JP5407490B2 - Window glass for solid-state image sensor package - Google Patents

Description

  The present invention relates to a window glass for a solid-state imaging device package.

  A solid-state imaging device such as a CCD or CMOS used for a digital still camera or the like has a spectral sensitivity ranging from a visible light region to a near infrared region near 1100 nm. Therefore, since excellent color reproducibility cannot be obtained as it is, the visibility is corrected using a near-infrared cut filter glass to which a specific substance that absorbs infrared rays is added. As this near-infrared cut filter glass, optical glass in which CuO is added to fluorophosphate glass or phosphate glass that selectively absorbs wavelengths in the near-infrared region has been developed and used.

  In recent years, video cameras and digital still cameras using solid-state image sensors have been reduced in size and cost, and near-infrared cut filter glass is used as a protective cover glass for solid-state image sensors in order to reduce the number of components. (Patent Document 1).

  On the other hand, the window glass for a solid-state image sensor package is hermetically sealed with an adhesive to a package made of ceramics or resin in which the solid-state image sensor is housed, but an ultraviolet curable adhesive for the purpose of shortening the curing time of the adhesive Are beginning to be used.

Japanese Patent Laid-Open No. 7-281021

  The near-infrared cut filter glass contains CuO in the glass for the purpose of absorbing near-infrared rays, but by incorporating CuO in the glass, not only near-infrared rays but also ultraviolet rays are absorbed.

  There are various types of ultraviolet curable adhesives, and as an example, they are cured by ultraviolet rays having a wavelength of 250 nm to 350 nm. However, when UV curable adhesive is used to bond the window glass for solid-state image sensor package made of near-infrared cut filter glass and the package, most of the irradiated UV light is absorbed by the glass, and the adhesive is hard to cure. A new problem has been identified that takes time.

  An object of the present invention is to provide a window glass for a solid-state image pickup device package that can quickly cure an ultraviolet curable adhesive even when used for a window glass for a solid-state image pickup device package having a near-infrared cut function.

A solid-state imaging element package window glass according to the present invention comprises a fluorophosphate salt-based glass or phosphate glass containing CuO, thickness of the peripheral portion rather thin compared to the thickness of the optical effective surface, wherein The peripheral portion is characterized in that the plate thickness gradually decreases from the optically effective surface side toward the end surface, and the ultraviolet transmittance gradually increases as the plate thickness of the peripheral portion gradually decreases .

  Even if the window glass for a solid-state image sensor package of the present invention is a window glass for a solid-state image sensor package having a near-infrared cut function, it can be quickly attached to the package using an ultraviolet curable adhesive. Thus, it is possible to efficiently assemble the solid-state image sensor device.

It is a perspective view of one embodiment of a window glass for a solid-state image sensor package of the present invention. It is sectional drawing of one Embodiment of the window glass for solid-state image sensor packages of this invention. It is a top view of one Embodiment of the window glass for solid-state image sensor packages of this invention. It is sectional drawing of the solid-state image sensor device in which the window glass for solid-state image sensor packages of this invention was used. It is sectional drawing of other embodiment of the window glass for solid-state image sensor packages of this invention. It is sectional drawing of other embodiment of the window glass for solid-state image sensor packages of this invention. It is the flowchart which showed one Embodiment of the manufacturing method of the window glass for solid-state image sensor packages of this invention. It is a figure which shows the spectral transmittance according to plate | board thickness of one Embodiment of the window glass for solid-state image sensor packages of this invention. It is a figure which shows the spectral transmittance according to plate | board thickness of other embodiment of the window glass for solid-state image sensor packages of this invention.

  FIG. 1 is a perspective view of an embodiment of a window glass 1 for a solid-state image sensor package of the present invention, FIG. 2 is a cross-sectional view of an embodiment of the window glass 1 for a solid-state image sensor package of the present invention, and FIG. FIG. 4 is a plan view of an embodiment of the window glass 1 for a solid-state image sensor package of the invention, and FIG. 4 is a cross-sectional view of a solid-state image sensor device 11 using the window glass 1 for a solid-state image sensor package of the present invention.

