを開放するとともに、所定の場所に吸引された塗布液を塗布液供給口内部に戻す。   Although not shown, the slit die nozzle has a coating liquid supply mechanism for intermittently supplying the coating liquid, a circulation pipe for circulating the coating liquid connected to the coating liquid supply mechanism, and a discharge pipe for discharging the coating liquid. And are connected. When the application is stopped, the flow of the application liquid to the application liquid supply port is shut off and guided to the circulation pipe. At the same time, the application liquid in the application liquid supply port and the slit die discharge port is sucked into a predetermined place by the suck back mechanism. . The suck back mechanism sucks the excess coating liquid at the coating end portion, improves the pattern cut and prevents the coating liquid from being dragged or dulled, and any structure can be used as long as it fulfills this function. . At the time of application, the flow of the application liquid to the application liquid supply port is released, and the application liquid sucked into a predetermined place is returned to the inside of the application liquid supply port.

ここで、塗布液供給機構は、所定の塗布液タンクから、所定量の塗布液をスリットダイのノズルへと間欠的に供給するもので、例えば、ギヤポンプ、ダイヤフラムポンプ、シリンジポンプなどの容積式ポンプを用い、塗布液タンクから配管を介して、塗布液をスリットダイのノズルへと供給する。通常、三方切り替え弁等を介して接続する塗布液を循環する循環配管と、塗布液を排出する排出配管とに塗布液の流れをコントロールして所定の間欠的な塗布液の供給を制御する。   Here, the coating liquid supply mechanism intermittently supplies a predetermined amount of coating liquid from a predetermined coating liquid tank to the nozzle of the slit die. For example, a positive displacement pump such as a gear pump, a diaphragm pump, or a syringe pump The coating solution is supplied from the coating solution tank to the slit die nozzle through a pipe. Usually, the supply of a predetermined intermittent application liquid is controlled by controlling the flow of the application liquid to a circulation pipe that circulates the application liquid connected through a three-way switching valve or the like and a discharge pipe that discharges the application liquid.

次に、本発明のパターン塗布方法の動作を説明する。塗布開始時すなわち塗布始端部では、塗布液の表面張力により基材に塗布される塗布液の量は多くなる。本発明のパターン塗布方法では図2に示すように、塗布開始時は、基材-スリットダイのギャップを狭くし、塗布量を連続塗布時の塗布量と等しくすることを特徴とする。図2(a)に示すように、塗布開始時において、吐出口を基材に接近させておく。そして図2(b)に示すように、塗布液をスリットダイから吐出する。そして、基材が濡れることにより、塗布液の表面張力の影響が減少する。従って、塗布量を一定に保つためには、基材が塗れた直後に基材とスリットダイの間隔を拡げる必要がある。そこで、図2(c)に示すように、リニアアクチュエータを駆動し、スリットダイを円弧運動で図2では斜め上方に後退させ、基材とスリットダイの間隔を拡げる。   Next, the operation of the pattern coating method of the present invention will be described. At the start of application, that is, at the start of application, the amount of the application liquid applied to the substrate increases due to the surface tension of the application liquid. As shown in FIG. 2, the pattern coating method of the present invention is characterized in that, at the start of coating, the gap between the substrate and the slit die is narrowed and the coating amount is made equal to the coating amount during continuous coating. As shown in FIG. 2A, the discharge port is kept close to the substrate at the start of application. And as shown in FIG.2 (b), a coating liquid is discharged from a slit die. And when a base material gets wet, the influence of the surface tension of a coating liquid reduces. Therefore, in order to keep the coating amount constant, it is necessary to increase the distance between the base material and the slit die immediately after the base material is applied. Therefore, as shown in FIG. 2 (c), the linear actuator is driven, and the slit die is retracted obliquely upward in FIG. 2 by an arc motion to widen the distance between the base material and the slit die.

塗布中は、リニアアクチュエータは駆動せず、回転軸に連結固定された棒状部材を介したシリンダでスリットダイがリニアアクチュエータに押し付けられた状態で保持して、基材と吐出口の間隔を図2(c)で示した間隔のままに、塗布液の吐出量を保持する。このことで、パターン塗布部の厚みムラが生じるのを防止することが可能となる。   During application, the linear actuator is not driven, and the slit die is held in a state of being pressed against the linear actuator by a cylinder via a rod-like member connected and fixed to the rotating shaft, and the interval between the base material and the discharge port is shown in FIG. The discharge amount of the coating liquid is maintained with the interval shown in (c). This makes it possible to prevent the thickness unevenness of the pattern application part from occurring.