The window glass 1 for a solid-state image sensor package of the present invention (hereinafter referred to as a cover glass) has a rectangular external shape as shown in FIGS. It has the surface 21 (package non-adhesion surface) and the 2nd translucent surface 22 (package adhesion surface), and the side surface which comprises the periphery of this glass.
The optically effective surface 3 refers to a range in which light incident on the solid-state imaging device 9 is transmitted through the cover glass 1, and refers to the inside of the adhesive surface between the cover glass 1 and the package 8.
The peripheral edge 2 refers to the vicinity of the outer side surface of the optically effective surface 3 on each light-transmitting surface, and the range to which the adhesive 7 provided between the second light-transmitting surface 22 and the package 8 adheres is also included. included.

As shown in FIG. 4, the cover glass 1 of the present invention has a solid-state imaging device 9 (CCD or CMOS) built in a package 8 made of alumina ceramic or resin and hermetically seals the opening. Accordingly, it is intended to protect the solid-state image sensor 9 and prevent dust and dust from adhering to the light receiving surface of the solid-state image sensor 9.
For bonding the cover glass 1 and the package 8, a thermosetting adhesive or a low-melting glass has been conventionally used. However, in recent years, an ultraviolet curable adhesive 7 is used for the purpose of shortening the curing time of the adhesive. It has become so.
The ultraviolet curable adhesive 7 is an adhesive having a property of being cured in a short time by irradiating with ultraviolet rays (wavelength in the range of 200 nm to 400 nm).
As a method for assembling the cover glass 1 and the package 8, the ultraviolet curable adhesive 7 is applied to the peripheral edge 2 of the cover glass 1 or the package 8. Then, after the cover glass 1 is installed at a predetermined position of the package 8, it is hermetically sealed by irradiating an ultraviolet lamp for a predetermined time to cure the adhesive 7.

Here, there is a correlation between the curing rate of the ultraviolet curable adhesive 7 and the integrated amount of ultraviolet light reaching the adhesive. Therefore, if sufficient ultraviolet rays do not reach the adhesive 7 provided on the back surface of the peripheral edge 2 of the cover glass 1, it takes a long time to cure the adhesive 7, and the efficiency of the assembly process of the cover glass 1 and the package 8 is increased. Becomes very bad.
The cover glass 1 of the present invention has a near-infrared cut function for the purpose of correcting the visibility of the solid-state imaging device 9. Although details of the glass composition will be described later, CuO is contained in the fluorophosphate glass or phosphate glass in order to give the glass a function of cutting near infrared rays. This CuO is a component for cutting near infrared rays, but it has been confirmed by the inventors that it has an ultraviolet cutting function around 300 nm with a very small amount. Therefore, in the cover glass 1 of the present invention, the near-infrared cut of the optical effective surface 3 is achieved by making the plate thickness of the peripheral edge 2 that does not affect the optical effective surface 3 thinner than the plate thickness of the optical effective surface 3. Without impairing the function, it is possible to secure the amount of ultraviolet light that passes through the peripheral edge 2 provided with the adhesive 7. Therefore, sufficient ultraviolet rays reach the adhesive 7 provided on the peripheral edge 2 of the cover glass 1, and the adhesive 7 can be cured in a short time, and the cover glass 1 and the package 8 can be efficiently processed. Can be assembled.

  As a method of reducing the thickness of the peripheral edge 2 of the cover glass 1 as compared with the thickness of the optically effective surface 3, there is a method of chamfering a ridge line portion where the side surface of the cover glass 1 and each light transmitting surface are adjacent. By chamfering, the ridgeline portion is chamfered into a square shape or an R shape, thereby reducing the thickness of the processed portion. As a chamfering method, a method using a centering process in which grinding is performed mechanically with a grinding wheel such as a diamond wheel, a method in which a side surface is bevel cut with a V-shaped dicing blade, a method in which an etching process is performed with an etching solution, etc. There is.

The chamfering is performed when both the first ridge line portion where the first light transmissive surface 21 and the side surface are adjacent to each other and the second ridge line portion where the second light transmissive surface 22 is adjacent to each other are processed. There may be a case where only the first ridge line portion where the surface 21 and the side surface are adjacent is to be processed.
When the first ridge line portion and the second ridge line portion are chamfered in the same manner, the plate thickness can be reduced as shown in FIG.
Further, since the second ridge line portion is a portion to which the adhesive 7 for bonding the cover glass 1 and the package 8 is applied, the amount of chamfering of the second ridge line portion should be smaller than the chamfering amount of the first ridge line portion. Thus, the plate thickness of the processed portion can be reduced while securing the bonding surface of the cover glass 1 and the package and 8 as in another embodiment shown in FIG. Moreover, the same effect can be acquired also by chamfering only a 1st ridgeline part, without chamfering a 2nd ridgeline part like other embodiment shown in FIG.
The chamfering amount (width, angle, R shape, etc.) is adjusted as appropriate according to the plate thickness of the cover glass 1, the wavelength required for the UV curable adhesive 7, the integrated light amount, and the curing time required for the assembly process. . Further, the chamfered portion does not need to process the entire range of the adhesive-applied portion of the second light-transmitting surface. Even if the range outside the adhesive-applied portion is processed, the irradiated ultraviolet rays are emitted from the processed portion. By refracting and reaching the adhesive, it is possible to contribute to rapid curing of the adhesive 7.

  The peripheral edge 2 of the cover glass 1 is preferably etched after chamfering. The cover glass 1 of the present invention is thinner than the optically effective surface 3 by chamfering the plate thickness of the peripheral edge portion 2. Therefore, there is a possibility that glass powder and chipping may occur due to contact with other members due to vibration during transportation of the manufacturing process or use of the product. Therefore, the cover glass 1 can be etched after the chamfering process to remove cracks and chipping caused by the chamfering process, and the cover glass 1 can be prevented from being cracked or chipped. The details of the etching method will be described later.

  The four corners 4 (corner portions) of the cover glass 1 are preferably chamfered. As described above, when the plate thickness of the peripheral edge portion 2 is reduced, the four corners 4 become sharp, and there is a possibility that glass powder and chipping may occur due to contact with other members due to vibration during transportation of the manufacturing process or use of the product. Therefore, by processing the four corners 4 into a square shape or an R shape, it is possible to prevent the four corners 4 from being cracked or chipped.

The cover glass 1 of the present invention uses a fluorophosphate glass or phosphate glass containing CuO as an essential constituent requirement.
The fluorophosphate glass used as the base glass has excellent weather resistance. Furthermore, by adding CuO to the glass, it is possible to absorb near infrared rays while maintaining high transmittance in the visible light range, so that it is suitably used as a window glass for a solid-state imaging device package having a near infrared cut function. Is possible. Further, since the thermal expansion coefficient of the fluorophosphate glass is around 130 × 10 ⁻⁷ / ° C., the thermal expansion coefficient is close to that of the resin package 8 that houses the solid-state image sensor 9, and the window glass 1 for the solid-state image sensor package is used. It can be suitably used.
The phosphate glass used as the base glass has a higher hardness than the fluorophosphate glass and is less likely to break when an external force such as bending acts. Furthermore, by adding CuO to the glass, it is possible to absorb near infrared rays while maintaining high transmittance in the visible light range, so that it is suitably used as a window glass for a solid-state imaging device package having a near infrared cut function. Is possible.
Further, since the thermal expansion coefficient of the fluorophosphate glass is about 80 × 10 ⁻⁷ / ° C., the thermal expansion coefficient is close to that of the alumina ceramic package 8 in which the solid-state image sensor 9 is accommodated, and the window glass 1 for the solid-state image sensor package. Can be suitably used.