塗布終端では、基材と吐出口の間隔内に形成された塗布液の液溜りを除去するために、サックバック機構により塗布液を吸引する。本発明のパターン塗布方法では、塗布終端では、基材と吐出口の間隔を狭くすることで、サックバック機構による塗布液の吸引量を増し、さらにその後は、塗布液を切るために、基材と吐出口の間隔を拡げる。図3(a)は、塗布中の図である。塗布終端では、図3(b)に示すように、リニアアクチュエータを駆動し、基材と吐出口の間隔を狭くする。この動作と同時に、サックバック機構により塗布液を吸引する。次に図3(c)に示すように、リニアアクチュエータを駆動して、基材と吐出口の間隔を拡げる。これにより、塗布液を切ることができる。そして、図3(d)に示すように、次の塗布のために、リニアアクチュエータを駆動して、基材と吐出口の間隔を狭くする。   At the end of coating, the coating liquid is sucked by a suck back mechanism in order to remove a liquid pool of the coating liquid formed in the interval between the base material and the discharge port. In the pattern coating method of the present invention, at the end of coating, by narrowing the distance between the base material and the discharge port, the suction amount of the coating liquid by the suck back mechanism is increased. And widen the gap between the discharge ports. Fig.3 (a) is a figure in process of application | coating. At the coating end, as shown in FIG. 3B, the linear actuator is driven to narrow the distance between the base material and the discharge port. Simultaneously with this operation, the coating liquid is sucked by the suck back mechanism. Next, as shown in FIG.3 (c), a linear actuator is driven and the space | interval of a base material and a discharge outlet is expanded. Thereby, a coating liquid can be cut. And as shown in FIG.3 (d), a linear actuator is driven for the next application | coating and the space | interval of a base material and a discharge outlet is narrowed.

以上詳細に述べたように、本発明のパターン塗布装置を用いることで、塗布始端部の塗布量および塗布終端部の塗布量を制御することができる。例えば、カーボン粉末を多量に混合した電池等の極板用塗布液を塗布する際、塗布始端部での基材と吐出口の間隔を意図的に狭くすることで塗布形状を制御し、かつ、塗布始端部の凸部(盛り上がり)を無くすことができる。また、塗布終端部での基材と吐出口の間隔を意図的に狭くすることでサックバック機構での吸引量を制御し、塗布終端部の凸部(盛り上がり)を無くすことができる。すなわち、本発明のパターン塗布装置およびパターン塗布方法を用いることで、スリットダイによる塗布において従来よりも均一に塗布することが可能であり、液晶表示ディスプレイや光学フィルター、あるいは燃料電池製造用のプラスチックシートなどの基材の表面に、ダイ・コーティング法によって、各種の塗布液を塗布して導電膜、絶縁膜、フォトレジスト膜等の機能性膜を形成するために用いられるパターン塗布において、非常に有用である。   As described in detail above, by using the pattern coating apparatus of the present invention, the coating amount at the coating start end portion and the coating amount at the coating end portion can be controlled. For example, when applying a coating solution for an electrode plate such as a battery in which a large amount of carbon powder is mixed, the coating shape is controlled by intentionally reducing the distance between the base material and the discharge port at the coating start end, and The convex part (swelling) at the coating start end can be eliminated. In addition, the suction amount in the suck back mechanism can be controlled by intentionally reducing the distance between the base material and the discharge port at the application terminal part, and the convex part (swell) at the application terminal part can be eliminated. In other words, by using the pattern coating apparatus and the pattern coating method of the present invention, it is possible to apply more uniformly than in the past by using a slit die, and a liquid crystal display, an optical filter, or a plastic sheet for manufacturing a fuel cell. Very useful in pattern coating used to form functional films such as conductive films, insulating films, and photoresist films by applying various coating solutions to the surface of a substrate such as a die coating method. It is.

本発明のパターン塗布装置のスリットダイ近傍の構成の概略図。The schematic of the structure of the slit die vicinity of the pattern coating device of this invention. 本発明のパターン塗布方法の一実施形態での一連の動作の説明図。Explanatory drawing of a series of operation | movement in one Embodiment of the pattern application | coating method of this invention. 本発明のパターン塗布方法の一実施形態での引き続く一連の動作の説明図。Explanatory drawing of a series of subsequent operation | movement in one Embodiment of the pattern application | coating method of this invention.