The fluorophosphate-based glass used in the present invention can use a known glass composition used as a near-infrared cut filter glass, but the content ratio of the glass network-forming component is particularly high in terms of excellent processing strength. by _{mass%, P 2 O 5 46~70%} , MgF 2 0~25%, CaF 2 0~25%, SrF 2 0~25%, LiF 0~20%, 0~10% NaF, KF 0~10 %, But the total amount of LiF, NaF and KF is 1 to 30%, AlF ₃ 0.2 to 20%, ZnF _{2 2 to} 15% (however, up to 50% of the total fluoride meter can be replaced with oxide) It preferably has a composition consisting of Moreover, it is preferable that the said fluorophosphate type | system | group accept | permits content of Ba and Pb only as an impurity.

  The reason why the content of each component of the fluorophosphate glass is limited to the above range is as follows.

P ₂ O ₅ is a main component that forms a network structure of glass. However, if it is less than 46%, the stability of the glass deteriorates, and the thermal expansion coefficient increases and the thermal shock resistance decreases. If it exceeds 70%, the chemical durability decreases. Preferably it is 48 to 65%.

AlF ₃ is a component that improves the chemical durability and increases the viscosity of the glass. However, if it is less than 0.2%, the effect cannot be obtained, and if it exceeds 20%, vitrification becomes difficult. Preferably it is 2 to 15%.

MgF ₂ , CaF ₂ , SrF ₂ , and BaF ₂ are effective in stabilizing the glass without deteriorating the chemical durability, but if each exceeds 25%, the melting temperature increases and devitrification occurs. It becomes easy. Preferably, MgF ₂ is 15% or less and CaF ₂ is in the range of 5 to 15%. SrF ₂ is also effective in improving the chemical durability of the glass, but if it exceeds 25%, the tendency to devitrification becomes stronger. Preferably it is 10% or less.

  LiF, NaF, and KF are effective components for lowering the melting temperature. However, when LiF exceeds 20%, and NaF and KF each exceed 10%, the chemical durability decreases and the thermal shock resistance Decreases. Further, if the total amount of LiF, NaF, and KF is less than 1%, the effect of lowering the melting temperature cannot be obtained, and if it exceeds 30%, the chemical durability is remarkably lowered. Preferably, LiF is 4 to 15%, NaF is 5% or less, KF is 5% or less, and the total amount is 5 to 20%.

ZnF ₂ has the effect of improving the chemical durability and lowering the thermal expansion coefficient. However, if it is less than 2%, the effect cannot be obtained, and if it exceeds 15%, the glass becomes unstable. Preferably it is 2 to 10% of range.

It is also possible to replace up to 50% of the total fluoride meter with oxides. In this case, O increases the thermal shock resistance and contributes to the coloring of the glass with Cu ²⁺ ions. However, if it exceeds 50%, the melting temperature becomes high, which leads to reduction of Cu ^{2+ and} the desired spectral transmission characteristics cannot be obtained.

In the fluorophosphate glass, it is preferable to allow the inclusion of Ba and Pb only as impurities. In the near-infrared cut filter glass based on the conventional fluorophosphate glass, Ba and Pb are contained as BaF ₂ and PbF ₂ for the purpose of stabilizing the glass and improving the weather resistance. When used as a window glass for a solid-state imaging device package, since it is required that the α dose emitted from the glass is low, it is preferable that BaF ₂ and PbF ₂ are not substantially contained. Moreover, it is preferable not to contain Pb as an environmental pollutant. For this reason, in this invention, it is preferable not to add Ba and Pb intentionally.

Phosphate-based glass used in the present invention may be a known glass compositions used as near-infrared cut filter glass, for example, by _{mass%, P 2 O 5 70~85%} , Al 2 O 3 8 _{~17%, B 2 O 3 1~10} %, Li 2 O 0~3%, Na 2 O 0~5%, K 2 O 0~5%, Li 2 O + Na 2 O + K 2 O 0.1~5% It is preferable to have a composition composed of 0 to 3% of SiO ₂ .

  The reason why the content of each component of the phosphate glass is limited to the above range is as follows.

P ₂ O ₅ is a main component constituting the glass network, but if it is less than 70%, the meltability deteriorates, and if it exceeds 85%, devitrification tends to occur.

Al ₂ O ₃ is an indispensable component for improving the scientific durability of the glass, but if it is less than 8%, there is no effect, and if it exceeds 17%, the meltability becomes poor.

B ₂ O ₃ improves the chemical durability and is an effective component for the stability of the glass. However, if it is less than 1%, there is no effect, and if it exceeds 10%, the tendency to devitrification increases.

Li ₂ O, Na ₂ O, and K ₂ O are added to improve the meltability of the glass and prevent devitrification. However, when the total amount of these components is less than 0.1%, there is no effect. If the content exceeds the above range, chemical durability deteriorates.

SiO ₂ has an effect of improving the chemical durability, but if it exceeds 3%, the chemical durability is extremely deteriorated.

  CuO contained in the basic glass composed of the fluorophosphate glass or phosphate glass described above is an essential component for near infrared cut. When CuO is not contained, although the amount of transmitted ultraviolet rays increases, the near infrared ray can hardly be cut, and the cover glass cannot have a near infrared ray cutting function. CuO is preferably contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the basic glass made of fluorophosphate glass or phosphate glass. If CuO is less than 0.1 parts by mass, the near-infrared cut function cannot be sufficiently obtained. Moreover, when there is more CuO than 5 mass parts, an ultraviolet-ray cut function is high and sufficient ultraviolet-ray transmission amount cannot be obtained even if a peripheral part is made thin. In addition, the more preferable range of CuO is 0.3-2 mass parts.

  Next, the manufacturing method of the window glass 1 for solid-state image sensor packages of this invention is demonstrated. FIG. 7 is a flowchart showing an embodiment of a method of manufacturing the window glass 1 for a solid-state image pickup device package including the end face processing method of the present embodiment.

  Hereinafter, the process flow from the glass raw material to the glass product will be briefly described with reference to FIG. First, a glass raw material is melted and formed to obtain a flat glass plate (glass plate forming step). This glass plate is cut into a predetermined size, and the ridge line portion is chamfered using a diamond wheel or the like (chamfering step). The glass plate is immersed in an etching solution, and the ridge portion is etched (etching process). The light-transmitting surface of the glass plate is polished and finished to a mirror surface (polishing step), and the glass plate is washed to sufficiently remove abrasives and polishing debris (first cleaning / drying step). A film such as an antireflection film or a near-infrared cut film is formed on the polished surface of the glass plate thus obtained as necessary (film formation step). Then, the glass substrate is washed and dried (second washing / drying step). Thereby, a glass product is obtained.

  In the glass plate forming step, the prepared glass raw material is melted in a glass melting furnace, and the molten glass flows out of the glass melting furnace into a forming die and is formed into a plate-like glass. Alternatively, after forming into block-shaped glass, it is cut into a plate shape.

  In the polishing process, it is necessary to use a relatively soft jig so as not to damage the ridge line portion obtained by the etching process. This polishing step is performed in, for example, the steps of rough polishing, intermediate polishing, and mirror finish, thereby obtaining good dimensional accuracy and a good finished surface.

  In the first and second cleaning / drying steps, the abrasive, polishing waste and cutting waste used for polishing are removed by cleaning. For example, a method in which a glass plate is housed and held in a cage having a holding portion that holds the glass plates one by one, and the cage is sequentially immersed in an ultrasonic cleaning tank for cleaning, and finally IPA cleaning and drying are performed. Can be used.