1・・・基材 2・・・バックアップロール 3・・・スリットダイ
4・・・リニアアクチュエータ 5・・・棒状部材 6・・・回転軸
7・・・容体 8・・・案内用ロール 9・・・シリンダ
10・・・塗布液 60・・・仮想の線(円弧運動)
DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Backup roll 3 ... Slit die 4 ... Linear actuator 5 ... Bar-shaped member 6 ... Rotating shaft 7 ... Container 8 ... Guide roll 9. ··Cylinder
10 ... coating liquid 60 ... virtual line (arc motion)

Claims (2)

少なくとも、基材を所定の速度で搬送するバックアップロールと案内用ロールとからなる搬送機構と、前記バックアップロールの周面に保持された前記基材上に塗布液を塗布するスリットダイと、前記スリットダイのノズルに前記塗布液を間欠的に供給する塗布液供給機構と、前記塗布液供給機構に接続する前記塗布液を循環する循環配管と前記塗布液を排出する排出配管と前記塗布液を吸引するサックバック機構とを有するパターン塗布装置において、
前記スリットダイは、塗布液の塗出方向を固定保持することが可能となるように回転軸に連結した容体に枢支され、前進・後退動作をさせるリニアアクチュエータを有し、かつ、前記スリットダイは前記回転軸に連結固定された棒状部材を介したシリンダで前記リニアアクチュエータに押し付けられた状態で配置され、前記リニアアクチュエータの前進・後退動作により前記回転軸を中心とした円弧運動で、前記スリットダイの吐出口が前記バックアップロールの周面に接近・離間することで、前記スリットダイと前記バックアップロールの間隔が調整されることを特徴とするパターン塗布装置。
At least a transport mechanism comprising a backup roll and a guide roll for transporting the base material at a predetermined speed, a slit die for applying a coating liquid onto the base material held on the peripheral surface of the backup roll, and the slit A coating liquid supply mechanism that intermittently supplies the coating liquid to the nozzle of the die, a circulation pipe that circulates the coating liquid connected to the coating liquid supply mechanism, a discharge pipe that discharges the coating liquid, and a suction of the coating liquid In a pattern coating apparatus having a suck back mechanism
The slit die has a linear actuator pivotally supported by a container connected to a rotating shaft so as to be able to fix and hold the coating direction of the coating liquid , and to move forward and backward, and the slit die Is arranged in a state where it is pressed against the linear actuator by a cylinder via a rod-like member connected and fixed to the rotating shaft, and the slit is an arc motion around the rotating shaft by the forward / backward movement of the linear actuator. The pattern coating apparatus is characterized in that the interval between the slit die and the backup roll is adjusted by the die outlet opening approaching and separating from the peripheral surface of the backup roll.
請求項1に記載するパターン塗布装置を用いて、以下の動作を繰り返し制御することを特徴とするパターン塗布方法。
(1)塗布始端部においてリニアアクチュエータを作動させてスリットダイを基材に接近
させて塗布液を吐出し、前記基材への塗布量を連続塗布時の塗布量に調整する動作

(2)ついで、前記リニアアクチュエータを作動させて前記スリットダイと前記基材との
間隔を拡げ、その間隔及び塗布液の吐出量を保持して、塗布量を連続塗布時の塗布
量に調整する動作、
(3)続いて、塗布終端部において、前記リニアアクチュエータを作動させて、前記スリ
ットダイを前記基材に定常間隔より近づけてサックバックを行う動作、
(4)さらに、前記リニアアクチュエータを作動させて、前記スリットダイと前記基材と
の間隔を定常間隔より拡げることより、塗布液を切る動作。

A pattern coating method using the pattern coating apparatus according to claim 1 to repeatedly control the following operations.
(1) The linear actuator is operated at the coating start end to bring the slit die close to the substrate to discharge the coating solution, and the coating amount applied to the substrate is adjusted to the coating amount during continuous coating.
(2) Next, the linear actuator is actuated to widen the gap between the slit die and the base material, and the gap and the discharge amount of the coating liquid are maintained, and the coating amount is adjusted to the coating amount at the time of continuous coating. Operation,
(3) Subsequently, at the coating end portion, the linear actuator is operated to perform a suck back by bringing the slit die closer to the base material than the normal interval.
(4) Furthermore, the operation | movement which cuts a coating liquid by operating the said linear actuator and expanding the space | interval of the said slit die and the said base material from a regular space | interval.

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