  The film forming step is a step of forming a thin film such as an antireflection film or a near-infrared cut film on the surface of the polished, cleaned and dried glass plate by a vacuum vapor deposition apparatus or a sputtering apparatus, if necessary. In the case of a plate-like optical glass that does not require a thin film as described above, the film forming step may be omitted.

  The chamfering process includes not only a so-called centering method in which chamfering is performed using a diamond wheel or the like, but also a method in which a side surface is bevel-cut with a dicing blade having a V-shaped cross section, an etching method, and the like.

  An etching process etches the ridgeline part of a glass plate by immersing the jig | tool with the jig | tool in an etching liquid, after hold | maintaining a plurality of glass plates chamfered by the ridgeline part. At this time, it is preferable to carry out by bringing the glass plate and the etching solution into dynamic contact. That is, the glass plate is not only immersed in the etching solution, but is also stirred or fluidized so that the contact surface between the two changes. Thereby, the progress of etching can be made uniform and accelerated. Specifically, a glass plate and an etching solution are accommodated in a sealed container, and this sealed container is rotated or vibrated.

  By etching the ridge line portion of the glass plate in the etching step and setting the maximum value of the crack length of the ridge line portion to 0.02 mm or less, for example, a cover glass having high strength can be obtained even if it is thin. Specifically, since cracks and chipping generated in the chamfering process at the ridge line portion of the glass plate can be removed by the etching process, the bending strength of the cover glass can be set to a certain level or more.

The etchant used in the etching process is suitably composed mainly of hydrochloric acid. In glass etching, an etching solution mainly containing hydrofluoric acid is usually used. However, when a fluorophosphate glass is etched with an etching solution containing hydrofluoric acid, the reaction deposition between the glass component and the etching solution occurs on the glass surface. An object adheres, which hinders the contact between the etchant and the glass, slows the progress of etching, and causes problems such as a decrease in the etching rate. On the other hand, by using an etching solution mainly composed of hydrochloric acid, there is no adhesion of such reaction precipitates, and the etching process can be performed accurately and easily. This is a particularly noticeable phenomenon when combined with a fluorophosphate glass. When the etching rate of the fluorophosphate glass was confirmed, the hydrochloric acid etchant was compared with the hydrofluoric acid etchant of the same concentration. It was experimentally confirmed that the etching rate was high by about 30%.
In addition to hydrochloric acid, a mixed acid aqueous solution of hydrochloric acid and H ₂ SO ₄ can be used as the etching solution. The concentration of the etching solution and the etching processing time can be appropriately adjusted depending on the degree of cracks to be removed, but the concentration of hydrochloric acid is preferably 3 to 25% (mass%).

  Further, the etching solution may contain a surfactant in addition to the hydrochloric acid. When a surfactant is added to the etching solution, wettability of the etching solution to the glass surface is improved, and the etching solution is likely to penetrate into the crack. Thereby, the crack removal by an etching process can be performed quickly and reliably. As the surfactant, known ones such as anionic surfactants and nonionic (nonionic) surfactants such as fatty acid sodium and polyoxyethylene alkyl ether can be used. The concentration of the surfactant is preferably 0.01 to 10% (mass%).

  As an embodiment of the present invention, a fluorophosphate glass (NF-50, manufactured by AGC Techno Glass) is used as the window glass 1 for a solid-state imaging device package, and the amount of CuO contained in the fluorophosphate glass is as follows. With respect to 0.5% and 1.2%, the spectral transmittance by thickness (1 mm, 0.75 mm, 0.5 mm) was investigated. The results are shown in FIGS. 8A shows the spectral transmittance in the wavelength range from the ultraviolet region to the infrared region according to the plate thickness when the amount of CuO contained in the fluorophosphate glass is 0.5%. B) is a diagram showing a spectral transmittance obtained by enlarging only the ultraviolet region in FIG. FIG. 9A shows the spectral transmittance in the wavelength range from the ultraviolet region to the infrared region depending on the plate thickness when the amount of CuO contained in the fluorophosphate glass is 1.2%. FIG. 9B is a diagram showing a spectral transmittance obtained by enlarging only the ultraviolet region in FIG.

  From the spectral transmittances shown in FIGS. 8 and 9, it can be seen that by changing the plate thickness from 1 mm to 0.5 mm, the transmittance of, for example, 320 nm ultraviolet light is improved by about 20%. Since there is a certain range of effective wavelengths for curing the ultraviolet curable adhesive, the curing time of the ultraviolet curable adhesive can be greatly shortened by the high transmittance in the entire ultraviolet region.

Next, the case where the package 8 is hermetically sealed using the window glass 1 for a solid-state image sensor package will be described.
About the window glass 1 for solid-state image sensor packages (fluorophosphate glass, CuO content: 0.5%, plate thickness 1 mm), what chamfered the peripheral part 2 and what did not chamfer process were prepared. In the chamfering process, only the light-transmitting surface on the non-contact surface side of the package was squared with a chamfering machine. The chamfered shape is a square shape having a width of about 1 mm on the side of the light transmitting surface and about 40 ° relative to the light transmitting surface. The plate thickness at the peripheral edge 2 of 0.5 mm from the end face to which the adhesive 7 was applied was about 0.5 mm.

An ultraviolet curable adhesive 7 is applied to the portion of the package 8 where the peripheral edge 2 of the window glass 1 for solid-state image pickup device comes into contact using a dispenser. Next, the glass 1 coated with the adhesive 7 is placed on the top of the package 8. Next, the package 8 on which the glass 1 was placed was irradiated with ultraviolet rays by an ultraviolet lamp to cure the adhesive 7, and the glass 1 was adhered to the package 8. At this time, the time required for adhesion of the glass 1, that is, the time when the adhesive 7 was cured was investigated.
The time required for bonding the glass 1 was about 40% shorter when the glass 1 with chamfering was used than when the glass 1 without chamfering was used.

  According to the window glass for a solid-state image sensor package of the present invention, even a solid-state image sensor package window glass having a near-infrared cut function can be quickly bonded to the package using an ultraviolet curable adhesive. It is possible to provide a window glass for an image sensor package.

  DESCRIPTION OF SYMBOLS 1 ... Window glass (cover glass) for solid-state image sensor packages, 2 ... Peripheral part, 3 ... Optical effective surface, 4 ... Four corners (corner part), 5 ... Chamfering process part, 7 ... Ultraviolet curable adhesive, 8 ... Package DESCRIPTION OF SYMBOLS 9 ... Solid-state image sensor, 11 ... Solid-state image sensor device, 21 ... 1st translucent surface (package non-contact surface), 22 ... 2nd translucent surface (package contact surface).

Claims (7)

The solid-state image pickup device package window glass consisting fluorophosphate salt-based glass or phosphate glass containing CuO, thickness of the peripheral portion rather thin compared to the thickness of the optical effective surface, the peripheral portion A window glass for a solid-state imaging device package, characterized in that the plate thickness gradually decreases from the optically effective surface side toward the end surface, and the ultraviolet transmittance gradually increases as the plate thickness of the peripheral edge portion gradually decreases .   The window glass for a solid-state imaging device package according to claim 1, wherein the peripheral edge portion is chamfered.   3. The window glass for a solid-state image pickup device package according to claim 2, wherein the chamfering process of the peripheral edge portion is chamfered more on the package non-adhesion surface side than on the package adhesion surface side.   3. The window glass for a solid-state image pickup device package according to claim 2, wherein the peripheral portion is chamfered by chamfering only the package non-adhesive surface side.   The window glass for a solid-state imaging device package according to any one of claims 2 to 4, wherein the peripheral edge portion is etched after chamfering.   The window glass for a solid-state image sensor package according to any one of claims 1 to 5, wherein four corners of the window glass for the solid-state image sensor package are chamfered.   The CuO is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the basic glass made of fluorophosphate glass or phosphate glass. A window glass for a solid-state imaging device package according to 1.

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